METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER

Packaging with base layers comprising alloy 42

Flip-Chip Semiconductor Package with Encapsulant Retaining Structure and Strip

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Method and apparatus of power ring positioning to minimize crosstalk

Wafer-level fabrication of lidded chips with electrodeposited dielectric coating

Bondwire utilized for coulomb counting and safety circuits

Stacked chip package structure with leadframe having inner leads with transfer pad

Semiconductor package and method of forming wire loop of semiconductor package

Semiconductor device and a method of manufacturing the same

CONNECTING A PLURALITY OF BOND PADS AND/OR INNER LEADS WITH A SINGLE BOND WIRE

Stacked chip packaging with heat sink structure

Semiconductor device, method of manufacturing the same

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME

Micropad for bonding and a method therefor

Array quad flat no-lead package and method of forming same

Semiconductor integrated circuit and method for manufacturing the same

Light emitting diode, optical semiconductor device, epoxy resin composition and phosphor suited for optical semiconductor device, and method for manufacturing the same

Method for mounting electronic component on substrate and method for forming solder surface

WIRE BONDING APPARATUS AND WIRE BONDING METHOD

Apparatus for delivering shielding gas during wire bonding

Method for fabricating a leadframe

METHOD FOR PRODUCING AN INTEGRATED CIRCUIT INCLUDING A CONNECTION CONTACT ON A SEMICONDUCTOR BODY

Flip chip metallization method and devices

Method for forming conductive layer and substrate having the same, and method for manufacturing semiconductor device

Electronic assemblies having a low processing temperature

INTEGRATED CIRCUIT DIE/PACKAGE INTERCONNECT

Sawn power package and method of fabricating same

Stacked die with a recess in a die BGA package

Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates

Low profile ball grid array (BGA) package with exposed die and method of making same

Apparatus and method for connecting components

INTEGRATED CIRCUIT STRUCTURE, DISPLAY MODULE, AND INSPECTION METHOD THEREOF

METHODS FOR FORMING PATTERNS OF A FILLED DIELECTRIC MATERIAL ON SUBSTRATES

Single chip USB packages with swivel cover

Electronics module and method for manufacturing the same

Three dimensional device integration method and integrated device

High performance system-on-chip using post passivation process

CHIP STRUCTURE AND WAFER STRUCTURE

Integrated circuit with a reduced pad bump area and the manufacturing method thereof

SEMICONDUCTOR DEVICE

Semiconductor module arrangement

Metallised film for sheet contacting

SEMICONDUCTOR PACKAGE PREVENTING WARPING AND WIRE SEVERING DEFECTS, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

Stackable micropackages and stacked modules

Single chip USB packages with contact-pins cover

CHIP PACKAGE STRUCTURE

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device with recess portion over pad electrode

Light emitting chip package and manufacturing method thereof

Semiconductor Device and Method of Fabricating the Same

Probe arrays and method for making

Wire bonding and wire bonding method

Electronic device handler for a bonding apparatus

Method for fabricating heat dissipating package structure

Microelectronic packages fabricated at the wafer level and methods therefor

Process for fabricating electronic components using liquid injection molding

Semiconductor device manufacturing method and manufacturing apparatus

Manufacturing device of semiconductor package and manufacturing method of semiconductor package

HEAT CURABLE ADHESIVE COMPOSITION, ARTICLE, SEMICONDUCTOR APPARATUS AND METHOD

Bond pad structures and integrated circuit chip having the same

Semiconductor package and method for manufacturing the same

Dicing die-bonding film

Semiconductor device and method for manufacturing the same

ATTACHING AND INTERCONNECTING DIES TO A SUBSTRATE

Substrate and manufacturing method of package structure

Semiconductor device having a specified terminal layout pattern

Structure and manufacturing method of a chip scale package

Stacked semiconductor package having fan-out structure through wire bonding

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE

Interconnections for fine pitch semiconductor devices and manufacturing method thereof

Semiconductor device and wire bonding method therefor

I/O Architecture for integrated circuit package

WAFER LEVEL PACKAGE STRUCTURE WITH BUILD UP LAYERS

Semiconductor integrated circuit device having reduced terminals and I/O area

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor apparatus

Semiconductor device having recessed connector portions

Semiconductor package having a bridged plate interconnection

Semiconductor package preventing generation of static electricity therein

Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same

Semiconductor device and method for producing the same

Bumping electronic components using transfer substrates

RESONATOR, ULTRASONIC DIE BONDING HEAD, AND ULTRASONIC DIE BONDING APPARATUS

Method of providing solder bumps on a substrate using localized heating

UNDERFILL DISPENSE AT SUBSTRATE APERTURE

SEMICONDUCTOR PACKAGING METHOD BY USING LARGE PANEL SIZE

Two-stage die-bonding method for simultaneous die-bonding of multiple dies

Light emitting device package and manufacture method of light emitting device package

Semiconductor device and an information management system therefor

Method for producing a semiconductor component and substrate for carrying out the method

Gold-Tin Solder Joints Having Reduced Embrittlement

Bonding and probing pad structures

Top layers of metal for high performance IC's

Top layers of metal for high performance IC's

Wafer-level interconnect for high mechanical reliability applications

Low fabrication cost, fine pitch and high reliability solder bump

Wiring board

BUMP ELECTRODE INCLUDING PLATING LAYERS AND METHOD OF FABRICATING THE SAME

Semiconductor device

Edge connect wafer level stacking with leads extending along edges

Stacked structures and methods of fabricating stacked structures

Light emitting device

SEMICONDUCTOR DEVICE

Combination wedge bonding and ball bonding transducer

Integrated circuit chips with fine-line metal and over-passivation metal

INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance

Processes and packaging for high voltage integrated circuits, electronic devices, and circuits

Device transfer method and display apparatus

Manufacturing Method of Semiconductor Apparatus

Wiring board and semiconductor device

Electronic device including a nickel-palladium alloy layer

Integrated circuit chips with fine-line metal and over-passivation metal

Integrated circuit chips with fine-line metal and over-passivation metal

Integrated circuit chips with fine-line metal and over-passivation metal

INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL

Method of making a light emitting device having a molded encapsulant

METHOD AND STRUCTURE TO ENHANCE TEMPERATURE/HUMIDITY/BIAS PERFORMANCE OF SEMICONDUCTOR DEVICES BY SURFACE MODIFICATION

LAYER FOR CHIP CONTACT ELEMENT

Substrate slot design for die stack packaging

Integrated circuit package system with pad to pad bonding

Semiconductor element comprising a supporting structure and production method

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor device

Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same

Die arrangement and method for producing a die arrangement

Semiconductor-embedded substrate and manufacturing method thereof

Power semiconductor arrangement

Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same

ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATON

Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wires

Pin Array No Lead Package and Assembly Method Thereof

Plastic surface mount large area power device

INTERDIGITATED LEADFINGERS

Process of forming an electronic device including an inductor

Sensor-type package and fabrication method thereof

Arrangement for cooling a power semiconductor module

Method of assembling carbon nanotube reinforced solder caps

Copper bonding or superfine wire with improved bonding and corrosion properties

Method of forming metal lines and bumps for semiconductor devices

Manufacturing method of a semiconductor device having a package dicing

METHOD FOR PRODUCING FLEXIBLE INTEGRATED CIRCUITS WHICH MAY BE PROVIDED CONTIGUOUSLY

Manufacturing method of semiconductor device

Nanoscopic Assurance Coating for Lead-Free Solders

Wire Bump Material

Methods of connecting an antenna to a transponder chip

Semiconductor device and manufacturing method thereof

Semiconductor die module and package and fabricating method of semiconductor package

INTEGRATED CIRCUIT INTERCONNECTION DEVICES AND METHODS

SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF

Electronic device and method for production

Wire pad of semiconductor device

METHOD OF FABRICATING A WIRE BOND PAD WITH Ni/Au METALLIZATION

Semiconductor device and method of manufacturing the same

Semiconductor device having sealing film and manufacturing method thereof

Circuit substrate for preventing warpage and package using the same

Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

SEMICONDUCTOR PACKAGE COMPRISING ALIGNMENT MEMBERS

Integrated circuit package system for chip on lead

CHIP PACKAGE AND CHIP PACKAGE ARRAY

ELECTRONIC DEVICE AND PRODUCTION METHOD

Semiconductor package and semiconductor system in package using the same

Pressure-contact semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device

Modified gold-tin system with increased melting temperature for wafer bonding

MOVABLE ELECTRONIC FLAME-OFF DEVICE FOR A BONDING APPARATUS

Deep access large ribbon bond head

Multi-part capillary

Methods and apparatus to dispense adhesive for semiconductor packaging

LAMINATED CIRCUIT BOARD AND ITS MANUFACTURING METHOD, AND MANUFACTURING METHOD FOR MODULE USING THE LAMINATED CIRCUIT BOARD AND ITS MANUFACTURING APPARATUS

Method of forming an inlay substrate having an antenna wire

Method of actuating implanted medical device

FIXING APPARATUS FOR SEMICONDUCTOR WAFER

Method for fabricating resin-molded semiconductor device having posts with bumps

Optical semiconductor device and method of manufacturing thereof

Removing dry film resist residues using hydrolyzable membranes

Positioning stage, bump forming apparatus equipped with the positioning stage, and bump forming method performed using the positioning stage

Semiconductor apparatus and method of producing the same

Semiconductor assembly with component attached on die back side

Pad over active circuit system and method with meshed support structure

Ta-TaN SELECTIVE REMOVAL PROCESS FOR INTEGRATED DEVICE FABRICATION

Bonding pad for contacting a device

Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bump

Castellation wafer level packaging of integrated circuit chips

Semiconductor device and method for fabricating the same

Semiconductor device and method for manufacturing the same

Wafer level chip package and a method of fabricating thereof

Stack semiconductor package including an interposer chip having an imposed diode or capacitor

Integrated circuit devices with multi-dimensional pad structures

Semiconductor device, lead-frame product used for the same and method for manufacturing the same

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Packaged microelectronic components with terminals exposed through encapsulant

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ENCAPSULATION LOCK

Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components

Chip Comprising at Least One Test Contact Configuration

Electronic packages with fine particle wetting and non-wetting zones

Printed circuit board for package and manufacturing method thereof

Ta-TaN SELECTIVE REMOVAL PROCESS FOR INTEGRATED DEVICE FABRICATION

Process for manufacturing semiconductor devices

Process of fabricating a semiconductor package

Adhesive film for circuit connection, and circuit connection structure

Circuit-connecting material and circuit terminal connected structure and connecting method

INTEGRATED DEVICE

System and method for increasing the strength of a bond made by a small diameter wire in ball bonding

METHOD OF FORMING A MULTI-LAYER SEMICONDUCTOR STRUCTURE INCORPORATING A PROCESSING HANDLE MEMBER

Methods using die attach paddle for mounting integrated circuit die

RELIABLE PRINTED WIRING BOARD ASSEMBLY EMPLOYING PACKAGES WITH SOLDER JOINTS AND RELATED ASSEMBLY TECHNIQUE

Extendable connector and network

Method for low temperature bonding and bonded structure

Adhesive film composition for semiconductor assembly, associated dicing die bonding film and semiconductor package

GNSS receiver package

Multi-layered printed circuit board having integrated circuit embedded therein

Pad over active circuit system and method with frame support structure

Bonding wire and bond using a bonding wire

Copper alloy bonding wire for semiconductor device

Wafer level chip scale package and method for manufacturing the same

Structure of mounting electronic component

Methods and substrates to connect an electrical member to a substrate to form a bonded structure

Power semiconductor module

Stacked chip package structure with leadframe having bus bar

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Mounting structure for IC tag and IC chip for mounting

Die attach paddle for mounting integrated circuit die

Method of producing a semiconductor package

Chip-stacked package structure having leadframe with multi-piece bus bar

Chip-stacked package structure for lead frame having bus bars with transfer pads

Electronic device having wiring substrate and lead frame

Semiconductor device package and manufacturing method

Stacked dual MOSFET package

Semiconductor device

Systems and methods for supporting a subset of multiple interface types in a semiconductor device

Underfill for light emitting device

Method for electrically connecting to a contact of a microelectronic component on a circuit board or substrate

METHOD AND APPARATUS FOR CREATING RFID DEVICES USING PENETRABLE CARRIER

Circuit-connecting material and circuit terminal connected structure and connecting method

Semiconductor and method for manufacturing the same

Method for manufacturing SIP semiconductor device

Modified chip attach process

Method of manufacturing a semiconductor device

Thin embedded active IC circuit integration techniques for flexible and rigid circuits

Map type semiconductor package

Lead pin for mounting semiconductor and printed wiring board

Component embedded printed circuit board

Compact impedance transformation circuit

Semiconductor memory device and semiconductor device

IC package with a protective encapsulant and a stiffening encapsulant

Semiconductor device, relay chip, and method for producing relay chip

Flip-Chip Ball Grid Array Strip and Package

Distributed semiconductor device methods, apparatus, and systems

SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

Semiconductor device and method of producing the same

Semiconductor apparatus and manufacturing method of semiconductor apparatus

RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A PACKAGED SEMICONDUCTOR DEVICE

Structure of wafer level package with area bump

Low fabrication cost, fine pitch and high reliability solder bump

Electronic device and method of manufacturing the same

Semiconductor chip and method for fabricating the same

SEMICONDUCTOR PACKAGE INCLUDING SILVER BUMP AND METHOD FOR FABRICATING THE SAME

MICROELECTRONIC DEVICE HAVING A PLURALITY OF STACKED MICROELECTRONIC DIES AND METHODS FOR MANUFACTURING SUCH MICROELECTRONIC ASSEMBLIES

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

Carrier board structure with semiconductor chip embedded therein

Chip package and method for fabricating the same

Wire bonding method, wire bonding apparatus and semiconductor device

SEMICONDUCTOR DEVICES AND MANUFACTURING METHOD THEREFOR

Semiconductor device and manufacturing method thereof

Power electronic package having two substrates with multiple electronic components

Apparatus and method for packaging circuits

Semiconductor device

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURE

POWER SEMICONDUCTION DEVICE AND CIRCUIT MODULE HAVING SUCH POWER SEMICONDUCTION DEVICE

POWER MODULE WITH LAMINAR INTERCONNECT

COMPOSITIONS FOR USE IN ELECTRONICS DEVICES

Circuit-connecting material and circuit terminal connected structure and connecting method

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Wire bonders and methods of wire-bonding

Method for low temperature bonding and bonded structure

Method of manufacturing a component-embedded printed circuit board

Top layers of metal for high performance IC's

Chip structure and process for forming the same

Top layers of metal for high performance IC's

Low fabrication cost, fine pitch and high reliability solder bump

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Methods for attaching microfeature dies to external devices

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time

Adhesion by plasma conditioning of semiconductor chip

Method for producing semiconductor device

Au Alloy Bonding Wire

Semiconductor device

HIGH PERFORMANCE IC PACKAGE AND METHOD

Thin flip-chip method

Multi-chip module

Semiconductor device including through electrode and method of manufacturing the same

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Implantable microelectronic device and method of manufacture