SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor chip having double bump structure and smart card including the same

Micro-fluidic injection molded solder (IMS)

Method of attaching die to circuit board with an intermediate interposer

Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Apparatus for mounting semiconductor device

Methods and apparatus for measuring analytes using large scale FET arrays

Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same

CONTACT STRUCTURE HAVING A COMPLIANT BUMP AND A TESTING AREA AND MANUFACTURING METHOD FOR THE SAME

Semiconductor device, manufacturing method of semiconductor device, and RFID tag

Method of providing an electronic device including dies, a dielectric layer, and an encapsulating layer

Fabrication method for integrated circuit chip component, multi-chip module, and their integration structure

Method for disposing a component

Electronic assembly with detachable components

Coupling heat sink to integrated circuit chip with thermal interface material

MULTI-FUNCTION CARD DEVICE

Packaged electronic device having metal comprising self-healing die attach material

Semiconductor wafer processing

FILLING COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE

Embedded die with protective interposer

Surface-mounted electronic component

Electronic device having interconnections, openings, and pads having greater width than the openings

Semiconductor package including a stacking element

Enhanced WLP for superior temp cycling, drop test and high current applications

Silicon substrate for package

Semiconductor package with stacked chips and method for manufacturing the same

Under-Bump Metallization Structure for Semiconductor Devices

Wiring board and method of manufacturing the same, and semiconductor device and method of manufacturing the same

Integrated circuit packaging system with bump contact on package leads and method of manufacture thereof

Integrated circuit package system with package stacking and method of manufacture thereof

Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut

Stacked dual chip package and method of fabrication

Multi-layer lead frame package and method of fabrication

Alignment structures for integrated-circuit packaging

Image sensor package and fabrication method thereof

Vertical MOSFET with through-body via for gate

Power MOS transistor device and switch apparatus comprising the same

ROOM TEMPERATURE DIRECT METAL-METAL BONDING

Bonding method, bonding apparatus, and manufacturing method of semiconductor device using the same

Die stacking with an annular via having a recessed socket

Electronic component package and method for producing electronic component package

Conformal shielding employing segment buildup

Multi-chip module with multi-level interposer

Silicon nitride passivation layer for covering high aspect ratio features

Electronic component manufacturing method

Method of fabricating a capillary-flow underfill compositions

Fabrication method for resin-encapsulated semiconductor device

Semiconductor device and manufacturing method of the same

Semiconductor device and automotive ac generator

Pin-type chip tooling

Electronic assembly with detachable components

Distributed semiconductor device methods, apparatus, and systems

Electronic assembly with detachable components

Electronic assembly with detachable components

Method of sensing magnitude of current through semiconductor power device

Semiconductor device

Method of manufacturing electronic device and electronic device

Layered chip package with wiring on the side surfaces

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

Chip package and method for forming the same

Semiconductor device having a semiconductor element buried in an insulating layer and method of manufacturing the same

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE

Process for fabricating electronic components using liquid injection molding

QUAD FLAT NON-LEADED SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die

PRE-PROCESSING TO REDUCE WAFER LEVEL WARPAGE

Leadframe based multi terminal IC package

Electronic device, relay member, and mounting substrate, and method for manufacturing the electronic device

Semiconductor device and method of forming insulating layer around semiconductor die

High power semiconductor device for wireless applications and method of forming a high power semiconductor device

Semiconductor packaging and fabrication method using connecting plate for internal connection

Integrated circuit package for semiconductior devices with improved electric resistance and inductance

Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the same

Ferroelectric component and manufacturing the same

Method for metalizing blind vias

METHOD FOR SIMULTANEOUSLY FORMING A MECHANICAL AND ELECTRICAL CONNECTION BETWEEN TWO PARTS

CONNECTING PAD PRODUCING METHOD

Method for singulating electronic components from a substrate

Semiconductor device

Method for fabricating circuit component

Multi-surface IC packaging structures

Through Silicon via Bridge Interconnect

METHOD FOR FORMING A DOUBLE EMBOSSING STRUCTURE

Bump-on-lead flip chip interconnection

MULTI-CHIP INTEGRATED CIRCUIT

Semiconductor package with embedded die and its methods of fabrication

Stacked semiconductor chips with separate encapsulations

Thin package system with external terminals and method of manufacture thereof

Semiconductor device capable of switching operation mode and operation mode setting method therefor

Chip package and method for fabricating the same

Stacked semiconductor package having discrete components

LED packaging with integrated optics and methods of manufacturing the same

ROTARY DIE BONDING APPARATUS AND METHODOLOGY THEREOF

Nanotube Materials for Thermal Management of Electronic Components

Manufacturing method of a bump structure having a reinforcement member

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Semiconductor device with copper wirebond sites and methods of making same

SEMICONDUCTOR POWER DEVICE HAVING A STACKED DISCRETE INDUCTOR STRUCTURE

Processing method for package substrate

Rigid-backed, membrane-based chip tooling

Semiconductor device support for bonding

Assembled multi-component electronic apparatus using alignment and reference marks

Carbon nanotubes for the selective transfer of heat from electronics

High Frequency Power Supply Module Having High Efficiency and High Current

Die bond film, dicing die bond film, and semiconductor device

Methods of forming a metal pattern and semiconductor device structure

Semiconductor device with hollow structure

SEMICONDUCTOR DEVICE HAVING BUCKET-SHAPED UNDER-BUMP METALLIZATION AND METHOD OF FORMING SAME

Manufacturing method for semiconductor package

CHIP PACKAGE

Stackable electronic package and method of fabricating same

Thermal vias in an integrated circuit package with an embedded die

Semiconductor chip and film and TAB package comprising the chip and film

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Method for placing a component onto a target platform by an apparatus using a probe

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

Assessing metal stack integrity in sophisticated semiconductor devices by mechanically stressing die contacts

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Method for manufacturing a semiconductor structure

Formation method of metallic electrode of semiconductor device and metallic electrode formation apparatus

Integrated chip package structure using organic substrate and method of manufacturing the same

Electronic component

Wireless communication system

Circuit component with conductive layer structure

Single chip semiconductor coating structure and manufacturing method thereof

IC die including RDL capture pads with notch having bonding connectors or its UBM pad over the notch

Device including an encapsulated semiconductor chip and manufacturing method thereof

Wirebondless wafer level package with plated bumps and interconnects

System and Method for Improving Reliability of Integrated Circuit Packages

Chip structure

Semiconductor device and method of forming IPD in fan-out level chip scale package

Two-shelf interconnect

Thermal interface material design for enhanced thermal performance and improved package structural integrity

Reducing susceptibility to electrostatic discharge damage during die-to-die bonding for 3-D packaged integrated circuits

Method of manufacturing a semiconductor device

Semiconductor device

Low temperature bonding material comprising coated metal nanoparticles, and bonding method

Printed wiring board and method for manufacturing same

Method for mounting a component

Method for integrating an electronic component into a printed circuit board

System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates

Flip chip mounting method and bump forming method

Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates

Method of making a semiconductor device having a conductive particle on an electric pad

METAL-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME

Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace

Manufacturing method of semiconductor device

Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces

Semiconductor device with a selection circuit selecting a specific pad

Led lead frame structure

Semiconductor package

Wiring board and liquid crystal display device

RFID integrated circuit with integrated antenna structure

PANELIZED PACKAGING WITH TRANSFERRED DIELECTRIC

Method and apparatus providing integrated circuit having redistribution layer with recessed connectors

Solder alloy and semiconductor device

Wafer level chip scale package without an encapsulated via

Lead frame ball grid array with traces under die

Method of improving adhesion of bond pad over pad metallization with a neighboring passivation layer by depositing a palladium layer

Semiconductor chip, electrode structure therefor and method for forming same

Method of fabricating a conductive post on an electrode

Conductive pillar structure for semiconductor substrate and method of manufacture

Wafer-level packaged device having self-assembled resilient leads

Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device

Semiconductor device and electronic device

Semiconductor storage device and manufacturing method thereof

Method for manufacturing a microelectronic package comprising at least one microelectronic device

Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same

Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly

Semiconductor device and method of patterning resin insulation layer on substrate of the same

Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same

Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace

III-nitride power device with solderable front metal

Semiconductor chip with a bonding pad having contact and test areas

Nitride semiconductor element and method for production thereof

METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD

ADHESIVE BONDING METHOD

Method of Magnetically Driven Simultaneous Assembly

Stacking package structure with chip embedded inside and die having through silicon via and method of the same

Package process of stacked type semiconductor device package structure

Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore

FLIP-CHIP ASSEMBLY WITH ORGANIC CHIP CARRIER HAVING MUSHROOM-PLATED SOLDER RESIST OPENING

Semiconductor device and a method of manufacturing the same

Rule-based semiconductor die stacking and bonding within a multi-die package

Light emitting device, method for manufacturing the same, and backlight unit

Polymer matrices for polymer solder hybrid materials

ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIVE SHEET AND SEMICONDUCTOR DEVICE

Bonded structure with enhanced adhesion strength

Conductive pillar structure for semiconductor substrate and method of manufacture

Electronic device package and method for fabricating the same

Lead free solder interconnections for integrated circuits

Microelectronic devices with through-substrate interconnects and associated methods of manufacturing

Electronic device package and fabrication method thereof

SEMICONDUCTOR DEVICE, CHIP-ON-CHIP MOUNTING STRUCTURE, METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE CHIP-ON-CHIP MOUNTING STRUCTURE

Semiconductor module, method for fabricating the semiconductor module, and mobile apparatus

3D IC architecture with interposer and interconnect structure for bonding dies

Pillar structure having a non-planar surface for semiconductor devices

Semiconductor device and semiconductor assembly with lead-free solder

Solder interconnect with non-wettable sidewall pillars and methods of manufacture

Manufacturing of a device including a semiconductor chip

SEMICONDUCTOR PACKAGE

Stacked semiconductor package

Systems and Methods Providing Arrangements of Vias

Surface Preparation of Die for Improved Bonding Strength

Semiconductor package of a flipped MOSFET and its manufacturing method

LEAD FRAME FOR SEMICONDUCTOR DIE

SEMICONDUCTOR DEVICE

Semiconductor device and method of manufacturing the same

Vertical LED chip package on TSV carrier

Micro-fluidic injection molded solder (IMS)

WIREBONDING PROCESS

Method for manufacturing an electronic device

Semiconductor device

Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device

Interconnection tape providing a serial electrode pad connection in a semiconductor device

Power semiconductor device

Integrated circuits having TSVs including metal gettering dielectric liners

Solder bump interconnect

Semiconductor module and portable apparatus provided with semiconductor module

Protruding TSV tips for enhanced heat dissipation for IC devices

Method of manufacturing a semiconductor device

GAAS INTEGRATED CIRCUIT DEVICE AND METHOD OF ATTACHING SAME

Semiconductor device and method of manufacturing the same

LED package and method for manufacturing same

LED package, method for manufacturing LED package, and packing member for LED package

SEMICONDUCTOR DEVICE WITH A VARIABLE INTEGRATED CIRCUIT CHIP BUMP PITCH

LED assembly with a protective frame

LED PACKAGE

RFID tags and processes for producing RFID tags

Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, and light-emitting device

Stable electroless fine pitch interconnect plating

Semiconductor device and a method of manufacturing the same

Electronic device and manufacturing method of the same

Method of manufacturing a semiconductor device

Integrated semiconductor substrate structure using incompatible processes

Semiconductor device

Packaging method involving rearrangement of dice

Packaging method involving rearrangement of dice

Array-molded package-on-package having redistribution lines

Dual carrier for joining IC die or wafers to TSV wafers

Interconnection structure and its design method

Semiconductor device having a chip bonding using a resin adhesive film and method of manufacturing the same

Semiconductor device structures and electronic devices including same hybrid conductive vias

Semiconductor device

SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD

Method of manufacturing layered chip package

Etched recess package on package system

Co-axial restraint for connectors within flip-chip packages

Multi-chip package having frame interposer

Integrated circuit package-in-package system with wire-in-film encapsulant and method for manufacturing thereof

Method of stacking flip-chip on wire-bonded chip

Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip

Semiconductor device

Packaged semiconductor product and method for manufacture thereof

CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME

Encapsulation, MEMS and encapsulation method

Semiconductor device and a method of manufacturing the same

Method of making a mounted gallium nitride device

Method of manufacturing semiconductor device and wire bonding apparatus

PRESSURE BONDING APPARATUS AND METHOD

Enhanced magnetic self-assembly using integrated micromagnets

Polishing solution for CMP, and method for polishing substrate using the polishing solution for CMP

PACKAGING BOARD AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR, AND PORTABLE DEVICE

Stable Gold Bump Solder Connections

Semiconductor device

Wafer-level semiconductor device packages with three-dimensional fan-out and manufacturing methods thereof

Chip packaging with metal frame pin grid array

Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device

Multilayer printed circuit board

Semiconductor device and manufacturing method thereof

Method for Producing Semiconductor Chips and Corresponding Semiconductor Chip

Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus

Semiconductor integrated circuit

Semiconductor device

Bonded structure and manufacturing method for bonded structure

Stacked semiconductor components having conductive interconnects

SEMICONDUCTOR PACKAGE

Semiconductor device having conductive pads and a method of manufacturing the same

PACKAGE ASSEMBLY HAVING A SEMICONDUCTOR SUBSTRATE

Semiconductor packages including die and L-shaped lead and method of manufacture

Integrated void fill for through silicon via

Semiconductor device and manufacturing method thereof

Dual die semiconductor package

Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material

Method of teaching eyepoints for wire bonding and related semiconductor processing operations

ELEMENT MOUNTING BOARD, SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING THE ELEMENT MOUNTING BOARD, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

Method and system for drug delivery to the eye

Method of manufacturing an interconnect structure for a semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device manufacturing method

Method of manufacturing semiconductor device

IC chip, antenna, and manufacturing method of the IC chip and the antenna

Reworkable electronic device assembly and method

4D device process and structure

System and Method To Embed A Wireless Communication Device Into Semiconductor Packages

WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCOTOR PACKAGE HAVING THE WIRING SUBSTRATE

Dual Interconnection in Stacked Memory and Controller Module

Through-silicon via formed with a post passivation interconnect structure

Grid array connection device and method