Method and system for 3D alignment in wafer scale integration

Method for measuring bonding quality of bonded substrates, metrology apparatus, and method of producing a device from a bonded substrate

Method of manufacturing a semiconductor device

Semiconductor package having semiconductor constructing body and method of manufacturing the same

Bare die socket

Plating apparatus and plating method

Packaging for electronic modules

Intelligent high-power amplifier module

Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors

Chip support of a leadframe for an integrated circuit package

Layered microelectronic contact and method for fabricating same

Solder structures for out of plane connections

Semiconductor device and fabrication method thereof

Method of forming a bonding pad structure

Semiconductor device and fabrication method thereof

Semiconductor device having exposed heat dissipating metal plate

Integrated circuit packaging device and method for matching impedance

Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module

Micromechanical getter anchor

Power semiconductor device

Semiconductor device

Stacked-type semiconductor device

Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication

Method for wafer stacking using copper structures of substantially uniform height

Semiconductor integrated circuit device and method of manufacturing the same

Semiconductor device and method of fabricating the same

INTEGRATED CIRCUIT PACKAGE WITH INNER GROUND LAYER

IC substrate with over voltage protection function

IC substrate with over voltage protection function

Ball grid array IC substrate with over voltage protection function

IC substrate with over voltage protection function

IC substrate with over voltage protection function

Method for attaching chips in a flip-chip arrangement

Semiconductor device and manufacturing method of the same

Semiconductor device and radio communication device

Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component

Semiconductor device and manufacturing method therefor

Electronic device including a substrate structure and a process for forming the same

Hot-Melt Underfill Composition and Methos of Application

Method of marking a low profile packaged semiconductor device

Manufacturing method of semiconductor device

Method and system for performing die attach using a flame

Package that integrates passive and active devices with or without a lead frame

Thermally controlled fluidic self-assembly

Semiconductor package with a controlled impedance bus

Module

Resin casting mold and method of casting resin

Bonding pad structure

Ball limiting metallurgy split into segments

Circuit device with circuit board and semiconductor chip mounted thereon

Semiconductor device and manufacturing method therefor

Semiconductor chip having coolant path, semiconductor package and package cooling system using the same

Package for a high-frequency electronic device

Repairable three-dimensional semiconductor subsystem

Arrangement of input/output pads on an integrated circuit

System for implementing a configurable integrated circuit

Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument

Semiconductor die positioning system and a method of bonding a semiconductor die to a substrate

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument

Use of a down-bond as a controlled inductor in integrated circuit applications

Semiconductor device with a guard-ring structure and a field plate formed of polycrystalline silicon film embedded in an insulating film

RFID tag and method of manufacturing the same

RFID tag and method of manufacturing the same

Method of manufacturing a semiconductor device

Method of manufacturing wiring substrate to which semiconductor chip is mounted

PCB, manufacturing method thereof and semiconductor package implementing the same

Semiconductor device and manufacturing method thereof

Microelectronic devices having underfill materials with improved fluxing agents

Solder bump composition for flip chip

Method for re-routing lithography-free microelectronic devices

Package structure with embedded chip and method for fabricating the same

Semiconductor device package

Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method

Method of manufacturing semiconductor device and support structure for semiconductor substrate

Electrical or electronic component and method of producing same

Fabrication of stacked die and structures formed thereby

Compact system module with built-in thermoelectric cooling

Electronic component with a housing package

Housing for power semiconductor modules

Protection of an integrated capacitor

Display, method of manufacturing display and apparatus for manufacturing display

B-stageable underfill encapsulant and method for its application

Semiconductor device having a bonding pad structure including an annular contact

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Flip chip package with anti-floating structure

Apparatus and method for manufacturing semiconductor device

Method for solder bumping, and solder-bumping structures produced thereby

Test system for semiconductor components having conductive spring contacts

Method for fabricating semiconductor components with conductive spring contacts

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Semiconductor device and manufacturing method thereof

Metallization structure over passivation layer for IC chip

Semiconductor device

Circuit boards, electronic devices, and methods of manufacturing thereof

Semiconductor device having a second semiconductor construction mounted on a first semiconductor construction and a manufacturing method thereof

Semiconductor package, manufacturing method thereof and IC chip

Integrated circuit with stacked-die configuration utilizing substrate conduction

Multi-part lead frame with dissimilar materials

Semiconductor device and a method of manufacturing the same

Semiconductor package having improved adhesion and solderability

Micro-C-4 semiconductor die and method for depositing connection sites thereon

Electronic parts packaging structure and method of manufacturing the same

Method of manufacturing a device-incorporated substrate

Wireless communication system

Manufacturing method of chip integrated substrate

Bonding structure and fabrication thereof

Three-dimensional device fabrication method

Wafer-level underfill process making use of sacrificial contact pad protective material

Semiconductor memory device and defect remedying method thereof

Liquid metal thermal interface material system

Coolant cooled type semiconductor device

Printed circuit board having a bond wire shield structure for a signal transmission line

Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip

Semiconductor device, its manufacturing method, and radio communication device

Semiconductor device and fabrication method for the same

Semiconductor device and the method of producing the same

Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts

Micro-hole plating method, gold bump fabrication method and semiconductor device fabrication method using the micro-hole plating method, semiconductor device

Semiconductor device and method of fabricating the same

Ultrasonic bonding equipment for manufacturing semiconductor device, semiconductor device and its manufacturing method

Liquid metal thermal interface material system

Semiconductor package and manufacturing method thereof

MSD raised metal interface features

Press pack power semiconductor module

Solder interconnect structure and method using injection molded solder

Method for mounting a semiconductor chip onto a substrate

Epoxy-solder thermally conductive structure for an integrated circuit

Method of making a circuitized substrate

Method for fabricating semiconductor components with conductive vias

Semiconductor device and method of fabricating the same, circuit board, and electronic instrument

Attachment of flip chips to substrates

Bond pad for ball grid array package

Semiconductor component having plate and stacked dice

Reinforced solder bump structure and method for forming a reinforced solder bump

Microelectronic packages with solder interconnections

Semiconductor device and manufacturing method of semiconductor device

Substrate package structure and packaging method thereof

Wire bond interconnection

Semiconductor device

Semiconductor die attachment for high vacuum tubes

Semiconductor chip and tab package having the same

Microelectronic assemblies incorporating inductors

Method and apparatus for polymer dielectric surface recovery by ion implantation

Methods for aligning semiconductor fabrication molds and semiconductor substrates

Method and device for mounting electric component

Ultrasonic head

Resonator, ultrasonic head, and ultrasonic bonder using the same

Plating apparatus

Method of forming external electrode

Package for a semiconductor device

Forming an intermediate layer in interconnect joints and structures formed thereby

Semiconductor device having low-k dielectric film in pad region and method for manufacture thereof

Method for removing resin mask layer and method for manufacturing solder bumped substrate

Wafer alignment method

Semiconductor device, and method for manufacturing the same

Electronic device and manufacturing method of the same

Ultra-thin semiconductor package device and method for manufacturing the same

Method of fabricating semiconductor package including die interposed between cup-shaped lead frame having mesas and valleys

Structure of embedded active components and manufacturing method thereof

Film adhesive and semiconductor package using the same

Radio frequency identification (RFID) tag for an item having a conductive layer included or attached

Transponder incorporated into an electronic device

Semiconductor device, method and apparatus for fabricating the same

Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode

Solder for fabricating solder bumps and pumping process

Power module, and phase leg assembly

Probe arrays and method for making

Multi-chip package and method of fabricating the same

Encapsulated electronic device structure

Die bonded device and method for transistor packages

Semiconductor package including die interposed between cup-shaped lead frame and lead frame having mesas and valleys

Semiconductor device and method of fabricating the same

Integrated circuit component and mounting method thereof

Structure of electronic package and method for fabricating the same

Circuit board with embedded component and method of manufacturing same

Semiconductor chip package having an adhesive tape attached on bonding wires

Method of fabricating a high Q factor integrated circuit inductor

Overmolded lens over LED die

Micro-machined structure production using encapsulation

Method for mounting an electronic element on a wiring board

Power amplifier module

Methods and systems for rise-time improvements in differential signal outputs

Die attach material for TBGA or flexible circuitry

Module substrate and disk apparatus

Flip chip system with organic/inorganic hybrid underfill composition

Electronic component unit

Heater for annealing trapped charge in a semiconductor device

Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate

Semiconductor packages with asymmetric connection configurations

Electronic device package and electronic equipment

Multi-chip semiconductor package

Multi-chip package

Bump formation method and bump forming apparatus for semiconductor wafer

Liquid metal droplet generator

Adhesion apparatus

Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same

Active area bonding compatible high current structures

Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin

Method of forming a multi-layer semiconductor structure having a seam-less bonding interface

Injection molded metal bonding tray for integrated circuit device fabrication

Fabricating surface mountable semiconductor components with leadframe strips

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Flip-chip semiconductor device utilizing an elongated tip bump

Semiconductor device

Integration type semiconductor device and method for manufacturing the same

Semiconductor package with conductive molding compound and manufacturing method thereof

No-flow underfill materials for flip chips

Method and structure to reduce risk of gold embrittlement in solder joints

Semiconductor device with crack-resistant multilayer copper wiring

Wafer structure, chip structure and bumping process

Semiconductor packaging device comprising a semiconductor chip including a MOSFET

Semiconductor wafer with electrically connected contact and test areas

Chip package with grease heat sink

Flip chip bonding structure using non-conductive adhesive and related fabrication method

Multi chip package

Electronic device package and electronic equipment

Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument

Flexible wiring substrate, semiconductor device and electronic device using flexible wiring substrate, and fabricating method of flexible wiring substrate

Integrated circuit device having flexible leadframe

Semiconductor package including leadframe roughened with chemical etchant to prevent separation between leadframe and molding compound

Integrated circuit chip package having a ring-shaped silicon decoupling capacitor

Semiconductor device having through electrode and method of manufacturing the same

Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head

Microcomputer chip with function capable of supporting emulation

Integrated circuit die with logically equivalent bonding pads

Structured semiconductor element for reducing charging effects

Interconnect including a pliable surface and use thereof

Electrical contact and connector and method of manufacture

Fabrication method of a wafer structure

In-place bonding of microstructures

Method for fabricating semiconductor components

Structure of mounting electronic component

Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding

Bond pad structure for integrated circuit chip

LED with self aligned bond pad

Method of mounting an electronic part to a substrate

Wiring board and method for producing same

Flip chip package including a heat spreader having an edge with a recessed edge portion and method of making the same

Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion

Semiconductor device, circuit board, electro-optic device, electronic device

Semiconductor device and method of fabricating the same

Bond pad structure with stress-buffering layer capping interconnection metal layer

Semiconductor device and a method for manufacturing of the same

Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module

Fan out type wafer level package structure and method of the same

Semiconductor device and manufacturing process thereof

Flip chip package including a non-planar heat spreader and method of making the same

Film circuit substrate having Sn-In alloy layer

Manufacturing method of solid-state image sensing device

Method of mounting electronic component

Method of ultrasonic-mounting electronic component and ultrasonic mounting machine

Method for manufacturing a semiconductor device

Method for flip chip bonding by utilizing an interposer with embedded bumps

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Using an interposer to facilate capacitive communication between face-to-face chips

Oblique parts or surfaces

Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same

Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel for producing an electronic component

Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same

Semiconductor device and manufacturing method of the same

Semiconductor device and method of manufacturing the same

UBM STRUCTURE FOR IMPROVING RELIABILITY AND PERFORMANCE

Packaged device and method of forming same

Chip-size package structure and method of the same

Compliant interconnects for semiconductors and micromachines

Semiconductor device capsule

Audio amplifier assembly

Functional coating of the SCFM preform

Multi-layer integrated semiconductor structure having an electrical shielding portion

IC substrate and manufacturing method thereof and semiconductor element package thereby

Solderable top metal for SiC device

Rfid tag

Method and apparatus for placing conductive balls

Thermal management of systems having localized regions of elevated heat flux

Iridium oxide nanowires and method for forming same

Device for bonding a metal on a surface of a substrate

Circuit carrier and production thereof

Manufacturing method of passivation layer on wafer and manufacturing method of bumps on wafer

Semiconductor device and method of manufacturing the same

Method for making electronic packages

Plating method, semiconductor device fabrication method and circuit board fabrication method

Methods of making microelectronic packages with conductive elastomeric posts

Method for fabricating packaged die

Packaging method for an electronic element

Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits

Connection structure for connecting semiconductor element and wiring board, and semiconductor device

Semiconductor device having aluminum electrode and metallic electrode

Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device

Structure of polymer-matrix conductive film and method for fabricating the same

Method of forming a bond pad on an I/C chip and resulting structure

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Chip-scale packages

Method and process of contact to a heat softened solder ball array

Plating apparatus and plating method

Manufacturing method of a semiconductor device

Semiconductor device and its manufacturing method

Method of manufacturing electric device

Polymer encapsulated dicing lane (PEDL) technology for Cu/low/ultra-low k devices

Semiconductor device and manufacturing method for the same