Fixture for P-through silicon via assembly

Power semiconductor module with pressure element and method for fabricating a power semiconductor module with a pressure element

Thermosetting resin composition and semiconductor sealing medium

Semiconductor device and method for manufacturing the same

Power converter apparatus

Method of making semiconductor devices employing first and second carriers

Solder ball attachment jig and method for manufacturing semiconductor device using the same

Three chip package

Integrated circuit system having different-size solder bumps and different-size bonding pads

Semiconductor device and manufacturing method therefor

Curing low-k dielectrics for improving mechanical strength

Method for manufacturing a circuit board having an embedded component therein

Semiconductor device manufacturing method

Semiconductor device and manufacturing method of semiconductor device

Capacitive isolation circuitry with improved common mode detector

Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon

Device interconnects

Method for mounting semiconductor device

Method of forming an interconnect on a semiconductor substrate

Sheet structure and method of manufacturing sheet structure

Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof

Semiconductor device

Apparatus and method for series connection of two die or chips in single electronics package

Semiconductor Device Having High-Density Interconnect Array with Core Pillars Formed With OSP Coating

Semiconductor device with integrated passive circuit and method of making the same using sacrificial substrate

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor die package including embedded flip chip

Semiconductor Device

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND LID FRAME

Self-assembly of elements using microfluidic traps

DEVICE CAPABLE OF THERMALLY COOLING WHILE ELECTRICALLY INSULATING

Semiconductor device and method of manufacturing the same

Methods of fabricating a composite carbon nanotube thermal interface device

Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor

Semiconductor package having side walls and method for manufacturing the same

Semiconductor device with wire-bonding on multi-zigzag fingers

Optical semiconductor device and method of manufacturing optical semiconductor device

Semiconductor light-emitting device, light-emitting module and lighting unit

Etching Solution And Method For Structuring A UBM Layer System

Semiconductor device

METHOD OF PRODUCING ELECTRONIC COMPONENT

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Capacitive isolation circuitry

Semiconductor interconnect structure with stacked vias separated by signal line and method therefor

Semiconductor device and method of supporting a wafer during backgrinding and reflow of solder bumps

Ball grid array package layout supporting many voltage splits and flexible split locations

SEMICONDUCTOR PACKAGE ACCOMPLISHING FAN-OUT STRUCTURE THROUGH WIRE BONDING

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD AND MOUNTING METHOD THEREOF

Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof

Semiconductor device

High voltage isolation dual capacitor communication system

Semiconductor device and a method of manufacturing the same

Gap capacitors for monitoring stress in solder balls in flip chip technology

Semiconductor device

Passivated Copper Chip Pads

Integrated circuit having wide power lines

Semiconductor device and method of manufacturing the same

Semiconductor package and method of making the same

3D smart power module

Package substrate with built-in capacitor and manufacturing method thereof

Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure

Electric Component with Two-Phase Cooling Device and Method for Manufacturing

Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them

Device mounting board, and semiconductor module and manufacturing method therefor

Integrated circuit with supply line intra-chip clock interface and methods for use therewith

Integrated Circuit and Memory Module

Semiconductor device including wiring and manufacturing method thereof

Semiconductor device having wiring line and manufacturing method thereof

Semiconductor device having antenna over thin film integrated circuit

Bondwire design

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

Electronic device and method of manufacturing same

Apparatus for improved power distribution in wirebond semiconductor packages

Semiconductor device

Method of manufacturing electronic device on leadframe

Circuit connection structure, method for producing the same and semiconductor substrate for circuit connection structure

Mounting substrate

Multilayer wiring board with concave portion for accomodating electronic component

Manufacturing method of semiconductor device

Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler

WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFFICIENCY WITH AN EMF SHIELD AND A METHOD FOR FABRICATING THE SAME

Process for producing semiconductor device and apparatus therefor

SUBSTRATE FOR MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME, AND PORTABLE APPARATUS PROVIDED WITH THE SAME

FLEXIBLE SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Semiconductor Die Packages Having Solder-free Connections, Systems Using the Same, and Methods of Making the Same

Semiconductor device and method of manufacturing the same

Solar cell and magnetically self-assembled solar cell assembly

Multiple access over proximity communication

Method of forming a bump structure using an etching composition for an under bump metallurgy layer

Removable layer manufacturing method

Bonding pad structure and semiconductor device including the bonding pad structure

Package substrate with built-in capacitor and manufacturing method thereof

Method for structuring a substrate using a metal mask layer formed using a galvanization process

I/O PAD STRUCTURE FOR ENHANCING SOLDER JOINT RELIABILITY IN INTEGRATED CIRCUIT DEVICES

Method of manufacturing semiconductor device

Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same

High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same

Semiconductor chip having conductive member for reducing localized voltage drop

STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE

Method for manufacturing metal chips by plasma from a layer comprising several elements

Nanoscale metal paste for interconnect and method of use

Semiconductor device

Introducing a metal layer between SiN and TiN to improve CBD contact resistance for P-TSV

Structure and process for the formation of TSVs

Method of fabricating a power electronic device

SEMICONDUCTOR MODULE MOUNTING STRUCTURE

CHIP STRUCTURE AND FABRICATION PROCESS THEREOF AND FLIP CHIP PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF

Semiconductor device and manufacturing method of the same

Electronic device including an inductor

FORMING EDGE METALLIC CONTACTS AND USING COULOMB FORCES TO IMPROVE OHMIC CONTACT

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Levitating substrate being charged by a non-volatile device and powered by a charged capacitor or bonding wire

Forming large planar structures from substrates using edge Coulomb forces

Assembling stacked substrates that can form cylindrical inductors and adjustable transformers

Semiconductor package and method of forming similar structure for top and bottom bonding pads

Component attach methods and related device structures

Reconfigurable system that exchanges substrates using coulomb forces to optimize a parameter

Wafer level die integration and method

Wafer level semiconductor package and method for manufacturing the same

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM ALLOY

Soft error rate mitigation by interconnect structure

Semiconductor power module package without temperature sensor mounted thereon and method of fabricating the same

Isolating chip-to-chip contact

Device and method including a soldering process

Soldering Method, Method for Manufacturing Semiconductor Module, and Soldering Apparatus

Soldering Method and Semiconductor Module Manufacturing Method

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM COPPER ALLOY

Semiconductor device

THREE DIMENSIONAL PACKAGING WITH WAFER-LEVEL BONDING AND CHIP-LEVEL REPAIR

High-volume on-wafer heterogeneous packaging of optical interconnects

Stacked-die package for battery power management

Integrated circuit chip component, multi-chip module, their integration structure, and their fabrication method

Undercut-free BLM process for Pb-free and Pb-reduced C4

Light-emitting diode

Optoelectronic component with a wireless contacting

DEVICE AND METHOD FOR PRODUCING A BONDING CONNECTION

Apparatus and method for producing a bonding connection

APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Integrated circuit with intra-chip clock interface and methods for use therewith

Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor device

Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules

Method for manufacturing a printed wiring board

Electrostatic discharge (ESD) protection structure

Method of forming an inductor on a semiconductor wafer

Mounting structure

Gold wire for semiconductor element connection

Back end integrated WLCSP structure without aluminum pads

Device mounting board, semiconductor module, and mobile device

Integrated circuit package with integrated heat sink

Wafer-level chip scale package and method for fabricating and using the same

Modular chip integration techniques

Packaged gallium nitride material transistors and methods associated with the same

Assembly comprising a functional device and a resonator and method of making same

Semiconductor device and method for manufacturing the same

SELF-ASSEMBLED STRESS RELIEF INTERFACE

SEMICONDUCTOR DEVICE

Apparatus and method configured to lower thermal stresses

Semiconductor structure and method of manufacture

Method of packaging an LED array module

Semiconductor chip with coil element over passivation layer

Image display unit with light emitting devices having a resin surrounding the light emitting devices

Power recovery circuit based on partial standing waves

Flip chip connection structure having powder-like conductive substance and method of producing the same

Wafer level stacked die packaging

Through-silicon vias and methods for forming the same

Wiring terminal-connecting adhesive

Method for bonding a wire conductor laid on a substrate

Semiconductor device comprising a housing containing a triggering unit

Method for manufacturing a stacked semiconductor package, and stacked semiconductor package

Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material

Bump I/O contact for semiconductor device

Semiconductor circuit with amplifier, bond wires and inductance compensating bond wire

Solder layer, substrate for device joining utilizing the same and method of manufacturing the substrate

Wafer structure with a buffer layer

I/O pad structures for integrated circuit devices

Semiconductor device having interconnected contact groups

Multilayer printed wiring board

Proximity communication package for processor, cache and memory

Flip chip package process

Method for thin semiconductor packages

Power semiconductor arrangement

Semiconductor device

Semiconductor device and methods of manufacturing semiconductor devices

Integrated-circuit package for proximity communication

Semiconductor device and method of laser-marking wafers with tape applied to its active surface

MULTI-BAND TUNABLE RESONANT CIRCUIT

Solder bump with inner core pillar in semiconductor package

Flip chip structure and method of manufacture

Stacked dual-die packages, methods of making, and systems incorporating said packages

Semiconductor device and method of forming interconnect structure in non-active area of wafer

Center Conductor to Integrated Circuit for High Frequency Applications

Semiconductor package and method of reducing electromagnetic interference between devices

Thermo-compression bonded electrical interconnect structure and method

Method of manufacturing device having adhesive film on back-side surface thereof including breaking the adhesive with tension

Manufacturing method of semiconductor apparatus comprising alignment patterns in scribe regions

Electromagnetic shield formation for integrated circuit die package

Minimizing the number of external terminals required when compensation is to be provided for signal drop in bond wire of a package in which an integrated circuit is provided

Connecting and bonding adjacent layers with nanostructures

Thermo-compression bonded electrical interconnect structure and method

Semiconductor mounting bonding wire

Redistribution layer for wafer-level chip scale package and method therefor

Structure and method for fabricating flip chip devices

Semiconductor device with inductor

Electronic assemblies providing active side heat pumping

Integrated shielding process for precision high density module packaging

Printed circuit board manufacturing method

3D IC method and device

Semiconductor connection component

Multi-chip semiconductor device

Printed wiring board

Method for forming bumps on under bump metallurgy

Rectifier device for automotive alternator

Semiconductor device having at least two terminals among the plurality of terminals electrically connected to each other while not being adjacent to one other and not being connected to internal circuit

Semiconductor device with non-overlapped circuits

Semiconductor device and method of manufacturing the same

CO-PACKAGED HIGH-SIDE AND LOW-SIDE NMOSFETS FOR EFFICIENT DC-DC POWER CONVERSION

Semiconductor element mounting substrate, semiconductor device using the same, and method for manufacturing semiconductor element mounting substrate

STRAP ASSEMBLY COMPRISING FUNCTIONAL BLOCK DEPOSITED THEREIN AND METHOD OF MAKING SAME

Electronic device and electronic apparatus

PROCESS FOR FORMING METAL FILM AND RELEASE LAYER ON POLYMER

Semiconductor component

Electronic device wafer level scale packages and fabrication methods thereof

Switching assembly for an aircraft ignition system

Spiral Contactor

Microelectronic lithographic alignment using high contrast alignment mark

Method of manufacturing semiconductor device

Multilayer printed circuit board structure comprising an integrated electrical component, and production method therefor

Cascode current sensor for discrete power semiconductor devices

Near chip scale package integration process

Power semiconductor module

Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member

Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the same

Light source, manufacturing method of light source, lighting apparatus, and display apparatus

In-place bonding of microstructures

Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same

Laying apparatus, contact-making apparatus, movement system, laying and contact-making unit, production system, method for production and a transponder unit

Output control device, and AC/DC power source device, circuit device, LED backlight circuit device, and switching DC/DC converter device each using output control device

Semiconductor device and method of providing common voltage bus and wire bondable redistribution

Under Bump Routing Layer Method and Apparatus

Conductor bump method and apparatus

Semiconductor device and lead frame

TFCC (TM) and SWCC (TM) thermal flex contact carriers

Method of manufacturing a contact arrangement between a microelectronic component and a carrier

Manufacturing method for interconnection having stress-absorbing layer between the semiconductor substrate and the external connection terminal

MCU with integrated voltage isolator to provide a galvanic isolation between input and output

Semiconductor device

Semiconductor package having a stacked wafer level package and method for fabricating the same

Electrical connections for multichip modules

Crosstalk-free WLCSP structure for high frequency application

Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same

Sensor package

Semiconductor device

Light emitting device and method of manufacturing the same

Methods and apparatus for measuring analytes using large scale FET arrays

Method and apparatus for fabricating integrated circuit device using self-organizing function

Semiconductor apparatus having side surface wiring

Capacitive isolator

Semiconductor assembly

Integrated circuit with electromagnetic intrachip communication and methods for use therewith

Semiconductor module, and hybrid vehicle drive device including the same

Electronic device which disconnects first and second terminals upon lapse of a prescribed device lifetime

Interposer chip, method of manufacturing the interposer chip, and multi-chip package having the interposer chip

SEMICONDUCTOR DEVICE PACKAGE WITH BUMP OVERLYING A POLYMER LAYER

Lead frame, semiconductor package including the lead frame and method of forming the lead frame

Hybrid integrated circuit device and manufacturing method thereof

Semiconductor Device Package Disassembly

INTEGRATED CIRCUIT WITH BONDING WIRE ANTENNA STRUCTURE AND METHODS FOR USE THEREWITH

Integrated circuit with power supply line antenna structure and methods for use therewith

RFID integrated circuit with integrated antenna structure

Semiconductor device and manufacturing method therefor

Electronic module and fabrication method thereof

SEMICONDUCTOR DEVICE HAVING AN INTERCONNECT ELECTRICALLY CONNECTING A FRONT AND BACKSIDE THEREOF AND A METHOD OF MANUFACTURE THEREFOR

Semiconductor device, a method of manufacturing the same and an electronic device

Semiconductor device including semiconductor chips having contact elements

Semiconductor module for a switched-mode power supply and method for its assembly

Method of machining substrate

Manufacturing method for semiconductor integrated device

Electrical shielding in stacked dies by using conductive die attach adhesive

Power Semiconductor Module And Method of Manufacturing the Power Semiconductor Module

Stacked semiconductor package and method for manufacturing the same

RF transistor packages with internal stability network and methods of forming RF transistor packages with internal stability networks

RF power transistor packages with internal harmonic frequency reduction and methods of forming RF power transistor packages with internal harmonic frequency reduction

Bumpless flip-chip assembly with a complaint interposer contractor

Method of assembly using array of programmable magnets

Method For Assembling Substrates By Depositing An Oxide Or Nitride Thin Bonding Layer

Solder bump interconnect for improved mechanical and thermo-mechanical performance

SEMICONDUCTOR PACKAGE STRUCTURES

Electronic structures including barrier layers defining lips

METHOD FOR PACKAGING SEMICONDUCTORS AT A WAFER LEVEL

Photoelectric conversion element having a semiconductor and semiconductor device using the same

Ubm Pad, Solder Contact and Methods for Creating a Solder Joint

Electronic component and manufacturing method thereof

Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support

Power semiconductor packaging method and structure

Au—Sn alloy bump including no large void and method of producing same

WIRE CLAMP FOR A WIRE BONDER

Printed wiring board and a method of manufacturing a printed wiring board

Method of fabricating a wafer structure having a pad and a first protection layer and a second protection layer

Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device

Reduced inductance in ball grid array packages