Method to create a metal pattern using a damascene-like process

Solder connector structure and method

Wafer level package with good CTE performance

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

THERMAL BONDING PROCESS FOR CHIP PACKAGING

Chip package structure

Display device

Method And System for Output Matching of Rf Transistors

Semiconductor device and method of manufacturing same

Interconnect for chip level power distribution

Soldering Method, Solder Pellet for Die Bonding, Method for Manufacturing a Solder Pellet for Die Bonding, and Electronic Component

Semiconductor device with a semiconductor chip connected in a flip chip manner

Semiconductor device and method of manufacturing the same

Top layers of metal for high performance IC's

SEMICONDUCTOR DEVICE WITH BONDING PAD

Novel substrate design for semiconductor device

Mobile binding in an electronic connection

METHOD FOR FABRICATING CONTACT PADS

Integrated circuit device and method for the production thereof

Chips having rear contacts connected by through vias to front contacts

Flip-chip image sensor packages and methods of fabricating the same

Semiconductor device and method of manufacturing semiconductor device

Chip package structure

Semiconductor package structure having enhanced thermal dissipation characteristics

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Arrangement for high frequency application

STACKED AND SHIELDED DIE PACKAGES WITH INTERCONNECTS

Semiconductor device including redistribution line structure and method of fabricating the same

Detector system and detector subassembly

Semiconductor light-emitting device

Heat cycle-able connection

Method for welding two welding parts by means of a fillet weld and welding part with an inclined tapered edge area therefor

Joining method and device produced by this method and joining unit

Variable interconnect geometry for electronic packages and fabrication methods

FABRICATION METHOD AND STRUCTURE OF PCB ASSEMBLY, AND TOOL FOR ASSEMBLY THEREOF

Method of creating contour structures to highlight inspection region

Manufacturing method of tape carrier for TAB

Flux for soldering and soldering process

METHOD OF MAKING SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND

Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device

Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip

Inkjet printed wirebonds, encapsulant and shielding

Wafer-level-chip-scale package and method of fabrication

Method for fabricating a low cost integrated circuit (IC) package

Manufacturing method of semiconductor device

Print mask and method of manufacturing electronic components using the same

Method of assembling chips

GANG FLIPPING FOR FLIP-CHIP PACKAGING

Semiconductor device with electrode pad having probe mark

INTEGRATED CIRCUIT PACKAGE AND METHOD FOR THE SAME

Semiconductor device

Semiconductor device

SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND

Semiconductor device and method of manufacturing the same

RECESSED SOLDER SOCKET IN A SEMICONDUCTOR SUBSTRATE

Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for WLP and method of the same

Semiconductor device

Integrated circuit package system with bonding in via

Semiconductor device

SEMICONDUCTOR DEVICE WITH STRENGTHENED PADS

Semiconductor package

Semiconductor Package and Method for Fabricating the Same

METHOD FOR FORMING CONTACT PADS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereof

COMPLIANT BUMP STRUCTURE AND BONDING STRUCTURE

Method and apparatus providing integrated circuit having redistribution layer with recessed connectors

Semiconductor device

Semiconductor device and manufacturing method thereof

Packaging substrate structure with a semiconductor chip embedded therein

Chip packaging structure

MULTI-CHIP SEMICONDUCTOR PACKAGE STRUCTURE

Semiconductor device

SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND DUAL BUILD-UP LAYERS OVER BOTH SIDE-SURFACES FOR WLP AND METHOD OF THE SAME

Package structure and manufacturing method thereof

Package structure and method of manufacturing the same

Controlling substrate surface properties via colloidal coatings

Semiconductor device and method of manufacturing the same

Composite semiconductor device

Integrated circuits and interconnect structure for integrated circuits

Semiconductor device with different sized ESD protection elements

Apparatus and method for semiconductor wafer bumping via injection molded solder

Die backside wire bond technology for single or stacked die package

Circuit board and circuit device

APPARATUSES AND METHODS FOR FORMING SMART LABELS

Method for producing electrically conductive bushings through non-conductive or semiconductive substrates

Method of wire bonding over active area of a semiconductor circuit

METHOD OF MANUFACTURING DEVICE

Manufacturing method for devices

Design of BEOL patterns to reduce the stresses on structures below chip bondpads

Semiconductor die collet and method

Method of making semiconductor package with plated connection

Method for manufacturing a semiconductor device

MARKED BODY AND MANUFACTURING METHOD THEREOF

Antenna device and radio communication device

Output Circuit

Contact carriers (tiles) for populating larger substrates with spring contacts

Module comprising a semiconductor chip

Surface treatments for contact pads used in semiconductor chip packagages and methods of providing such surface treatments

SOLDER-BUMPING STRUCTURES PRODUCED BY A SOLDER BUMPING METHOD

Semiconductor device, semiconductor package for use therein, and manufacturing method thereof

Semiconductor device and its manufacturing method

Wire-bonded semiconductor component with reinforced inner connection metallization

SEMICONDUCTOR PACKAGE USING WIRES CONSISTING OF Ag OR Ag ALLOY

Semiconductor element connected to printed circuit board

Stackable semiconductor device and fabrication method thereof

Wafer-level stack package and method of fabricating the same

Method of forming a silicide layer on a thinned silicon wafer, and related semiconducting structure

Semiconductor device with Al pad

Power semiconductor module, method for producing a power semiconductor module, and semiconductor chip

Flip chip semiconductor device including an unconnected neutralizing electrode

Method of forming solder bump on high topography plated Cu

STRUCTURE FOR CONTROLLED COLLAPSE CHIP CONNECTION WITH DISPLACED CAPTURED PADS

Semiconductor device and manufacturing method thereof

Semiconductor device and method for manufacturing thereof

Method of manufacturing electronic device, substrate and semiconductor device

Copper die bumps with electromigration cap and plated solder

Chip and wafer integration process using vertical connections

Semiconductor package

Semiconductor device including mounting board with stitches and first and second semiconductor chips

Methods and apparatus for flip-chip-on-lead semiconductor package

SEMICONDUCTOR PACKAGE HAVING WIRE REDISTRIBUTION LAYER AND METHOD OF FABRICATING THE SAME

HEAT BLOCK

Paste for forming an interconnect and interconnect formed from the paste

Electronic part, method for fabricating electronic part, acceleration sensor, and method for fabricating acceleration sensor

Self chip redistribution apparatus and method for the same

System for fabricating semiconductor components with conductive interconnects

Fibrous laminate interface for security coatings

Method of making an interconnect structure

Wire bonding method and related device for high-frequency applications

Method of making reliable wafer level chip scale package semiconductor devices

Method of joining chips utilizing copper pillar

Molded beam for optoelectronic sensor chip substrate

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Power delivery package having through wafer vias

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

TEMPORARY CHIP ATTACH USING INJECTION MOLDED SOLDER

Microelectronic substrate including bumping sites with nanostructures

Chip structure with bumps and testing pads

Wiring board for flip-chip mounting, mounting structure of electronic components on wiring board, and semiconductor device including wiring board

Semiconductor module with multiple semiconductor chips

Silicon chip having inclined contact pads and electronic module comprising such a chip

Electronic device and method for producing electronic devices

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Device having a bonding structure for two elements

Method for manufacturing semiconductor device

SEMICONDUCTOR DEVICE MOUNTED ON SUBSTRATE, AND MANUFACTURING METHOD THEREOF

Semiconductor package and fabricating method thereof

MULTI-CHIPS PACKAGE AND METHOD OF FORMING THE SAME

Semiconductor module having deflecting conductive layer over a spacer structure

Lead structure for a semiconductor component and method for producing the same

Base substrate for chip scale packaging

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

Apparatus comprising a device and method for producing it

Article and panel comprising semiconductor chips, casting mold and methods of producing the same

Package structure and stacked package module using the same

Method and apparatus for fabricating a plurality of semiconductor devices

Packaged semiconductor components having substantially rigid support members and methods of packaging semiconductor components

Low cost lead-free preplated leadframe having improved adhesion and solderability

Multi-chip stack structure and fabrication method thereof

OPTOELECTRONIC DEVICE ALIGNMENT IN AN OPTOELECTRONIC PACKAGE

Power module having stacked flip-chip and method of fabricating the power module

Leadframe-based semiconductor package and fabrication method thereof

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing same

Lead frame, semiconductor device, and method of manufacturing the semiconductor device

Vertical electrical interconnect formed on support prior to die mount

CHIP PACKAGE AND METHOD OF FABRICATING THE SAME

Packaging methods for imager devices

Semiconductor device and manufacturing method of the same

BGA PACKAGE SUBSTRATE AND METHOD OF FABRICATING SAME

Wiring substrate and electronic device

Solar Cell (Sliver) Sub-Module Formation

Method of opening reservoir of containment device

Wireless communication system

Method of manufacturing device having a UV-curable adhesive

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Semiconductor module

Increased Stand-Off Height Integrated Circuit Assemblies, Systems, and Methods

Method and structure for magnetically-directed, self-assembly of three-dimensional structures

Class D amplifier arrangement

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns

Semiconductor device with grounding structure

Substrate with feedthrough and method for producing the same

METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS

Removal of integrated circuits from packages

Semiconductor device manufacturing method and semiconductor device

Metallic electrode forming method and semiconductor device having metallic electrode

Mounting configuration of electronic component

Semiconductor module, method of manufacturing semiconductor module, and mobile device

System and method for increased stand-off height in stud bumping process

Semiconductor component and method of manufacture

Chip carrier structure having semiconductor chip embedded therein and metal layer formed thereon

Structure of semiconductor device package and method of the same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Substrate for mounting semiconductor element and method of manufacturing the same

Resin molded semiconductor device and differential amplifier circuit

Semiconductor device and method of manufacturing the same

Conductive ball mounting apparatus and conductive ball mounting method

Electropolishing metal features on a semiconductor wafer

Method for manufacturing the BGA package board

Designs and methods for conductive bumps

Process applied to semiconductor

Substrate based unmolded package

Semiconductor device and fabrication process thereof

Thermosetting die bonding film

Method for fabricating semiconductor device and carrier applied therein

Method of forming a bump-on-lead flip chip interconnection having higher escape routing density

Electronic part mounting board and method of mounting the same

Electronic component package and manufacturing method thereof

Compression clamping of semiconductor components

Collective mounting method of electronic components and manufacturing method of electronic component-embedded substrate

SEMICONDUCTOR COMPONENT

Carbon nanotube bond pad structure and method therefor

Semiconductor apparatus and mobile apparatus

Semiconductor device and a method of manufacturing the same

Method of assembling chips

High temperature, stable SiC device interconnects and packages having low thermal resistance

Semiconductor device and manufacturing method of the semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device having conductive bumps, metallic layers, covering layers and fabrication method thereof

Electronic assembly having a multilayer adhesive structure

Power semiconductor module and method for producing the same

Interposer for die stacking in semiconductor packages and the method of making the same

Mounting method of electronic components, manufacturing method of electronic component-embedded substrate, and electronic component-embedded substrate

Electronic package and manufacturing method thereof

Semiconductor device and a method of manufacturing for high output MOSFET

Planar multi semiconductor chip package and method of manufacturing the same

Memory IC package assembly having stair step metal layer and apertures

Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product

Semiconductor device

Semiconductor device

Semiconductor wafer, semiconductor device, and semiconductor device manufacturing method

Method for manufacturing circuit modules and circuit module

Tape carrier for semiconductor device and method for making same

Bonding device

Method and device for transferring a chip to a contact substrate

Electronic module

Methods for fabricating semiconductor components with conductive interconnects

Method for manufacturing semiconductor device, and method and structure for implementing semiconductor device

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

REWORKABLE CHIP STACK

Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL, AND SEMICONDUCTOR DEVICE

Layer sequence and method of manufacturing a layer sequence

Method of manufacturing an electronic component and an electronic device

Plastic Conductive Particles and Manufacturing Method Thereof

Solder layer and device bonding substrate using the same and method for manufacturing such a substrate

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME, AND POWER CONVERSION APPARATUS INCORPORATING THIS SEMICONDUCTOR DEVICE

Packaged integrated circuit

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Semiconductor package and fabrication method thereof

Circuit device, a method for manufacturing a circuit device, and a semiconductor module

Semiconductor integrated circuit device and fabrication method for the same

BACKSIDE METALLIZATION FOR INTEGRATED CIRCUIT DEVICES

Semiconductor device and manufacturing method thereof

Semiconductor device including a coupling region which includes layers of aluminum and copper alloys

Semiconductor device having stress alleviating portion positioned at outer circumference of chip, wiring substrate, and method for producing the same

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Stacked Package and Method of Fabricating the Same

Component, power component, apparatus, method of manufacturing a component, and method of manufacturing a power semiconductor component

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION THEREOF

Semiconductor components with conductive interconnects

Sensor-type semiconductor package and method for fabricating the same

Method of mounting an electronic component and mounting apparatus

Wiring structure, forming method of the same and printed wiring board

Method for manufacturing a circuit board structure

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS

PRODUCTION METHOD OF ELECTRONIC APPARATUS, PRODUCTION METHOD OF ELECTRONIC EQUIPMENT IN WHICH ELECTRONIC APPARATUS IS PACKAGED, AND PRODUCTION METHOD OF ARTICLE IN WHICH ELECTRONIC APPARATUS IS MOUNTED

Chip bonding tool and related apparatus and method

Mask and substrate alignment for solder bump process

Multilayer printed circuit board and multilayer printed circuit board manufacturing method

Method and apparatus for manufacturing electronic integrated circuit chip

Leadframe enhancement and method of producing a multi-row semiconductor package

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Package board and method for manufacturing thereof

Method of assembling semiconductor devices with LEDS

Bonding pad structure, electronic device having a bonding pad structure and methods of fabricating the same

Semiconductor device and wire bonding method

Semiconductor package having stacked semiconductor chips

Electronic package structure and method

Semiconductor device and method for manufacturing the same

BARRIER FOR USE IN 3-D INTEGRATION OF CIRCUITS

Semiconductor device, connecting member, method for manufacturing a semiconductor device and method for manufacturing a connecting member

Conductive structure for a semiconductor integrated circuit and method for forming the same

Packaging conductive structure and method for manufacturing the same

Bowed wafer hybridization compensation

Semiconductor device with resin layers and wirings and method for manufacturing the same

Module comprising a semiconductor chip comprising a movable element

Method of manufacturing electronic component package, and wafer and substructure used for manufacturing electronic component package

Semiconductor module, portable device and method for manufacturing semiconductor module

Semiconductor device package with multi-chips and method of the same

Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same

SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND CONNECTING THROUGH-HOLE AND METHOD OF THE SAME

Integrated package circuit with stiffener

SEMICONDUCTOR DEVICE

Packaging conductive structure for a semiconductor substrate having a metallic layer

Semiconductor device package with multi-chips and method of the same