Top layers of metal for high performance IC's

Chip structure and process for forming the same

Stacked structure of chips and water structure for making the same

SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION PATTERN AND METHOD OF MANUFACTURING THE SAME

FLIP CHIP SEMICONDUCTOR ASSEMBLY WITH VARIABLE VOLUME SOLDER BUMPS

Low fabrication cost, fine pitch and high reliability solder bump

Semiconductor device having pads

Electric component with a flip-chip construction

Packaged microdevices and methods for manufacturing packaged microdevices

Semiconductor package and method for manufacturing the same

Semiconductor device, substrate for producing semiconductor device and method of producing them

Stackable packages for three-dimensional packaging of semiconductor dice

Pre-encapsulated lead frames for microelectronic device packages, and associated methods

LED with phosphor tile and overmolded phosphor in lens

Process of forming an electronic device including a barrier layer

Resonator, ultrasonic head, and ultrasonic bonder using the same

Resonator, ultrasonic head, and ultrasonic bonder using the same

Circuit Board Assembly Having Passive Component and Stack Structure Thereof

Etching solution for etching metal layer, etching method using the etching solution, and method of fabricating semiconductor product using the etching solution

Top layers of metal for integrated circuits

Method of wire bonding over active area of a semiconductor circuit

Semiconductor device and method for manufacturing same

Methods for releasably attaching sacrificial support members to microfeature workpieces and microfeature devices formed using such methods

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

Manufacturing method for resin sealed semiconductor device

Method to provide substrate-ground coupling for semiconductor integrated circuit dice constructed from SOI and related materials in stacked-die packages

Semiconductor die package using leadframe and clip and method of manufacturing

Method for forming filling paste structure of WL package

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Electronic module

Plastic overmolded packages with molded lid attachments

Semiconductor device package and manufacturing method

Circuit substrate and semiconductor device

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Bond pad for wafer and package for CMOS imager

High performance system-on-chip using post passivation process

Semiconductor chip structure

MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE HAVING FLUX AND UNDER FILL RESIN LAYER AND METHOD OF MOUNTING SEMICONDUCTOR DEVICE

Structure for bumped wafer test

High performance system-on-chip using post passivation process

Semiconductor device

Trace design to minimize electromigration damage to solder bumps

BUMP STRUCTURES AND PACKAGED STRUCTURES THEREOF

CHIP SCALE MODULE PACKAGE IN BGA SEMICONDUCTOR PACKAGE

Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument

CHIP PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

Microelectronic package

Stacked semiconductor components with through wire interconnects (TWI)

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

Laminating system, IC sheet, scroll of IC sheet, and method for manufacturing IC chip

Power semiconductor component

Component-embedded multilayer printed wiring board and manufacturing method thereof

Diamond heat sink

Assembling Two Substrates by Molecular Adhesion, One of the Two Supporting an Electrically Conductive Film

Semiconductor element and manufacturing method thereof

METHODS OF FORMING ALUMINUM-FREE WIRE BOND PAD AND PAD SO FORMED

Interconnect for improved die to substrate electrical coupling

Semiconductor bonding and layer transfer method

Chip package and method for fabricating the same

Method of manufacturing semiconductor device

Thermal method to control underfill flow in semiconductor devices

High performance system-on-chip using post passivation process

Process for packaging components, and packaged components

Solder elements with columnar structures and methods of making the same

Method for producing a component and device having a component

SEMICONDUCTOR PACKAGE, METHOD OF PRODUCTION THEREOF AND ENCAPSULATION RESIN

Method for embedding a component in a base

Semiconductor integrated circuit device

Semiconductor apparatus having improved thermal fatigue life

Web process interconnect in electronic assemblies

Semiconductor device and method for manufacturing the same

Circuit board including solder ball land having hole and semiconductor package having the circuit board

Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same

Interconnection structure of integrated circuit chip

Conductive connection structure formed on the surface of circuit board and manufacturing method thereof

WIREBOND-LESS SEMICONDUCTOR PACKAGE

High density electronic packages

Bond Wireless Package

Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device

Package structure with leadframe on offset chip-stacked structure

Method of packaging and interconnection of integrated circuits

Electronic device and method for producing a device

Semiconductor package having flexible lead connection plate for electrically connecting base and chip

Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant

Method for manufacturing a passive integrated matching network for power amplifiers

Lead frame with included passive devices

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

Chip scale package for power devices and method for making the same

Light emitting diode package

Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatus

Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers

Mounting device for electrical component

Acceleration sensor

Ball transferring method and apparatus

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

SEMICONDUCTOR MEMORY DEVICE

Semiconductor device and method of manufacturing same

Structure and method of making sealed capped chips

Method of manufacturing a semiconductor device

Chip scale package and method for manufacturing the same

Method for fabricating chip-stacked semiconductor package

Method of fabricating a stacked die having a recess in a die BGA package

Semiconductor device with stacked chips and method for manufacturing thereof

Method of fabricating microelectronic devices

COMBINATION HEAT DISSIPATION DEVICE WITH TERMINATION AND A METHOD OF MAKING THE SAME

Method of assembling displays on substrates

Multiplexed RF isolator

Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same

Power semiconductor devices having integrated inductor

Integrated circuit package-in-package system

Chip-stacked package structure

Carrier board structure with embedded semiconductor chip and fabrication method thereof

EMBEDDED CHIP PACKAGE PROCESS AND CIRCUIT BOARD WITH EMBEDDED CHIP

METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS

Solder Interconnect Joints For A Semiconductor Package

Electronic device including a conductive stud over a bonding pad region

Versatile Si-based packaging with integrated passive components for mmWave applications

MULTICHIP DEVICE AND METHOD FOR PRODUCING A MULTICHIP DEVICE

METHOD FOR SEPARATING PACKAGE OF WLP

Bump pattern design for flip chip semiconductor package

Integrated circuit component with a surface-mount housing

Plate structure having chip embedded therein and the manufacturing method of the same

Interposer and semiconductor package with reduced contact area

Semiconductor package device

Stackable multi-chip package system with support structure

Electronic Device and Method For Producing the Same

SEMICONDUCTOR DEVICE WITH INTERNAL HEAT SINK

Electrical through contact

Method for placing material onto a target board by means of a transfer board

On-chip magnetic components

Methods and apparatus for efficiently generating profiles for circuit board work/rework

Wiring substrate and manufacturing method thereof, and semiconductor device

Methods of forming electronic structures including conductive shunt layers and related structures

Solder Ball Pad Structure

Electronic system modules and method of fabrication

SEMICONDUCTOR MULTI-CHIP PACKAGE AND FABRICATION METHOD

Composite photoresist for modifying die-side bumps

Film splicer

Multiplexed RF isolator circuit

Substrate structure integrated with passive components

Multi-die DC-DC buck power converter with efficient packaging

Methods for providing and using grid array packages

Microelectronic device connection structure

Semiconductor device and its wiring method

Semiconductor device and its wiring method

Semiconductor device

Semiconductor device with interface peeling preventing rewiring layer

Solder bumps in flip-chip technologies

Contact structure having a compliant bump and a test pad

Semiconductor device and manufacturing method for the same

Contact structure having a compliant bump and a testing area

Substrate and process for semiconductor flip chip package

Semiconductor device having bumps in a same row for staggered probing

Solder connector structure and method

Substrate structure integrated with passive components

Package structure having semiconductor chip embedded therein and method for fabricating the same

Contact device for use in a power semiconductor module or in a disc-type thyristor

Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture

Array-Processed Stacked Semiconductor Packages

Semiconductor device

Fabrication method and structure of PCB assembly, and tool for assembly thereof

Bonding apparatus

Method for self-assembling microstructures

Bonding apparatus and method for cleaning tip of a bonding tool

ELECTRONIC PACKAGE WITH OPTIMIZED LAMINATION PROCESS

Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuit

Single chip USB packages by various assembly methods

Pad structure design with reduced density

Method Of Transferring At Least One Object Of Micrometric Or Millimetric Size By Means Of A Polymer Handle

Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device

Structure of image sensor module and a method for manufacturing of wafer level package

Method to build robust mechanical structures on substrate surfaces

Electronic component module and radio comunications equipment

Method and apparatus for precisely aligning integrated circuit chips

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Flip chip mounting process and flip chip assembly

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR CHIP

Semiconductor integrated circuit device

Semiconductor device with reduced contact resistance

Electronic component of VQFN design and method for producing the same

BLM structure for application to copper pad

Flip-chip semiconductor package and chip carrier for preventing corner delamination

Semiconductor chip and method for manufacturing same, electrode structure of semiconductor chip and method for forming same, and semiconductor device

Compliant Bumps for Integrated Circuits Using Carbon Nanotubes

Chip having two groups of chip contacts

Semiconductor device and manufacturing method therefor

Electronic circuit in a package-on-package configuration and method for producing the same

Pillar Bump Package Technology

Chip package structure and manufacturing method thereof

Surface mount multichip devices

Chip package structure

Interconnect structure for semiconductor package

Structure of image sensor module and a method for manufacturing of wafer level package

Semiconductor module with a power semiconductor chip and a passive component and method for producing the same

Power semiconductor apparatus

Methods and apparatus for packaging integrated circuit devices

Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, LED display, LED backlight and electronic device

Semiconductor device and an information management system therefor

Device With Mounted Electronic Parts, Method Of Producing The Same, Protection Circuit Module Of Secondary Battery, And Battery Package

Derivatives of poly(styrene-co-allyl alcohol) and methods for use thereof

Automatic level adjustment for die bonder

Conductive adhesive rework method

Method and apparatus for microstructure assembly

Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices

Integrated circuit mount system with solder mask pad

Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same

Application of PVD W/WN bilayer barrier to aluminum bondpad in wire bonding

Method for manufacturing a semiconductor wiring base that includes a wiring base with wiring extending inside and outside of a mounting region

Method of fabricating a semiconductor device including forming an insulating layer with a hard sheet buried therein

Packaging structure with protective layers and packaging method thereof

System and method of attenuating electromagnetic interference with a grounded top film

Chip scale package (CSP) assembly apparatus and method

Process for manufacture of thin wafer

CIRCULAR WIRE-BOND PAD, PACKAGE MADE THEREWITH, AND METHOD OF ASSEMBLING SAME

Transformer coils for providing voltage isolation

Method for producing a dielectric layer for an electronic component

ESD protection circuit for semiconductor device

Component and method for producing a component

Chip structure

Semiconductor chip structure

Method for producing chip packages, and chip package produced in this way

Chip structure with redistribution traces

Semiconductor device, mounting construction of a semiconductor device, and method of manufacturing the semiconductor device with the mounting construction

Semiconductor device and method of producing the same

Semiconductor device having an electrode pad, a bump provided above the electrode pad and a bump foundation layer therebetween

Semiconductor device, electro-optical device, and method for manufacturing semiconductor device

Method of manufacturing semiconductor device

Semiconductor package and method of fabricating the same and semiconductor module and method of fabricating the same

Semiconductor device having pillar-shaped terminal

Methods and apparatus for packaging integrated circuit devices

Semiconductor package and fabrication method thereof

Semiconductor device

CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF

EMI ABSORBING GAP FILLING MATERIAL

Semiconductor Package Having Improved Adhesion and Solderability

Integrated circuit package system employing an exposed thermally conductive coating

Semiconductor with reduced pad pitch

Semiconductor device and method of manufacturing the same

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Wire bonding apparatus

Electronic parts packaging structure and method of manufacturing the same

Sheet Peeling Apparatus and Peeling Method

Method for connecting electronic components, method for forming bump and conductive connection film and fabrication apparatus for electronic component mounted body, bump and conductive correction film

Apparatus and method for reducing volume of resource allocation information message in a broadband wireless communication system

Methods and systems for laser assisted wirebonding

SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING AND FABRICATING METHOD THEREOF

Quad flat no-lead (QFN) chip package assembly apparatus and method

Method for encapsulating sensor chips

Compressible films surrounding solder connectors

Integrated circuit package, panel and methods of manufacturing the same

Advanced Thin Flexible Microelectronic Assemblies and Methods for Making Same

Semiconductor device with electrode pad having probe mark

Electronic device with EMI screen and packing process thereof

Multilayer printed circuit board

Power semiconductor module with connection elements electrically insulated from one another

Thermally conductive composite and uses for microelectronic packaging

Misalignment detection devices

Copper bonding compatible bond pad structure and method

BONDING PAD STRUCTURE FOR ELECTRONIC DEVICE

Semiconductor package including dummy board and method of fabricating the same

Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Semiconductor package and method of manufacturing the same

Method for bonding wafers to produce stacked integrated circuits

Solderability Improvement Method for Leaded Semiconductor Package

Superfine-circuit semiconductor package structure

Flip chip package including a non-planar heat spreader and method of making the same

Semiconductor constructions and assemblies, and electronic systems

SEMICONDUCTOR PACKAGE

Composite multi-layer substrate and module using the substrate

Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board

Electronic module with switching functions and method for producing the same

Thermal release adhesive-backed carrier tapes

Multi-chip semiconductor connector assemblies

Flip chip package and method of fabricating the same

Chip package structure and fabricating method thereof

Method of Manufacturing a Semiconductor Device

Semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device with back surface electrode including a stress relaxation film

Method and apparatus for measuring oscillation amplitude of an ultrasonic device

Bond and method for bonding two contact surfaces

Method for production of a semiconductor component

Bonding pad structure and method for making the same

Method of providing mixed size solder bumps on a substrate using a solder delivery head

Method of providing solder bumps of mixed sizes on a substrate using solder transfer in two stages

Semiconductor package substrate for flip chip packaging

Method of providing solder bumps of mixed sizes on a substrate using a sorting mask and bumped substrate formed according to the method

Detachable stiffener for ultra-thin die

Nickel tin bonding system for semiconductor wafers and devices

Vibration-Assisted Method for Underfilling Flip-Chip Electronic Devices

Wafer-level bonding for mechanically reinforced ultra-thin die

Electronic assembly with stacked IC's using two or more different connection technologies and methods of manufacture

Semiconductor device and method of manufacturing the semiconductor device

Tapered die-side bumps

Fine pitch microcontacts and method for forming thereof

Semiconductor device