212030 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Vanadium [V]
Apparatus and method for predetermined component placement to a target platform
#902Bonding connection between a bonding wire and a power semiconductor chip
#903Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingers
#904Electronic device and electronic apparatus
#905ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME
#906Semiconductor device and structure
#907Method for assembling a multi-component electronic apparatus
#908Apparatus and method for predetermined component placement to a target platform
#909Apparatus and method for predetermined component placement to a target platform
#910Programmable capacitor associated with an input/output pad
#911Fabrication of electronic devices including flexible electrical circuits
#912MICROSTRUCTURE, AND METHOD FOR PRODUCTION THEREOF
#913Method for manufacturing a plurality of thin chips and correspondingly manufactured thin chip
#914Interconnect with flexible dielectric layer
#915Lead-free solder connection structure and solder ball
#916Bumping free flip chip process
#917WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION
#918Power semiconductor module and method for operating a power semiconductor module
#919Circuit-connecting material and circuit terminal connected structure and connecting method
#920Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer
#921Wiring forming method
#922Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
#923Integrated-circuit package for proximity communication
#924Laminate electronic device
#925Packaging device and base member for packaging
#926Method of manufacturing a semiconductor device having a heat spreader
#927Manufacturing method of semiconductor device
#928SUBSTRATE MEMBER, MODULE, ELECTRIC EQUIPMENT, AND MANUFACTURING METHOD OF MODULES
#929Indium compositions
#930Power semiconductor module and method for operating a power semiconductor module
#931Microelectronic assembly with impedance controlled wirebond and conductive reference element
#932Mechanisms for forming copper pillar bumps
#933Copper bump joint structures with improved crack resistance
#934Semiconductor device with bump interconnection
#935PILLAR BUMP WITH BARRIER LAYER
#936Post passivation interconnect with oxidation prevention layer
#937Robust joint structure for flip-chip bonding
#938Power module assembly with reduced inductance
#939Manufacturing method for semiconductor integrated device
#940Thermo-compression bonded electrical interconnect structure
#941Semiconductor package and method for fabricating the same
#942Method and apparatus for semiconductor device fabrication using a reconstituted wafer
#943Semiconductor device
#944Wirebond-less semiconductor package
#945Microelectronic assembly with impedance controlled wirebond and conductive reference element
#946Semiconductor device, method of manufacturing the same, and wireless transmission system utilizing the same
#947Semiconductor chip, stack module, and memory card
#948Preventing UBM oxidation in bump formation processes
#949Method of manufacturing a three dimensional integrated circuit by transfer of a mono-crystalline layer
#950Method for manufacturing and testing an integrated electronic circuit
#951DOUBLE-LAYERED PATTERNABLE ADHESIVE FILM, METHOD OF FORMING THE SAME, AND METHOD OF FORMING PATTERNABLE ADHESIVE LAYER USING THE SAME
#952SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF
#953Apparatus and method configured to lower thermal stresses
#954Interposer Based Monolithic Microwave Integrate Circuit (iMMIC)
#955Mounting apparatus
#956ASSEMBLY OF SEMICONDUCTOR CHIPS/WAFERS
#957Semiconductor element mounting board
#958Pad bonding employing a self-aligned plated liner for adhesion enhancement
#959Electrical connection for multichip modules
#960Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers
#961Semiconductor device
#962Designs and methods for conductive bumps
#963Chip having a metal pillar structure
#964Device including a semiconductor chip and a carrier and fabrication method
#965Manufacturing method for semiconductor devices
#966Surface modification for handling wafer thinning process
#967Vertically stackable dies having chip identifier structures
#968Semiconductor device having a copper plug
#969Die stacking system and method
#970Method of manufacturing a semiconductor component and structure
#971Semiconductor device
#972Back side metallization with superior adhesion in high-performance semiconductor devices
#973SEMICONDUCTOR DEVICE AND METHOD FOR MOUNTING SEMICONDUCTOR DEVICE
#974Semiconductor device with overlapped lead terminals
#975Mechanical coupling in a multi-chip module using magnetic components
#976RF transistor packages with internal stability network including intra-capacitor resistors and methods of forming RF transistor packages with internal stability networks including intra-capacitor resistors
#977Package process and package structure
#978Semiconductor power module package with temperature sensor mounted thereon and method of fabricating the same
#979SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#980Plating apparatus
#981ELECTRONIC DEVICE AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE
#982Template and pattern forming method
#983Fabrication method of semiconductor device having conductive bumps
#9843D smart power module
#985Device and manufacturing method
#986Wafer backside interconnect structure connected to TSVs
#987Semiconductor package and method of manufacturing the semiconductor package
#988METHOD OF BONDING PARTS TO SUBSTRATE USING SOLDER PASTE
#989Method for low temperature bonding and bonded structure
#990Process for producing a contact area of an electronic component
#991Stacked-die package including substrate-ground coupling
#992Protection layer for preventing UBM layer from chemical attack and oxidation
#993Substrate and package with micro BGA configuration
#994Interconnection of land section to wiring layers at center of external connection terminals in semiconductor device and manufacturing thereof
#995Non-volatile memory with reduced mobile ion diffusion
#996Circuit module and method of manufacturing the same
#997Method of manufacturing a printed wiring board
#998High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same
#999Power semiconductor module
#1000Semiconductor device and manufacturing method therefor
#1001Semiconductor Chip with Stair Arrangement Bump Structures
#1002Impedance optimized chip system
#1003Method of manufacturing semiconductor device and semiconductor device
#1004LED WITH PHOSPHOR TILE AND OVERMOLDED PHOSPHOR IN LENS
#1005Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
#1006Semiconductor device, and power conversion device using semiconductor device
#1007Method for producing a hermetically sealed, electrical feedthrough using exothermic nanofilm
#1008Semiconductor chip with contoured solder structure opening
#1009Integrated circuits having TSVs including metal gettering dielectric liners
#1010Wafer Level Stacked Die Packaging
#1011Front side copper post joint structure for temporary bond in TSV application
#1012Self-aligned protection layer for copper post structure
#1013Semiconductor device that performs signal transmission using induction coupling, method of said manufacturing semiconductor device, and lead frame thereof
#1014Bonding pad structure and integrated circuit chip using such bonding pad structure
#1015Resin sheet for circuit boards, sheet for circuit boards and circuit board displays
#1016Photosensitive adhesive
#1017High frequency circuit having multi-chip module structure
#1018Electronic component and manufacturing method thereof
#1019Semiconductor device
#1020Extendable connector and network
#1021Layered chip for use in soldering
#1022BONDING STRUCTURES AND METHODS OF FORMING BONDING STRUCTURES
#1023SEMICONDUCTOR DEVICE AND ON-VEHICLE AC GENERATOR
#1024Semiconductor device with pad with less diffusible contacting surface and method for production of the semiconductor device
#1025Composite silver nanoparticle, composite silver nanopaste, bonding method and patterning method
#1026Room temperature metal direct bonding
#1027Semiconductor device
#1028Semiconductor device
#1029Integrated circuit
#1030Electronic structures including barrier layers and/or oxidation barriers defining lips and related methods
#1031Method and package for circuit chip packaging
#1032Device including a ring-shaped metal structure and method
#1033Electrostatic chucking of an insulator handle substrate
#1034Implantable electrode array assembly including a carrier in which control modules for regulating the operation of the electrodes are disposed and electrodes that are disposed on top of the carrier
#1035Structure and process for the formation of TSVs
#1036Tie-bar configuration for leadframe type carrier strips
#1037Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device
#1038Semiconductor devices having stress relief layers and methods for fabricating the same
#1039Method of manufacturing a semiconductor device
#1040Semiconductor device including first and second carriers
#1041Process of forming an electronic device including a conductive stud over a bonding pad region
#1042System-in packages
#1043Multi-die package
#1044METALLURGY FOR COPPER PLATED WAFERS
#1045Manufacturing method of semiconductor device and semiconductor device
#1046Stacked semiconductor package and method for manufacturing the same
#1047Stackable Package By Using Internal Stacking Modules
#1048High frequency field-effect transistor
#1049Semiconductor Substrates, Devices and Associated Methods
#1050System with semiconductor components having encapsulated through wire interconnects (TWI)
#1051Semiconductor package and method of manufacturing the same
#1052Process for making contact with and housing integrated circuits
#1053TEST CIRCUIT UNDER PAD
#1054Vacuum coupled tool apparatus for dry transfer printing semiconductor elements
#1055Semiconductor device
#1056Semiconductor device
#1057Air cavity package with copper heat sink and ceramic window frame
#1058Bonding wire for semiconductor devices
#1059Copper alloy bonding wire for semiconductor device
#1060Near chip scale package integration process
#1061RESIN VARNISH USED FOR ADHESIVE FILM FOR SEMICONDUCTOR ELEMENT, ADHESIVE FILM FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE
#1062NICKEL-TITANUM CONTACT LAYERS IN SEMICONDUCTOR DEVICES
#1063Connect and capacitor substrates in a multilayered substrate structure coupled by surface coulomb forces
#1064Method of manufacturing a semiconductor device
#1065Method of making an integrated circuit package with shielding via ring structure
#1066Semiconductor optical interconnection device and semiconductor optical interconnection method
#1067Method and structure for adhesion of intermetallic compound (IMC) on Cu pillar bump
#1068Semiconductor device and a method of manufacturing the same
#1069Method of assembling a multi-component electronic package
#1070Power converter integrated circuit floor plan and package
#1071Multi-segments modeling bond wire interconnects with 2D simulations in high speed, high density wire bond packages
#1072Formation of TSV backside interconnects by modifying carrier wafers
#1073Adhesive, method of connecting wiring terminals and wiring structure
#1074Printed circuit board
#1075Stacked structures and methods of fabricating stacked structures
#1076Semiconductor device bonding wire and wire bonding method
#1077JOINING STRUCTURE AND A SUBSTRATE-JOINING METHOD USING THE SAME
#1078Near chip scale semiconductor packages
#1079Semiconductor chip, method of fabricating the same, and stack module and memory card including the same
#1080Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
#1081Bond pad with integrated transient over-voltage protection
#1082ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE
#1083Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member
#1084Semiconductor device and manufacturing method thereof
#1085Fabrication method of semiconductor device having conductive bumps
#1086ULTRASONIC BONDING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
#1087Multilayer printed wiring board
#1088Electronic component built-in wiring substrate
#1089Semiconductor device
#1090Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die
#1091Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure
#1092Semiconductor chip passivation structures and methods of making the same
#1093Methods to fabricate integrated circuits by assembling components
#1094Package-on-package technology for fan-out wafer-level packaging
#1095Processes and structures for IC fabrication
#1096Methods for interconnecting bonding pads between components
#1097Processes and structures for IC fabrication
#1098Processes and structures for beveled slope integrated circuits for interconnect fabrication
#1099High-voltage semiconductor device
#1100Processes for IC fabrication
#1101Processes and structures for IC fabrication
#1102METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#1103MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#1104Metallic electrode forming method and semiconductor device having metallic electrode
#1105Method for making an electrically conducting mechanical interconnection member
#1106Method for manufacturing hetero-bonded wafer
#1107Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support
#1108Semiconductor device, semiconductor wafer and manufacturing method of the same
#1109UNIFIED SCALABLE HIGH SPEED INTERCONNECTS TECHNOLOGIES
#1110Processed wafer via
#1111Source driver, method for manufacturing same, and liquid crystal module
#1112Stacked package and method for forming stacked package
#1113CONDUCTIVE BUMP STRUCTURE FOR SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
#1114Method for producing electric contacts on a semiconductor component
#1115Power electronic device
#1116METHOD FOR MANUFACTURING NITRIDE BASED SINGLE CRYSTAL SUBSTRATE AND METHOD FOR MANUFACTURING NITRIDE BASED SEMICONDUCTOR DEVICE
#1117ADHESIVE FILM
#1118Semiconductor package, lead frame, and wiring board with the same
#1119System-in packages
#1120Semiconductor component and assumbly with projecting electrode
#11213D integration structure and method using bonded metal planes
#1122Semiconductor device
#1123Semiconductor device
#1124Die down ball grid array packages and method for making same
#1125Connecting film, and joined structure and method for producing the same
#1126Antennas using chip-package interconnections for millimeter-wave wireless communication
#1127Ohmic Contact Having Silver Material
#1128Semiconductor device driving bridge-connected power transistor
#1129DIE ATTACH FILM-PROVIDED DICING TAPE AND PRODUCTION PROCESS OF SEMICONDUCTOR DEVICE
#1130Semiconductor device
#1131Wafer backside structures having copper pillars
#1132Optoelectronic semiconductor chip, optoelectronic component and a method for producing an optoelectronic component
#1133Semiconductor package including power ball matrix and power ring having improved power integrity
#1134High quality electrical contacts between integrated circuit chips
#1135Dual Interconnection in Stacked Memory and Controller Module
#1136Power lead-on-chip ball grid array package
#1137Method for Mounting Flip Chip and Substrate Used Therein
#1138Semiconductor device and method for manufacturing the same
#1139Carbon nanotubes for the selective transfer of heat from electronics
#1140Receive circuit for connectors with variable complex impedance
#1141Method of forming an inductor on a semiconductor wafer
#1142High breakdown voltage semiconductor device and high voltage integrated circuit
#1143Metal wiring structures for uniform current density in C4 balls
#1144THERMOSETTING DIE BONDING FILM
#1145SEMICONDUCTOR DEVICE
#1146Assembling substrates that can form 3-D structures
#1147Ball-limiting-metallurgy layers in solder ball structures
#1148Semiconductor die package and method for making the same
#1149SEMICONDUCTOR DEVICE AND IMAGING DEVICE USING THE SEMICONDUCTOR DEVICE
#1150SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME
#1151Semiconductor device with I/O cell and external connection terminal and method of manufacturing the same
#1152Joining method and device produced by this method and joining unit
#1153Methods and apparatuses for assembling components onto substrates
#1154Method of fabricating a semiconductor device
#1155Self-Aligned Chip Stacking
#1156Integrated circuit chip using top post-passivation technology and bottom structure technology
#1157Method and apparatus for distributing a thermal interface material
#1158Semiconductor device and method of forming a thin wafer without a carrier
#1159Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability
#1160Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure
#1161Semiconductor device and manufacturing method therefor
#1162Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
#1163Film-like adhesive, adhesive sheet, and semiconductor device using same
#1164Power module
#1165Structure and Method for Thin Single or Multichip Semiconductor QFN Packages
#1166Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads
#1167PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS HAVING A PRINTED CIRCUIT BOARD
#1168Method for forming functional element using metal-to-insulator transition material, functional element formed by method, method for producing functional device, and functional device produced by method
#1169Method for bonding wafers to produce stacked integrated circuits
#1170Reconfigured wafer alignment
#1171Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication
#1172Semiconductor device
#1173Microelectronic assembly with impedance controlled wirebond and conductive reference element
#1174Flip chip semiconductor package and fabrication method thereof
#1175Semiconductor device including spacer element
#1176SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#1177Conductive ball mounting apparatus and conductive ball mounting method
#1178Joint Structure Between a Wound Coil and An IC-Chip for a Noncontact RFID Device and Methods of Manufacturing The Same
#1179Printed circuit board and method of manufacturing printed circuit board
#1180Integrated circuit for driving semiconductor device and power converter
#1181MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
#1182Stress buffering package for a semiconductor component
#1183Stress barrier structures for semiconductor chips
#1184Semiconductor device having a junction FET and a MISFET for control
#1185Micro-fluidic injection molded solder (IMS)
#1186Method to build robust mechanical structures on substrate surfaces
#1187METHOD OF PRODUCING SEMICONDUCTOR DEVICE
#1188Electronic substrate, semiconductor device, and electronic device
#1189Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
#1190Chip capacitive coupling
#1191MIM decoupling capacitors under a contact pad
#1192Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board
#1193Semiconductor device and method of forming through vias with reflowed conductive material
#1194Chip and Transmitter for Wireless Communication System
#1195Semiconductor device and method of forming through vias with reflowed conductive material
#1196Through-silicon via formed with a post passivation interconnect structure
#1197SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME
#1198MULTI-CHIP PACKAGE
#1199WIRE BOND CHIP PACKAGE
#1200Reduced-crosstalk wirebonding in an optical communication system