212030 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Vanadium [V]
Multi-function and shielded 3D interconnects
#602Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device
#603Printed wiring board
#604Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
#605Apparatus and methods for high-density chip connectivity
#606Semiconductor device and method of manufacturing the same
#607Semiconductor package and method for manufacturing the same
#608STACK PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#609Semiconductor device
#610Semiconductor device having pad structure with stress buffer layer
#611Semiconductor module and method for production thereof
#612POWER SEMICONDUCTOR MODULE HAVING SINTERED METAL CONNECTIONS, PREFERABLY SINTERED SILVER CONNECTIONS, AND PRODUCTION METHOD
#613Power semiconductor chip package
#614Apparatus and method configured to lower thermal stresses
#615DICING DIE BOND FILM
#616Control device of semiconductor device
#617Alignment marks in substrate having through-substrate via (TSV)
#618Contacting means and method for contacting electrical components
#619Use of Aliphatic Hydrocarbons and Paraffins as Solvents for Silver Sinter Pastes
#620SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#621Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the same
#622Semiconductor device
#623Semiconductor device
#624ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER
#625Multilevel interconnection system
#626Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate
#627Semiconductor module system having stacked components with encapsulated through wire interconnects (TWI)
#628WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER
#629Mechanisms for forming copper pillar bumps using patterned anodes
#630Process for making conductive post with footing profile
#631Method for producing a semiconductor element
#632Repairable semiconductor device and method
#633VERTICALLY CONTACTED ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME
#634Semiconductor device and method of producing same
#635Process for chip capacitive coupling
#636Side wettable plating for semiconductor chip package
#637Semiconductor device having a conductive layer reliably formed under an electrode pad
#638Flexible micro-system and fabrication method thereof
#639Semiconductor device and method for producing such a device
#640DETECTION DEVICE, LIGHT-RECEIVING ELEMENT ARRAY, SEMICONDUCTOR CHIP, METHOD FOR MANUFACTURING THE SAME, AND OPTICAL SENSOR APPARATUS
#641Printed wiring board and a method of manufacturing a printed wiring board
#642Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device
#643LIQUID ENCAPSULATING RESIN COMPOSITION, SEMICONDUCTOR DEVICE USING LIQUID ENCAPSULATING RESIN COMPOSITION, AND METHOD OF MANUFACTURING THE SAME
#644Film for flip chip type semiconductor back surface
#645Three-dimensional integrated circuit structure having improved power and thermal management
#646Solder interconnect on IC chip
#647Microelectronic packages with nanoparticle joining
#648Power semiconductor device
#649Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same
#650Optical connection through single assembly overhang flip chip optics die with micro structure alignment
#651Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production
#652Method for forming terminal of stacked package element and method for forming stacked package
#653Microelectronic elements with post-assembly planarization
#654Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device
#655Semiconductor device with conductive vias between saw streets
#656Semiconductor device and method of conforming conductive vias between insulating layers in saw streets
#657Methods of forming semiconductor elements using micro-abrasive particle stream
#658SEMICONDUCTOR DEVICE WITH INDUCTOR AND FLIP-CHIP
#659Semiconductor device and method of forming stress relief layer between die and interconnect structure
#660Method and package for circuit chip packaging
#661Method of assembling shielded integrated circuit device
#662Metal-contamination-free through-substrate via structure
#663Semiconductor device for driving electric motor
#664Semiconductor device package and method of assembly thereof
#665Methods of forming bonded semiconductor structures using a temporary carrier having a weakened ion implant region for subsequent separation along the weakened region
#666Methods of forming bonded semiconductor structures
#667Semiconductor device having an interconnect structure with TSV using encapsulant for structural support
#668Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device
#669INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS
#670THERMAL FLEX CONTACT CARRIERS #2
#671Solder bump with inner core pillar in semiconductor package
#672Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
#673Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the same
#674Multi-chip package including chip address circuit
#675Backside processing of semiconductor devices
#676SEMICONDUCTOR ELEMENT AND FABRICATION METHOD THEREOF
#677Method of forming Cu pillar capped by barrier layer
#678Semiconductor device
#679Semiconductor device
#680Semiconductor device having a capacitor
#681Multilayered printed circuit board and method for manufacturing the same
#682Method of manufacturing printed wiring board
#683Method for manufacture of integrated circuit package system with protected conductive layers for pads
#684Internal packaging of a semiconductor device mounted on die pads
#685CORROSION-RESISTANT COPPER-TO-ALUMINUM BONDS
#686Structure and process for the formation of TSVs
#687Semiconductor package and method of forming similar structure for top and bottom bonding pads
#688Semiconductor module and method of manufacturing the same
#689Semiconductor device and manufacturing method thereof
#690Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device
#691CIRCUIT MODULE
#692Printed circuit board manufacturing method
#693Semiconductor integrated circuit device
#694Electronic device comprising a nanotube-based interface connection layer, and manufacturing method thereof
#695Method of mounting electronic component and mounting substrate
#696Electronic devices with yielding substrates
#697Method for manufacturing a multilayered circuit board
#698Manufacturing method for semiconductor devices
#699MICROSTRUCTURE AND MICROSTRUCTURE PRODUCTION METHOD
#700Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system
#701Three-dimensional semiconductor integrated circuit
#702Voltage Spike Protection for Power DMOS Devices
#703Insulating member, metal base substrate, and semiconductor module, and manufacturing methods thereof
#704Semiconductor package having gap-filler injection-friendly structure
#705Packaged semiconductor device having improved locking properties
#706Semiconductor device, a method of manufacturing the same and an electronic device
#707Method of producing semiconductor device packaging having chips attached to islands separately and covered by encapsulation material
#708Method of cutting semiconductor substrate via modified region formation and subsequent sheet expansion
#709Semiconductor integrated circuit device and method of manufacturing the same
#710SEMICONDUCTOR CHIP WITH THROUGH ELECTRODES AND METHOD FOR MANUFACTURING THE SAME
#711MULTILAYER PRINTED WIRING BOARD
#712Surface mountable device
#713Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes
#714Cu pillar bump with non-metal sidewall spacer and metal top cap
#715Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die
#716SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#717AC switch having compound semiconductor MOSFETs
#7183D semiconductor device
#719Reception circuit and signal reception method
#720Semiconductor integrated circuit having a multi-chip structure
#721Manufacturing method for semiconductor integrated device
#722SEMICONDUCTOR PACKAGE HAVING SIDE WALLS AND METHOD FOR MANUFACTURING THE SAME
#723ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE
#724Semiconductor module device and driving apparatus having the same
#725Bump structure and fabrication method thereof
#726Cu pillar bump with L-shaped non-metal sidewall protection structure
#727Package systems having interposers with interconnection structures
#728Semiconductor device, semiconductor unit, and power semiconductor device
#729Near chip scale semiconductor packages
#730ADHESIVE BONDING SHEET, SEMICONDUCTOR DEVICE USING SAME, AND METHOD FOR MANUFACTURING SUCH SEMICONDUCTOR DEVICE
#731Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
#732Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#733Chip structure and process for forming the same
#734Semiconductor device
#735Semiconductor substrate structure and semiconductor device
#736Method of fabricating bump structure
#737Internal matching transistor
#738Bonding wire profile for minimizing vibration fatigue failure
#739Semiconductor Device with Circuit for Reduced Parasitic Inductance
#740Semiconductor unit having a power semiconductor and semiconductor apparatus using the same
#741Method for disposing a microstructure
#742PATTERNED CONTACT
#743Semiconductor device
#744Integrated circuit with supply line intra-chip clock interface and methods for use therewith
#745Electronic module and method for producing an electric functional layer on a substrate by blowing powder particles of an electrically conductive material
#746Die backside standoff structures for semiconductor devices
#747Hermetic wafer-to-wafer bonding with electrical interconnection
#748HERMETIC WAFER-TO-WAFER BONDING WITH ELECTRICAL INTERCONNECTION
#749Gold-tin etch using combination of halogen plasma and wet etch
#750Semiconductor device and manufacturing method thereof
#751Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#752Carbon nanotube circuit component structure
#753Laser etch via formation
#754WAFER LEVEL CHIP SCALE PACKAGE WITH ANNULAR REINFORCEMENT STRUCTURE
#755Cu pillar bump with non-metal sidewall protection structure
#756Method of forming nanoscale three-dimensional patterns in a porous material
#757Electromagnetic interference shielding on semiconductor devices
#758Die package
#759Cu pillar bump with electrolytic metal sidewall protection
#760Semiconductor device and method of wafer level package integration
#761Method for fabricating bump structure without UBM undercut
#762Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape
#763Chip package structure and method of making the same
#764Apparatus with a multi-layer coating and method of forming the same
#765Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel
#766Inverse chip connector
#767METHOD AND APPARATUS FOR FABRICATING INTEGRATED CIRCUIT DEVICE USING SELF-ORGANIZING FUNCTION
#768Package substrate and fabricating method thereof
#769Methods and apparatus for measuring analytes using large scale FET arrays
#770Methods and apparatus for measuring analytes using large scale FET arrays
#771Adhesive for bonding circuit members, circuit board and process for its production
#772Adhesive for bonding circuit members, circuit board and process for its production
#773Adhesive for bonding circuit members, circuit board and process for its production
#774THREE-DIMENSIONAL STRUCTURES AND METHODS OF FABRICATING THE SAME USING A PRINTING PLATE
#775APPARATUS FOR PREDETERMINED COMPONENT PLACEMENT TO A TARGET PLATFORM
#776EPOXY RESIN COMPOSITION FOR SEALING PACKING OF SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF
#777LIQUID RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
#778Wire bonding structure of semiconductor device and wire bonding method
#779Semiconductor package
#780Monolithic semiconductor switches and method for manufacturing
#781Methods and apparatus for measuring analytes using large scale FET arrays
#782Thermo-compression bonded electrical interconnect structure and method
#783Electronic device wafer level scale packages and fabrication methods thereof
#784Voltage converter
#785STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE
#786Methods and systems for material bonding
#787Semiconductor device
#788Semiconductor chip with coil element over passivation layer
#789Integrated circuit system with stress redistribution layer and method of manufacture thereof
#790Cu pillar bump with non-metal sidewall protection structure
#791SEMICONDUCTOR DEVICE
#792Semiconductor device
#793Integrated circuit packages
#794Semiconductor chip having double bump structure and smart card including the same
#795Micro-fluidic injection molded solder (IMS)
#796Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel
#797Methods and apparatus for measuring analytes using large scale FET arrays
#798Fabrication method for integrated circuit chip component, multi-chip module, and their integration structure
#799Coupling heat sink to integrated circuit chip with thermal interface material
#800MULTI-FUNCTION CARD DEVICE
#801Embedded die with protective interposer
#802Vertical MOSFET with through-body via for gate
#803Power MOS transistor device and switch apparatus comprising the same
#804Fabrication method for resin-encapsulated semiconductor device
#805Pin-type chip tooling
#806Method of sensing magnitude of current through semiconductor power device
#807Process for fabricating electronic components using liquid injection molding
#808Method for fabricating circuit component
#809METHOD FOR FORMING A DOUBLE EMBOSSING STRUCTURE
#810Stacked semiconductor chips with separate encapsulations
#811Nanotube Materials for Thermal Management of Electronic Components
#812Rigid-backed, membrane-based chip tooling
#813Assembled multi-component electronic apparatus using alignment and reference marks
#814Carbon nanotubes for the selective transfer of heat from electronics
#815High Frequency Power Supply Module Having High Efficiency and High Current
#816Die bond film, dicing die bond film, and semiconductor device
#817Methods of forming a metal pattern and semiconductor device structure
#818Method for placing a component onto a target platform by an apparatus using a probe
#819SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
#820Formation method of metallic electrode of semiconductor device and metallic electrode formation apparatus
#821Device including an encapsulated semiconductor chip and manufacturing method thereof
#822Semiconductor device and method of forming IPD in fan-out level chip scale package
#823Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier
#824RFID integrated circuit with integrated antenna structure
#825Lead frame ball grid array with traces under die
#826Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device
#827Semiconductor device and electronic device
#828Semiconductor device and method of patterning resin insulation layer on substrate of the same
#829Semiconductor chip with a bonding pad having contact and test areas
#830Nitride semiconductor element and method for production thereof
#831Flux-free chip to wafer joint serial thermal processor arrangement
#832Method of Magnetically Driven Simultaneous Assembly
#833Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore
#834Rule-based semiconductor die stacking and bonding within a multi-die package
#835ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIVE SHEET AND SEMICONDUCTOR DEVICE
#836Bonded structure with enhanced adhesion strength
#837Lead free solder interconnections for integrated circuits
#838Semiconductor device and semiconductor assembly with lead-free solder
#839Manufacturing of a device including a semiconductor chip
#840Vertical LED chip package on TSV carrier
#841Micro-fluidic injection molded solder (IMS)
#842Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device
#843Integrated circuits having TSVs including metal gettering dielectric liners
#844Solder bump interconnect
#845GAAS INTEGRATED CIRCUIT DEVICE AND METHOD OF ATTACHING SAME
#846LED package, method for manufacturing LED package, and packing member for LED package
#847LED PACKAGE
#848Electronic device and manufacturing method of the same
#849Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip
#850Polishing solution for CMP, and method for polishing substrate using the polishing solution for CMP
#851Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
#852Multilayer printed circuit board
#853Method for Producing Semiconductor Chips and Corresponding Semiconductor Chip
#854Bonded structure and manufacturing method for bonded structure
#855PACKAGE ASSEMBLY HAVING A SEMICONDUCTOR SUBSTRATE
#856ELEMENT MOUNTING BOARD, SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING THE ELEMENT MOUNTING BOARD, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
#8574D device process and structure
#858Dual Interconnection in Stacked Memory and Controller Module
#859Through-silicon via formed with a post passivation interconnect structure
#860Manufacturing method of lead frame substrate and semiconductor apparatus
#861Die package including multiple dies and lead orientation
#862Semiconductor device including a DC-DC converter having a metal plate
#863Bond pad connection to redistribution lines having tapered profiles
#864Apparatus and method for predetermined component placement to a target platform
#865METHOD FOR MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE, AND STACKED SEMICONDUCTOR PACKAGE
#866PB-free solder bumps with improved mechanical properties
#867Semiconductor device
#868Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film
#869PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE FILM ADHESIVE, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT
#870Dicing tape-integrated film for semiconductor back surface
#871PAD STRUCTURE AND INTEGRATED CIRCUIT CHIP WITH SUCH PAD STRUCTURE
#872Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip
#873Wiring board capable of containing functional element and method for manufacturing same
#874Circuit board and its wire bonding structure
#875PHOTOSENSITIVE ADHESIVE COMPOSITION, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER AND SEMICONDUCTOR DEVICE USING THE PHOTOSENSITIVE ADHESIVE COMPOSITION
#876Method for producing a non-plane element
#877Contact-based encapsulation
#878Lead frame land grid array with routing connector trace under unit
#879Pre-soldered leadless package
#880Semiconductor chip device with solder diffusion protection
#881Manufacturing method for semiconductor device
#882Semiconductor connection component
#883Method of room temperature covalent bonding
#884Semiconductor device and method of forming PiP with inner known good die interconnected with conductive bumps
#885Method for manufacturing semiconductor device
#886ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME
#887Conductor bump method and apparatus
#888Semiconductor device having heat radiating configuration
#889Multi-chip stacked package and its mother chip to save interposer
#890Semiconductor device with sealed semiconductor chip
#891Heat radiation member for a semiconductor package with a power element and a control circuit
#892METAL PARTICLES-DISPERSED COMPOSITION AND FLIP CHIP MOUNTING PROCESS AND BUMP-FORMING PROCESS USING THE SAME
#893Method of manufacturing a laminate electronic device including separating a carrier into a plurality of parts
#894Semiconductor package having a stacked wafer level package and method for fabricating the same
#895Semiconductor Device and Method of Forming Bump Structure with Multi-Layer UBM Around Bump Formation Area
#896ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME
#8973D interconnection structure and method of manufacturing the same
#898Substrate holder and plating apparatus
#899Manufacturing method of semiconductor device
#900Method of Fabricating Semiconductor Die with Through-Hole Via on Saw Streets and Through-Hole Via in Active Area of Die