SENSOR CHIP AND METHOD OF MANUFACTURING THE SAME

Light-emitting device having a thermal conductive member with wiring function and method of manufacturing the same

Method for contacting electronic components by means of a substrate plate

Pad interface circuit and method of improving reliability of the pad interface circuit

Bump Structure With Multiple Layers And Method Of Manufacture

Process for placing, securing and interconnecting electronic components

Chip assembly

Gap capacitors for monitoring stress in solder balls in flip chip technology

Electronic module with EMI protection

SEMICONDUCTOR PACKAGE STRUCTURE USING THE SAME

Anisotropic conductive adhesive

Coaxial through chip connection

Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same

WAFER LEVEL, CHIP SCALE SEMICONDUCTOR DEVICE PACKAGING COMPOSITIONS, AND METHODS RELATING THERETO

Structure of UBM and solder bumps and methods of fabrication

Reinforced structure for a stack of layers in a semiconductor component

Semiconductor device having a sealing body and partially exposed conductors

MULTI-CHIP SEMICONDUCTOR DEVICES HAVING CONDUCTIVE VIAS AND METHODS OF FORMING THE SAME

Semiconductor die package and method for making the same

SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD OF ENCAPSULATING

Solder bump confinement system for an integrated circuit package

THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

METHOD OF FORMING CONNECTION TERMINAL

Method of manufacturing semiconductor device

Method and apparatus for manufacturing an electronic module, and electronic module

Reduced bottom roughness of stress buffering element of a semiconductor component

Monolithic semiconductor switches and method for manufacturing

Lead pin for mounting semiconductor and printed wiring board

FLUIDIC SELF-ASSEMBLY FOR SYSTEM INTEGRATION

Method to prevent corrosion of bond pad structure

Method of manufacturing semiconductor device

Semiconductor device including single circuit element for soldering

3D integration of vertical components in reconstituted substrates

CONTACT STRUCTURE FOR A SEMICONDUCTOR AND METHOD FOR PRODUCING THE SAME

Lead frames with improved adhesion to plastic encapsulant

Semiconductor device and method for manufacturing

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps

Semiconductor device having a plurality of semiconductor constructs

ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE MADE WITH THE SAME

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps

Semiconductor device package and method of assembly thereof

Semiconductor device, method for manufacturing the same, and multilayer substrate having the same

Semiconductor device with circuit for reduced parasitic inductance

Electronic device and electronic apparatus

Method of Producing Optoelectronic Components and Optoelectronic Component

Detection device and method for manufacturing the same

DEVICE, UNIT, SYSTEM AND METHOD FOR THE MAGNETICALLY-ASSISTED ASSEMBLING OF CHIP-SCALE, AND NANO AND MICRO-SCALE COMPONENTS ONTO A SUBSTRATE

Semiconductor device

Backside metal of redistribution line with silicide layer on through-silicon via of semiconductor chips

Semiconductor device

Ball land structure having barrier pattern

Semiconductor device and manufacturing method thereof

Multi-die building block for stacked-die package

METHOD OF MANUFACTURING AN ASSEMBLY AND ASSEMBLY

Semiconductor device and method of manufacturing same

Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip

Method for low temperature bonding and bonded structure

Method of manufacturing multilayer printed circuit board

Method of manufacturing a semiconductor device

Semiconductor device

METHOD FOR MANUFACTURING SYSTEM-IN-PACKAGE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor device and method of forming recessed conductive vias in saw streets

Semiconductor device having an inorganic coating layer applied over a junction termination extension

Method for forming thin film resistor and terminal bond pad simultaneously

Nano memory, light, energy, antenna and strand-based systems and methods

Microprobe Tips and Methods for Making

Printed wiring board

Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages

Semiconductor element and electrical apparatus

Semiconductor device with a vertical interconnect structure for 3-D FO-WLCSP

Electronic devices including flexible electrical circuits and related methods

Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV

Semiconductor device

Semiconductor device

Semiconductor element and electrical apparatus

Method of mounting electronic circuit constituting member and relevant mounting apparatus

Oblique parts or surfaces

Semiconductor device including DC-DC converter

SEMICONDUCTOR DIE INTERCONNECT FORMED BY AEROSOL APPLICATION OF ELECTRICALLY CONDUCTIVE MATERIAL

Insulating film material, multilayer wiring board and production method thereof, and semiconductor device and production method thereof

Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devices

Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure

High frequency semiconductor device

Semiconductor device

Package for Semiconductor Devices

Oblique parts or surfaces

Self-assembled electrical contacts

Sealed surface acoustic wave element package

Semiconductor device with solder bump formed on high topography plated Cu pads

A POWER SEMICONDUCTOR ARRANGEMENT AND A SEMICONDUCTOR VALVE PROVIDED THEREWITH

Device including a semiconductor chip and metal foils

Method for producing electronic component and electronic component

Method for producing semiconductor components and thin-film semiconductor component

Semiconductor device including a DC-DC converter having a metal plate

Two-sided substrateless multichip module and method of manufacturing same

Electronic device and semiconductor device

Device including a semiconductor chip

Power semiconductor module with segmented base plate

Semiconductor module including a switch and non-central diode

Methods and apparatus for efficiently generating profiles for circuit board work/rework

Carbon nanotubes solder composite for high performance interconnect

Heat radiation material, electronic device and method of manufacturing electronic device

Printing semiconductor elements by shear-assisted elastomeric stamp transfer

Layout design method and semiconductor integrated circuit

Semiconductor integrated circuit devices and display apparatus including the same

Passivation layer for a circuit device and method of manufacture

Integrated circuit package and a method for dissipating heat in an integrated circuit package

Spread spectrum isolator

Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same

RELIABLE WAFER-LEVEL CHIP-SCALE SOLDER BUMP STRUCTURE

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Semiconductor device and a manufacturing method of the same

Chip package structure

Semiconductor body and method for the design of a semiconductor body with a connecting line

Circuit board including solder ball land having hole and semiconductor package having the circuit board

Method for producing semiconductor chips using thin film technology

Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them

Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof

CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS

Electroconductive fine particles, anisotropic electroconductive material, and electroconductive connection structure

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS

BUMPED CHIP WITH DISPLACEMENT OF GOLD BUMPS

Semiconductor die package including lead with end portion

SEMICONDUCTOR DEVICE HAVING INTEGRATED CIRCUIT WITH PADS COUPLED BY EXTERNAL CONNECTING COMPONENT AND METHOD FOR MODIFYING INTEGRATED CIRCUIT

Semiconductor device and manufacturing method thereof

DEVICE CAPABLE OF THERMALLY COOLING WHILE ELECTRICALLY INSULATING

Method for manufacturing a semiconductor device having a heat spreader

Electronic circuit for controlling a power field effect transistor

Semiconductor device and method of forming double-sided through vias in saw streets

Semiconductor electronic component and semiconductor device using the same

Wafer level package using stud bump coated with solder

Electronic component built-in substrate and method of manufacturing the same

DICING/DIE-BONDING TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP

Process for spontaneous deposition from an organic solution

Assembling stacked substrates that can form 3-D structures

Semiconductor substrates with unitary vias and via terminals, and associated systems and methods

Chip Module for Installing in Sensor Chip Cards for Fluidic Applications and Method for Producing a Chip Module of This Type

Self-assembly of components

Adhesive film, connecting method, and joined structure

Pad structure of semiconductor integrated circuit apparatus

Bond pad connection to redistribution lines having tapered profiles

Backside connection to TSVs having redistribution lines

Arrangement for hermetically sealing components, and method for the production thereof

Semiconductor power conversion apparatus and method of manufacturing the same

Thermosetting die-bonding film

Adhesive tape and semiconductor device using the same

Electronic device and method of manufacturing same

Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layer

Device including two mounting surfaces

On-chip RF shields with front side redistribution lines

Method and apparatus for fabricating self-assembling microstructures

Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor die

Semiconductor device for battery power voltage control

Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection

Top exposed clip with window array

Method of electrically connecting a shielding layer to ground through a conductive via disposed in peripheral region around semiconductor die

Semiconductor device and method of forming embedded passive circuit elements interconnected to through hole vias

Electronic component mounting structure

Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package

METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY FROM WHICH A WIRE IS PLAYED OUT

Power semiconductor module including a multilayer substrate

Process for making contact with and housing integrated circuits

CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATERIAL, CIRCUIT-CONNECTING STRUCTURE, AND METHOD FOR CONNECTION OF CIRCUIT MEMBER

Low temperature curing acrylate and maleimide based formulations and methods for use thereof

Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers

Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device

Composition Containing Porphyrin to Improve Adhesion

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

Semiconductor device

Adhesive tape, connected structure and semiconductor package

Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers

Package with power and ground through via

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

Semiconductor package structures

Method of manufacturing a semiconductor device

Wafer level compliant packages for rear-face illuminated solid state image sensors

Isolator with complementary configurable memory

Crystal structure of a solder bump of flip chip semiconductor device

QFN package

Resin sealing type semiconductor device and method of manufacturing the same, and lead frame

MULTI-CHIP PRINTHEAD ASSEMBLER

Method for fabricating semiconductor component having encapsulated through wire interconnect (TWI)

Electronic Component Union, Electronic Circuit Module Utilizing the Same, and Process for Manufacturing the Same

Electrical component and film composite laminated on the component and method for production

Method for the fabrication of semiconductor devices including attaching chips to each other with a dielectric material

Semiconductor device

Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip

INTEGRATED CIRCUIT STRUCTURES AND FABRICATING METHODS THAT USE VOIDS IN THROUGH HOLES AS JOINING INTERFACES

Bond pad for wafer and package for CMOS imager

Method of packaging and interconnection of integrated circuits

Method for forming terminal of stacked package element and method for forming stacked package

Semiconductor structure with communication element

Processes for forming photovoltaic devices

BUMP STRUCTURE FOE SEMICONDUCTOR DEVICE

Flange package for a semiconductor device

Lead frame package

Through wafer vias and method of making same

Through wafer vias and method of making same

Wafer level semiconductor module and method for manufacturing the same

Radio frequency power semiconductor device comprising matrix of cavities as dielectric isolation structure

Electrical connection of components

Method for manufacturing multilayer printed circuit board

Semiconductor device and method of manufacturing a semiconductor device

Semiconductor device and manufacturing method

Semiconductor device and method of forming shielding along a profile disposed in peripheral region around the device

Under bump metallization for on-die capacitor

Multilayer printed circuit board and multilayer printed circuit board manufacturing method

Semiconductor device, manufacturing method and apparatus for the same

Printed circuit board

Stacked semiconductor chips with separate encapsulations

Semiconductor embedded module and method for producing the same

Semiconductor package and methods of manufacturing the same

Adhesive for connection of circuit member and semiconductor device using the same

Vertical MOSFET with through-body via for gate

Light-emitting diode arrangement and method for producing the same

Electronic component assembly

Programmable capacitor associated with an input/output pad

Aluminum leadframes for semiconductor QFN/SON devices

Semiconductor device

Method for connecting between substrates, flip-chip mounting structure, and connection structure between substrates

Semiconductor device and a method of manufacturing the same

Wafer and semiconductor package

Liquid resin composition, semiconductor wafer having adhesive layer, semiconductor element having adhesive layer, semiconductor package, process for manufacturing semiconductor element and process for manufacturing semiconductor package

Chip-level underfill method of manufacture

Production method of semiconductor device and bonding film

Methods of fabricating nanostructures and nanowires and devices fabricated therefrom

Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device

Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device

Bond pad structure

Semiconductor chip passivation structures and methods of making the same

Repairable semiconductor device and method

Semiconductor device including power supply bar having jutted portion, parallel running portion and bent portion and manufacturing method therefor

Electronic device having contact elements with a specified cross section and manufacturing thereof

Substrate holder and plating apparatus

Electronic component bonding machine

Semiconductor device and semiconductor integrated circuit

FLIP-CHIP LIGHT EMITTING DIODE AND METHOD FOR FABRICATING THE SAME

Semiconductor device

INTEGRATED CIRCUIT DISTRIBUTED OVER AT LEAST TWO NON-PARALLEL PLANES AND ITS METHOD OF PRODUCTION

ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION

Method for producing a semiconductor component

Manufacturing method of semiconductor device

Heat sink, electronic device, and method of manufacturing electronic device

Systems and methods for power amplifier with integrated passive device

Method and apparatus for wafer level integration using tapered vias

Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device

Method of forming stress relief layer between die and interconnect structure

Semiconductor device having lands disposed inward and outward of an area of a wiring board where electrodes are disposed

Apparatus for mounting conductive balls

Bump structure for a semiconductor device and method of manufacture

Semiconductor device and method of forming recessed conductive vias in saw streets

Mountable integrated circuit package-in-package system

Semiconductor device and method of connecting a shielding layer to ground through conductive vias

Method and system for composite bond wires

Electronic apparatus

Substrate for semiconductor package

Semiconductor device and manufacturing method therefor

Four mosfet full bridge module

Conductive clip for semiconductor device package

Semiconductor device and method of forming through vias with reflowed conductive material

Method for manufacturing semiconductor chip and semiconductor device

Semiconductor device and method of forming double-sided through vias in saw streets

Semiconductor device and method of forming embedded passive circuit elements interconnected to through hole vias

Semiconductor package having through-hole vias on saw streets formed with partial saw

Semiconductor package having through-hole vias on saw streets formed with partial saw

Semiconductor package having through-hole vias on saw streets formed with partial saw

Semiconductor device and a semiconductor device manufacturing method

Mounting method, mounted structure, manufacturing method for electronic equipment, electronic equipment, manufacturing method for light-emitting diode display, and light-emitting diode display

Power semiconductor device

Electrically conducting poylmer glue, devices made therewith and methods of manufacture

Bump with multiple vias for semiconductor package and fabrication method thereof, and semiconductor package utilizing the same

Package structure of three-dimensional stacking dice and method for manufacturing the same

Semiconductor device and method of conforming conductive vias between insulating layers in saw streets

Printed wiring board and method for manufacturing the same

Die bonding apparatus

Method and apparatus for 3D interconnect

Method and apparatus for facilitating proximity communication and power delivery

GaN-based semiconductor light-emitting device and method for the fabrication thereof

Method and apparatus for electrostatic discharge protection using a temporary conductive coating

Semiconductor storage device, semiconductor storage device manufacturing method and package resin forming method

Semiconductor component with improved contact pad and method for forming the same

Planar packageless semiconductor structure with via and coplanar contacts

Semiconductor device package interconnections

Semiconductor device and method

Three-dimensional structures and methods of fabricating the same using a printing plate

Semiconductor device and method of manufacturing the same

Thermal enhanced package

Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same

Chip-based thermo-stack

Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same

Manufacturing method of semiconductor device

Bonded semiconductor structure and method of making the same

Method of manufacturing an integrated circuit

ULTRA-THIN CHIP PACKAGING

Externally configurable integrated circuits

Multilayer printed wiring board

Method of mounting electronic circuit constituting member and relevant mounting apparatus

Method for low temperature bonding and bonded structure