212040 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Arsenic [As]
High density nanostructured interconnection
#9902Stack package having pattern die redistribution
#9903Multiple-dies semiconductor device with redistributed layer pads
#9904Integrated circuit (IC) chip and method for fabricating the same
#9905Semiconductor Device and Manufacturing Method Thereof, Semiconductor Package, and Electronic Apparatus
#9906Semiconductor device having an inductor
#9907Semiconductor package having embedded passive elements and method for manufacturing the same
#9908IC chip, antenna, and manufacturing method of the IC chip and the antenna
#9909Chip stack, chip stack package, and method of forming chip stack and chip stack package
#9910Semiconductor package having optimal interval between bond fingers for reduced substrate size
#9911Flexible joint methodology to attach a die on an organic substrate
#9912Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages
#9913Electronic package and semiconductor device using the same
#9914Exposed top side copper leadframe manufacturing
#9915System Comprising an Electrical Component and an Electrical Connecting Lead for Said Component, and Method for the Production of Said System
#9916Solid state image pickup device, method for manufacturing the same, semiconductor device and method for manufacturing the same
#9917Ball forming device in a bonding apparatus and ball forming method
#9918Printed circuit board and method of manufacturing the same
#9919COMPLIANT ELECTRICAL CONTACTS
#9920Circuit-connecting material and circuit terminal connected structure and connecting method
#9921SURFACE TREATMENT, SORTING AND ASSEMBLING METHODS OF MICROELECTRONIC DEVICES AND STORAGE STRUCTURE THEREOF
#9922Capping of metal interconnects in integrated circuit electronic devices
#9923Die configurations and methods of manufacture
#9924Method for applying solder to redistribution lines
#9925Method of manufacturing a semiconductor device
#9926Manufacturing method for a leadless multi-chip electronic module
#9927Method for bonding semiconductor chip
#9928Au bonding wire for semiconductor device
#9929BONDING MATERIALS HAVING PARTICLE WITH ANISOTROPIC SHAPE
#9930Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same
#9931Die package and probe card structures and fabrication methods
#9932Use of a die-attach composition for high power semiconductors, method for attaching same to a printed circuit board and semiconductor device manufactured thereby
#9933Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#9934Semiconductor device having conductive adhesive layer and method of fabricating the same
#9935SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#9936Semiconductor Module Having Low Thermal Load
#9937RF power transistor having an encapsulated chip package
#9938Three dimensional integrated circuit and method of making the same
#9939Semiconductor apparatus with decoupling capacitor
#9940Semiconductor package including connector disposed in troughhole
#99413D electronic packaging structure having a conductive support substrate
#9942Integrated Circuits Having Controlled Inductances
#9943Semiconductor device, and life prediction circuit and life prediction method for semiconductor device
#9944Micro universal serial bus (USB) memory package
#9945Semiconductor device, manufacturing method and apparatus for the same
#9946Molding methods to manufacture single-chip chip-on-board USB device
#9947Top layers of metal for high performance IC's
#9948Top layers of metal for high performance IC's
#9949Microelectronic assembly with back side metallization and method for forming the same
#9950Manufacturing method of semiconductor device
#9951METHOD OF ALIGNING A CONTACTLESS SEMICONDUCTOR DEVICE INTERFACE
#9952Stacked semiconductor package having flexible circuit board therein
#9953Interposer containing bypass capacitors for reducing voltage noise in an IC device
#9954Micro power converter and method of manufacturing same
#9955Integrated circuit (IC) package stacking and IC packages formed by same
#9956Multilayer bonding ribbon
#9957SEMICONDUCTOR DEVICE HAVING WIRE LOOP AND METHOD AND APPARATUS FOR MANUFACTURING THE SEMICONDUCTOR DEVICE
#9958Resin Paste For Die Bonding And Its Use
#9959Top layers of metal for high performance IC's
#9960Mold for forming conductive bump, method of fabricating the mold, and method of forming bump on wafer using the mold
#9961Embedded chip package structure
#9962INTEGRATED INDUCTORS AND COMPLIANT INTERCONNECTS FOR SEMICONDUCTOR PACKAGING
#9963Via layout with via groups placed in interlocked arrangement
#9964Top layers of metal for high performance IC's
#9965Top layers of metal for high performance IC's
#9966Top layers of metal for high performance IC's
#9967Top layers of metal for high performance IC's
#9968Top layers of metal for high performance IC's
#9969Top layers of metal for high performance IC's
#9970Top layers of metal for high performance IC's
#9971Top layers of metal for high performance IC's
#9972Top layers of metal for high performance IC's
#9973Top layers of metal for high performance IC's
#9974Top layers of metal for high performance IC's
#9975Electronic component, semiconductor device employing same, and method for manufacturing electronic component
#9976Semiconductor device having semiconductor element with back electrode on insulating substrate
#9977CHIP STRUCTURE
#9978Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same
#9979Electrically conductive connection, electronic component and method for their production
#9980Semiconductor package having dimpled plate interconnections
#9981Stacking structure of chip package
#9982Surface mounting structure and packaging method thereof
#9983Thermal improvement for hotspots on dies in integrated circuit packages
#9984DIE STACK CAPACITORS, ASSEMBLIES AND METHODS
#9985Bond wireless power module with double-sided single device cooling and immersion bath cooling
#9986IC chip package, and image display apparatus using same
#9987Multi-chip stacked package with reduced thickness
#9988Method of wafer plating
#9989Top layers of metal for high performance IC's
#9990Composition for removing a photoresist and method of forming a bump electrode
#9991METHODS OF FORMING SOLDER CONNECTIONS AND STRUCTURE THEREOF
#9992Methods of forming solder connections and structure thereof
#9993Substrate treating method and method of manufacturing semiconductor apparatus
#9994Fabrication method of semiconductor integrated circuit device
#9995Electronic device and production method thereof
#9996Semiconductor package and method of assembling the same
#9997Stacked Chips with Underpinning
#9998MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#9999Method of manufacturing an integrated circuit
#10000Method of fixing curved circuit board and wire bonding apparatus
#10001Wiring module
#10002Computer systems having an interposer including a flexible material
#10003Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
#10004Chip and flat panel display apparatus comprising the same
#10005Method for producing sheet with IC tags, apparatus for producing sheet with IC tags, sheet with IC tags, method for fixing IC chips, apparatus for fixing IC chips, and IC tag
#10006Electronics package and associated method
#10007Electronic circuit arrangement
#10008Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device
#10009Top layers of metal for high performance IC's
#10010Top layers of metal for high performance IC's
#10011Top layers of metal for high performance IC's
#10012Top layers of metal for high performance IC's
#10013Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
#10014Semiconductor device having improved contacts
#10015Top layers of metal for high performance IC's
#10016Wiring board and method for manufacturing the same, and semiconductor device
#10017Semiconductor Device
#10018Method of making thermally enhanced substrate-base package
#10019Mounting integrated circuit dies for high frequency signal isolation
#10020Semiconductor device package utilizing proud interconnect material
#10021Semiconductor device and method for producing the semiconductor device
#10022Power semiconductor device connected in distinct layers of plastic
#10023Semiconductor device
#10024Stacked die package system
#10025Electronic Part And Method Of Producing The Same
#10026Semiconductor integrated circuit device, and method of designing and manufacturing the same
#10027Methods and apparatus for thermal management in a multi-layer embedded chip structure
#10028Method for fabricating flip-chip semiconductor package with lead frame as chip carrier
#10029Semiconductor device
#10030Interconnections resistant to wicking
#10031Package structure and lead frame using the same
#10032Methods and apparatus for a semiconductor device package with improved thermal performance
#10033Semiconductor device having a bonding pad and fuse and method for forming the same
#10034SEMICONDUCTOR DEVICE, MAGNETIC SENSOR, AND MAGNETIC SENSOR UNIT
#10035Device clamp for reducing oxidation in wire bonding
#10036INTEGRATED CIRCUIT CHIP FORMED ON SUBSTRATE
#10037Wire bonding method for forming low-loop profiles
#10038SEMICONDUCTOR HAVING A BONDING WIRE AND PROCESS
#10039Assembly and method of assembling by soldering an object and a support
#10040HIGHLY COMPLIANT PLATE FOR WAFER BONDING
#10041Resonating conductive traces and methods of using same for bonding components
#10042Advanced multilayer coreless support structures and method for their fabrication
#10043Top layers of metal for high performance IC's
#10044Top layers of metal for high performance IC's
#10045Semiconductor device and method for fabricating the same
#10046Top layers of metal for high performance IC's
#10047Top layers of metal for high performance IC's
#10048Method of forming semiconductor packaged device
#10049Method of Dissipating heat, Packaging and Shaping for Light Emitting Diodes
#10050Method and system for fabricating a semiconductor device
#10051METHOD OF FORMING A TRACE EMBEDDED PACKAGE
#10052Chip stack package and manufacturing method thereof
#10053Semiconductor device encapsulated with resin composition
#10054Backages with buried electrical feedthroughs
#10055On-chip inductor using redistribution layer and dual-layer passivation
#10056Stacked contact bump
#10057Semiconductor package and method for fabricating the same
#10058Encapsulated electronic device
#10059Microelectronic element chips
#10060Semiconductor device
#10061Top layers of metal for high performance IC's
#10062Top layers of metal for high performance IC's
#10063Top layers of metal for high performance IC's
#10064Top layers of metal for high performance IC's
#10065Top layers of metal for high performance IC's
#10066Top layers of metal for high performance IC's
#10067Top layers of metal for high performance IC's
#10068Top layers of metal for high performance IC's
#10069Interlayer dielectric and pre-applied die attach adhesive materials
#10070Top layers of metal for high performance IC's
#10071Semiconductor device and method for fabricating the same
#10072System and method to reduce metal series resistance of bumped chip
#10073Semiconductor circuit arrangement
#10074Semiconductor package structure having enhanced thermal dissipation characteristics
#10075Semiconductor package substrate and semiconductor package having the same
#10076Modular bonding pad structure and method
#10077Electronic assemblies and systems with filled no-flow underfill
#10078Producing thin integrated semiconductor devices
#10079Semiconductor integrated circuit device
#10080Semiconductor device having a bonding wire and method for manufacturing the same
#10081Stacked package electronic device
#10082Stack structure of circuit board with semiconductor component embedded therein
#10083Stackable multi-chip package system
#10084Side stacking apparatus and method
#10085Semiconductor package structure
#10086Circuit Arrangement, System Carrier and Methods for Producing Same
#10087Au-Ag based alloy wire for semiconductor package
#10088Lead frame and method of manufacturing the same and semiconductor device
#10089Leadframe IC packages having top and bottom integrated heat spreaders
#10090Self-aligned wafer level integration system
#10091Semiconductor device and method for manufacturing the same
#10092Semiconductor device with reduced parasitic inductance
#10093Light-emitting device manufacturing method and light-emitting device
#10094Method for producing a chip-substrate connection
#10095Spring connector for making electrical contact at semiconductor scales
#10096Barrier layer for fine-pitch mask-based substrate bumping
#10097Contact surrounded by passivation and polymide and method therefor
#10098Fabrication method of semiconductor device
#10099Separation method of semiconductor device
#10100Electronic Component Mounting Structure
#10101Non-cyanide gold electroplating for fine-line gold traces and gold pads
#10102Interconnect structure and formation for package stacking of molded plastic area array package
#10103Semiconductor component with connecting elements and method for producing the same
#10104Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates
#10105Top layers of metal for high performance IC's
#10106Top layers of metal for high performance IC's
#10107Top layers of metal for high performance IC's
#10108Top layers of metal for high performance IC's
#10109Top layers of metal for high performance IC's
#10110Top layers of metal for high performance IC's
#10111Top layers of metal for high performance IC's
#10112Top layers of metal for high performance IC's
#10113Top layers of metal for high performance IC's
#10114Top layers of metal for high performance IC's
#10115Method of wire bonding over active area of a semiconductor circuit
#10116Device Comprising Circuit Elements Connected By Bonding Bump Structure
#10117Integrated circuit package having exposed thermally conducting body
#10118Dividable semiconductor device having ceramic substrate and surface mount components collectively sealed on principle surface of ceramic substrate
#10119Semiconductor device
#10120Semiconductor package, chip carrier structure thereof, and method for fabricating the chip carrier
#10121SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
#10122METHOD FOR FABRICATING A MODULE HAVING AN ELECTRICAL CONTACT-CONNECTION
#10123Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modules
#10124Semiconductor device and method for manufacturing the same
#10125Method and apparatus for depositing coplanar microelectronic interconnectors using a compliant mold
#10126System and Method for Low Temperature Plasma Enhanced Bonding
#10127Conductive adhesive composition
#10128Electronic components with plurality of contoured microelectronic spring contacts
#10129Method of providing solder bumps using reflow in a forming gas atmosphere
#10130WAFER LEVEL PACKAGE AND METHOD OF FABRICATING THE SAME
#10131Methodology to control underfill fillet size, flow-out and bleed in flip chips (FC), chip scale packages (CSP) and ball grid arrays (BGA)
#10132Temporary chip attach using injection molded solder
#10133Apparatus For Aligning Microchips On Substrate And Method For The Same
#10134METHOD FOR PROCESSING AN INTEGRATED CIRCUIT
#10135Heat sink electronic package having compliant pedestal
#10136Stub-tuned wirebond package
#10137Ultrasound Transducer and Method for Implementing High Aspect Ration Bumps for Flip-Chip Two Dimensional Arrays
#10138Integrated circuit package and multi-layer lead frame utilized
#10139Integrated circuit having pads and input/output (I/O) cells
#10140Semiconductor device having pad structure for preventing and buffering stress of silicon nitride film
#10141Metallization layer for a power semiconductor device
#10142INTEGRATED CIRCUIT HAVING PADS AND INPUT/OUTPUT (I/O) CELLS
#10143Dual-sided chip attached modules
#10144Semiconductor device including electrically conductive bump and method of manufacturing the same
#10145Manufacturing a bump electrode with roughened face
#10146Semiconductor device having low dielectric insulating film and manufacturing method of the same
#10147Dual MOSFET package
#10148Semiconductor device and method of manufacturing the same
#10149Semiconductor device with semiconductor chips mounted on mounting board via conductive anaotubes
#10150No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement
#10151Integrated circuit package system with different mold locking features
#10152Wafer level semiconductor chip packages and methods of making the same
#10153Electronic component having a semiconductor power device
#10154Flip chip MLP with folded heat sink
#10155Copper straps
#10156Dual side cooling integrated power device module and methods of manufacture
#10157Top layers of metal for high performance IC's
#10158Methods and apparatus having an integrated circuit attached to fused silica
#10159Multilayer electronic component, electronic device, and method for manufacturing multilayer electronic component
#10160Method for manufacturing an electronics module
#10161Method of producing an electronic component
#10162Integrated circuit chip packaging
#10163Method and apparatus for locating and/or forming bumps
#10164Method for forming a semiconductor on insulator structure
#10165Micro-package, multi-stack micro-package, and manufacturing method therefor
#10166Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
#10167Method of manufacturing a semiconductor device
#10168Super high density module with integrated wafer level packages
#10169Module With Built-In Semiconductor And Method For Manufacturing The Module
#10170Method for fabricating semiconductor package with multi-layer die contact and external contact
#10171SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#10172Semiconductor device
#10173Manufacturing method of resin-molding type semiconductor device, and wiring board therefor
#10174Semiconductor device and method of producing the same
#10175Top layers of metal for high performance IC's
#10176Top layers of metal for high performance IC's
#10177Top layers of metal for high performance IC's
#10178Top layers of metal for high performance IC's
#10179Top layers of metal for high performance IC's
#10180Top layers of metal for high performance IC's
#10181Electronic component built-in substrate and method of manufacturing the same
#10182Circuit board, method for manufacturing the same, and semiconductor device
#10183Stacked bump structure and manufacturing method thereof
#10184Heat sink structure for embedded chips and method for fabricating the same
#10185COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same
#10186Method of fabricating microelectronic devices
#10187THREE-DIMENSIONAL PACKAGING SCHEME FOR PACKAGE TYPES UTILIZING A SACRIFICIAL METAL BASE
#10188INTERCONNECTED IC PACKAGES WITH VERTICAL SMT PADS
#10189Semiconductor device having shifted stacked chips
#10190Lead frame and semiconductor device using the same
#10191WIRE BONDING PROCESS FOR INSULATED WIRES
#10192Component mounting apparatus and component mounting method
#10193Method and system for fabricating a semiconductor device
#10194METHOD FOR MANUFACTURING WAFER-LEVEL PACKAGES FOR FLIP CHIPS CAPABLE OF PREVENTING ADHESIVES FROM ABSORBING WATER
#10195Interconnection structure, electronic component and method of manufacturing the same
#10196Process for fabricating chip package structure
#10197Printed circuit board
#10198Semiconductor module
#10199SEMICONDUCTOR MODULE
#10200Increased interconnect density electronic package and method of fabrication