212013 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Carbon [C]
Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
#11402Underfilling with acid-cleavable acetal and ketal epoxy oligomers
#11403Method for internal electrical insulation of a substrate for a power semiconductor module
#11404Method and apparatus for shielding integrated circuits
#11405Semiconductor chip arrangement and method
#11406Method of magnetic field assisted self-assembly
#11407Electronic device including chip parts and a method for manufacturing the same
#11408Semiconductor device
#11409Chip scale package with heat spreader
#11410Mounting with auxiliary bumps
#11411Embedded chip semiconductor without wire bondings
#11412Circuit method integrating the power distribution functions of the circuits and leadframes into the chip surface
#11413High data rate chip mounting
#11414Array capacitors in interposers, and methods of using same
#11415Flip chip semiconductor package for testing bump and method of fabricating the same
#11416Surface mount multichip devices
#11417Selectable decoupling capacitors for integrated circuits and associated methods
#11418Compositions for use in electronics devices
#11419Method for securing electronic components to a substrate
#11420Linear split axis wire bonder
#11421Method of manufacturing an electronic parts packaging structure
#11422Top layers of metal for high performance IC's
#11423Methods of forming solder bumps on exposed metal pads
#11424Single row bond pad arrangement
#11425Semiconductor device and manufacturing method thereof
#11426Implementation of protection layer for bond pad protection
#11427Method of fabricating a semiconductor device
#11428Active matrix substrate with height control member
#11429Method and apparatus for synthesizing high-frequency signals for wireless communications
#11430Display device and manufacturing method of the same
#11431Electrode pad arrangement with open side for waste removal
#11432Semiconductor chip having pads with plural junctions for different assembly methods
#11433FCBGA package structure
#11434Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same
#11435Semiconductor component having multiple stacked dice
#11436Structure of package
#11437Semiconductor chip package and method for manufacturing the same
#11438Semiconductor device
#11439Method of fabricating a rat's nest RFID antenna
#11440Mounting machine and controller for the mounting machine
#11441Method for manufacturing an interconnect
#11442Method of making a semiconductor device using bump material including a liquid
#11443Compliant multi-composition interconnects
#11444Method for producing a semiconductor element
#11445Method for producing a BGA chip module and BGA chip module
#11446Semiconductor assembly using dual-cure die attach adhesive
#11447Semiconductor device and its manufacturing process, electro-optical equipment, and electronic equipment
#11448Power module comprising at least two substrates and method for producing the same
#11449Method for testing using a universal wafer carrier for wafer level die burn-in
#11450Method for testing using a universal wafer carrier for wafer level die burn-in
#11451Method for testing using a universal wafer carrier for wafer level die burn-in
#11452Semiconductor chip having pads with plural junctions for different assembly methods
#11453Semiconductor device in which semiconductor chip is mounted on lead frame
#11454Semiconductor device having improved solder joint and internal lead lifetimes
#11455Fan out type wafer level package structure and method of the same
#11456High-frequency amplification device
#11457Semiconductor device, producing method of semiconductor substrate, and producing method of semiconductor device
#11458Semiconductor device
#11459Method for mounting semiconductor device, as well as circuit board, electrooptic device, and electronic device
#11460Compliant interconnect assembly
#11461Method for making an anisotropic conductive film pointed conductive inserts
#11462Method for manufacturing semiconductor device
#11463Flip chip package, semiconductor package with bumps and method for manufacturing semiconductor package with bumps
#11464Method for manufacturing semiconductor device having solder layer
#11465Method of transferring devices, method of arranging devices using the same, and method of manufacturing an image display system
#11466DEVICE TRANSFER METHOD AND DISPLAY APPARATUS
#11467Semiconductor device and a method of manufacturing the same
#11468Semiconductor device and manufacturing method of the same
#11469Systems and methods for filling voids and improving properties of porous thin films
#11470Methods and apparatus for transferring conductive pieces during semiconductor device fabrication
#11471Semiconductor device
#11472Semiconductor device
#11473High power Doherty amplifier
#11474Led chip mounting structure and image reader having same
#11475Wafer level chip scale packaging structure and method of fabricating the same
#11476Flip-chip type semiconductor devices and conductive elements thereof
#11477Semiconductor device
#11478Semiconductor device, magnetic sensor, and magnetic sensor unit
#11479Semiconductor device and multilayer substrate therefor
#11480Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
#11481NANO IC packaging
#11482Semiconductor module mounting structure, a cardlike semiconductor module, and heat receiving members bonded to the cardlike semiconductor module
#11483In-process semiconductor packages with leadframe grid arrays
#11484Power semiconductor module
#11485Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements
#11486Semiconductor device with stacked semiconductor chips of the same type
#11487Semiconductor integrated circuit
#11488Semiconductor device
#11489High performance system-on-chip discrete components using post passivation process
#11490Semiconductor device having a refractory metal containing film and method for manufacturing the same
#11491Electronic component, mounted structure, electro-optical device, and electronic device
#11492Power semiconductor switching devices and power semiconductor devices
#11493Bonding structure and method for bonding members
#11494Thermally conductive compositions and methods of making thereof
#11495Programmable radio transceiver
#11496Method of migrating and fixing particles in a solution to bumps on a chip
#11497Method of connecting base materials
#11498Electronic device and method of manufacture the same
#11499Method for fabricating encapsulated semiconductor components
#11500Packaging method for integrated circuits
#11501Method for depositing a solder material on a substrate
#11502Manufacture of microelectronic fold packages
#11503Method for manufacturing semiconductor device
#11504Dicing die bonding film
#11505Conductive material for integrated circuit fabrication
#11506Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits
#11507Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor package
#11508Method for embedding a component in a base
#11509Heat curable adhesive composition, article, semiconductor apparatus and method
#11510High density nanostructured interconnection
#11511Electronic component mounting method and apparatus
#11512Extension of fatigue life for C4 solder ball to chip connection
#11513Circuit device and method of manufacturing the circuit device
#11514Circuit board, device mounting structure, device mounting method, and electronic apparatus
#11515Interconnections for flip-chip using lead-free solders and having reaction barrier layers
#11516Integrated circuit package and method having wire-bonded intra-die electrical connections
#11517Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus
#11518Electronic package with optimized lamination process
#11519Surface mounted package with die bottom spaced from support board
#11520Semiconductor device and method of fabricating the same
#11521Power semiconductor device package
#11522Method for maintaining solder thickness in flipchip attach packaging processes
#11523Semiconductor device and method for manufacturing same
#11524Circuit device
#11525Multi-part lead frame
#11526Integrated circuit device having flexible leadframe
#11527Lead frame having a tilt flap for locking molding compound and semiconductor device having the same
#11528Leadless semiconductor package and manufacturing method thereof
#11529Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device
#11530Power semiconductor switching-device and semiconductor power module using the device
#11531Integrated circuit with intergrated capacitor and methods for making same
#11532Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same
#11533Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device
#11534Component mounting substrate and structure
#11535Bonding an interconnect to a circuit device and related devices
#11536Semiconductor device comprising through-electrode interconnect
#11537Wafer support and release in wafer processing
#11538Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor
#11539Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig
#11540Jig for a semiconductor substrate
#11541Vacuum fixing jig for semiconductor device
#11542Wafer stacking using interconnect structures of substantially uniform height
#11543Self-coplanarity bumping shape for flip-chip
#11544Method of making chip package with grease heat sink
#11545Carrier substrates and conductive elements thereof
#11546Wire bonding apparatus
#11547Circuitry module
#11548Semiconductor device with electrode pads for test probe
#11549Circuit support for a semiconductor chip and component
#11550Capillary underfill channel
#11551Semiconductor device
#11552Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device
#11553Semiconductor flip-chip package and method for the fabrication thereof
#11554Self-coplanarity bumping shape for flip chip
#11555Die down semiconductor package
#11556Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus
#11557Method for manufacturing leadless semiconductor packages
#11558Semiconductor device
#11559Through electrode, spacer provided with the through electrode, and method of manufacturing the same
#11560Semiconductor device, a method of manufacturing the same and an electronic device
#11561Semiconductor device with non-overlapping chip mounting sections
#11562Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
#11563Power semiconductor module
#11564Underfill fluxing curative
#11565Wire bonding apparatus
#11566Fabrication method and structure of PCB assembly, and tool for assembly thereof
#11567Fixture and method for uniform electroless metal deposition on integrated circuit bond pads
#11568Low fabrication cost, high performance, high reliability chip scale package
#11569Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same
#11570Method of wafer/substrate bonding
#11571Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#11572Semiconductor device assembly method and semiconductor device assembly apparatus
#11573BUMPING PROCESS, BUMP STRUCTURE, PACKAGING PROCESS AND PACKAGE STRUCTURE
#11574Method for attaching a semiconductor chip in a plastic encapsulant, optoelectronic semiconductor component and method for the production thereof
#11575Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
#11576Programmable radio transceiver
#11577Motor driving system having power semiconductor module life detection function
#11578Adhesion by plasma conditioning of semiconductor chip surfaces
#11579Semiconductor device and manufacturing metthod thereof
#11580Semiconductor apparatus with improved yield
#11581Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip
#11582Under bump metallization layer to enable use of high tin content solder bumps
#11583Electric wave readable data carrier manufacturing method, substrate, and electronic component module
#11584Semiconductor chip, semiconductor device, method for producing semiconductor device, and electronic equipment
#11585Semiconductor package with build-up structure and method for fabricating the same
#11586Semiconductor device and method of manufacturing the same
#11587Electrical component
#11588Semiconductor device
#11589Semiconductor device with plate-shaped component
#11590HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
#11591Circuit device
#11592Vertically stacked semiconductor device
#11593Semiconductor device designed to produce no resonance of loop due to ultrasonic vibration, semiconductor design apparatus and method of manufacturing semiconductor device
#11594Semiconductor device and method of manufacturing the same
#11595Lead on chip semiconductor package
#11596Surface-mountable semiconductor component and method for producing it
#11597Semiconductor apparatus and method of fabricating the apparatus
#11598Solid state imaging device having electromagnetic wave absorber attached to a mounting board
#11599Electronic parts packaging structure and method of manufacturing the same
#11600Method of microelectrode connection and connected structure of use threof
#11601High frequency circuit block unit, method for producing same, high frequency module device and method for producing same
#11602Spiral contactor, contact sheet having spiral contactor, and connecting device having contact sheet
#11603Top layers of metal for high performance IC's
#11604Solder bump structure and method for forming a solder bump
#11605Methods for forming electrical connections and resulting devices
#11606Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
#11607Dicing die-bonding film
#11608Semiconductor device and manufacturing method of the same
#11609Methods including fabrication of substrates and other semiconductor device components with collars on or around the contact pads thereof
#11610Method of producing an electronic component with flexible bonding
#11611Semiconductor chip packaging method with individually placed film adhesive pieces
#11612Manufacturing method for semiconductor device and determination method for position of semiconductor element
#11613Semiconductor device and method of manufacturing the same
#11614Multi-flip chip on lead frame on over molded IC package and method of assembly
#11615Method for manufacturing wiring board and semiconductor device
#11616Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits
#11617Wire bonding method and semiconductor device
#11618Semiconductor device with recessed post electrode
#11619Method of manufacturing substrate joint body, substrate joint body and electrooptical device
#11620Stacked electronic part
#11621Methods and apparatus for packaging integrated circuit devices
#11622Circuit device and manufacturing method thereof
#11623Semiconductor package having step type die and method for manufacturing the same
#11624Board-on-chip packages
#11625Semiconductor chip and display device using the same
#11626Ultrasonic tool and ultrasonic bonder
#11627Connector
#11628Method of fabricating a wire bond with multiple stitch bonds
#11629Process for producing optical semiconductor device
#11630Manufacturing method of a tray, a socket for inspection, and a semiconductor device
#11631Thin-film semiconductor device and method of manufacturing the same
#11632Semiconductor chip capable of implementing wire bonding over active circuits
#11633Memory component with asymmetrical contact row
#11634Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#11635Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts
#11636Top layers of metal for high performance IC's
#11637Semiconductor device and manufacturing method thereof
#11638Semiconductor device with increased number of external connection electrodes
#11639Semiconductor device and method for manufacturing the same
#11640Package structure with two solder arrays
#11641Solderable top metalization and passivation for source mounted package
#11642Method and apparatus for bonding a wire
#11643Semiconductor component assemblies having interconnects
#11644Semiconductor device, manufacturing method thereof, circuit board, and electronic appliance
#11645Two solder array structure with two high melting solder joints
#11646Semiconductor stack package and memory module with improved heat dissipation
#11647Semiconductor device and manufacturing method thereof
#11648Semiconductor device and electronic device
#11649Semiconductor device with interlocking clip
#11650Electronic component having an integrated passive electronic component and associated production method
#11651Capacitor device and semiconductor device having the same, and capacitor device manufacturing method
#11652Wire bonding apparatus having actuated flame-off wand
#11653Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument
#11654Solder ball excellent in micro-adhesion preventing properties and wetting properties and method for preventing the micro-adhesion of solder balls
#11655Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
#11656Semiconductor device and method of manufacturing the same
#11657Device mounting method and device transport apparatus
#11658Method and apparatus for joining semiconductor
#11659Element arrangement method
#11660Apparatuses and methods for forming assemblies
#11661Wire bonding method and liquid-jet head
#11662Driver chip and display apparatus having the same
#11663Power amplifier module for wireless communication devices
#11664Circuit component with bump formed over chip
#11665Semiconductor device manufacturing method and manufacturing apparatus
#11666Submount and semiconductor device
#11667Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument
#11668Semiconductor device and manufacturing method for the same
#11669Method for mounting semiconductor chips and corresponding semiconductor chip system
#11670Resin-molded semiconductor device having posts with bumps and method for fabricating the same
#11671Electrical connection materials and electrical connection methods
#11672Multi-chip package including at least one semiconductor device enclosed therein
#11673High frequency semiconductor device
#11674Semiconductor device and manufacturing method of the same
#11675Semiconductor package free of substrate and fabrication method thereof
#11676Semiconductor package free of substrate and fabrication method thereof
#11677Semiconductor package free of substrate and fabrication method thereof
#11678Bonding pad arrangement method for semiconductor devices
#11679Semiconductor device
#11680Transferring semiconductor crystal from a substrate to a resin
#11681Flip-chip light emitting diode device without sub-mount
#11682Light emitting device
#11683Semiconductor devices and manufacturing method therefor
#11684Titanium stripping solution
#11685Ultrasonic bonding apparatus and method
#11686Bump bonding apparatus and bump bonding method
#11687Electrical contact
#11688Apparatus and method for forming bump
#11689Method to prevent passivation layer peeling in a solder bump formation process
#11690Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#11691Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#11692Methods of fabrication of package assemblies for optically interactive electronic devices
#11693Via structure of packages for high frequency semiconductor devices
#11694Electronic component, method of manufacturing the electronic component, and electronic apparatus
#11695Test head assembly having paired contact structures
#11696Semiconductor device assembly process
#11697Low fabrication cost, high performance, high reliability chip scale package
#11698LSI package, LSI element testing method, and semiconductor device manufacturing method
#11699Packaged die on PCB with heat sink encapsulant and methods
#11700Semiconductor package with crossing conductor assembly and method of manufacture