SEMICONDUCTOR DIES WITH RECESSES, ASSOCIATED LEADFRAMES, AND ASSOCIATED SYSTEMS AND METHODS

Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same

Leadframe panel

Sensor package

Semiconductor device having a sensor chip, and method for producing the same

Semiconductor device

Light emitting device and method of manufacturing the same

Method and apparatus for loading solder balls

METHOD FOR SOLDERING TWO COMPONENTS TOGETHER BY USING A SOLDER MATERIAL

Apparatus and method of mounting conductive ball

Methods and apparatus for measuring analytes using large scale FET arrays

Electronic component-embedded board and method of manufacturing the same

Methods of attaching a die to a substrate

Assembly substrate and method of manufacturing the same

Electronic component-embedded board and method of manufacturing the same

Isolated conformal shielding

Apparatus and method for producing semiconductor modules

Method for forming side wirings

Embedded chip package process

Flip chip mounting method and bump forming method

Method and apparatus for fabricating integrated circuit device using self-organizing function

PUNCHED ADHESIVE TAPE FOR SEMICCONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME

Semiconductor device with offset stacked integrated circuits

Method for making contact with a contact surface on a substrate

Under bump metal film comprising a stress relaxation layer and a diffusion-resistant layer

Integrated circuit package system with triple film spacer having embedded fillers and method of manufacture thereof

Semiconductor device sealed in a resin section and method for manufacturing the same

Semiconductor apparatus having side surface wiring

SEMICONDUCTOR APPARATUS AND MANUFACTURING METHOD THEREOF

Semiconductor device having double side electrode structure and method of producing the same

Semiconductor device package and fabricating method thereof

SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME

HIGH TEMPERATURE PACKAGING FOR SEMICONDUCTOR DEVICES

Semiconductor device and method for manufacturing semiconductor device

Method of manufacturing a semiconductor apparatus

WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE PROVIDED WITH WIRING BOARD, METHOD FOR MANUFACTURING SUCH ELECTRONIC DEVICE AND WIRING BOARD FOR SUCH ELECTRONIC DEVICE

Method for packaging semiconductor dies having through-silicon vias

Wafer level package structure and fabrication methods

Semiconductor device and manufacturing method of the same

QUAD FLAT PACKAGE WITH EXPOSED COMMON ELECTRODE BARS

System and method for routing supply voltages or other signals between side-by-side die and a lead frame for system in a package (SIP) devices

SEMICONDUCTOR DEVICE STRUCTURES AND METHODS FOR SHIELDING A BOND PAD FROM ELECTRICAL NOISE

Method for stacking serially-connected integrated circuits and multi-chip device made from same

Semiconductor device bonding apparatus and method for bonding semiconductor device using the same

Weldable contact and method for the production thereof

Semiconductor chip bonding apparatus

Method of manufacturing printed wiring board

Capacitive isolator

METHOD OF MANUFACTURING INTERCONNECT SUBSTRATE AND SEMICONDUCTOR DEVICE

Method of manufacturing a semiconductor device having an intermetallic terminal pad and solder junction structure

DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Systems and methods for vertically integrating semiconductor devices

Manufacturing method of semiconductor integrated circuit device

Semiconductor assembly

Integrated circuit with electromagnetic intrachip communication and methods for use therewith

Test structures for electrically detecting back end of the line failures and methods of making and using the same

Semiconductor module, and hybrid vehicle drive device including the same

Electronic device which disconnects first and second terminals upon lapse of a prescribed device lifetime

Solder cap application process on copper bump using solder powder film

Semiconductor chip package and method of manufacturing the same

Flip-chip package structure, and the substrate and the chip thereof

Interposer chip, method of manufacturing the interposer chip, and multi-chip package having the interposer chip

Stacked semiconductor device and semiconductor memory device

Integrated circuit package system with wire-in-film isolation barrier

Three-dimensional die-stacking package structure

Wafer level stacked package having via contact in encapsulation portion and manufacturing method thereof

Bonding pad for preventing pad peeling and method for fabricating the same

Semiconductor package with reduced length interconnect and manufacturing method thereof

Electronic device and manufacturing method

Method for manufacturing a circuit board structure, and a circuit board structure

Semiconductor device

SEMICONDUCTOR CHIP AND PACKAGE PROCESS FOR THE SAME

SEMICONDUCTOR DEVICE PACKAGE WITH BUMP OVERLYING A POLYMER LAYER

Microelectronic package element and method of fabricating thereof

Interconnects for packaged semiconductor devices and methods for manufacturing such devices

Packaged semiconductor assemblies and methods for manufacturing such assemblies

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Lead frame, semiconductor package including the lead frame and method of forming the lead frame

Integrated circuit package for semiconductor devices with improved electric resistance and inductance

Flip-Chip Packaging with Stud Bumps

Fusion quad flat semiconductor package

Electrically connecting substrate with electrical device

Semiconductor device

Manufacturing process and structure of through silicon via

Semiconductor device and semiconductor device fabrication method

Method for connecting an electronic chip to a radiofrequency identification device

Method and apparatus for placing conductive balls

COMPRESSION BONDING DEVICE

Film substrate, fabrication method thereof, and image display substrate

Hybrid integrated circuit device and manufacturing method thereof

Method of fabricating chip package

Stacked microelectronic devices and methods for manufacturing microelectronic devices

Die-wafer package and method of fabricating same

Mounting system

Semiconductor Device Package Disassembly

INTEGRATED CIRCUIT WITH BONDING WIRE ANTENNA STRUCTURE AND METHODS FOR USE THEREWITH

Integrated circuit with power supply line antenna structure and methods for use therewith

RFID integrated circuit with integrated antenna structure

Power semiconductor package

Layout of dummy patterns

Semiconductor device and method for fabricating the same

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

Semiconductor device suitable for a stacked structure

COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT

Stackable microelectronic device carriers, stacked device carriers and methods of making the same

Stackable semiconductor package with encapsulant and electrically conductive feed-through

Three-dimensional chip-stack package and active component on a substrate

Semiconductor device having through electrode and method of fabricating the same

Power semiconductor substrates with metal contact layer and method of manufacture thereof

Composite carbon nanotube-based structures and methods for removing heat from solid-state devices

Chip package

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF THE SAME

Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method

Semiconductor device with welded leads and method of manufacturing the same

Semiconductor switching module

Chip embedded substrate and method of producing the same

Ultra-Thin Wafer-Level Contact Grid Array

Ultra slim semiconductor package and method of fabricating the same

Integrated circuit package system with flex bump

Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant

Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package

Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads

Semiconductor device and method for manufacturing thereof

Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method

Heating device, reflow device, heating method, and bump forming method

ELECTRONIC APPARATUS

Capacitor device and method of manufacturing the same

Method of Creating Molds of Variable Solder Volumes for Flip Attach

Adhesive composition and adhesive sheet

Method for fabricating semiconductor package free of substrate

Method of fabricating a two-sided die in a four-sided leadframe based package

METHOD OF MULTI-CHIP PACKAGING IN A TSOP PACKAGE

Semiconductor device and manufacturing method therefor

Mount Board and Electronic Device

Method of manufacturing a module

Process for manufacturing a module

Conformal shielding process using process gases

FIELD BARRIER STRUCTURES WITHIN A CONFORMAL SHIELD

Electronic module and fabrication method thereof

Circuit board with an attached die and intermediate interposer

Packaging system with hollow package and method for the same

Integrated circuit package system with overhang die

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING THE SHEET, AND SEMICONDUCTOR DEVICE OBTAINED BY THE METHOD

Semiconductor device and wire bonding method

Semiconductor package and trenched semiconductor power device using the same

Semiconductor package and method for manufacturing the same

Semiconductor Package and Method for Producing Same

STACK PACKAGE THAT PREVENTS WARPING AND CRACKING OF A WAFER AND SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE HAVING AN INTERCONNECT ELECTRICALLY CONNECTING A FRONT AND BACKSIDE THEREOF AND A METHOD OF MANUFACTURE THEREFOR

Integrated circuit package system with overhanging connection stack

Ta-TaN selective removal process for integrated device fabrication

Multi-chips Stacked package structure

Semiconductor device and method of manufacturing the same

Semiconductor device with flip-chip connection that uses gallium or indium as bonding material

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method for manufacturing the same

Wafer-level solder bumps

IC chip with finger-like bumps

Semiconductor device, a method of manufacturing the same and an electronic device

Forming a semiconductor package including a thermal interface material

LOW TEMPERATURE THERMAL INTERFACE MATERIALS

Semiconductor device having metal cap divided by slit

Semiconductor device including semiconductor chips having contact elements

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SYMMETRIC PACKAGING

CHIP STACKED STRUCTURE AND METHOD OF FABRICATING THE SAME

Semiconductor package and multi-chip semiconductor package using the same

Stackable package by using internal stacking modules

Semiconductor module for a switched-mode power supply and method for its assembly

Two-sided die in a four-sided leadframe based package

Plastic-Encapsulated Semiconductor Device with an Exposed Radiator at the Top and Manufacture Thereof

Semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device including fuse elements and bonding pad

Packaged device and method of manufacturing the same

Semiconductor device, method of fabricating the same, stacked module including the same, card including the same, and system including the stacked module

Semiconductor device

Methods of Creating Molds of Variable Solder Volumes for Flip Attach

SEMICONDUCTOR MANUFACTURING APPARATUS AND SEMICONDUCTOR MANUFACTURING METHOD

Using a simultaneously tilting and moving bonding apparatus

Conformal shielding process using flush structures

CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP

Heat sink formed with conformal shield

Method of machining substrate

METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND INTERCONNECT COMPONENT RECOVERY PROCESS

Formation of alpha particle shields in chip packaging

Process applying die attach film to singulated die

Stack circuit member and method

Manufacturing Method of Semiconductor Integrated Circuit Device

Semiconductor apparatus and method for manufacturing the same

Method of constructing a stacked-die semiconductor structure

Manufacturing method for semiconductor integrated device

RECOVERABLE ELECTRONIC COMPONENT

LOW-TEMPERATURE RECOVERABLE ELECTRONIC COMPONENT

Demountable interconnect structure

3D electronic module

Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system

Semiconductor memory device and semiconductor memory card using the same

Apparatus for non-conductively interconnecting integrated circuits

Quad flat non-leaded chip package

Semiconductor device including a stress buffer

Tape wiring substrate and chip-on-film package using the same

SEMICONDUCTOR WAFER THAT SUPPORTS MULTIPLE PACKAGING TECHNIQUES

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Self-aligned wafer or chip structure, and self-aligned stacked structure

Electrical shielding in stacked dies by using conductive die attach adhesive

Substrate bonding method and semiconductor device

Structure and manufactruing method of chip scale package

Semiconductor device

Metal pad formation method and metal pad structure using the same

CHIP PACKAGE

Semiconductor package with passive elements embedded within a semiconductor chip

Semiconductor device and manufacturing method thereof

Electronic device manufacturing method and electronic device

Electronic device manufacturing method and electronic device

Package Structure with Flat Bumps for Integrate Circuit or Discrete Device and Method of Manufacture the Same

Substrate including barrier solder bumps to control underfill transgression and microelectronic package including same

Direct edge connection for multi-chip integrated circuits

THREE-DIMENSIONAL CIRCUITRY FORMED ON INTEGRATED CIRCUIT DEVICE USING TWO-DIMENSIONAL FABRICATION

Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

Power Semiconductor Module And Method of Manufacturing the Power Semiconductor Module

PACKAGING SUBSTRATE WITH EMBEDDED CHIP AND BURIED HEATSINK

Mold compound circuit structure for enhanced electrical and thermal performance

Stacked semiconductor package and method for manufacturing the same

Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same

RF transistor packages with internal stability network and methods of forming RF transistor packages with internal stability networks

RF power transistor packages with internal harmonic frequency reduction and methods of forming RF power transistor packages with internal harmonic frequency reduction

Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layer

Bumpless flip-chip assembly with a complaint interposer contractor

Array molded package-on-package having redistribution lines

Integrated circuit package system having perimeter paddle

Semiconductor device with surface mounting terminals

Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic system

Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

Method of making a wafer level integration package

Method of assembly using array of programmable magnets

Method of making demountable interconnect structure

ELECTROLYTIC NI PLATING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Parallel chip embedded printed circuit board and manufacturing method thereof

METHOD FOR MAKING AN INTERCONNECT STRUCTURE AND LOW-TEMPERATURE INTERCONNECT COMPONENT RECOVERY PROCESS

Power composite integrated semiconductor device and manufacturing method thereof

METHOD OF FORMING AN INTERCONNECT JOINT

Method For Assembling Substrates By Depositing An Oxide Or Nitride Thin Bonding Layer

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Method for fabricating semiconductor package

Methods relating to the reconstruction of semiconductor wafers for wafer level processing including forming of alignment protrusion and removal of alignment material

Thick film circuit component and method for manufacturing the same

Apparatus for Producing Ic Chip Package

Connected body and optical transceiver module

Method of producing a transponder and a transponder

Semiconductor power device having a stacked discrete inductor structure

Method for Reliably Positioning Solder on a Die Pad for Attaching a Semiconductor Chip to the Die Pad and Molding Die for Solder Dispensing Apparatus

Semiconductor package and fabrication method thereof

FLIP CHIP PACKAGE AND METHOD FOR MANUFACTURING THE SAME

Die offset die to die bonding

Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices

Under bump metallurgy structure and wafer structure using the same and method of manufacturing wafer structure

Solder bump interconnect for improved mechanical and thermo-mechanical performance

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DIFFERENT CONNECTION STRUCTURES

SEMICONDUCTOR PACKAGE STRUCTURES

Electronic structures including barrier layers defining lips

Semiconductor device mounting structure, manufacturing method, and removal method of semiconductor device

METHOD FOR PACKAGING SEMICONDUCTORS AT A WAFER LEVEL

Molded reconfigured wafer, stack package using the same, and method for manufacturing the stack package

Embedded chip package

Chip package

CHIP PACKAGE

CHIP PACKAGE

EMI shielded semiconductor package

Photoelectric conversion element having a semiconductor and semiconductor device using the same

Semiconductor device

Camera module with window mechanical attachment

BOND HEAD FOR A WIRE BONDER

Implementation structure of semiconductor package

Ubm Pad, Solder Contact and Methods for Creating a Solder Joint

Electronic component and manufacturing method thereof

Method of fabricating a semiconductor device

Bonding structure with buffer layer and method of forming the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Method of manufacturing a semiconductor device

Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support

Power semiconductor packaging method and structure

Reducing stress in a flip chip assembly

Method for fabricating semiconductor device installed with passive components

Au—Sn alloy bump including no large void and method of producing same

SEMICONDUCTOR PACKAGE AND METHOD FOR DISCHARGING ELECTRONIC DEVICES ON A SUBSTRATE

Patterned die attach and packaging method using the same

METHOD FOR STACKING SEMICONDUCTOR CHIPS AND SEMICONDUCTOR CHIP STACK PRODUCED BY THE METHOD

STRUCTURE FOR PREVENTING PAD PEELING

Circuit arrangement and integrated circuit

Through silicon via dies and packages

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE PRODUCT

Contact pad and method of forming a contact pad for an integrated circuit

Method of packaging a microchip having a footprint that is larger than that of the integrated circuit

Electronic Component

HIGH-FREQUENCY CIRCUIT DEVICE AND RADAR

Process for manufacturing substrate with bumps and substrate structure

Structure, method and system for assessing bonding of electrodes in FCB packaging

Electronic system with vertical intermetallic compound