212040 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Arsenic [As]
Semiconductor chip having bond pads
#11402Electronic device and manufacturing method therefor
#11403Semiconductor memory device comprising pseudo ground pad and related method
#11404Semiconductor device having metallic plate with groove
#11405Semiconductor device
#11406Semiconductor device
#11407Semiconductor package having plate interconnections
#11408Semiconductor chip having bond pads and multi-chip package
#11409Semiconductor IC-embedded module with multilayer substrates with multiple chips embedded therein
#11410Semiconductor package film having reinforcing member and related display module
#11411System in package (SIP) structure
#11412Multi-part lead frame with dissimilar materials
#11413Multi-part lead frame with dissimilar materials
#11414Structure of IC packaging and method forming the same
#11415Semiconductor component and method of assembling the same
#11416Power semiconductor device and method therefor
#11417Self-centering braze assembly methods
#11418Component mounting method and component-mounted body
#11419Semiconductor device and automotive AC generator
#11420Bonding structure with buffer layer and method of forming the same
#11421Methods for electronic fluorescent perturbation for analysis and electronic perturbation catalysis for synthesis
#11422METHODS OF FABRICATING AND USING SHAPED SPRINGS
#11423Grooved substrates for uniform underfilling solder ball assembled electronic devices
#11424METHOD FOR FABRICATING SEMICONDUCTOR PACKAGES
#11425Integrated die bumping process
#11426Multi-chip stack structure
#11427Wafer level chip size package for CMOS image sensor module and manufacturing method thereof
#11428Metal duplex method
#11429Manufacturing method of electronic device
#11430Support with solder ball elements and a method for populating substrates with solder balls
#11431Elastomer interposer with voids in a compressive loading system
#11432Chip structure and chip package structure
#11433Flip-chip packaging process using copper pillar as bump structure
#11434Semiconductor device and method for fabricating the same
#11435Metal duplex method
#11436Integrated circuit chip and manufacturing process thereof
#11437Protective barrier layer for semiconductor device electrodes
#11438Semiconductor device and manufacturing method thereof
#11439Electronic device and method of manufacturing same
#11440Semiconductor chip package and method of manufacturing the same
#11441Adhesive film having multiple filler distribution and method of manufacturing the same, and chip stack package having the adhesive film and method of manufacturing the same
#11442Encapsulated electronic part packaging structure
#11443Semiconductor device having a probing region
#11444High density interconnect assembly comprising stacked electronic module
#11445Low height vertical sensor packaging
#11446Partially patterned lead frames and methods of making and using the same in semiconductor packaging
#11447Resin mold type semiconductor device
#11448Die pad for semiconductor packages and methods of making and using same
#11449Semiconductor device having pads and which minimizes defects due to bonding and probing processes
#11450Semiconductor device and power conversion apparatus using the same
#11451Light emitting diode and method for manufacturing the same
#11452Stack type package module and method for manufacturing the same
#11453Quinolinols as fluxing and accelerating agents for underfill compositions
#11454Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives
#11455Bumping process and structure thereof
#11456Method for fabricating semiconductor component having conductors and bonding pads with wire bondable surfaces and selected thickness
#11457Method for fabricating semiconductor components having encapsulated, bonded, interconnect contacts on redistribution contacts
#11458Chip package structure and method for manufacturing bumps
#11459Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices
#11460Stacked chip package using photosensitive polymer and manufacturing method thereof
#11461Radiant energy heating for die attach
#11462Microfeature workpieces, carriers, and associated methods
#11463Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling micoelectronic devices
#11464Device transferring method, and device arraying method
#11465Heat transfer plate
#11466Solid image pickup unit and camera module
#11467Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology
#11468Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
#11469Lithographic type microelectronic spring structures with improved contours
#11470Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
#11471Pad open structure
#11472Chip package and bump connecting structure thereof
#11473Semiconductor device including a plurality of semiconductor chips stacked three-dimensionally, and method of manufacturing the same
#11474PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF
#11475Stacked microelectronic devices and methods for manufacturing microelectronic devices
#11476Semiconductor device, semiconductor package for use therein, and manufacturing method thereof
#11477Method for forming a double embossing structure
#11478Semiconductor packages for surface mounting and method of producing same
#11479Alpha particle shields in chip packaging
#11480Lead-containing solder bumps
#11481Insulating layer between bumps of semiconductor chip, and display panel using the same with anisotropic conductive film between semiconductor chip and substrate
#11482METHOD OF SOLDER BUMPING A CIRCUIT COMPONENT AND CIRCUIT COMPONENT FORMED THEREBY
#11483Lead-containing solder paste
#11484Lead-containing anodes
#11485Semiconductor device and semiconductor chip
#11486Stacked chip package using warp preventing insulative material and manufacturing method thereof
#11487Interconnecting substrates for microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices
#11488Copper bump barrier cap to reduce electrical resistance
#11489Wafer integrated rigid support ring
#11490Semiconductor device package
#11491Thermal paste containment for semiconductor modules
#11492Wiring board construction including embedded ceramic capacitors(s)
#11493Microfeature assemblies including interconnect structures and methods for forming such interconnect structures
#11494Quad flat pack (QFP) package and flexible power distribution method therefor
#11495Microelectronic devices and methods for manufacturing microelectronic devices
#11496Microelectronic devices and microelectronic support devices, and associated assemblies and methods
#11497Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#11498Semiconductor device with reduced thickness of the semiconductor substrate
#11499Semiconductor device and manufacturing method thereof
#11500Reversible-multiple footprint package and method of manufacturing
#11501Blue LED with phosphor layer for producing white light and different phosphor in outer lens for reducing color temperature
#11502Semiconductor device and method of manufacturing the same
#11503Power semiconductor device having lines within a housing
#11504Display panel package
#11505Method for hybridization of two components by using different sized solder protrusions and a device that uses two components hybridized according to this method
#11506Semiconductor device and method of manufacturing the same
#11507Approach to high temperature wafer processing
#11508Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip
#11509Integrated circuit device
#11510Chip package and package process thereof
#11511Method for producing semiconductor device and semiconductor device
#11512Methods and apparatus for high-density chip connectivity
#11513Hybridization of polynucleotides conjugated with chromophores and fluorophores to generate donor-to-donor energy transfer system
#11514Ternary alloy column grid array
#11515Bonding program
#11516Method and device for producing a system having a component applied to a predetermined location of a surface of a substrate
#11517RFID inlays and methods of their manufacture
#11518RFID inlays and methods of their manufacture
#11519Actuator and bonding apparatus
#11520Structure for circuit assembly
#11521Two layer substrate ball grid array design
#11522Encapsulated chip scale package having flip-chip on lead frame structure and method
#11523Printed circuit board and method thereof and a solder ball land and method thereof
#11524Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#11525Method of packaging and interconnection of integrated circuits
#11526Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features
#11527Underfilled semiconductor die assemblies and methods of forming the same
#11528Power semiconductor device comprising a semiconductor chip stack and method for producing the same
#11529Method of packaging and interconnection of integrated circuits
#11530Semiconductor device
#11531Semiconductor die package
#11532Semiconductor power component with a vertical current path through a semiconductor power chip
#11533Method for connecting a die assembly to a substrate in an integrated circuit and a semiconductor device comprising a die assembly
#11534Semiconductor device
#11535MOSFET package
#11536MOSFET package
#11537Leadframe package with dual lead configurations
#11538High current semiconductor device system having low resistance and inductance
#11539Bi-directional switch, and use of said switch
#11540Semiconductor connection component
#11541Power semiconductor packaging method and structure
#11542Integrated circuit device
#11543METHODS OF FABRICATING A SEMICONDUCTOR DEVICE USING A PHOTOSENSITIVE POLYIMIDE LAYER AND SEMICONDUCTOR DEVICES FABRICATED THEREBY
#115443D IC method and device
#11545Method for forming metal pad in semiconductor device
#11546Tin-silver solder bumping in electronics manufacture
#11547Manufacturing method of semiconductor device
#11548Semiconductor device and a manufacturing method of the same
#11549Semiconductor package with contact support layer and method to produce the package
#11550Method and apparatus for flip-chip bonding
#11551Assembly of an electrical component comprising an electrical insulation film on a substrate and method for producing said assembly
#11552Bonding apparatus
#11553Bonding pattern discrimination device
#11554Bonding pattern discrimination program
#11555Bonded structure and bonding method
#11556Tier structure with tier frame having a feedthrough structure
#11557Semiconductor device with improved contacts
#11558Semiconductor device and method of manufacturing the same
#11559Printed circuit board and electronic apparatus including printed circuit board
#11560Semiconductor component and method of manufacture
#11561Mount for a programmable electronic processing device
#11562Multi-chip semiconductor device package
#11563Stack structure with semiconductor chip embedded in carrier
#11564Printed circuit board, semiconductor package and multi-stack semiconductor package using the same
#11565Thin IC package for improving heat dissipation from chip backside
#11566Semiconductor module
#11567Semiconductor device and a manufacturing method of the same
#11568Semiconductor device electronic component, circuit board, and electronic device
#11569Method for fabricating wafer level semiconductor package with build-up layer
#11570Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same
#11571Semiconductor assembly and packaging for high current and low inductance
#11572Insulated gate semiconductor device and manufacturing method thereof
#11573Method for controlling telemetry in an implantable medical device based on power source capacity
#11574Method of making wafer level package structure by grinding the backside thereof and then forming metal layer on the ground side
#11575Use of an internal on-chip inductor for electrostatic discharge protection of circuits which use bond wire inductance as their load
#11576Packaged integrated circuit having a heat spreader and method therefor
#11577Mounting structure, electro-optical device, and electronic apparatus
#11578Apparatuses and methods facilitating functional block deposition
#11579Copper-metallized integrated circuits having electroless thick copper bond pads
#11580Solder composition for electronic devices
#11581Method of making a conformal electromagnetic interference shield
#11582Liquid crystal display devices
#11583Display device having an anisotropic-conductive adhesive film
#11584Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same
#11585Chip packaging structure without leadframe
#11586Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#11587Semiconductor device
#11588Semiconductor device
#11589Integrated circuit with low-stress under-bump metallurgy
#11590SEMICONDUCTOR DEVICE
#11591Chip-sized flip-chip semiconductor package and method for making the same
#11592Multilayered circuit substrate and semiconductor package structure using the same
#11593Power plane design and jumper wire bond for voltage drop minimization
#11594Application of autonomic self healing composites to integrated circuit packaging
#11595Semiconductor device and method of manufacturing the same
#11596Semiconductor device
#11597Radio frequency over-molded leadframe package
#11598Polysilicon film with increased roughness
#11599Semiconductor device
#11600SEMICONDUCTOR DEVICE
#11601Fluxless bumping process
#11602High frequency semiconductor integrated circuit device, wireless electric unit and wireless communication system
#11603METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#11604Method for manufacturing semiconductor device
#11605Metal pad or metal bump over pad exposed by passivation layer
#11606No flow underfill device and method
#11607Electrical interconnect structures for integrated circuits and methods of manufacturing the same
#11608Method of making a stacked die package
#11609Roll-to-roll fabricated encapsulated semiconductor circuit devices
#11610Roll-to-roll fabricated electronically active device
#11611Methods of bonding two semiconductor devices
#11612Semiconductor module comprising components for microwave engineering in plastic casing and method for the production thereof
#11613Laminated electronic component and method for producing the same
#11614Connection structure semiconductor chip and electronic component including the connection structure and methods for producing the connection structure
#11615Output match transistor
#11616Semiconductor power device and RF signal amplifier
#11617Technique for efficiently patterning an underbump metallization layer using a dry etch process
#11618Semiconductor device
#11619Planar bond pad design and method of making the same
#11620Semiconductor element with conductive bumps and fabrication method thereof
#11621Semiconductor device and method of manufacturing the same
#11622Flip chip package with reduced thermal stress
#11623Bonding pad on IC substrate and method for making the same
#11624Technique for forming a copper-based contact layer without a terminal metal
#11625ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE
#11626Self-assembled interconnection particles
#11627Semiconductor device-composing substrate and semiconductor device
#11628Semiconductor device, electronic module, and method of manufacturing electronic module
#11629Semiconductor package with ferrite shielding structure
#11630Microelectronic bond pad
#11631Bonding pad fabrication method, method for fabricating a bonding pad and an electronic device, and electronic device
#11632Integrated circuit chip and integrated device
#11633Semiconductor device having capacitors for reducing power source noise
#11634Multi-chip semiconductor package featuring wiring chip incorporated therein, and method for manufacturing such multi-chip semiconductor package
#11635METHOD FOR PRODUCING A CHIP ARRANGEMENT, A CHIP ARRANGEMENT AND A MULTICHIP DEVICE
#11636Packaged integrated circuit with enhanced thermal dissipation
#11637IC with on-die power-gating circuit
#11638Semiconductor package and manufacturing method thereof
#11639Semiconductor device
#11640Wire bonding method and device of performing the same
#11641Packaging method
#11642Method for modifying surface of substrate and method for manufacturing semiconductor device
#11643Manufacturing method for electronic substrate, manufacturing method for electro-optical device, and manufacturing method for electronic device
#11644Methods for forming flexible column die interconnects and resulting structures
#11645Method of forming solder bump with reduced surface defects
#11646Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same
#11647Self alignment features for an electronic assembly
#11648Method of forming a connecting conductor and wirings of a semiconductor chip
#11649Method for forming high reliability bump structure
#11650Semiconductor device and a method of manufacturing the same
#11651Process for exposing solder bumps on an underfill coated semiconductor
#11652Methods of underfilling and encapsulating semiconductor assemblies with materials having selected properties using stereolithography
#11653Circuit board structure integrated with semiconductor chip and method of fabricating the same
#11654Method and apparatus for attaching microelectronic substrates and support members
#11655Thermoplastic/thermoset composition material and method of attaching a wafer to a substrate
#11656Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack
#11657Method of manufacturing electronic circuit device
#11658IC chip mounting method
#11659Integrated circuit pad with separate probing and bonding areas
#11660Relay board with bonding pads connected by wirings
#11661Connection element for a semiconductor component and method for producing the same
#11662Method and apparatus for attaching microelectronic substrates and support members
#11663Stress and force management techniques for a semiconductor die
#11664Dummy structures extending from seal ring into active circuit area of integrated circuit chip
#11665Wafer-level-chip-scale package and method of fabrication
#11666Reduced inductance in ball grid array packages
#11667Wafer level package and its manufacturing method
#11668Multi-component integrated circuit contacts
#11669Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device
#11670Semiconductor device
#11671Wiring substrate and semiconductor package implementing the same
#11672Semiconductor device and method of manufacturing the same
#11673Packaging for high speed integrated circuits
#11674Composite metal column for mounting semiconductor device
#11675Semiconductor device and method of manufacturing the same
#11676Stacked semiconductor package having adhesive/spacer structure and insulation
#11677Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby
#11678Packaging for high speed integrated circuits
#11679Packaging for high speed integrated circuits
#11680Packaging for high speed integrated circuits
#11681Semiconductor package without chip carrier and fabrication method thereof
#11682Packaging for high speed integrated circuits
#11683Packaging for high speed integrated circuits
#11684Semiconductor device and manufacturing method thereof
#11685Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus
#11686Electrically connecting substrate with electrical device
#11687Method of realizing thermosonic wire bonding between metal wires and copper pads by depositing a thin film to surface of semiconductor chip with copper pads
#11688Process for making a semiconductor device having a roughened surface
#11689Fabrication method of semiconductor circuit device
#11690Method and structure for interfacing electronic devices
#11691Substrate applicable to both wire bonding and flip chip bonding, smart card modules having the substrate and methods for fabricating the same
#11692Method for forming bump protective collars on a bumped wafer
#11693Method for mounting electronic element on a circuit board
#11694Bumped die and wire bonded board-on-chip package
#11695ELECTRONIC MODULE WITH STACKED IC CHIP STRUCTURE
#11696Method and structure for reduction of soft error rates in integrated circuits
#11697Probing pads in kerf area for wafer testing
#11698Electronic component unit
#11699Semiconductor package and fabrication method thereof
#11700Semiconductor device