BGA package board and method for manufacturing the same

Semiconductor package and method for its manufacture

Semiconductor device and its manufacturing method

Bonding configurations for lead-frame-based and substrate-based semiconductor packages

Power semiconductor package

Electronic part-containing elements, electronic devices and production methods

Electronic module with layer of adhesive and process for producing it

Damascene patterning of barrier layer metal for C4 solder bumps

Wirebonding method and apparatus

Strap bonding machine and method of manufacturing a semiconductor device

Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components

Mounting method and mounting device

Vibratable die attachment tool

Manufacturing method of a semiconductor device, and paste applicator

Circuit-connecting material and circuit terminal connected structure and connecting method

Methods and apparatuses relating to block configurations and fluidic self-assembly processes

Method of manufacturing semiconductor device

Castellation wafer level packaging of integrated circuit chips

Method of fabricating an electronic component having at least one semiconductor chip on a circuit carrier with elastic external contacts

Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal

Substrate for mounting IC chip

Method for manufacturing surface acoustic wave device

Semiconductor chip resin encapsulation method

Semiconductor package including rivet for bonding of lead posts

Top layers of metal for high performance IC's

Connection between a semiconductor chip and a circuit component with a large contact area

Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow

Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device

Methods of bonding two semiconductor devices

Semiconductor device and manufacturing method therefor

Semiconductor chip assembly with metal containment wall and solder terminal

Wafer-level assembly method for semiconductor devices

Semiconductor device and method of manufacturing the same

Radiofrequency power semiconductor module with cavity housing, and method for producing it

Method for producing a component comprising a conductor structure that is suitable for use at high frequencies

IMPROVED DECAL SOLDER TRANSFER METHOD

Method of fabricating a semiconductor device and mounting equipment

Formation of a wire bond with enhanced pull

Bonding method and bonding apparatus

Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device

Method of manufacturing a wiring board

RFID tag and method of manufacturing RFID tag

High thermal cycle conductor system

Methods of forming electronic structures including conductive shunt layers and related structures

Method for forming robust solder interconnect structures by reducing effects of seed layer underetching

Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus

Stacked semiconductor chips

Castellation wafer level packaging of integrated circuit chips

Substrate having built-in semiconductor apparatus and manufacturing method thereof

Mounting semiconductor chips

Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device

Manufacturing method for magnetic sensor and lead frame therefor

Method for manufacturing surface acoustic wave device

Electronic device package

Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration

Substrate based unmolded package

Semiconductor device and a method of manufacturing the semiconductor device

Method of forming a micro solder ball for use in C4 bonding process

BGA package with concave shaped bonding pads

Microelectronic devices

Flip-chip without bumps and polymer for board assembly

Bonding pad and chip structure

Thermal interposer for cooled electrical packages

Semiconductor component and assembly having female conductive members

Castellation wafer level packaging of integrated circuit chips

Stacked semiconductor device and semiconductor memory module

Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers

Semiconductor device and method of manufacturing same

Image sensor package and method of manufacturing the same

Semiconductor integrated circuit device

Under bump metallurgy process on passivation opening

Highly compliant plate for wafer bonding

Semiconductor device packages including hermetic packaging elements for at least partially encapsulating conductive elements and other package elements for protecting the portions of semiconductor devices not covered by the hermetic package elements, and packaging methods

Method for fabricating an electronic component embedded substrate

Substrate based unmolded package

Technique for protecting photonic devices in optoelectronic packages with clear overmolding

In-line wire bonding on a package, and method of assembling same

Electrode contact structure

Electronic assembly having multi-material interconnects

Direct connection multi-chip semiconductor element structure

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Multi-component integrated circuit contacts

Electronic package and semiconductor device using the same

Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication

Taped lead frames and methods of making and using the same in semiconductor packaging

Semiconductor device, optoelectronic board, and production methods therefor

Method of manufacturing active matrix substrate with height control member

Circular wire-bond pad, package made therewith, and method of assembling same

Bonding apparatus and method of bonding for a semiconductor chip

Co-curable compositions

Modular board device, high frequency module, and method of manufacturing same

Method of stacking wafers with anisotropic conductive adhesive

Method for fabricating semiconductor packages

Leadless semiconductor package and method for manufacturing the same

Semiconductor chip package manufacturing method including screen printing process

Electronic device package

Electrical package employing segmented connector and solder joint

Method and structure for manufacturing improved yield semiconductor packaged devices

Circuit film with bump, film package using the same, and related fabrication methods

Lead solder indicator and method

Semiconductor device with magnetically permeable heat sink

Encapsulated device with heat isolating structure

Method of embedding semiconductor element in carrier and embedded structure thereof

Method for manufacturing a semiconductor device

Semiconductor package including a semiconductor device, and method of manufacturing the same

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Methods of forming vias in multilayer substrates

Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement

Circuit apparatus provided with asperities on substrate surface

Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates

Electronic assembly with carbon nanotube contact formations or interconnections

Method of soldering electronic component having solder bumps to substrate

In-situ alloyed solders, articles made thereby, and processes of making same

Die attach area cut-on-fly method and apparatus

Ball bonding method and ball bonding apparatus

Apparatus and method for indexing of substrates and lead frames

Capillary for wire bonding

Sensor equipment having sensing portion and method for manufacturing the same

Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device

Stud bump socket

High-reliability solder joint for printed circuit board and semiconductor package module using the same

Methods for modifying semiconductor devices to stabilize the same and semiconductor device assembly

Semiconductor device and manufacturing method thereof

Method for manufacturing semiconductor substrate and semiconductor substrate

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Thermal interposer for thermal management of semiconductor devices

Method for manufacturing wafer level chip stack package

Prefabricated semiconductor chip carrier

Semiconductor bonding and layer transfer method

Semiconductor memory device

Semiconductor device

Interposer containing bypass capacitors for reducing voltage noise in an IC device

Semiconductor die package with internal bypass capacitors

Electronic assembly having an indium wetting layer on a thermally conductive body

Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same

Apparatus for providing capacitive decoupling between on-die power and ground conductors

Printed wiring board

Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages

Semiconductor assembly having substrate with electroplated contact pads

Vertical memory device structures

Wafer bonding method

Semiconductor, electrooptic apparatus and electronic apparatus

Semiconductor device

Semiconductor device, manufacturing method and apparatus for the same

Wire bonding wedge

Method of forming a lead-free bump and a plating apparatus therefor

Compliant spring contact structures

Field weldable connections

Fabrication method of wafer level chip scale packages

Method for fabricating chip structure

Microfeature devices and methods for manufacturing microfeature devices

Compound semiconductor device and manufacturing method thereof

Method for forming bump on electrode pad with use of double-layered film

Method for fastening microtool components to objects

High density flip chip interconnections

Heat-decaying materials, transfer sheet using the same, and patterning method

Manufacturing method of semiconductor device

Reconstructed semiconductor wafers including alignment droplets contacting alignment vias

Semiconductor device and semiconductor apparatus

Capping of metal interconnects in integrated circuit electronic devices

Semiconductor apparatus and method of manufacturing semiconductor apparatus

Method of forming a solder bump and the structure thereof

Pre-doped reflow interconnections for copper pads

Stress mitigation layer to reduce under bump stress concentration

Semiconductor device mounted on and electrically connected to circuit board

High density multilayer circuit module

Embedded chip semiconductor having dual electronic connection faces

High density chip scale leadframe package and method of manufacturing the package

Semiconductor device having inductor

Compound semiconductor device and manufacturing method thereof

Bonding apparatus

Lead-free bonding systems

Method and apparatus for cleaning mounting nozzle, and mounting machine

Semiconductor device with reduced contact resistance

Method for manufacturing circuit element, method for manufacturing electronic element, circuit substrate, electronic device, and electro-optical apparatus

Method of manufacturing semiconductor device

Formation method for conductive bump

Method for forming interconnects on thin wafers

Methods for making electronic devices with small functional elements supported on a carriers

Electronic devices with small functional elements supported on a carrier

Method of making photolithographically-patterned out-of-plane coil structures

Semiconductor package, mold used in manufacturing the same, and method for manufacturing the same

Semiconductor device components with structures for stabilizing the semiconductor device components upon flip-chip arrangement with high-level substrates

Apparatus and method for wire bonding and die attaching

Semiconductor device and method of manufacture thereof with two or more bond pad connections for each input/output cell

Semiconductor device and method capable of scribing chips with high yield

Semiconductor device

Semiconductor component and system having thinned, encapsulated dice

Semiconductor device having adhesion increasing film to prevent peeling

Semiconductor device that improves electrical connection reliability

Ribbon bonding in an electronic package

Build-up structures with multi-angle vias for Chip to Chip interconnects and optical bussing

Semiconductor package including redistribution pattern and method of manufacturing the same

Component built-in module and method for producing the same

System-in-package (SIP) structure and fabrication thereof

Preparation of front contact for surface mounting

Adhesive/spacer island structure for stacking over wire bonded die

Semiconductor equipment having multiple semiconductor devices and multiple lead frames

Flip chip FET device

Soldering method and solder joints formed therein

Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith

Novel aqueous based metal etchant

Wire-bonding method for chips with copper interconnects by introducing a thin layer

Manufacturing method of semiconductor device

Process of bonding circuitry components

Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits

Semiconductor device and method of manufacturing the same

Plasma processing method and method for fabricating electronic component module using the same

Method of manufacturing semiconductor device and method of manufacturing electronic device

Integrated circuit packages with reduced stress on die and associated methods

Top layers of metal for high performance IC's

Method of fabricating a built-in chip type substrate

Refractory solid, adhesive composition, and device, and associated method

Optical modulator module

Integrated power amplifier module with power sensor

Circuit device and manufacturing method thereof

Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device

Method of manufacturing semiconductor device and support structure for semiconductor substrate

Photoresist process to enable sloped passivation bondpad openings for ease of metal step coverings

Chip structure and process for forming the same

Semiconductor device

Semiconductor device

Semiconductor device and method of manufacturing the same

Circuit device and manufacturing method thereof

Cold weld hermetic MEMS package and method of manufacture

Laminated radiation member, power semiconductor apparatus, and method for producing the same

Interposer substrate, semiconductor package and semiconductor device, and their producing methods

Semiconductor device and manufacturing process therefor

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Semiconductor device and a method of manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof

Semiconductor device with a floating gate electrode that includes a plurality of particles

Apparatus relating to the reconstruction of semiconductor wafers for wafer-level processing

Method of manufacturing circuit device

Moisture-resistant electronic device package and methods of assembly

Multi-band tunable resonant circuit

Top layers of metal for high performance IC's

Bonding method, bonding apparatus and sealing means

Electronic and optoelectronic component packaging technique

Circuit device, manufacturing method thereof, and sheet-like board member

Method for fabricating leadless packages with mold locking characteristics

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Fine-pitch packaging substrate and a method of forming the same

Semiconductor device

Bump structure

Double density method for wirebond interconnect

Chip heat sink device and method

Adhesive/spacer island structure for multiple die package

Semiconductor device and method of manufacturing the same

Leadless leadframe with an improved die pad for mold locking

Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement

Power composite integrated semiconductor device and manufacturing method thereof

Method of manufacturing electronic part packaging structure

Method for forming bump, semiconductor element having bumps and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment

Semiconductor die attachment for high vacuum tubes

Structure for mounting electronic component on wiring board

Thermal interface adhesive and rework

Method of manufacturing semiconductor device

Void free solder arrangement for screen printing semiconductor wafers

Method and resulting structure for manufacturing semiconductor substrates

Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material

Chemical-enhanced package singulation process

Methods for producing an electronic device having microscopically small contact areas

Microelectronic devices and methods for packaging microelectronic devices

Web fabrication of devices

Method of attaching a leadframe to singulated semiconductor dice

Method to build robust mechanical structures on substrate surfaces

Multilayer substrate including components therein

Method for testing using a universal wafer carrier for wafer level die burn-in

Method for testing using a universal wafer carrier for wafer level die burn-in

Semiconductor package and method for fabricating the same

Vibration-assisted method for underfilling flip-chip electronic devices

Semiconductor chip package and method for fabricating the same

Method for integrating pre-fabricated chip structures into functional electronic systems

Semiconductor device

Semiconductor device and method of manufacturing the semiconductor device

Method of manufacturing different bond pads on the same substrate of an integrated circuit package

Semiconductor device having conductive bumps, method of manufacturing thereof, circuit board and electronic apparatus

Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate

Semiconductor device and manufacturing method therefor

Package design and method for electrically connecting die to package

Semiconductor die attachment for high vacuum tubes

Method of forming an array of semiconductor packages

Semiconductor device capable of being connected to external terminals by wire bonding in stacked assembly

Semiconductor package and method of fabricating the same

Semiconductor device

Semiconductor device and manufacturing method of same

Die package

Semiconductor micro device

Semiconductor (LED) chip attachment

Lead wire bonding method

Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape

Microelectronic assembly having variable thickness solder joint

Under bump metallization layer to enable use of high tin content solder bumps

Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device with electroless plating

Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions

Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive