Cylindrical bonding structure and method of manufacture

Metal interconnect System and Method for Direct Die Attachment

Reactive solder material

Method for mounting anisotropically-shaped members

Solderable top metal for silicon carbide semiconductor devices

Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler

Alignment mark, semiconductor chip including the same, semiconductor package including the chip and methods of fabricating the same

BUMP STRUCTURE

Methods of assembling integrated circuit packages

Die stacking system and method

Semiconductor Device and Its Fabrication Method

Semiconductor device

METHODS AND APPARATUS FOR TRANSFERRING CONDUCTIVE PIECES DURING SEMICONDUCTOR DEVICE FABRICATION

METHODS FOR FORMING PACKAGE STRUCTURES

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Semiconductor package and method of forming the same, and printed circuit board

Flip-chip semiconductor package and package substrate applicable thereto

Semiconductor device and a method of manufacturing the same

Semiconductor device and manufacturing method thereof

POWER SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, LEAD FRAME MEMBER, AND METHOD OF MAKING POWER SEMICONDUCTOR DEVICE

Method of manufacturing a semiconductor device having an insulating protective film covering at least a portion of a tile-shaped element

Electronic device manufacturing method and supporter

Methods of forming a semiconductor device including a diffusion barrier film

Semiconductor package having through-hole via on saw streets formed with partial saw

SEMICONDUCTOR DEVICE INCLUDING MULTILAYER WIRING BOARD WITH POWER SUPPLY CIRCUIT

Semiconductor die with through-hole via on saw streets and through-hole via in active area of die

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Adhesive composition and a method of using the same

Bidirectional multiplexed RF isolator

Die bonding agent and a semiconductor device made by using the same

Selective etch of TiW for capture pad formation

METHOD FOR FORMING BUMPS ON UNDER BUMP METALLURGY

Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device

On chip transformer isolator

Power semiconductor module

Connecting microsized devices using ablative films

Semiconductor Device and Method for Fabricating the Same

Ultra-thin chip packaging

Semiconductor device with improved pads

Semiconductor device with power noise suppression

Integrated circuits and interconnect structure for integrated circuits

Integrated circuits and interconnect structure for integrated circuits

Semiconductor device and process for manufacturing the same

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME

Low shrinkage polyester thermosetting resins

Multi-chip module

Curing layers of a semiconductor product using electromagnetic fields

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Method to create a metal pattern using a damascene-like process

Interconnect for chip level power distribution

Arrangement for high frequency application

Detector system and detector subassembly

Joining method and device produced by this method and joining unit

Flux for soldering and soldering process

Wafer-level-chip-scale package and method of fabrication

Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof

SEMICONDUCTOR DEVICE WITH STRENGTHENED PADS

Semiconductor device including an insulating film and insulating pillars and manufacturing method of the semiconductor device

Sensor-type semiconductor device and manufacturing method thereof

Integrated circuits and interconnect structure for integrated circuits

Apparatus and method for semiconductor wafer bumping via injection molded solder

METHOD OF MANUFACTURING DEVICE

Manufacturing method for devices

Method for manufacturing a semiconductor device

Stackable semiconductor device and fabrication method thereof

Method of forming a silicide layer on a thinned silicon wafer, and related semiconducting structure

Semiconductor device with Al pad

Power semiconductor module, method for producing a power semiconductor module, and semiconductor chip

Method of forming solder bump on high topography plated Cu

SEMICONDUCTOR PACKAGE HAVING WIRE REDISTRIBUTION LAYER AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Lead structure for a semiconductor component and method for producing the same

Semiconductor module with semiconductor chips and method for producing it

Semiconductor device and method of manufacturing same

Semiconductor device and manufacturing method of the same

Wiring substrate and electronic device

Solar Cell (Sliver) Sub-Module Formation

Method of manufacturing device having a UV-curable adhesive

Semiconductor module

Method and structure for magnetically-directed, self-assembly of three-dimensional structures

Class D amplifier arrangement

Substrate with feedthrough and method for producing the same

Metallic electrode forming method and semiconductor device having metallic electrode

Conductive ball mounting apparatus and conductive ball mounting method

Electropolishing metal features on a semiconductor wafer

Designs and methods for conductive bumps

Semiconductor device having conductive bumps, metallic layers, covering layers and fabrication method thereof

Semiconductor device and a method of manufacturing for high output MOSFET

Semiconductor device

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Layer sequence and method of manufacturing a layer sequence

Semiconductor memory device and defect remedying method thereof

Solder layer and device bonding substrate using the same and method for manufacturing such a substrate

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME, AND POWER CONVERSION APPARATUS INCORPORATING THIS SEMICONDUCTOR DEVICE

Packaged integrated circuit

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Semiconductor integrated circuit device and fabrication method for the same

BACKSIDE METALLIZATION FOR INTEGRATED CIRCUIT DEVICES

Sensor-type semiconductor package and method for fabricating the same

Wiring structure, forming method of the same and printed wiring board

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS

Multilayer printed circuit board and multilayer printed circuit board manufacturing method

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

CHIP PACKAGE

Integrated circuit including conductive bumps

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electronic component and method for manufacturing an electronic component

Encapsulated chip scale package having flip-chip on lead frame structure

Method of manufacturing semiconductor devices encapsulated in chip size packages

Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition

Undercut-free BLM process for Pb-free and Pb-reduced C4

Method for producing a metal article intended for at least partially coating with a substance

APPARATUS FOR STACKING SEMICONDUCTOR CHIPS, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREBY

SOLDER DEPOSITION ON WAFER BACKSIDE FOR THIN-DIE THERMAL INTERFACE MATERIAL

Bump structure and manufacturing method thereof

Multi-chip module

Sensor device having stopper for limitting displacement

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

Semiconductor device

Method of room temperature covalent bonding

Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment

Passivation layer for a circuit device and method of manufacture

Fabrication method of a semiconductor device

Modular board device, high frequency module, and method of manufacturing the same

Thermal interconnect systems methods of production and uses thereof

Driver chip and display apparatus having the same

SEMICONDUCTOR DEVICE AND METHOD OF FORMING METAL PAD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device including isolation layer

Semiconductor device with parylene coating

ADHESIVE SHEET, DICING TAPE INTEGRATED TYPE ADHESIVE SHEET, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE

Electrically conductive interconnect system and method

Bonding pad of semiconductor integrated circuit, method for manufacturing the bonding pad, semiconductor integrated circuit, and electronic device

Semiconductor package and method of manufacturing the same

Semiconductor device having conductive bumps and deviated solder pad

Semiconductor Device

Printed circuit board

Power MOSFET wafer level chip-scale package

HIGHLY CONDUCTIVE COMPOSITION FOR WAFER COATING

Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei

Highly conductive composition for wafer coating

Semiconductor power device

High power semiconductor package

Electronic components produced by a method of separating two layers of material from one another

B-stageable die attach adhesives

Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers

Semiconductor device

CURVED HEAT SPREADER DESIGN FOR ELECTRONIC ASSEMBLIES

Package having shield case

Integrated circuits and interconnect structure for integrated circuits

Alignment and cutting of microelectronic substrates

Method for integrating pre-fabricated chip structures into functional electronic systems

ELECTRONIC ASSEMBLY HAVING AN INDIUM WETTING LAYER ON A THERMALLY CONDUCTIVE BODY

Thinned die integrated circuit package

Multilayer printed circuit board

Multilayer printed circuit board

Multilayer printed circuit board

Circuit for suppressing voltage jitter and method thereof

Single mask via method and device

Method of Manufacturing a Semiconductor Packages and Packages Made

Semiconductor device with lead frame including conductor plates arranged three-dimensionally

Process for making contact with and housing integrated circuits

Nitride semiconductor device

Printed wiring board

Semiconductor device and electronic device

Chip structure and process for forming the same

Printed circuit board

Chip structure and process for forming the same

Chip structure and process for forming the same

Dummy patterns and method of manufacture for mechanical strength of low K dielectric materials in copper interconnect structures for semiconductor devices

Metal particles-dispersed composition and flip chip mounting process and bump-forming process using the same

Leadframe on heat sink (LOHS) semiconductor packages and fabrication methods thereof

Lead-frame circuit package

Semiconductor device and method for manufacturing the same

Printed circuit board

Method of sputtering a nickel silicon alloy, especially useful for forming a solder bump barrier

Manufacturing method of semiconductor device

Liquid metal thermal interface material system

Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument

Chip structure and process for forming the same

Method for manufacturing semiconductor device and semiconductor device

Solder Bump/Under Bump Metallurgy Structure for High Temperature Applications

High power semiconductor package and method of making the same

Semiconductor device

LDO regulator with ground connection through package bottom

Electrical/optical integration scheme using direct copper bonding

Amplifier chip mounted on a lead frame

Method for Preparing an Intergrated Circuits Device Having a Reinforcement Structure

Single Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices

Resin-sealed electronic device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing semiconductor device

Intergrated Circuits Device Having a Reinforcement Structure

Semiconductor chip and method of producing the same

Solid-state imaging device

Light emitting device having a mirror portion

Flip-chip mounting resin composition and bump forming resin composition

Chip structure and process for forming the same

Stacked structures and methods of fabricating stacked structures

Reduction of damage to thermal interface material due to asymmetrical load

Electrical Insulating Layer for Metallic Thermal Interface Material

Gold/silicon eutectic die bonding method

Mounting method of semiconductor element using outside connection projection electyrode and manufacturing method of semiconductor device using outside connection projection electrode

MULTI-COMPONENT ELECTRONIC PACKAGE WITH PLANARIZED EMBEDDED-COMPONENTS SUBSTRATE

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud-bumps

Three-dimensional wafer stacking with vertical interconnects

Bonding structures and methods of forming bonding structures

Chip structure and process for forming the same

Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart

Method for producing a semiconductor device including connecting a functional wafer to a carrier substrate and selectively etching the carrier substrate

Spread spectrum isolator

SEMICONDUCTOR CHIP HAVING BUMPS OF DIFFERENT HEIGHTS AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

METHOD FOR IMPROVED COPPER LAYER ETCHING OF WAFERS WITH C4 CONNECTION STRUCTURES

Semiconductor device and method for manufacturing same

Assembly and Method of Placing the Assembly on an External Board

Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate

COPPER-METALLIZED INTEGRATED CIRCUITS HAVING AN OVERCOAT FOR PROTECTING BONDABLE METAL CONTACTS AND IMPROVING MOLD COMPOUND ADHESION

Integrated circuit chips with fine-line metal and over-passivation metal

Metal filled through via structure for providing vertical wafer-to-wafer interconnection

Gold wire for connecting semiconductor chip

Electronic component and wire bonding method

Semiconductor device, mounting structure, electro-optical apparatus, electronic system, and method for manufacturing electronic component

METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Semiconductor device, method of manufacturing the same

Semiconductor integrated circuit and method for manufacturing the same

Light emitting diode, optical semiconductor device, epoxy resin composition and phosphor suited for optical semiconductor device, and method for manufacturing the same

Mounting structure, electro-optical device, electronic apparatus, and method of producing the mounting structure

Method for forming conductive layer and substrate having the same, and method for manufacturing semiconductor device

Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates

METHODS FOR FORMING PATTERNS OF A FILLED DIELECTRIC MATERIAL ON SUBSTRATES

Single chip USB packages with swivel cover

Semiconductor device with recess portion over pad electrode

Methods of fabricating nanostructures and nanowires and devices fabricated therefrom

Process for fabricating electronic components using liquid injection molding

HEAT CURABLE ADHESIVE COMPOSITION, ARTICLE, SEMICONDUCTOR APPARATUS AND METHOD

Bond pad structures and integrated circuit chip having the same

Stacked semiconductor package having fan-out structure through wire bonding

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Bonding and probing pad structures

Wafer-level interconnect for high mechanical reliability applications

BUMP ELECTRODE INCLUDING PLATING LAYERS AND METHOD OF FABRICATING THE SAME

Semiconductor device

Stacked structures and methods of fabricating stacked structures

Light emitting device

Integrated circuit chips with fine-line metal and over-passivation metal

INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

Processes and packaging for high voltage integrated circuits, electronic devices, and circuits

Integrated circuit chips with fine-line metal and over-passivation metal

Integrated circuit chips with fine-line metal and over-passivation metal

Integrated circuit chips with fine-line metal and over-passivation metal

INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

Method of making a light emitting device having a molded encapsulant

Process of forming an electronic device including an inductor

Nanoscopic Assurance Coating for Lead-Free Solders

Wire Bump Material

Semiconductor device

Semiconductor device and method for manufacturing the same

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Process for manufacturing semiconductor devices

Circuit-connecting material and circuit terminal connected structure and connecting method

Extendable connector and network

Method for low temperature bonding and bonded structure

Copper alloy bonding wire for semiconductor device

Wafer level chip scale package and method for manufacturing the same

Electronic device having wiring substrate and lead frame

Semiconductor device

Underfill for light emitting device

Circuit-connecting material and circuit terminal connected structure and connecting method

Lead pin for mounting semiconductor and printed wiring board

Semiconductor device and method of producing the same

RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A PACKAGED SEMICONDUCTOR DEVICE

Electronic device and method of manufacturing the same

POWER MODULE WITH LAMINAR INTERCONNECT

Circuit-connecting material and circuit terminal connected structure and connecting method

Method for low temperature bonding and bonded structure

Chip structure and process for forming the same

Adhesion by plasma conditioning of semiconductor chip

Method for producing semiconductor device

Au Alloy Bonding Wire

Semiconductor device

Chip structure and process for forming the same

SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION PATTERN AND METHOD OF MANUFACTURING THE SAME

LED with phosphor tile and overmolded phosphor in lens

Process of forming an electronic device including a barrier layer

Resonator, ultrasonic head, and ultrasonic bonder using the same

Resonator, ultrasonic head, and ultrasonic bonder using the same

Semiconductor device and method for manufacturing same

Method to provide substrate-ground coupling for semiconductor integrated circuit dice constructed from SOI and related materials in stacked-die packages

Plastic overmolded packages with molded lid attachments

Bond pad for wafer and package for CMOS imager

Semiconductor chip structure

Trace design to minimize electromigration damage to solder bumps

BUMP STRUCTURES AND PACKAGED STRUCTURES THEREOF

Power semiconductor component