Electronic device with conductive connection structure

Hard disk drive and wireless data terminal using the same

Method and apparatus for facilitating proximity communication and power delivery

Electronic device, semiconductor device using same, and method for manufacturing semiconductor device

Attachment system incorporating a recess in a structure

Contacts to microdevices

Solder bump structure for flip chip semiconductor devices and method of manufacture therefore

Integrated circuit solder bumping system

Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the same

Insulated gate semiconductor device having a clamping element to clamp gate-emitter voltage and method of manufacturing thereof

Semiconductor device and a method of manufacturing the same

Semiconductor manufacturing method

Bonding apparatus and method of bonding for a semiconductor chip

Decoupling capacitor closely coupled with integrated circuit

Routing under bond pad for the replacement of an interconnect layer

Semiconductor device having metallic plate with groove

Semiconductor IC-embedded module with multilayer substrates with multiple chips embedded therein

Semiconductor component and method of assembling the same

Power semiconductor device and method therefor

Grooved substrates for uniform underfilling solder ball assembled electronic devices

Semiconductor device and method for fabricating the same

Semiconductor device and power conversion apparatus using the same

Bumping process and structure thereof

Method for fabricating semiconductor component having conductors and bonding pads with wire bondable surfaces and selected thickness

Microfeature workpieces, carriers, and associated methods

Lithographic type microelectronic spring structures with improved contours

Method for forming a double embossing structure

Wafer structure with a multi-layer barrier in an UBM layer network device with power supply

METHOD OF SOLDER BUMPING A CIRCUIT COMPONENT AND CIRCUIT COMPONENT FORMED THEREBY

Quad flat pack (QFP) package and flexible power distribution method therefor

Reversible-multiple footprint package and method of manufacturing

Methods and apparatus for high-density chip connectivity

Hybridization of polynucleotides conjugated with chromophores and fluorophores to generate donor-to-donor energy transfer system

Method and device for producing a system having a component applied to a predetermined location of a surface of a substrate

Two layer substrate ball grid array design

Encapsulated chip scale package having flip-chip on lead frame structure and method

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Method of packaging and interconnection of integrated circuits

Semiconductor die package

Bi-directional switch, and use of said switch

Semiconductor connection component

Power semiconductor packaging method and structure

3D IC method and device

Tin-silver solder bumping in electronics manufacture

Manufacturing method of semiconductor device

Semiconductor device and a manufacturing method of the same

Assembly of an electrical component comprising an electrical insulation film on a substrate and method for producing said assembly

Bonding pad structure to minimize IMD cracking

Semiconductor device electronic component, circuit board, and electronic device

Semiconductor assembly and packaging for high current and low inductance

Apparatuses and methods facilitating functional block deposition

Integrated circuit with low-stress under-bump metallurgy

Metal pad or metal bump over pad exposed by passivation layer

Laminated electronic component and method for producing the same

Technique for efficiently patterning an underbump metallization layer using a dry etch process

Semiconductor element with conductive bumps and fabrication method thereof

Bonding pad on IC substrate and method for making the same

Technique for forming a copper-based contact layer without a terminal metal

Semiconductor package with ferrite shielding structure

Semiconductor device, power amplifier device and PC card

IC with on-die power-gating circuit

Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same

Process for exposing solder bumps on an underfill coated semiconductor

Connection element for a semiconductor component and method for producing the same

Wafer-level-chip-scale package and method of fabrication

Reduced inductance in ball grid array packages

Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby

Semiconductor device and manufacturing method thereof

Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus

Process for making a semiconductor device having a roughened surface

Semiconductor device

Semiconductor device

Packaged integrated circuits and methods of producing thereof

Direct FET device for high frequency application

Micro-package, multi-stack micro-package, and manufacturing method therefor

Integrated circuit for driving semiconductor device and power converter

Hybrid conductive coating method for electrical bridging connection of RFID die chip to composite antenna

Method of manufacturing a passive integrated matching network for power amplifiers

Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same

Dicing die bonding film

Semiconductor device with semiconductor device components embedded in a plastics composition

Semiconductor device advantageous in improving water resistance and oxidation resistance

Semiconductor device

Semiconductor die package and method for making the same

Semiconductor device and package, and method of manufacturer therefor

Semiconductor device

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer

Lead-free semiconductor package

Semiconductor device

Method of manufacturing semiconductor device

Semiconductor wafer package and manufacturing method thereof

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same

Micro solder pot

Manufacturing method for a semiconductor device

Coaxial through chip connection

Post-attachment chip-to-chip connection

Tack & fuse chip bonding

Routingless chip architecture

Semiconductor device and method for manufacturing the same

Rigid-backed, membrane-based chip tooling

Through chip connection

Chip-based thermo-stack

Chip spanning connection

Inverse chip connector

Chip connector

Post & penetration interconnection

Triaxial through-chip connection

Profiled contact

Chip capacitive coupling

Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus

Metal bump with an insulation for the side walls and method of fabricating a chip with such a metal bump

Electronic chip contact structure

Patterned contact

Contact-based encapsulation

Membrane-based chip tooling

METHOD FOR FORMING BUMPS

Electronic circuit protection device

Semiconductor device having reduced number of external pad portions

Structure for avalanche improvement of ultra high density trench MOSFET

Source contact and metal scheme for high density trench MOSFET

Wiring board and method for manufacturing the same

Semiconductor package and method for forming the same

Method and apparatus for moving blocks

Nanotube materials for thermal management of electronic components

Method for mounting an electronic part on a substrate using a liquid containing metal particles

Semiconductor device having capacitive insulation means and communication terminal using the device

Encapsulated power semiconductor assembly

Redistribution layer with microstrips

Circuit arrangement placed on a substrate and method for producing the same

Offset solder bump method and apparatus

Semiconductor device

Semiconductor chip with coil element over passivation layer

Semiconductor device and manufacturing method thereof

Semiconductor device packages with substrates for redistributing semiconductor device electrodes

Low cost power semiconductor module without substrate

Semiconductor device

Light emitting device package and method for manufacturing the same

Mask and method for electrokinetic deposition and patterning process on substrates

NANO IC

Semiconductor device and fabrication method thereof

Electrical/optical integration scheme using direct copper bonding

Semiconductor device and method of fabricating the same

Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device

Semiconductor device with sealed semiconductor chip

Method and Device for Producing a System Having a Component Applied to a Predetermined Location of a Surface of a Substrate

Method for making a flat-top pad

Fabrication method of under bump metallurgy structure

Intermediate semiconductor device structures

Surface protection film and method for producing the same

Device with area array pads for test probing

Stacked type semiconductor device

Conductive bump structure for semiconductor device and fabrication method thereof

Multi-chip module and method of manufacture

Alignment key structure in a semiconductor device and method of forming the same

Package substrate with built-in capacitor and manufacturing method thereof

Semiconductor device production method and semiconductor device

Solder deposition on wafer backside for thin-die thermal interface material

Multilayer printed wiring board

Semiconductor device having a flexible board for connection to a semiconductor chip mounted on an insulating substrate

Multilayer printed wiring board

Pressure contract spring for contact arrangement in power semiconductor module

Semiconductor device and method of manufacturing the same

Thermal interconnect systems methods of production and uses thereof

Semiconductor device and electronic device

Semiconductor device with electrically isolated ground structures

Device packages having a III-nitride based power semiconductor device

Semiconductor chip having a soldering layer sequence, and process for soldering a semiconductor chip

Semiconductor device with self-aligning contactless interface

Electric circuit module with improved heat dissipation characteristics using a fixing tool for fixing an electric apparatus to a heat sink

Coolant cooled type semiconductor device

Semiconductor package accomplishing fan-out structure through wire bonding

Integrated circuit system for bonding

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Integrated heat spreader and method for using

Semiconductor device and fabrication method thereof

Semiconductor device

Elimination of low frequency oscillations in semiconductor circuitry

Power semiconductor device and method therefor

Semiconductor integrated circuit device and vehicle-mounted radar system using the same

SOCKETS FOR "SPRINGED" SEMICONDUCTOR DEVICES

Copper interconnect post for connecting a semiconductor chip to a substrate and method of fabricating the same

Resin-encapsulated type semiconductor packages, and production method and apparatus therefor

Fluidic heterogeneous microsystems assembly and packaging

Semiconductor device and an image sensing device

Mounting structure and mounting method of a semiconductor device, and liquid crystal display device

Integrated heat spreader with intermetallic layer and method for making

Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance

Semiconductor device with extraction electrode

Method of room temperature covalent bonding

Universal interconnect die

Methods for the electronic, homogeneous assembly and fabrication of devices

Semiconductor structure with RF element

Secure system for tracking elements using tags

Semiconductor device having a functional surface

Wafer level chip scale package having a gap and method for manufacturing the same

System for tracking elements using tags

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Bonding pads having slotted metal pad and meshed via pattern

Wiring board manufacturing method

Method for producing a semiconductor device and resulting device

Semiconductor package fabrication

Wafer-processing tape

Apparatus and method for predetermined component placement to a target platform

Magnetron sputtered metallization of a nickel silicon alloy, especially useful as solder bump barrier

METHOD OF FORMING REDISTRIBUTION BUMP AND SEMICONDUCTOR CHIP AND MOUNT STRUCTURE FABRICATED USING THE SAME

Semiconductor device

Semiconductor device and a manufacturing method of the same

Nano memory, light, energy, antenna and strand-based systems and methods

Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device

System for different bond pads in an integrated circuit package

Arrangement of an electrical component placed on a substrate, and method for producing the same

Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded

CHIP STRUCTURE AND WAFER STRUCTURE

Underfill encapsulant for wafer packaging and method for its application

Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus

Manufacturing method for electronic device

Semiconductor device, electrode member and electrode member fabrication method

Method for integrating an electronic component or similar into a substrate

Semiconductor device with chip-on-board structure

Method and system for bonding a semiconductor chip onto a carrier using micro-pins

Trace design to minimize electromigration damage to solder bumps

Semiconductor device

Semiconductor packages and methods for making and using same

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Forming a cap above a metal layer

Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Ground arch for wirebond ball grid arrays

Method of manufacturing non-leaded integrated circuit package system having etched differential height lead structures

Thin-film semiconductor component and production method for said component

Method and system for transferring dies between surfaces

Integrated circuits and interconnect structure for integrated circuits

Semiconductor device and method of manufacturing the same

Semiconductor device and fabrication method thereof

Method and system for 3D alignment in wafer scale integration

Efficient method of forming and assembling a microelectronic chip including solder bumps

Semiconductor laser, method of mounting semiconductor laser, semiconductor laser mounted structure, and optical disk system

Semiconductor device

Method for depositing an adhesion-promoting layer on a metallic layer of a chip

Transducer assembly, capillary and wire bonding method using the same

Electronic device manufacture

Elevated bond-pad structure for high-density flip-clip packaging and a method of fabricating the structures

High-density inter-die interconnect structure

Semiconductor device and method of manufacturing a semiconductor device

Chip-type noise filter, manufacturing method thereof, and semiconductor package

Method of making an electronic assembly

Semiconductor element with under bump metallurgy structure and fabrication method thereof

Method of manufacturing semiconductor device and method of treating electrical connection section

Methods relating to forming interconnects

Method for producing an anisotropic conductive film on a substrate

Under bump metallurgy in integrated circuits

Semiconductor module including circuit component and dielectric film, manufacturing method thereof, and application thereof

Printed-circuit board and circuit unit incorporating the circuit board

Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus

Heat conductive sheet, manufacturing method of the same, and manufacturing method of a liquid crystal display using the same

Semiconductor apparatus and manufacturing method

Semiconductor device having a particular electrode structure

Semiconductor chip stack package having dummy chip

Multi-function card device

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Method for cutting semiconductor substrate

Assembly comprising functional devices and method of making same

NANO IC packaging

Semiconductor device

Method of forming contact pads

Semiconductor integrated device and method for manufacturing same

Method and system for 3D alignment in wafer scale integration

Microelectronic package having stacked semiconductor devices and a process for its fabrication

Semiconductor device

Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component

Hot-Melt Underfill Composition and Methos of Application

Wafer structure, chip structure, and fabricating process thereof

Ball limiting metallurgy split into segments

Semiconductor device and manufacturing method therefor

Package for a high-frequency electronic device

Repairable three-dimensional semiconductor subsystem

Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument

Semiconductor device with a guard-ring structure and a field plate formed of polycrystalline silicon film embedded in an insulating film

Method of manufacturing wiring substrate to which semiconductor chip is mounted

PCB, manufacturing method thereof and semiconductor package implementing the same

Microelectronic devices having underfill materials with improved fluxing agents

Semiconductor device package

Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method

Electrical or electronic component and method of producing same

Compact system module with built-in thermoelectric cooling

Protection of an integrated capacitor

B-stageable underfill encapsulant and method for its application

Method of making wafer level ball grid array

Apparatus and method for manufacturing semiconductor device

Metallization structure over passivation layer for IC chip

Semiconductor device

Forming of high aspect ratio conductive structure using injection molded solder

Micro-C-4 semiconductor die and method for depositing connection sites thereon

Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of a semiconductor device

Semiconductor memory device and defect remedying method thereof

Coolant cooled type semiconductor device

Semiconductor device and method of fabricating the same

Ultrasonic bonding equipment for manufacturing semiconductor device, semiconductor device and its manufacturing method