Assembling Two Substrates by Molecular Adhesion, One of the Two Supporting an Electrically Conductive Film

METHODS OF FORMING ALUMINUM-FREE WIRE BOND PAD AND PAD SO FORMED

Thermal method to control underfill flow in semiconductor devices

SEMICONDUCTOR PACKAGE, METHOD OF PRODUCTION THEREOF AND ENCAPSULATION RESIN

Circuit board including solder ball land having hole and semiconductor package having the circuit board

WIREBOND-LESS SEMICONDUCTOR PACKAGE

Bond Wireless Package

Method for manufacturing a passive integrated matching network for power amplifiers

Ball transferring method and apparatus

Structure and method of making sealed capped chips

Multiplexed RF isolator

Electronic device including a conductive stud over a bonding pad region

Methods and apparatus for efficiently generating profiles for circuit board work/rework

Methods of forming electronic structures including conductive shunt layers and related structures

Multiplexed RF isolator circuit

Semiconductor device

Method Of Transferring At Least One Object Of Micrometric Or Millimetric Size By Means Of A Polymer Handle

Method to build robust mechanical structures on substrate surfaces

Semiconductor device with reduced contact resistance

Surface mount multichip devices

Interconnect structure for semiconductor package

Power semiconductor apparatus

Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, LED display, LED backlight and electronic device

Method for manufacturing a semiconductor wiring base that includes a wiring base with wiring extending inside and outside of a mounting region

Transformer coils for providing voltage isolation

ESD protection circuit for semiconductor device

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Multilayer printed circuit board

Method for bonding wafers to produce stacked integrated circuits

Semiconductor device with back surface electrode including a stress relaxation film

Method and apparatus for measuring oscillation amplitude of an ultrasonic device

Fine pitch microcontacts and method for forming thereof

Integrated circuit (IC) chip and method for fabricating the same

Electronic package and semiconductor device using the same

System Comprising an Electrical Component and an Electrical Connecting Lead for Said Component, and Method for the Production of Said System

Solid state image pickup device, method for manufacturing the same, semiconductor device and method for manufacturing the same

Circuit-connecting material and circuit terminal connected structure and connecting method

Capping of metal interconnects in integrated circuit electronic devices

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Module Having Low Thermal Load

RF power transistor having an encapsulated chip package

Three dimensional integrated circuit and method of making the same

Semiconductor device, manufacturing method and apparatus for the same

Manufacturing method of semiconductor device

METHOD OF ALIGNING A CONTACTLESS SEMICONDUCTOR DEVICE INTERFACE

Micro power converter and method of manufacturing same

Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same

Electrically conductive connection, electronic component and method for their production

Thermal improvement for hotspots on dies in integrated circuit packages

IC chip package, and image display apparatus using same

MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Method for producing sheet with IC tags, apparatus for producing sheet with IC tags, sheet with IC tags, method for fixing IC chips, apparatus for fixing IC chips, and IC tag

Electronics package and associated method

Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device

Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same

Semiconductor device

Interconnections resistant to wicking

Assembly and method of assembling by soldering an object and a support

HIGHLY COMPLIANT PLATE FOR WAFER BONDING

Stacked contact bump

Interlayer dielectric and pre-applied die attach adhesive materials

Semiconductor device and method for fabricating the same

System and method to reduce metal series resistance of bumped chip

Au-Ag based alloy wire for semiconductor package

Semiconductor device with reduced parasitic inductance

Light-emitting device manufacturing method and light-emitting device

Separation method of semiconductor device

Non-cyanide gold electroplating for fine-line gold traces and gold pads

Dividable semiconductor device having ceramic substrate and surface mount components collectively sealed on principle surface of ceramic substrate

Electronic components with plurality of contoured microelectronic spring contacts

Electronic component having a semiconductor power device

Method for forming a semiconductor on insulator structure

Micro-package, multi-stack micro-package, and manufacturing method therefor

Super high density module with integrated wafer level packages

Heat sink structure for embedded chips and method for fabricating the same

Lead frame and semiconductor device using the same

Printed circuit board

Semiconductor module

SEMICONDUCTOR MODULE

Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips

Process for forming bumps and solder bump

CHIP PACKAGING STRUCTURE

Semiconductor device having a smaller electrostatic capacitance electrode

Semiconductor device

Wafer level semiconductor module and method for manufacturing the same

Semiconductor components having encapsulated through wire interconnects (TWI)

Memory circuit system having semiconductor devices and a memory

Semiconductor device using semiconductor chip

Semiconductor memory device and defect remedying method thereof

Wiring board, semiconductor device using the same, and method for manufacturing wiring board

Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device

Adhesive sheet, semiconductor device, and process for producing semiconductor device

Low inductance bond-wireless co-package for high power density devices, especially for IGBTs and diodes

Semiconductor light emitting device with first and second leads

Bilayer Laminated Film for Bump Formation and Method of Bump Formation

Chip with power and signal pads connected to power and signal lines on substrate

Space transformer having multi-layer pad structures

Semiconductor device and method of manufacturing the same

Electronic device substrate and its fabrication method, and electronic device and its fabrication method

Methods and materials useful for chip stacking, chip and wafer bonding

Room temperature metal direct bonding

Semiconductor device manufacturing method

Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method

Isolating chip-to-chip contact

Semiconductor device with guard rings that are formed in each of the plural wiring layers

Semiconductor device including a DC-DC converter

Grounding structure of semiconductor device including a conductive paste

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out

Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium

Solder layer and electronic device bonding substrate and submount using the same

Multilayer printed circuit board

HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Resin Paste for Die Bonding

Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film

Reactive foil assembly

Semiconductor device

Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film

Power transistor and power semiconductor device

Method for manufacturing bump of wafer level package

Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus

METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES

Multichip module with improved system carrier

Semiconductor package with heat spreader

Semiconductor package containing multi-layered semiconductor chips

Semiconductor device

Vertical semiconductor power switch, electronic component and methods of producing the same

GaAs integrated circuit device and method of attaching same

Method of self-assembly on a surface

In-place bonding of microstructures

Method for manufacturing semiconductor device

Perforated embedded plane package and method

Semiconductor device packaging

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Warp compensated package and method

Wafer bonding of damascene-patterned metal/adhesive redistribution layers

Integrating a heat spreader with an interface material having reduced void size

Electronic substrate, semiconductor device, and electronic device

Chip package and method for fabricating the same

Layer between interfaces of different components in semiconductor devices

SEMICONDUCTOR DEVICE WITH BATTERY

STACKED CONTACT BUMP

Semiconductor device

Wiring board with connection electrode formed in opening and semiconductor device using the same

Redistribution connecting structure of solder balls

Flip-Chip Device Having Underfill in Controlled Gap

Semiconductor device and semiconductor module therewith

Power semiconductor device and method for producing it

Apparatus And Method For Temperature-Interrupting Protection Of An Electric Device

Entire encapsulation of Cu interconnects using self-aligned CuSiN film

Processed wafer via

Semiconductor device and manufacturing the same

Stacked chip-based system and method

Method for manufacturing semiconductor package capable of potting thermosetting resin while being heated

Cap layer for an aluminum copper bond pad

Semiconductor device and manufacturing method for the same

Single-chip and multi-chip module for proximity communication

Apparatus and methods for high-density chip connectivity

RF module including control IC without the aid of a relay pad

Methods of Processing Thick ILD Layers Using Spray Coating or Lamination for C4 Wafer Level Thick Metal Integrated Flow

Electronic device and method of manufacturing the same

Positively radiation-sensitive resin composition

DRIVE IC AND DISPLAY DEVICE HAVING THE SAME

PAD STRUCTURE FOR BONDING PAD AND PROBE PAD AND MANUFACTURING METHOD THEREOF

Connection structure and method for fabricating the same

Method of producing a semiconductor device by forming an oxide film on a resin layer

Printed wiring board with component mounting pin and electronic device using the same

Semiconductor device

Methods of forming metal layers using multi-layer lift-off patterns

Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board

Solder bump confinement system for an integrated circuit package

Nanoscale metal paste for interconnect and method of use

CHIP CONNECTOR

Semiconductor device having a bump formed over an electrode pad

Electronic devices including solder bumps on compliant dielectric layers

Semiconductor device

Stacked semiconductor device

Electronic module with stacked semiconductors

Semiconductor device having an antenna with anisotropic conductive adhesive

Solder composition and method of bump formation therewith

Direct write# system

Thermal enhanced package

Power semiconductor component having chip stack

Semiconductor device having tin-based solder layer and method for manufacturing the same

Wafer level chip scale package having a gap and method for manufacturing the same

Aluminum leadframes for semiconductor QFN/SON devices

Electrical component on a substrate and method for production thereof

Method for mounting electronic components on a support

Method of manufacturing semiconductor device

Tooling for coupling multiple electronic chips

Semiconductor device and manufacturing method of them

Semiconductor devices with oxide coatings selectively positioned over exposed features including semiconductor material and solutions for forming the coatings

Semiconductor integrated circuit device and test method thereof

Triaxial through-chip connection

Method for fabricating circuit component

Method of forming a microelectronic package and microelectronic package formed according to the method

Carbon nanotube circuit component structure

Thermally enhanced semiconductor package and method of producing the same

Semiconductor package

Semiconductor chip with bond area

Methods of fabricating nanostructures and nanowires and devices fabricated therefrom

Back-to-front via process

Semiconductor device package and method for manufacturing same

Printed circuit board and method of manufacturing semiconductor package using the same

Semiconductor device having a plurality of semiconductor constructs

Method for manufacturing mold type semiconductor device

Thermally balanced via

Electronic device and method of manufacturing the same

Semiconductor device and a method of manufacturing the same

Method for joining electronic parts finished with nickel and electronic parts finished with electroless nickel

Heater, reflow apparatus, and solder bump forming method and apparatus

Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps

Microchannel heat sink manufactured from graphite materials

Electronic device and method of manufacturing the same, circuit board, and electronic instrument

Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same

Super high-density module with integrated wafer level packages

Object and bonding method thereof

CHIP STRUCTURE AND CHIP MANUFACTURING PROCESS

Conductive particles for anisotropic conductive interconnection

Vertical power semiconductor component, semiconductor device and methods for the production thereof

Semiconductor device having a metal plate conductor

Sequential fabrication of vertical conductive interconnects in capped chips

Super high-density module with integrated wafer level packages

Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas

Carbon nanotubes solder composite for high performance interconnect

Miniaturized Contact Spring

Methods of fabricating interconnects for semiconductor components

Thin-film capacitor and method for fabricating the same, electronic device and circuit board

Semiconductor device

Semiconductor device with thermoplastic resin to reduce warpage

Lead assemblies with offset portions and microelectronic assemblies with leads having offset portions

Electronics package with an integrated circuit device having post wafer fabrication integrated passive components

Coaxial through chip connection

Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof

Adhesive for bonding circuit members, circuit board and process for its production

Negative thermal expansion material filler for low CTE composites

Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device

Power semiconductor component with semiconductor chip stack in a bridge circuit and method for producing the same

Structure and method for thin single or multichip semiconductor QFN packages

Method and apparatus for mounting conductive ball

Adhesion by plasma conditioning of semiconductor chip surfaces

Method and system for increasing yield of vertically integrated devices

Method for bonding substrates and device for bonding substrates

Metal-base circuit board and its manufacturing method

Liquid metal thermal interface material system

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device

SEMICONDUCTOR DEVICE

Semiconductor device and method for manufacturing same, and semiconductor wafer

Light emitting device

High-temperature solder, high-temperature solder paste and power semiconductor using same

Interconnect assemblies and methods

Dicing and die bonding adhesive tape

Pin-type chip tooling

Circuit substrate and method of manufacture

Methods for fabricating protective layers on semiconductor device components

Integrated heat spreader with intermetallic layer and method for making

Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material

Output amplifier structure with bias compensation

Damascene patterning of barrier layer metal for C4 solder bumps

Wafer redistribution structure with metallic pillar and method for fabricating the same

Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device

Bonding method, device formed by such method, surface activating unit and bonding apparatus comprising such unit

Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon

Chip structure and manufacturing method of the same

Semiconductor device

Semiconductor package that includes stacked semiconductor die

Method for pressure bonding and method for manufacturing semiconductor device

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

Constant voltage diode

Composite carbon nanotube thermal interface device

Method for making stacked integrated circuits (ICs) using prepackaged parts

Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device

Void-free circuit board and semiconductor package having the same

Printed wiring board

Structure and self-locating method of making capped chips

Structure and method of making capped chips having vertical interconnects

Back-face and edge interconnects for lidded package

High frequency chip packages with connecting elements

Multilayered printed circuit board and method for manufacturing the same

Method and apparatus for attaching a workpiece to a workpiece support

Semiconductor device and method for producing the same

Semiconductor component and methods to produce a semiconductor component

Electronic module and method of assembling the same

Radio frequency power semiconductor device package comprising dielectric platform and shielding plate

Light emitting diode chip with reflective layer thereon

Adhesive composition and sheet having an adhesive layer of the composition

Method of producing image display unit

Method for forming bumps

Etchant and method for forming bumps

Method of improving power distribution in wirebond semiconductor packages

Decoupling capacitor closely coupled with integrated circuit

Conductor substrate, semiconductor device and production method thereof

Method for manufacturing nitride based single crystal substrate and method for manufacturing nitride based semiconductor device

Semiconductor module having a coupling substrate, and methods for its production

Semiconductor device with front side metallization and method for the production thereof

Methods and apparatuses relating to block receptor configurations and block assembly processes