Chip-in-slot interconnect for 3D chip stacks

Semiconductor device and method for manufacturing same

Semiconductor package and method for fabricating the same

Microelectronic packages having cavities for receiving microelectric elements

Electrically interconnected stacked die assemblies

Integrated circuit package system with leaded package

Device configuration and method to manufacture trench MOSFET with solderable front metal

Semiconductor subassemblies with interconnects and methods for manufacturing the same

Wiring method and device

Conductive ball arraying apparatus

Printed wiring board and a method of manufacturing a printed wiring board

Fill head for injection molding of solder

Dial module and process for manufacturing the same, LED display element, display module, movement module, connector module and meter employing the same

Circuit device and manufacturing method therefor

Method of fabricating a wafer structure having a pad and a first protection layer and a second protection layer

Thermal paste containment for semiconductor modules

Chip scale package having flip chip interconnect on die paddle

Front-end processing of nickel plated bond pads

One piece method for integrated circuit (IC) assembly

Dial module and process for manufacturing the same, LED display element, display module, movement module, connector module and meter employing the same

Current sensor

Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier

REDUCED-DIMENSION MICROELECTRONIC COMPONENT ASSEMBLIES WITH WIRE BONDS AND METHODS OF MAKING SAME

MEMORY DEVICES INCLUDING SEPARATING INSULATING STRUCTURES ON WIRES AND METHODS OF FORMING

SEMICONDUCTOR DEVICE

Method of Manufacturing Electrical Conductors for a Semiconductor Device

Arrangement including a semiconductor device and a connecting element

Silicon carbide power devices including P-type epitaxial layers and direct ohmic contacts

Reduced inductance in ball grid array packages

Semiconductor element and method of manufacturing the same

Enhanced copper posts for wafer level chip scale packaging

Multi-die wafer level packaging

Semiconductor device

Cylindrical bonding structure and method of manufacture

Semiconductor apparatus having a first and a second projection portion on opposite surfaces of a semiconductor wafer and method for manufacturing the same

Semiconductor packaging system with stacking and method of manufacturing thereof

Protection and Connection of Devices Underneath Bondpads

Package stacking through rotation

Microelectronic package having interconnected redistribution paths

Lead frame and manufacturing method thereof, and semiconductor apparatus and manufacturing method thereof

SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR CHIP AND ANTENNA

Packages and assemblies including lidded chips

Metal interconnect System and Method for Direct Die Attachment

Semiconductor chip mounting board with multiple ports

Method of manufacturing electronic component package

Manufacture of a layer including a component

Prevention and control of intermetallic alloy inclusions

Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment

Method of manufacturing chip integrated substrate

COMPOUND WIREBONDING AND METHOD FOR MINIMIZING INTEGRATED CIRCUIT DAMAGE

Semiconductor device and manufacturing method of the same

Standoff height improvement for bumping technology using solder resist

Reactive solder material

Method of bonding aluminum electrodes of two semiconductor substrates

Method for mounting anisotropically-shaped members

Method of fabricating a semiconductor device package

Antenna structure for integrated circuit die using bond wire

Semiconductor device with integrated coils

Semiconductor device and process for fabrication thereof

SEMICONDUCTOR PACKAGE HAVING MOLDED BALLS AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and fabrication method thereof

Chip Assembly and Method of Manufacturing Thereof

Mold design and semiconductor package

Compliant thermal contactor

INTEGRATED CIRCUIT PACKAGE WITH SOLDERED LID FOR IMPROVED THERMAL PERFORMANCE

Wafer level system in package and fabrication method thereof

Semiconductor packages with enhanced joint reliability and methods of fabricating the same

Semiconductor device and a method of manufacturing the same

LEAD FRAME FOR SEMICONDUCTOR DEVICE

Leadframe with extended pad segments between leads and die pad, and leadframe package using the same

SEMICONDUCTOR DEVICE, LEADFRAME AND STRUCTURE FOR MOUNTING SEMICONDUCTOR DEVICE

LEAD-FRAME ARRAY PACKAGE STRUCTURE AND METHOD

Semiconductor integrated circuit with solder bump

Transistor package with wafer level dielectric isolation

Integrated circuit for various packaging modes

MULTI-STRAND SUBSTRATE FOR BALL-GRID ARRAY ASSEMBLIES AND METHOD

Solderable top metal for silicon carbide semiconductor devices

Semiconductor device and a method of manufacturing the same

METHOD FOR FABRICATING METAL PAD

Downhill Wire Bonding for QFN L - Lead

Semiconductor Substrate Having Enhanced Adhesion And Method For Manufacturing The Same

Method for manufacturing semiconductor package

Semiconductor device packaged into chip size and manufacturing method thereof

Method of manufacturing a semiconductor device

Method of making integrated circuit package with transparent encapsulant

Method for adhering semiconductor devices

Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler

Packaging Substrate with Flat Bumps for Electronic Devices and Method of Manufacturing the Same

Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability

Assembling lighting elements onto a substrate

Alignment mark, semiconductor chip including the same, semiconductor package including the chip and methods of fabricating the same

Flip chip mounting method and bump forming method

Method for Fabricating Array-Molded Package-On-Package

Semiconductor device and method of manufacturing same

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PERIMETER PADDLE

Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compound

Semiconductor device with multilayered metal pattern

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING BOAC/COA

METHODS OF FABRICATING CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE, AND CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE FABRICATED USING THE METHODS

Reliable metal bumps on top of I/O pads after removal of test probe marks

Semiconductor package with under bump metallization aligned with open vias

Chip assembly with interconnection by metal bump

Method for manufacturing semiconductor device, and semiconductor device

Semiconductor module manufacturing method, semiconductor module, and mobile device

BUMP STRUCTURE

Apparatus for connecting integrated circuit chip to power and ground circuits

Dimple free gold bump for drive IC

Semiconductor device

Semiconductor package having die with recess and discrete component embedded within the recess

Electronic system with expansion feature

Semiconductor package using chip-embedded interposer substrate

Compact multi-port CAM cell implemented in 3D vertical integration

Die stacking system and method

Multi-chip semiconductor device having leads and method for fabricating the same

Chip-On-Lead and Lead-On-Chip Stacked Structure

Semiconductor Device and Its Fabrication Method

Semiconductor device

Method for bonding electronic components

Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit

METHODS AND APPARATUS FOR TRANSFERRING CONDUCTIVE PIECES DURING SEMICONDUCTOR DEVICE FABRICATION

Method for manufacturing strip level substrate without warpage and method for manufacturing semiconductor package using the same

Systems and methods for post-circuitization assembly

METHODS FOR FORMING PACKAGE STRUCTURES

CONVEX DIE ATTACHMENT METHOD

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Etch method

Semiconductor package and method of forming the same, and printed circuit board

RF-coupled digital isolator

RF-coupled digital isolator

Device comprising an element with electrodes coupled to connections

Semiconductor device

Semiconductor device with improved resin configuration

Flip-chip semiconductor package and package substrate applicable thereto

Semiconductor package and method of forming the same

Semiconductor device and a method of manufacturing the same

Semiconductor device and manufacturing method thereof

Package structure for integrated circuit device

Semiconductor chip and manufacturing method thereof

Flash memory card

Multi-die molded substrate integrated circuit device

Substrate and multilayer circuit board

POWER SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE, LEAD FRAME MEMBER, AND METHOD OF MAKING POWER SEMICONDUCTOR DEVICE

Methods of packaging a semiconductor die and package formed by the methods

Semiconductor device

Package integrated soft magnetic film for improvement in on-chip inductor performance

Semiconductor device, semiconductor wafer structure and method for manufacturing the semiconductor wafer structure

Semiconductor device for high frequency

Method of manufacturing a semiconductor device having an insulating protective film covering at least a portion of a tile-shaped element

Electronic device manufacturing method and supporter

Methods of forming a semiconductor device including a diffusion barrier film

Structure and method for enhancing resistance to fracture of bonding pads

Semiconductor device package with multi-chips and method of the same

Process and apparatus for wafer-level flip-chip assembly

Manufacturing method of semiconductor device

Wafer-level flip-chip assembly methods

Semiconductor device and method of fabricating the same, circuit board, and electronic instrument

Method of assembling electronic components of an electronic system, and system thus obtained

COPPER-METALLIZED INTEGRATED CIRCUITS HAVING ELECTROLESS THICK COPPER BOND PADS

PCB having embedded IC and method for manufacturing the same

Memory card and method for fabricating the same

SEMICONDUCTOR DEVICE INCLUDING MULTILAYER WIRING BOARD WITH POWER SUPPLY CIRCUIT

Package-in-package using through-hole via die on saw streets

Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method therefor

Semiconductor device and method for manufacturing semiconductor device

Package substrate and its solder pad

Semiconductor Device

SYSTEM FOR IMPLEMENTING HARD-METAL WIRE BONDS

Land grid array semiconductor package

Package-on-package using through-hole via die on saw streets

Through-hole via on saw streets

Air cavity package for a semiconductor die and methods of forming the air cavity package

Semiconductor packaging device comprising a semiconductor chip including a MOSFET

Same size die stacked package having through-hole vias formed in organic material

Semiconductor die package and integrated circuit package and fabricating method thereof

Semiconductor die with through-hole via on saw streets and through-hole via in active area of die

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

Extended redistribution layers bumped wafer

Vacuum wire tensioner for wire bonder

Re-workable heat sink attachment assembly

Temperature control of a bonding stage

METHOD, SYSTEM, AND APPARATUS FOR TRANSFER OF DIES USING A DIE PLATE

Substrate with feedthrough and method for producing the same

SEMICONDUCTOR CHIP PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Method and system for bonding 3D semiconductor devices

Chip package

Flip chip laser bonding process

Fabricating process of a chip package structure

Adhesive composition and a method of using the same

Bidirectional multiplexed RF isolator

Pressure-contact power semiconductor module and method for producing the same

METHOD AND APPARATUS FOR HEAT DISSIPATION

PANEL/WAFER MOLDING APPARATUS AND METHOD OF THE SAME

Method transparent member, optical device using transparent member and method of manufacturing optical device

Semiconductor device and method of manufacturing the same

Semiconductor device with a semiconductor chip and electrical connecting elements to a conductor structure

Die bonding agent and a semiconductor device made by using the same

Package equipped with semiconductor chip and method for producing same

MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE MULTI-CHIP PACKAGE

Semiconductor package and method of manufacturing the semiconductor package

Semiconductor device

Structure for electrostatic discharge in embedded wafer level packages

Semiconductor device

Wafer level package

Highly reliable low cost structure for wafer-level ball grid array packaging

WAFER-LEVEL BONDING FOR MECHANICALLY REINFORCED ULTRA-THIN DIE

Integrated chip package structure using organic substrate and method of manufacturing the same

Semiconductor device and method of fabricating the semiconductor device

WAFER LEVEL PACKAGE AND FABRICATING METHOD THEREOF

STACK PACKAGE WITH RELEASING LAYER AND METHOD FOR FORMING THE SAME

Semiconductor device and method for manufacturing the same

Substrate for multi-chip stacking, multi-chip stack package utilizing the substrate and its applications

Semiconductor device

Semiconductor package using copper wires and wire bonding method for the same

Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips

IC chip and its manufacturing method

Magnetically alignable integrated circuit device

Semiconductor layer structure and method of making the same

Semiconductor device and method for producing the same

Structure and method for self protection of power device with expanded voltage ranges

Semiconductor device

Electronic flame-off electrode with ball-shaped tip

Interconnect structure with stress buffering ability and the manufacturing method thereof

Selective etch of TiW for capture pad formation

Method for manufacturing printed circuit board having embedded component

METHOD FOR FORMING BUMPS ON UNDER BUMP METALLURGY

Semiconductor layer structure and method of making the same

Method for manufacturing an electronics module comprising a component electrically connected to a conductor-pattern layer

Semiconductor device and manufacturing method thereof

Adhesive Sheet and Method for Manufacturing the Same, Semiconductor Device Manufacturing Method and Semiconductor Device

Sheet to Form a Protective Shield for Chips

On chip transformer isolator

Chip Module and Method for Producing a Chip Module

Apparatus for detecting press-bonded ball at bonding portion in bonding apparatus and method for detecting press-bonded ball at bonding portion

Method for fabricating a probing pad of an integrated circuit chip

Power semiconductor module

Connecting microsized devices using ablative films

Semiconductor device

Integration type semiconductor device and method for manufacturing the same

Semiconductor Device and Method for Fabricating the Same

Low fabrication cost, fine pitch and high reliability solder bump

Semiconductor device and manufacturing method of the same

Wiring board manufacturing method, semiconductor device manufacturing method and wiring board

Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Method of making solder pad

SEMICONDUCTOR DEVICE PACKAGE TO IMPROVE FUNCTIONS OF HEAT SINK AND GROUND SHIELD

Semiconductor packaging with internal wiring bus

Semiconductor device stack package, electronic apparatus including the same, and method of manufacturing the same

Ultra-thin chip packaging

Leadframe for leadless package, structure and manufacturing method using the same

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Semiconductor device comprising a semiconductor chip stack and method for producing the same

Semiconductor package and method

Package Structure With Flat Bumps For Electronic Device and Method of Manufacture the Same

Semiconductor device with improved pads

Semiconductor device and method for manufacturing the same

Semiconductor device with power noise suppression

Semiconductor device

Integrated circuits and interconnect structure for integrated circuits

Integrated circuits and interconnect structure for integrated circuits

Wiring board manufacturing method

Semiconductor device and a method of manufacturing the same

Interconnection designs and materials having improved strength and fatigue life

Semiconductor device and process for manufacturing the same

Manufacturing method of a tray, a socket for inspection, and a semiconductor device

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME

Chip package structure

Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus

Semiconductor device

Flip chip with interposer, and methods of making same

Semiconductor device and manufacturing method thereof

Chip package

SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE

Low shrinkage polyester thermosetting resins

Electromigration-Resistant Flip-Chip Solder Joints

Wire Bonds Having Pressure-Absorbing Balls

UBM structure for strengthening solder bumps

Structure of semiconductor chip and package structure having semiconductor chip embedded therein

Semiconductor device

SEMICONDUCTOR DEVICE INCLUDING WIRING SUBSTRATE HAVING ELEMENT MOUNTING SURFACE COATED BY RESIN LAYER

Multi-chip module

Curing layers of a semiconductor product using electromagnetic fields

Semiconductor module

Plastic package and method of fabricating the same

Semiconductor device

Semiconductor device

Semiconductor device

Mounted body and method for manufacturing the same

LOW-STRESS HERMETIC DIE ATTACH

Semiconductor module including semiconductor chips coupled to external contact elements

Semiconductor Device with Improved Contact Pad and Method for Fabrication Thereof

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Wafer-level package having test terminal

Substrate and method for manufacturing the same

Mounting substrate and electronic device

Electrical interconnect structure and method

Wiring design support apparatus for bond wire of semiconductor devices