Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips

Semiconductor device including a buffer layer structure for reducing stress

Process for forming bumps and solder bump

CHIP PACKAGE

Test pads on flash memory cards

Wafer level stack structure for system-in-package and method thereof

CHIP STRUCTURE AND FABRICATING PROCESS THEREOF

Low resistance integrated MOS structure

Transducer and method for mounting the same

CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD

ALLOY COMPOSITIONS AND TECHNIQUES FOR REDUCING INTERMETALLIC COMPOUND THICKNESS AND OXIDATION OF METALS AND ALLOYS

Method of making a radio frequency identification (RFID) tag

Process for bonding and electrically connecting microsystems integrated in several distinct substrates

Systems and methods for high density multi-component modules

Method of forming stackable package

Method of making wirebond electronic package with enhanced chip pad design

3D interconnect with protruding contacts

Method of preventing dielectric breakdown of semiconductor device and semiconductor device preventing dielectric breakdown

Oriented self-location of microstructures with alignment structures

INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Wirebond pad for semiconductor chip or wafer

CHIP PACKAGING STRUCTURE

Method for forming C4 connections on integrated circuit chips and the resulting devices

Semiconductor device having a smaller electrostatic capacitance electrode

Bump structure, method of forming bump structure, and semiconductor apparatus using the same

Power semiconductor module as H-bridge circuit and method for producing the same

SEMICONDUCTOR PACKAGE STRUCTURES HAVING HEAT DISSIPATIVE ELEMENT DIRECTLY CONNECTED TO INTERNAL CIRCUIT AND METHODS OF FABRICATING THE SAME

Stackable integrated circuit structures and systems devices and methods related thereto

Circuit apparatus and method of fabricating the apparatus

Packaging of integrated circuits to lead frames

System and method for providing a power bus in a wirebond leadframe package

Semiconductor device

Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having the semiconductor device

Conductive ball arraying apparatus

Polymer matrices for polymer solder hybrid materials

Semiconductor device with via hole of uneven width

Method of manufacturing semiconductor apparatus

Method of dividing an adhesive film bonded to a wafer

PANEL AND SEMICONDUCTOR DEVICE HAVING A STRUCTURE WITH A LOW-K DIELECTRIC

Method for fabricating semiconductor package free of substrate

Carrierless chip package for integrated circuit devices, and methods of making same

Method for fabricating multi-chip semiconductor package

Semiconductor device and method of manufacturing the semiconductor device

Semiconductor die package including multiple dies and a common node structure

Method for applying rewiring to a panel while compensating for position errors of semiconductor chips in component positions of the panel

Surface mounting electronic component and manufacturing method thereof

Filter device substrate and filter device

Semiconductor device

Integrated circuit devices with stacked package interposers

Power semiconductor component, power semiconductor device as well as methods for their production

Semiconductor power module including epoxy resin coating

Semiconductor device and method for producing the same

Semiconductor device and method of manufacturing the same

Wafer level semiconductor module and method for manufacturing the same

Utra-thin substrate package technology

Semiconductor components having encapsulated through wire interconnects (TWI)

Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of electronic device containing additional metal powder component

Leadframe enhancement and method of producing a multi-row semiconductor package

Package for optical device and method of manufacturing the same

Power semiconductor module having surface-mountable flat external contacts and method for producing the same

Memory circuit system having semiconductor devices and a memory

Embedded integrated circuit package system

MULTI-DIE INDUCTOR

MOSFET power package

Semiconductor device using semiconductor chip

Fill head for injection molding of solder

Universal mold for injection molding of solder

Tail wire cutting method and bonding apparatus

Method of producing semiconductor package, apparatus for producing semiconductor package, and adhesive film

Method for Electroplating and Contact Projection Arrangement

Fabrication method for electronic system modules

FINE PITCH MICROFABRICATED SPRING CONTACT STRUCTURE & METHOD

Method of manufacturing a through electrode

POP Semiconductor Device Manufacturing Method

Semiconductor package, array arranged substrate structure for the semiconductor package and fabrication method of the semiconductor package

Flip-chip mounting method and bump formation method

Method of wafer level chip size packaging

Thin semiconductor device package

Chip package

Solder joint flip chip interconnection having relief structure

Wiring board, semiconductor device using the same, and method for manufacturing wiring board

Conductive structures including titanium-tungsten base layers

Direct-write wafer level chip scale package

Semiconductor device, substrate for producing semiconductor device and method of producing them

Overmolded semiconductor package with a wirebond cage for EMI shielding

Stacked semiconductor device

Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device

Optical display package and the method thereof

Adhesive sheet, semiconductor device, and process for producing semiconductor device

Etched leadframe flipchip package system

Alternative flip chip in leaded molded package design and method for manufacture

ELECTRICALLY CONDUCTING TRACK AND METHOD OF MANUFACTURE THEREOF

Low inductance bond-wireless co-package for high power density devices, especially for IGBTs and diodes

Semiconductor light emitting device with first and second leads

Semiconductor device and method of producing the same

Method for bonding a semiconductor substrate to a metal substrate

Transfer tape strap process

Apparatus and method for signal bus line layout in semiconductor device

Apparatuses and methods to enhance passivation and ILD reliability

Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

Bilayer Laminated Film for Bump Formation and Method of Bump Formation

Semiconductor device having heat radiation member and semiconductor chip and method for manufacturing the same

Bonding Wire and Integrated Circuit Device Using the Same

Semiconductor die packages using thin dies and metal substrates

Hybrid stacking package system

Chip with power and signal pads connected to power and signal lines on substrate

Space transformer having multi-layer pad structures

SEMICONDUCTOR PACKAGE STRUCTURE

High frequency IC package and method for fabricating the same

Common Assembly Substrate and Applications Thereof

Integrated circuit package system with wire bond pattern

Hybrid flip-chip and wire-bond connection package system

Semiconductor device having an adhesion promoting layer and method for producing it

Methods and apparatus for a reduced inductance wirebond array

Chip package structure

Semiconductor package and method using isolated Vplane to accommodate high speed circuitry ground isolation

Integrated circuit package system with net spacer

ELECTRONIC DEVICE MOUNTING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Electronic device with selective nickel palladium gold plated leadframe and method of making the same

Power semiconductor module and fabrication method

Capacitor structure of semiconductor device and method of fabricating the same

Chip scale surface mount package for semiconductor device and process of fabricating the same

Semiconductor device and method of manufacturing the same

Electrical arrangement comprising a wire connection arrangement and method for the production of such an electrical arrangement

SEMICONDUCTOR DEVICE HAVING CARBON NANOTUBE INTERCONNECTS AND METHOD OF FABRICATION

Wire bonding capillary tool having multiple outer steps

Electronic device substrate and its fabrication method, and electronic device and its fabrication method

Multichip package system

Multiple flip-chip integrated circuit package system

Method of forming solder connection portions, method of forming wiring substrate and method of producing semiconductor device

QFN housing having optimized connecting surface geometry

Semiconductor device having adhesion increasing film to prevent peeling

Semiconductor device and method for manufacturing the same

Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging

Method for forming metal bumps

Method and structure for eliminating aluminum terminal pad material in semiconductor devices

Methods and materials useful for chip stacking, chip and wafer bonding

Singulating surface-mountable semiconductor devices and fitting external contacts to said devices

Room temperature metal direct bonding

Semiconductor device fabricating method

Semiconductor device manufacturing method

Method for making a wedge wedge wire loop

Method of manufacturing semiconductor device

Gold/silicon eutectic die bonding method

Flexible interconnect pattern on semiconductor package

Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method

Barrier for use in 3-D integration of circuits

Functional blocks for assembly

Fabrication method of semiconductor integrated circuit device

Article and assembly for magnetically directed self assembly

Method of correcting bonding coordinates using reference bond pads

Flip chip bonding structure

Adjustable thickness thermal interposer and electronic package utilizing same

Power module

Carbon nanotube via interconnect

Piezoelectric device and method for manufacturing the same

SEMICONDUCTOR DEVICE HAVING STACKED STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Isolating chip-to-chip contact

Semiconductor device with guard rings that are formed in each of the plural wiring layers

Semiconductor chip comprising a metal coating structure and associated production method

Flip chip bonded package applicable to fine pitch technology

High-performance semiconductor package

Semiconductor device and manufacturing method thereof

Semiconductor device that improves electrical connection reliability

Power semiconductor component with a power semiconductor chip and method for producing the same

Semiconductor chip having fine pitch bumps and bumps thereon

Interconnect structure with stress buffering ability and the manufacturing method thereof

Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices

Semiconductor device including a DC-DC converter

Folding chip planar stack package

Edge coating a microelectronic device

Heat conductive bonding material, semiconductor package, heat spreader, semiconductor chip and bonding method of bonding semiconductor chip to heat spreader

Grounding structure of semiconductor device including a conductive paste

CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING BUMPS

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

Method and arrangement for forming a microelectronic package

Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out

Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium

Solder layer and electronic device bonding substrate and submount using the same

Connecting device for electronic components

Multilayer printed circuit board

Heat conduction from an embedded component

HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

SYSTEM AND METHOD FOR ADHERING LARGE SEMICONDUCTOR APPLICATIONS TO PCB

Resin Paste for Die Bonding

Method of forming a semiconductor device having bonding pad of the second chip thinner than bonding pad of the first chip

PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE

System for making a semiconductor device using bump material including liquid

Semiconductor device and medium of fabricating the same

Single passivation layer scheme for forming a fuse

Separation method for cutting semiconductor package assemblage for separation into semiconductor packages

Method for fabricating a BGA device and BGA device

Die bonding

Manufacturing method of a package structure

Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film

INDIUM FEATURES ON MULTI-CONTACT CHIPS

Method of manufacturing display device using LED chips formed in a porous template

Conductor composition, a mounting substrate and a mounting structure utilizing the composition

Reactive foil assembly

Semiconductor device

SEMICONDUCTOR DEVICE WITH SOLDERABLE LOOP CONTACTS

On-die bond wires system and method for enhancing routability of a redistribution layer

Semiconductor device and fabrication process thereof

Semiconductor integrated circuit device

Structure and method to improve current-carrying capabilities of C4 joints

Chip package

Method for precision assembly of integrated circuit chip packages

Thermal paste containment for semiconductor modules

Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation film

Semiconductor components with through wire interconnects

Semiconductor constructions having interconnect structures, methods of forming interconnect structures, and methods of forming semiconductor constructions

Semiconductor package structure

Electronic component having exposed surfaces

Semiconductor devices and electrical parts manufacturing using metal coated wires

Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same

Semiconductor device and manufacturing method of a semiconductor device

Semiconductor integrated circuit device

Semiconductor component having test pads and method and apparatus for testing same

Method of and Apparatus for Forming Three-Dimensional Structures Integral With Semiconductor Based Circuitry

Electronic component and its manufacturing method

Accelerated B-Stage curing process for thermosetting resins and FBGA assembly process utilizing the accelerated B-Stage curing process

Adhesion tape and method for mounting a chip onto a substrate

Power transistor and power semiconductor device

Method for forming metal bumps

Method for manufacturing bump of wafer level package

Semiconductor wafer coat layers and methods therefor

Manufacturing method of a semiconductor device

Semiconductor device and method of manufacturing the same, electronic device and method of manufacturing the same, and electronic instrument

Method for producing semiconductor package

Manufacturing method of semiconductor device

Microelectronic devices and methods for manufacturing microelectronic devices

Semiconductor component having test pads and method and apparatus for testing same

Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus

Wafer level packaging structure with inductors and manufacture method thereof

Fiducial scheme adapted for stacked integrated circuits

Method for producing semiconductor components

Flip-chip type semiconductor device

Low thermal resistance assembly for flip chip applications

Carrierless chip package for integrated circuit devices, and methods of making same

Semiconductor device

Aluminum bump bonding for fine aluminum wire

Device having a contacting structure

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

Heat-radiating tape carrier package and method for manufacturing the same

METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES

Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same

Semiconductor device

Semiconductor package containing multi-layered semiconductor chips

Semiconductor device

Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink

Connecting a plurality of bond pads and/or inner leads with a single bond wire

Chip Package Structure

Chip package and wafer treating method for making adhesive chips

Semiconductor chip assembly

Chip packaging structure for improving reliability

Vertical semiconductor power switch, electronic component and methods of producing the same

GaAs integrated circuit device and method of attaching same

Bonding apparatus and bonding method

Production system

Method of self-assembly on a surface

Resin composition and semiconductor device produced by using the same

Wire bonding method for preventing polymer cracking

Method and structure for improving bonding reliability in bond pads

Method for planarizing vias formed in a substrate

In-place bonding of microstructures

Method for fabricating a semiconductor package

Method for manufacturing semiconductor device

Silicone Adhesive

Method for manufacturing semiconductor device

Perforated embedded plane package and method

Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device

Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof

MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE

Semiconductor device packaging

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Composite bump

Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board

Method of forming a bump and a connector structure having the bump

Elongated fasteners for securing together electronic components and substrates, semiconductor device assemblies including such fasteners, and accompanying systems

Method and apparatus for providing structural support for interconnect pad while allowing signal conductance

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Package structure for electronic device

Warp compensated package and method

Embedded chip package structure with chip support protruding section

Semiconductor package system with substrate having different bondable heights at lead finger tips

Combined board level EMI shielding and thermal management

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Electronic component with high density, low cost attachment

Semiconductor device and manufacturing process thereof

Method for forming reinforced interconnects on a substrate

Wafer bonding of damascene-patterned metal/adhesive redistribution layers

FABRICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip

Optical device and method for manufacturing the same

Method for embedding a component in a base

Integrating a heat spreader with an interface material having reduced void size

Electronic substrate, semiconductor device, and electronic device