212040 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Arsenic [As]
Semiconductor device
#902Semiconductor Device and Method of Forming Composite Bump-on-Lead Interconnection
#903SEMICONDUCTOR DEVICE AND METHOD OF FORMING BUMP-ON-LEAD INTERCONNECTION
#904Wafer level MOSFET metallization
#905Method to realize flux free indium bumping
#906Off-chip vias in stacked chips
#907Leadless array plastic package with various IC packaging configurations
#9083D packaging with low-force thermocompression bonding of oxidizable materials
#909Etching solution for copper or copper alloy
#910Indium compositions
#911Semiconductor packages and methods of fabricating the same
#912Semiconductor device and method of manufacturing the semiconductor device
#913RFID tags and processes for producing RFID tags
#914Semiconductor device and method of forming the same
#915Wireless communication system
#916Deformable network structure
#917Multifunction sensor as PoP microwave PCB
#918Bonded processed semiconductor structures and carriers
#919Semiconductor device
#920Semiconductor device
#921Chip package and manufacturing method thereof
#922Semiconductor device packaging structure and packaging method
#923Junction material, manufacturing method thereof, and manufacturing method of junction structure
#924Method of cutting semiconductor substrate
#925Method of manufacturing a semiconductor device
#926Method for fabricating packaging structure having embedded semiconductor element
#927Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices
#928Microelectronic package
#929Method of manufacturing a semiconductor component
#930Molded leadframe substrate semiconductor package
#931Integrated circuit chip using top post-passivation technology and bottom structure technology
#932Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of FO-WLCSP
#933Semiconductor chip package having via hole and semiconductor module thereof
#934Wiring board and semiconductor device
#935Semiconductor device bonding with stress relief connection pads
#936Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate
#937Semiconductor component that includes a protective structure
#938Semiconductor device including a stress buffer material formed above a low-k metallization system
#939Room temperature metal direct bonding
#940Three-dimensional system-in-package architecture
#941Protection layer for adhesive material at wafer edge
#942Ta—TaN selective removal process for integrated device fabrication
#943Passivated copper chip pads
#944Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device
#945Method for chip package
#946Magnetic attachment structure
#947Production method of high-density SIM card package
#948Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements
#949High density sensor array without wells
#950Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#951Misalignment detection devices
#952Package-in-package using through-hole via die on saw streets
#953Printed wiring board and method for manufacturing the same
#954Manufcaturing method for room-temperature substrate bonding
#955Methods and apparatus for measuring analytes using large scale FET arrays
#956Semiconductor device with die stack arrangement including staggered die and efficient wire bonding
#957Multilayer printed wiring board
#958Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#959Package manufacturing method and semiconductor device
#960Transfer substrate for forming metal wiring and method for forming metal wiring using said transfer substrate
#961Method for building vertical pillar interconnect
#962Method of testing through silicon VIAS (TSVs) of three dimensional integrated circuit (3DIC)
#963Packaged microdevices and methods for manufacturing packaged microdevices
#964Semiconductor device
#965System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates
#966Semiconductor device structures and electronic devices including hybrid conductive vias, and methods of fabrication
#967Semiconductor device and method of manufacturing the same
#968Method of manufacturing a wiring board having pads highly resistant to peeling
#969Molding method for COB-EUSB devices and metal housing package
#970Method of fabricating a circuit board structure
#971Bump pad structure
#972Leadframe and semiconductor package made using the leadframe
#973Manufacturing method of solder transfer substrate, solder precoating method, and solder transfer substrate
#974Electronic component mounting apparatus and the same method thereof
#975Bonding structure of multilayer copper bonding wire
#976Power semiconductor device with reduced contact resistance
#977Light emitting device package and method of fabricating the same
#978Manufacturing method and electronic module with new routing possibilities
#979Semiconductor device and method for manufacturing the same
#980Method of fabricating a packaged semiconductor
#981Stackable semiconductor package and manufacturing method thereof
#982ESD protection device
#983Precious metal paste for bonding semiconductor element
#984Electrical device, system and method for operating with reduced acoustic noise generation
#985Method of manufacturing printed wiring board
#986Production apparatus of composite silver nanoparticle
#987COMPOSITE ALLOY BONDING WIRE
#988High efficiency module
#989Wafer-to-wafer stack with supporting post
#990Semiconductor light-emitting device, method for producing same, and display device
#991MANUFACTURING METHOD FOR COMPOSITE ALLOY BONDING WIRE
#992Chip assembly with a coreless substrate employing a patterned adhesive layer
#993Semiconductor package including flip chip controller at bottom of die stack
#994Chip on wafer bonder
#995Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe
#996Electrically bonded arrays of transfer printed active components
#997Semiconductor device having a chip mounting portion on which a separated plated layer is disposed
#998Semiconductor package
#999Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same
#1000Substrate with embedded stacked through-silicon via die
#1001Semiconductor device and method of forming insulating layer around semiconductor die
#1002Semiconductor package having internal shunt and solder stop dimples
#1003Semiconductor device including a protective film
#1004Flip chip package utilizing trace bump trace interconnection
#1005Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die
#1006Monolithic semiconductor switches and method for manufacturing
#1007Power semiconductor package with conductive clip
#1008Anisotropic conductive material and method for manufacturing same
#1009Semiconductor assemblies, stacked semiconductor devices, and methods of manufacturing semiconductor assemblies and stacked semiconductor devices
#1010Bonding material for semiconductor devices
#1011Microelectronic package with self-heating interconnect
#1012Semiconductor device and methods of manufacturing semiconductor devices
#1013Multi-transistor exposed conductive clip for semiconductor packages
#1014Wafer level chip scale package
#1015Metallization structure for high power microelectronic devices
#1016Solder in cavity interconnection structures
#1017Integrated circuit having staggered bond pads and I/O cells
#1018Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
#1019Semiconductor device and manufacturing method thereof
#1020Pre-encapsulated lead frames for microelectronic device packages, and associated methods
#1021Wire loops, methods of forming wire loops, and related processes
#1022Flexible interconnect pattern on semiconductor package
#1023Die power structure
#1024Semiconductor device with wireless communication
#1025Packaging structural member
#1026Method for developing a custom device
#1027Microelectronic package and method of manufacturing same
#1028Misalignment correction for embedded microelectronic die applications
#1029Resin paste composition
#1030Semiconductor structure and manufacturing method thereof
#1031Semiconductor device
#1032Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package
#1033Sensor device manufacturing method and sensor device
#1034Resin composition and semiconductor device produced by using the same
#1035Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
#1036Flattened substrate surface for substrate bonding
#1037Compact wirebonded power quad flat no-lead (PQFN) package
#1038Support mounted electrically interconnected die assembly
#1039Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#1040Hermetic Surface Mount Packages for Diodes and Transistors
#1041ESD protection device
#1042Semiconductor device
#1043Multilayer adhesive sheet and method for manufacturing electronic component
#1044Semiconductor packages and electronic systems including the same
#1045Diode package having improved lead wire and manufacturing method thereof
#1046Electrical device with protruding contact elements and overhang regions over a cavity
#1047Electrochemical deposition apparatus
#1048METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS
#1049Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant
#1050Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding
#1051Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant
#1052Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatus
#1053Tape attaching device and tape attaching method
#1054Method of sealing and contacting substrates using laser light and electronics module
#1055Semiconductor device
#1056Device including a semiconductor chip and metal foils
#1057Method of manufacturing an electronic device package
#1058Chips having rear contacts connected by through vias to front contacts
#1059Manufacturing method of semiconductor device
#1060Method for producing chip stacks, and a carrier for carrying out the method
#1061Mounting method for semiconductor light emitter using resist with openings of different sizes
#1062Semiconductor integrated circuit device and method of manufacturing same
#1063Multi-chip packages providing reduced signal skew and related methods of operation
#1064Semiconductor structure and method for making same
#1065System and method for 3D integrated circuit stacking
#1066Electronic device package
#1067Epoxy resin composition for semiconductor encapsulant and semiconductor device using the same
#1068Semiconductor device
#1069Method of manufacturing esterified substance
#1070Semiconductor device and method of manufacturing the same
#1071Methods of forming semiconductor device packages including a semiconductor device and a redistribution element, methods of forming redistribution elements and methods for packaging semiconductor devices
#1072Fabrication method of semiconductor package device, and fabrication method of semiconductor package structure
#1073Method for manufacturing a package-on-package type semiconductor device
#1074Electronic component and method for producing same
#1075Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die
#1076Pillar structure having a non-planar surface for semiconductor devices
#1077ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
#1078Inductive loop formed by through silicon via interconnection
#1079Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module and multilayer circuit board
#1080DIE PACKAGE INCLUDING ENCAPSULATED DIE AND METHOD OF MANUFACTURING THE SAME
#1081Method for manufacturing a circuit device
#1082Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages
#1083FUNCTIONAL DEVICE-EMBEDDED SUBSTRATE
#1084STACKING METHOD AND STACKING CARRIER
#1085Semiconductor chip device with solder diffusion protection
#1086STACKED INTEGRATED CIRCUIT PACKAGES THAT INCLUDE MONOLITHIC CONDUCTIVE VIAS
#1087Self-aligned protection layer for copper post structure
#1088Light-reflective anisotropic conductive adhesive agent, and light emitting device
#1089Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device
#1090Semiconductor package and method of manufacturing the semiconductor package
#1091Method for fabricating electronic device package
#1092Method and apparatus for fabricating integrated circuit device using self-organizing function
#1093Semiconductor device including a recess formed above a semiconductor chip
#1094METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENTS
#1095Fabrication method of packaging substrate having through-holed interposer embedded therein
#1096SPIRAL STAIRCASE SHAPED STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#1097Semiconductor device and method of manufacturing the same
#1098Semiconductor package with under bump metallization routing
#1099LEAD FRAME, AND LIGHT EMITTING DIODE MODULE HAVING THE SAME
#1100Light emitting device and method for manufacturing light emitting device
#1101Method of Forming a Bonded Structure
#1102Method of forming a semiconductor device with a contact pad on a sloped silicon dioxide surface
#1103Structure and method for power field effect transistor
#1104Multilayer printed circuit board
#1105Routing layer for mitigating stress in a semiconductor die
#1106Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device
#1107Semiconductor device comprising through-electrode interconnect
#1108Method of making cavity substrate with built-in stiffener and cavity substrate manufactured thereby
#1109Microelectronic package with terminals on dielectric mass
#1110Method and system for forming conductive bumping with copper interconnection
#1111TCE compensation for package substrates for reduced die warpage assembly
#1112Semiconductor packages and electronic systems including the same
#1113Method for manufacturing semiconductor device
#1114Semiconductor device
#1115Wafer-level chip scale package
#1116Semiconductor element-embedded wiring substrate
#1117SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE UNIT, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
#1118Flip chip interconnection having narrow interconnection sites on the substrate
#1119PACKAGE ASSEMBLY INCLUDING A SEMICONDUCTOR SUBSTRATE WITH STRESS RELIEF STRUCTURE
#1120Semiconductor device
#1121Dual metal for a backside package of backside illuminated image sensor
#1122Bonding tool, electronic component mounting apparatus, and manufacturing method of bonding tool
#1123Copper column
#1124Integrated circuit with electromagnetic intrachip communication and methods for use therewith
#1125Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby
#1126SOFT DILUTE COPPER ALLOY WIRE, SOFT DILUTE COPPER ALLOY PLATE AND SOFT DILUTE COPPER ALLOY STRANDED WIRE
#1127Semiconductor device
#1128Semiconductor device
#1129Method for Making a Stackable Package
#1130Semiconductor device and a method of manufacturing the same
#1131Semiconductor device
#1132Semiconductor device and method of manufacturing the same
#1133Method of manufacturing a semiconductor device
#1134SUPPORT SYSTEM FOR A SEMICONDUCTOR DEVICE
#1135Void-Free Implantable Hermetically Sealed Structures
#1136Methods and apparatus for measuring analytes using large scale FET arrays
#1137Integrated antennas in wafer level package
#1138Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
#1139Solder bump with inner core pillar in semiconductor package
#1140Semiconductor device with solder bump formed on high topography plated Cu pads
#1141Bump I/O contact for semiconductor device
#1142Methods and apparatus for measuring analytes using large scale FET arrays
#1143Methods and apparatus for measuring analytes using large scale FET arrays
#1144PLATING APPARATUS AND PLATING METHOD
#1145Method for producing a wafer provided with chips
#1146Stackable semiconductor assemblies and methods of manufacturing such assemblies
#1147Thermal enhanced package
#1148Laminate electronic device
#1149Carrier structures for microelectronic elements
#1150Power module and method for manufacturing the same
#1151Circuit board and process for producing the same
#1152Semiconductor element-embedded substrate, and method of manufacturing the substrate
#1153SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS
#1154SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
#1155Oblique parts or surfaces
#1156Ball-limiting-metallurgy layers in solder ball structures
#1157Method of manufacturing a circuit substrate
#1158Methods of forming a metal pattern
#1159Electronic device
#1160METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A HEAT SPREADER
#1161Method of manufacturing semiconductor device
#1162Semiconductor device and method for manufacturing the same
#1163Four MOSFET full bridge module
#1164Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices
#1165Semiconductor device and manufacturing method thereof
#1166Semiconductor constructions
#1167Semiconductor device
#1168Multi-component integrated circuit contacts
#1169Copper wire receiving pad
#1170Conductive connecting member and manufacturing method of same
#1171Electrically conductive paste, and electrically conducive connection member produced using the paste
#1172Semiconductor device and a method of manufacturing the same
#1173Method of manufacturing an electronic system
#1174LEAD CARRIER WITH THERMALLY FUSED PACKAGE COMPONENTS
#1175Stacked semiconductor device and fabrication method for same
#1176METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE BONDING METHOD AND DIE BONDING APPARATUS USING THE METAL NANOINK
#1177MICRO PIN HYBRID INTERCONNECT ARRAY
#1178Die attached to a support member by a plurality of adhesive members
#1179PHOTOVOLTAIC DEVICE ELECTRICAL CONTACTS
#1180Connecting film, and joined structure and method for producing the same
#1181Method for Predetermined Component Placement to a Target Platform
#1182Method for Predetermined Component Placement to a Target Platform
#1183Method for manufacturing a through hole electrode substrate
#1184Method of cutting semiconductor substrate
#1185Through wafer vias and method of making same
#1186Semiconductor die package and method for making the same
#1187Fabrication method of semiconductor integrated circuit device
#1188Method of forming semiconductor device package having high breakdown voltage and low parasitic inductance
#1189SEMICONDUCTOR DEVICE MOUNTING METHOD
#1190Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
#1191Enhanced WLP for superior temp cycling, drop test and high current applications
#1192SEMICONDUCTOR CHIP WITH DUAL POLYMER FILM INTERCONNECT STRUCTURES
#1193Optoelectronic component and method for producing an optoelectronic component
#1194Die backside standoff structures for semiconductor devices
#1195Semiconductor device and manufacturing of the semiconductor device
#1196Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
#1197Method for wafer level packaging of electronic devices
#1198SEMICONDUCTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME
#1199Manufacturing method including deformation of supporting board to accommodate semiconductor device
#1200Method of producing a radiation-emitting optoelectronic component