212013 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Carbon [C]
Semiconductor package
#11702Semiconductor device and manufacturing method thereof
#11703Method of surface mounting a semiconductor device
#11704Semiconductor device support structures
#11705Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus
#11706Chip package sealing method
#11707Methods of fabricating interconnects for semiconductor components including plating solder-wetting material and solder filling
#11708Methods of fabricating interconnects for semiconductor components including a through hole entirely through the component and forming a metal nitride including separate precursor cycles
#11709Manufacturing method for semiconductor device and semiconductor device
#11710Methods of fabricating interconnects including depositing a first material in the interconnect with a thickness of angstroms and a low temperature for semiconductor components
#11711Transferring semiconductor crystal from a substrate to a resin
#11712Process for producing semiconductor chips having a protective film on the back surface
#11713Method and apparatus for fabricating self-assembling microstructures
#11714Method of manufacturing semiconductor device
#11715Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods
#11716Intrinsic thermal enhancement for FBGA package
#11717Semiconductor device manufacturing method and manufacturing apparatus
#11718spliced film carrier tape
#11719Apparatus and method for die attachment
#11720Actuator and bonding apparatus
#11721Semiconductor integrated circuit device
#11722Sheet to form a protective film for chips
#11723Method and structure for interfacing electronic devices
#11724Electrode package for semiconductor device
#11725Semiconductor device
#11726Semiconductor device and a memory system including a plurality of IC chips in a common package
#11727Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
#11728Semiconductor device and method of manufacturing the same
#11729Electronic device configured as a multichip module, leadframe and panel with leadframe positions
#11730Semiconductor device and fabrication method for the same
#11731High density lead arrangement package structure
#11732Lead frame for semiconductor package and method of fabricating semiconductor package
#11733High performance system-on-chip using post passivation process
#11734Laser cleaning system for a wire bonding machine
#11735Wire bonding method and apparatus
#11736Wire bonding apparatus
#11737Manufacturing method and manufacturing apparatus for semiconductor device
#11738Alloying method using laser irradiation for a light emitting device
#11739Method for alloying a wiring portion for a image display device
#11740Alloying method, and wiring forming method, display device forming method, and image display unit fabricating method
#11741Method of manufacturing a display panel
#11742Microelectronic packages and methods therefor
#11743Wafer level semiconductor component having thinned, encapsulated dice and polymer dam
#11744Semiconductor device for wire-bonding and flip-chip bonding package and manufacturing method thereof
#11745Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#11746Semiconductor copper bond pad surface protection
#11747Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#11748Electronic circuit module
#11749Semiconductor device and method of manufacturing the same
#11750Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#11751Thermal head and bonding connection method therefor
#11752Flip-chip attach structure
#11753Semiconductor device and manufacturing method thereof
#11754Semiconductor integrated circuit device
#11755Lateral conduction Schottky diode with plural mesas
#11756Semiconductor memory device and defect remedying method thereof
#11757System semiconductor device and method of manufacturing the same
#11758Method for preparing integrated circuit modules for attachment to printed circuit substrates
#11759Adhesive, method of connecting wiring terminals and wiring structure
#11760Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles
#11761Manufacturing method of semiconductor device
#11762Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles
#11763Alloy method using laser irradiation
#11764Method for manufacturing semiconductor device
#11765Ball transferring method and apparatus
#11766Method of manufacturing hybrid integrated circuit device
#11767Manufacturing method of a semiconductor device utilizing a flexible adhesive tape
#11768High-frequency power amplifier module
#11769Electronic component and fabricating method
#11770Optically interactive device package array
#11771Method of manufacturing a sensor device with binding material having a foaming agent
#11772Wafer-level package and method for production thereof
#11773Electronic component and fabricating method
#11774Semiconductor device having bonding pad above low-k dielectric film
#11775Electrode pad section for external connection
#11776Semiconductor device and method of manufacturing the same
#11777Electronic component and fabricating method
#11778Quad flat non-leaded package comprising a semiconductor device
#11779Wire-bonding method and semiconductor package using the same
#11780Semiconductor package with wire bonded stacked dice and multi-layer metal bumps
#11781Method for assembling a ball grid array package with two substrates
#11782Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#11783Brazing filler metal, assembly method for semiconductor device using same, and semiconductor device
#11784System and method for automated wire bonding
#11785Dies bonding apparatus and dies bonding method
#11786Reworkable thermosetting resin compositions
#11787High performance system-on-chip discrete components using post passivation process
#11788Methods for reducing flip chip stress
#11789Semiconductor device and method for fabricating the device
#11790Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#11791Conductive bond for through-wafer interconnect
#11792Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment
#11793Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#11794Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#11795Method for making a micromechanical device by using a sacrificial substrate
#11796Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#11797Resin compositions and methods of use thereof
#11798Resin-encapsulation semiconductor device and method for fabricating the same
#11799Flip-chip adaptor package for bare die
#11800DEVICE WITH AREA ARRAY PADS FOR TEST PROBING
#11801Semiconductor device including semiconductor element mounted on another semiconductor element
#11802Bumped IC, display device and electronic device using the same
#11803Semiconductor device and method for manufacturing the same
#11804Semiconductor device and method of fabricating the same
#11805Partially etched dielectric film with conductive features
#11806Solder alloy and semiconductor device
#11807Bumpless wafer scale device and board assembly
#11808Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#11809Semiconductor device having radiation structure
#11810Method of making microelectronic packages including electrically and/or thermally conductive element
#11811Semiconductor device, three-dimensional semiconductor device, and method of manufacturing semiconductor device
#11812Film substrate, fabrication method thereof, and image display substrate
#11813Semiconductor device
#11814Semiconductor device and method of manufacturing same
#11815Assembly and method for modified bus bar with Kapton™ tape or insulative material on LOC packaged part
#11816Integrated circuit package with transparent encapsulant and method for making thereof
#11817Surface mountable hermetically sealed package
#11818High Q factor integrated circuit inductor
#11819Active matrix substrate, method of manufacturing the same, and display device
#11820Active matrix substrate display device
#11821METHOD FOR PRODUCING WEDGE-WEDGE WIRE CONNECTION
#11822Bonding method, bonding apparatus and bonding program
#11823Bonding pattern discrimination method, bonding pattern discrimination device and bonding pattern discrimination program
#11824Interconnection device and system
#11825Method and system for batch forming spring elements in three dimensions
#11826High performance interposer for a chip package using deformable button contacts
#11827Selective passivation of exposed silicon
#11828Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same
#11829Method for fabricating semiconductor device and apparatus for fabricating the same
#11830Method of fabricating a pad over active circuit I.C. with meshed support structure
#11831Method of forming solder bump with reduced surface defects
#11832Method for fabricating a chip scale package using wafer level processing
#11833Method for processing an integrated circuit
#11834Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the same
#11835Direct writeTM system
#11836Semiconductor device and manufacturing method of them
#11837Method for mounting a driver IC chip and a FPC board/TCP/COF device using a single anisotropic conductive film
#11838Driver chip and display apparatus having the same
#11839Method and apparatus for underfilling semiconductor devices
#11840Chip and multi-chip semiconductor device using thereof and method for manufacturing same
#11841Adhesion by plasma conditioning of semiconductor chip
#11842Package structure having semiconductor device embedded within wiring board
#11843Method and structure to reduce risk of gold embrittlement in solder joints
#11844Semiconductor device
#11845Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus
#11846Method of fabricating a semiconductor package utilizing a thermosetting resin base member
#11847Semiconductor device with a solder creep-up prevention zone
#11848Semiconductor device having conducting portion of upper and lower conductive layers
#11849Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#11850Room temperature metal direct bonding
#11851Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate
#11852Semiconductor device and stacked semiconductor device that can increase flexibility in designing a stacked semiconductor device
#11853Junction member comprising junction pads arranged in matrix and multichip package using same
#11854Semiconductor device
#11855Method for manufacturing circuit board, circuit board, and electronic equipment
#11856HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF
#11857Method of making wireless semiconductor device, and leadframe used therefor
#11858Interconnect structure for power transistors
#11859Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
#11860ULTRA-FINE CONTACT ALIGNMENT
#11861Method and apparatus for forming metal contacts on a substrate
#11862Microparticle loaded solder preform allowing bond site control of device spacing at micron, submicron, and nanostructure scale
#11863Method and resulting structure for manufacturing semiconductor substrates
#11864Method of manufacturing high performance copper inductors with bond pads
#11865Method of forming segmented ball limiting metallurgy
#11866Hermetic passivation structure with low capacitance
#11867Manufacturing method for resin sealed semiconductor device
#11868Semiconductor device and method of fabricating the same
#11869Device transferring method
#11870Device transferring method
#11871Device transferring method
#11872Process of fabricating polymer sustained microelectrodes
#11873Resin composition for encapsulating semiconductor
#11874Structure and method for temporarily holding integrated circuit chips in accurate alignment
#11875Method for manufacturing optical module, optical communication device, and electronic device
#11876Electronic device and production method thereof
#11877Spatial light modulators with light blocking/absorbing areas
#11878Driver chip and display apparatus including the same
#11879Polymer sustained microelectrodes
#11880Display unit
#11881Damascene interconnection and semiconductor device
#11882Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same
#11883Colored conductive wires for a semiconductor package
#11884Die attach by temperature gradient lead free soft solder metal sheet or film
#11885Method for manufacturing connection construction
#11886Process for producing a semiconductor device
#11887Integrated device including connections on a separate wafer
#11888Semiconductor integrated circuit device
#11889Semiconductor device including semiconductor elements mounted on base plate
#11890Reduced size semiconductor package with stacked dies
#11891Flipchip QFN package
#11892Integrated circuit packages with sandwiched capacitors
#11893Semiconductor device
#11894Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance
#11895Semiconductor device using LED chip
#11896Test assembly including a test die for testing a semiconductor product die
#11897Mounting board and electronic device using same
#11898Electronic component mounting method and apparatus
#11899Device transferring method, and device arraying method and image display unit fabricating method using the same
#11900Methods of making microelectronic assemblies
#11901Method for compensating for CTE mismatch using phase change lead-free super plastic solders
#11902Wafer level chip stack method
#11903Carrier, method of manufacturing a carrier and an electronic device
#11904Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof
#11905Interconnect circuitry, multichip module, and methods for making them
#11906Method of embedding components in multi-layer circuit boards
#11907Cooling devices and methods of using them
#11908Adhesive film for circuit connection, and circuit connection structure
#11909Materials for electronic devices
#11910UBM for fine pitch solder ball and flip-chip packaging method using the same
#11911Semiconductor device and method of manufacturing the same
#11912Semiconductor device
#11913Bonding wire and an integrated circuit device using the same
#11914Mounting substrate and electronic component using the same
#11915Semiconductor device and manufacturing method thereof
#11916Semiconductor device and manufacturing method for the same
#11917Electronic device having wiring substrate and lead frame
#11918LED substrate
#11919Semiconductor device, optoelectronic board, and production methods therefor
#11920Bumping electronic components using transfer substrates
#11921System and method for increasing the strength of a bond made by a small diameter wire in ball bonding
#11922Arrangement for wire bonding and method for producing a bonding connection
#11923Method for producing an electronic device connected to a printed circuit board
#11924Electronic device and method for producing the same
#11925Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate
#11926Lithographic contact elements
#11927Photoresist process to enable sloped passivation bondpad openings for ease of metal step coverings
#11928Semiconductor device and manufacturing method thereof
#11929Encapsulated semiconductor components and methods of fabrication
#11930Capacitor device and method of manufacturing the same
#11931Method of manufacturing semiconductor device
#11932Micro lead frame package having transparent encapsulant
#11933Semiconductor chip with external connecting terminal
#11934Semiconductor chip with external connecting terminal
#11935Wafer stacking with anisotropic conductive adhesive
#11936Semiconductor device and semiconductor module
#11937Semiconductor device and method of manufacturing the same
#11938Method for fabricating a semiconductor interconnect having conductive spring contacts
#11939Method of forming a bonding pad structure
#11940Semiconductor chip with external connecting terminal
#11941Low profile stacking system and method
#11942Solder ball pad structure
#11943Semiconductor element having protruded bump electrodes
#11944Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same
#11945Method of fabricating a pad over active circuit I.C. with frame support structure
#11946Semiconductor device
#11947Multi-part lead frame with dissimilar materials
#11948Semiconductor device
#11949Surface mount package
#11950Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area
#11951Strobe light control circuit and IGBT device
#11952Apparatus and methods for an underfilled integrated circuit package
#11953Method of forming bump pad of flip chip and structure thereof
#11954Method of disposing conductive bumps onto a semiconductor device and semiconductor devices so formed
#11955Method of manufacturing a semiconductor device by using a matrix frame
#11956Induction-based heating for chip attach
#11957Semiconductor device with intermediate connector
#11958Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device
#11959Electrical connection of components
#11960Dual band power amplifier module for wireless communication devices
#11961Fabrication methods for electronic system modules
#11962Semiconductor device, manufacturing method thereof and electronic equipment
#11963Method of manufacturing a semiconductor device
#11964Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same
#11965Semiconductor device and method of fabricating the same
#11966Thermal intermediate apparatus, systems, and methods
#11967Methods of making microelectronic assemblies including compliant interfaces
#11968Semiconductor chip package and multichip package
#11969Method of manufacturing a semiconductor device
#11970High-frequency device
#11971Dicing die-bonding film
#11972Semiconductor package with increased number of input and output pins
#11973Methods for depositing, releasing and packaging microelectromechanical devices on wafer substrates
#11974Package structure for semiconductor
#11975Nanotube modified solder thermal intermediate structure, systems, and methods
#11976Wire bonder for ball bonding insulated wire and method of using same
#11977Mounting device and method thereof
#11978Method to remove fluorine residue from bond pads
#11979Semiconductor device and fabrication method thereof
#11980Methods of providing solder structures for out plane connections
#11981Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same
#11982Method for manufacturing metal structure having different heights
#11983Process for producing optical semiconductor device
#11984Chip packaging compositions, packages and systems made therewith, and methods of making same
#11985Various structure/height bumps for wafer level-chip scale package
#11986Semiconductor module with a semiconductor stack, and methods for its production
#11987Wire loop grid array package
#11988Metal article intended for at least partially coating with a substance and a method for producing the same
#11989Method of assembling a ball grid array package with patterned stiffener layer
#11990Dual semiconductor die package with reverse lead form
#11991Microelectronic assemblies with composite conductive elements
#11992Semiconductor package with a flip chip on a solder-resist leadframe
#11993Manufacturing method of a semiconductor device
#11994Lead frame structure with aperture or groove for flip chip in a leaded molded package
#11995Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portions
#11996System and method for increasing the ball pitch of an electronic circuit package
#11997Semiconductor device having pad structure for preventing and buffering stress of silicon nitride film
#11998Method for manufacturing semiconductor device, adhesive sheet for use therein and semiconductor device
#11999Opto-electronic assembly having an encapsulant with at least two different functional zones
#12000Nitride semiconductor light emitting device