Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Wafer backside interconnect structure connected to TSVs

Stackable package by using internal stacking modules

Semiconductor device and method of forming high routing density interconnect sites on substrate

Power semiconductor package

Integrated circuit package including embedded thin-film battery

Chip embedded substrate and method of producing the same

Semiconductor device, substrate and semiconductor device manufacturing method

Semiconductor device including a DC-DC converter

Wafer backside interconnect structure connected to TSVs

Semiconductor device and a method of manufacturing the same

Lead and lead frame for power package

Semiconductor device, having through electrodes, a manufacturing method thereof, and an electronic apparatus

Semiconductor packages and methods of fabricating the same

Resin-sealed semiconductor device and associated wiring and support structure

Chip and manufacturing method thereof

Passivated copper chip pads

Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same

Bump, method for forming the bump, and method for mounting substrate having the bump thereon

Impedance controlled packages with metal sheet or 2-layer rdl

Electronic apparatus having a resin filled through electrode configured to go through first and second semiconductor components

Stacked semiconductor package

Solder joint flip chip interconnection

Carrier tape for tab-package and manufacturing method thereof

Semiconductor device including semiconductor construct installed on base plate, and manufacturing method of the same

System and method of sensing current in a power semiconductor device

Semiconductor device and method for manufacturing the same

Semiconductor device, method for manufacturing the same, and electronic device

Pb-free solder bumps with improved mechanical properties

Method of manufacturing semiconductor device

Power module having stacked flip-chip and method for fabricating the power module

Three-dimensional semiconductor architecture

Semiconductor device and method of forming a dual UBM structure for lead free bump connections

Transfer substrate for forming metal wiring and method for forming metal wiring with the transfer substrate

Methods for bonding a die and a substrate

Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die

Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package

Semiconductor devices that include a die bonded to a substrate with a gold interface layer

Semiconductor substrates with unitary vias and via terminals, and associated systems and methods

Insulating resin film, bonded structure using insulating resin film, and production method of bonded structure

Semiconductor device with a semiconductor chip connected in a flip chip manner

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

Leadframe, semiconductor device, and method of manufacturing the same

Solder in cavity interconnection technology

Enhanced stacked microelectronic assemblies with central contacts

Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof

Bumpless build-up layer package with pre-stacked microelectronic devices

Semiconductor device with a connection pad in a substrate and method for production thereof

Window ball grid array (BGA) semiconductor packages

Semiconductor device

Bonded structure with enhanced adhesion strength

Semiconductor device including a plurality of magnetic shields

Wafer level chip scale package and process of manufacture

Semiconductor package and method of forming the same

3D semiconductor device

Semiconductor constructions, semiconductor processing methods, methods of forming contact pads, and methods of forming electrical connections between metal-containing layers

Apparatus for lead free solder interconnections for integrated circuits

Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation

Front side copper post joint structure for temporary bond in TSV application

Method for fabricating quad flat non-leaded package structure with electromagnetic interference shielding function

Isolation structure for stacked dies

Semiconductor module system having encapsulated through wire interconnect (TWI)

Method and apparatus providing integrated circuit having redistribution layer with recessed connectors

Structure and method of forming a pad structure having enhanced reliability

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor device, semiconductor package, and electronic device

Method for forming a thin semiconductor device

Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure

Wafer leveled chip packaging structure and method thereof

Flow underfill for microelectronic packages

Semiconductor device

Bonding apparatus and bonding method

Semiconductor die mount by conformal die coating

Pre-soldered leadless package

Semiconductor device, semiconductor device design method, semiconductor device design apparatus, and program

Circuit module and method of manufacturing the same

Integrated circuit system with distributed power supply comprising interposer and voltage regulator

Method for low temperature bonding and bonded structure

Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device

Stacked microelectronic assembly with TSVS formed in stages and carrier above chip

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

Method of forming wafer-level molded structure for package assembly

Interconnection designs and materials having improved strength and fatigue life

Semiconductor device including cooler

Half-bridge package with a conductive clip

Chip package and method for forming the same

Chip package and method for forming the same

Extended redistribution layers bumped wafer

Methods of fabricating package stack structure and method of mounting package stack structure on system board

Sensor package

Fixture to constrain laminate and method of assembly

Sonotrode with cutting mechanism

Method of manufacturing semiconductor device having pad region for wire-bonding

Method of manufacturing semiconductor device

External storage device and method of manufacturing external storage device

3D IC method and device

Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip

Semiconductor device including passivation layer encapsulant

Three-dimensional structure in which wiring is provided on its surface

Waterfall wire bonding

Semiconductor device with through silicon via and alignment mark

Three-dimensional structure for wiring formation

Polymer matrices for polymer solder hybrid materials

System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates

Resin sealing type semiconductor device and method of manufacturing the same, and lead frame

Semiconductor device and method of manufacturing the same

Dicing tape-integrated film for semiconductor back surface

Apparatuses and methods to enhance passivation and ILD reliability

Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die

Substrate contact opening

Package systems and manufacturing methods thereof

Microelectronic package with terminals on dielectric mass

Routing layer for mitigating stress in a semiconductor die

Semiconductor device

Semiconductor device carrier and semiconductor package using the same

Semiconductor die package and method for making the same

OLED device in contact with a conductor

Method for top-side cooled semiconductor package with stacked interconnection plates

Methods for attachment and devices produced using the methods

Semiconductor package and process for fabricating same

Semiconductor device

Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package

Method of manufacturing a semiconductor device using markings on both lead frame and sealing body

Semiconductor packages and electronic systems including the same

Electronic component device

Semiconductor device and production method therefor

Packaged microelectronic components

Semiconductor device and semiconductor package containing the same

Semiconductor device

Multi-chip package and manufacturing method

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Semiconductor device with copper-tin compound on copper connector

Semiconductor device having conductive pads and a method of manufacturing the same

Plasma treatment for semiconductor devices

Semiconductor packages utilizing leadframe panels with grooves in connecting bars

Method of manufacturing semiconductor device

Method for fabricating a semiconductor and semiconductor package

Semiconductor package having an over-temperature protection circuit utilizing multiple temperature threshold values

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Memory device, laminated semiconductor substrate and method of manufacturing the same

Integrated circuit device including a copper pillar capped by barrier layer and method of forming the same

Semiconductor package having multi-phase power inverter with internal temperature sensor

Microelectronic assembly with impedance controlled wirebond and reference wirebond

Laminate electronic device

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device having electrode pads arranged between groups of external electrodes

Control and driver circuits on a power quad flat no-lead (PQFN) leadframe

Power quad flat no-lead (PQFN) package having control and driver circuits

Integrated antennas in wafer level package

Active area bonding compatible high current structures

Semiconductor device and method for manufacturing thereof

Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate

Wire bondable surface for microelectronic devices

Routing layer for mitigating stress in a semiconductor die

Semiconductor device and a method of manufacturing the same

Semiconductor device and production method therefor

Cylindrical embedded capacitors

Structures embedded within core material and methods of manufacturing thereof

Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera

Semiconductor package with bonding wires of reduced loop inductance

Self-aligned protection layer for copper post structure

Semiconductor device and a method of manufacturing the same

Power quad flat no-lead (PQFN) package having bootstrap diodes on a common integrated circuit (IC)

Dual-leadframe multi-chip package

Semiconductor chip device with polymeric filler trench

Microelectronic assembly with impedance controlled wirebond and conductive reference element

Semiconductor device

Techniques for packaging multiple device components

Power quad flat no-lead (PQFN) package in a single shunt inverter circuit

Open source power quad flat no-lead (PQFN) package

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

Semiconductor device with stacked semiconductor chips

Power quad flat no-lead (PQFN) semiconductor package with leadframe islands for multi-phase power inverter

Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same

Method of fabricating a wafer level chip scale package without an encapsulated via

Package process and package structure

Forming functionalized carrier structures with coreless packages

Semiconductor device

Semiconductor device including semiconductor chip mounted on lead frame

Semiconductor chip and film and tab package comprising the chip and film

Method for fabricating leadframe-based semiconductor package with connecting pads top and bottom surfaces of carrier

Semiconductor packaging method using connecting plate for internal connection

Method for producing semiconductor device

Compliant printed circuit semiconductor package

Integrated circuit device

Solder interconnect with non-wettable sidewall pillars and methods of manufacture

Microelectronic packages with nanoparticle joining

Semiconductor device and lead frame used for the same

Semiconductor device and method for manufacturing thereof

Three-dimensional integrated circuit device using a wafer scale membrane

Semiconductor device having low dielectric insulating film and manufacturing method of the same

Chip package and manufacturing method thereof

Electronic substrate, semiconductor device, and electronic device

Semiconductor device and semiconductor assembly with lead-free solder

Semiconductor package with connecting plate for internal connection

Integrated electronic device with transceiving antenna and magnetic interconnection

Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate

Power quad flat no-lead (PQFN) package

Electronic system modules and method of fabrication

Method for manufacturing a circuit board structure

Dicing die bond film

Semiconductor device having a copper plug

Semiconductor device with copper wirebond sites and methods of making same

Method of manufacturing semiconductor device

Stacked dual chip package having leveling projections

Method of fabricating a package substrate

Conductive lines and pads and method of manufacturing thereof

Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure

Semiconductor package for high power devices

Semiconductor device and method of manufacturing the same

Waterproof structure of pad, waterproof pad, and method for forming waterproof structure

Apparatus, system, and method for wireless connection in integrated circuit packages

Semiconductor structures comprising a dielectric material having a curvilinear profile

Semiconductor device and method of manufacturing the same

Semiconductor device for preventing a progression of a crack in a solder layer and method of manufacturing the same

Microelectronic devices and methods for manufacturing microelectronic devices

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Semiconductor device and programming method

Semiconductor device stack with bonding layer and wire retaining member

Semiconductor device and method of manufacturing the same

Embedded package security tamper mesh

Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristics

Semiconductor device and manufacturing method thereof

Fabricating method of embedded package structure

Routing method for flip chip package and apparatus using the same

Electronic devices including two or more substrates electrically connected together and methods of forming such electronic devices

Semiconductor device with embedded interconnect pad

Microelectronic packages having cavities for receiving microelectronic elements

Semiconductor package with single sided substrate design and manufacturing methods thereof

Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device

Method of manufacturing a ball grid array substrate or a semiconductor chip package

Multilayer ceramic electronic device and method for manufacturing the same

Backside processing of semiconductor devices

Method of packaging a die

Semiconductor device including cooler

Copper or copper alloy, bonding wire, method of producing the copper, method of producing the copper alloy, and method of producing the bonding wire

Semiconductor device and method of forming bump-on-lead interconnection

Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing

Mount board and electronic device

Semiconductor device capable of switching operation modes and operation mode setting method therefor

Thermally enhanced semiconductor package

Semiconductor structure with thin film resistor and terminal bond pad

Assembly and production of an assembly

Stacked packaging improvements

Reconstituted wafer stack packaging with after-applied pad extensions

Electronic assembly with detachable components

Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

Semiconductor device with output circuit and pad

Methods and apparatus for measuring analytes using large scale FET arrays

Thermally enhanced semiconductor package with conductive clip

Apparatus, system, and method for wireless connection in integrated circuit packages

Bumpless build-up layer package design with an interposer

EMBEDDED PACKAGES AND METHODS OF MANUFACTURING THE SAME

Method of making a stacked microelectronic package

Electronic modules

Die edge contacts for semiconductor devices

Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof

Embedded semiconductive chips in reconstituted wafers, and systems containing same

Electronic device and method for production

Short and low loop wire bonding

Bump-on-lead flip chip interconnection

Power semiconductor device and method therefor

Semiconductor device and a method of manufacturing the same

Power electronic devices

Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects

Multi-chip package and method of manufacturing thereof

Semiconductor power module and method of manufacturing the same

Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package

Integrated chip package structure using ceramic substrate and method of manufacturing the same

Multi-chip package with offset die stacking and method of making same

Integrated circuit apparatus, systems, and methods

Reliable area joints for power semiconductors

Bonding wire for semiconductor

Methods of forming bonded semiconductor structures

Bump structure for stacked dies

Protected solder ball joints in wafer level chip-scale packaging

Through wire interconnect (TWI) for semiconductor components having wire in via and bonded connection with substrate contact

Semiconductor device and method of forming through vias with reflowed conductive material

Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure

Lead structures with vertical offsets

Method of fabricating a power semiconductor chip package

Thermally enhanced electronic package

Method for the wafer-level integration of shape memory alloy wires

Method for housing an electronic component in a device package and an electronic component housed in the device package

Semiconductor package with embedded die

Stacked semiconductor packages

Printed wiring board and method for manufacturing printed wiring board

Method of manufacturing leadless integrated circuit packages having electrically routed contacts

Interconnection element with posts formed by plating

Circuit device

Circuit device

Circuit device

Circuit device and method for manufacturing same

Semiconductor module with a semiconductor chip and a passive component and method for producing the same

Method for chip packaging

Semiconductor device fabrication method capable of scribing chips with high yield

Method for producing a component and device comprising a component

Chip pad resistant to antenna effect and method