212040 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Arsenic [As]
Semiconductor device and electronic apparatus of multi-chip packaging
#11702Self alignment features for an electronic assembly
#11703Semiconductor device
#11704Stacked Semiconductor Package having Adhesive/Spacer Structure and Insulation
#11705Semiconductor power module with SiC power diodes and method for its production
#11706Tape wiring substrate and chip-on-film package using the same
#11707Electronic parts packaging structure and method of manufacturing the same
#11708Packaged integrated circuits and methods of producing thereof
#11709Packaging of a microchip device
#11710Package substrate and semiconductor package using the same
#11711Direct FET device for high frequency application
#11712Method of making an electronic device using an electrically conductive polymer, and associated products
#11713Micro-package, multi-stack micro-package, and manufacturing method therefor
#11714Temperature dependent semiconductor module connectors
#11715Manufacturing method improving the reliability of a bump electrode
#11716Integrated circuit for driving semiconductor device and power converter
#11717Wire-bonding method and semiconductor package using the same
#11718Substrate for manufacturing semiconductor device, semiconductor device manufacturing method
#11719SEMICONDUCTOR PACKAGE WITH MOLDED BACK SIDE AND METHOD OF FABRICATING THE SAME
#11720Semiconductor package having dual interconnection form and manufacturing method thereof
#11721Semiconductor device
#11722Hybrid conductive coating method for electrical bridging connection of RFID die chip to composite antenna
#11723Seedless wirebond pad plating
#11724Semiconductor device
#11725Semiconductor device
#11726Chip-embedded interposer structure and fabrication method thereof, wafer level stack structure and resultant package structure
#11727Multi-layered substrate assembly with vialess electrical interconnect scheme
#11728Parallel chip embedded printed circuit board and manufacturing method thereof
#11729Method for manufacturing semiconductor chip package
#11730Method of manufacturing a passive integrated matching network for power amplifiers
#11731Semiconductor sensor and manufacturing method therefor
#11732Semiconductor device
#11733Light-emitting device
#11734Method for self-assembling microstructures
#11735Method and System for Applying an Adhesive Substance on an Electronic Device
#11736Electronic assembly and method for producing an electronic assembly
#11737Trenched MOSFET termination with tungsten plug structures
#11738Semiconductor device manufacturing method
#11739Semiconductor device and manufacturing method thereof
#11740Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
#11741Chip and multi-chip semiconductor device using the chip, and method for manufacturing same
#11742Dicing die bonding film
#11743Image display and manufacturing method thereof having particular internal wiring structure
#11744Apparatuses and methods for forming assemblies
#11745Lighting device
#11746Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material
#11747Bonding apparatus and method
#11748Semiconductor device with semiconductor device components embedded in a plastics composition
#11749Soldering a die to a substrate
#11750Semiconductor device
#11751Semiconductor device with improved signal transmission characteristics
#11752Method of interconnecting terminals and method of mounting semiconductor devices
#11753Thermal interface material with carbon nanotubes and particles
#11754Semiconductor device advantageous in improving water resistance and oxidation resistance
#11755Semiconductor device and manufacturing method of the same
#11756Under bump metallization design to reduce dielectric layer delamination
#11757Adhesive layer forming a capacitor dielectric between semiconductor chips
#11758Low profile stacked semiconductor chip package
#11759Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom
#11760Anti-warp heat spreader for semiconductor devices
#11761Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same
#11762Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
#11763Semiconductor die package and method for making the same
#11764Multi-part lead frame with dissimilar materials
#11765Semiconductor device
#11766Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#11767Semiconductor device and method of manufacturing the same
#11768SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE DESIGN METHOD, SEMICONDUCTOR DEVICE DESIGN METHOD RECORDING MEDIUM, AND SEMICONDUCTOR DEVICE DESIGN SUPPORT SYSTEM
#11769Circuit device and method of manufacturing the same
#11770Method of producing wire-connection structure, and wire-connection structure
#11771Assembly method for semiconductor die and lead frame
#11772Cure catalyst, composition, electronic device and associated method
#11773Circuitry component and method for forming the same
#11774Ultrathin semiconductor circuit having contact bumps
#11775Spacer die structure and method for attaching
#11776Methods for bonding and micro-electronic devices produced according to such methods
#11777Method and apparatus for bonding wafers
#11778Method of manufacturing a semiconductor device
#11779Standoffs for centralizing internals in packaging process
#11780Method of fabricating a stacked die in die BGA package
#11781Method of fabricating a stacked die in die BGA package
#11782Three dimensional device integration method and integrated device
#11783Stacked die in die BGA package
#11784Heat-dissipating semiconductor package and fabrication method thereof
#11785Grid array connection device and method
#11786Semiconductor integrated circuit device
#11787Mechanical integrity evaluation of low-k devices with bump shear
#11788Printed circuit board having embedded RF module power stage circuit
#11789Printed circuit board with embedded electronic components
#11790Wire bonding structure to electrically connect a printhead chip to a flexible printed circuit of an ink cartridge and method thereof
#11791Semiconductor half-bridge module with low inductance
#11792Radio frequency receiver chip with improved electrostatic discharge level
#11793Method of embedding semiconductor chip in support plate
#11794Semiconductor device and method for manufacturing the same
#11795Semiconductor device and a method of manufacturing the same
#11796Semiconductor device
#11797Semiconductor device and manufacturing method of the same
#11798Packaging logic and memory integrated circuits
#11799MEMORY ELEMENT CONDUCTING STRUCTURE
#11800Lead-free semiconductor package
#11801Alignment using fiducial features
#11802Semiconductor device
#11803Wire bonding machine capable of removing particles from capillary and cleaning method of capillary bottom tip
#11804Method of manufacturing semiconductor device
#11805Transmission-line spring structure
#11806Contact Structures Comprising A Core Structure And An Overcoat
#11807Semiconductor wafer package and manufacturing method thereof
#11808Method of manufacturing a semiconductor device
#11809Stretchable form of single crystal silicon for high performance electronics on rubber substrates
#11810Semiconductor packages and methods of manufacturing thereof
#11811Signal isolation in a package substrate
#11812Substrate structure and the fabrication method thereof
#11813Anodic bonding process for ceramics
#11814Adhesive tape for electronic components
#11815Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same
#11816Micro solder pot
#11817Electronic board, method of manufacturing the same, and electronic device
#11818Electronic board, method of manufacturing the same, and electronic device
#11819Chip-on-board assemblies
#11820Low stress chip attachment with shape memory materials
#11821Flip chip packaging using recessed interposer terminals
#11822Wirebond electronic package with enhanced chip pad design, method of making same, and information handling system utilizing same
#11823CSP semiconductor chip and BGA assembly with enhanced physical protection, protective members and assemblies used with same, and methods of enhancing physical protection of chips and assemblies
#11824Lead frame structure with aperture or groove for flip chip in a leaded molded package
#11825Chip-package structure and fabrication process thereof
#11826Electronic component comprising a cooling surface
#11827Wafer and single chip having circuit rearranged structure and method for fabricating the same
#11828Manufacturing method for a semiconductor device
#11829Power semiconductor module
#11830Method of soldering or brazing articles having surfaces that are difficult to bond
#11831Positioning flowable solder for bonding integrated circuit elements
#11832Wiring board, method for manufacturing same, and semiconductor package
#11833Load compensator with pre-load compression
#11834Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same
#11835Remote chip attachment
#11836Process of manufacture of ultra thin semiconductor wafers with bonded conductive hard carrier
#11837Coaxial through chip connection
#11838Post-attachment chip-to-chip connection
#11839Tack & fuse chip bonding
#11840Routingless chip architecture
#11841Semiconductor device and method for manufacturing the same
#11842Rigid-backed, membrane-based chip tooling
#11843Through chip connection
#11844Packaging method and package using the same
#11845Semiconductor device packaging substrate and semiconductor device packaging structure
#11846Chip-based thermo-stack
#11847Interposers with alignment fences and semiconductor device assemblies including the interposers
#11848Non-contact ID card and manufacturing method thereof
#11849Probe card assembly and kit
#11850Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state
#11851Protected chip stack
#11852Semiconductor device and manufacturing method therefor
#11853Substrate for pre-soldering material and fabrication method thereof
#11854Integrated electronic chip and interconnect device and process for making the same
#11855Chip spanning connection
#11856Inverse chip connector
#11857Chip connector
#11858Post & penetration interconnection
#11859Stack circuit member and method
#11860Triaxial through-chip connection
#11861Profiled contact
#11862Chip capacitive coupling
#11863Semiconductor device with a diffusion barrier film having a spacing for stress relief of solder bump
#11864Metal bump with an insulation for the side walls and method of fabricating a chip with such a metal bump
#11865Electronic chip contact structure
#11866Patterned contact
#11867Method of manufacturing semiconductor device with improved design freedom of external terminal
#11868Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof
#11869Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device
#11870Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods
#11871Electronic module with a conductive-pattern layer and a method of manufacturing same
#11872Contact-based encapsulation
#11873Leadless semiconductor package
#11874Bond capillary design for ribbon wire bonding
#11875Membrane-based chip tooling
#11876Mounting device and method thereof
#11877METHOD FOR FORMING BUMPS
#11878Capping copper bumps
#11879Microelectronic assemblies having low profile connections
#11880Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors
#11881Electronic circuit protection device
#11882Superimposed displays
#11883Silicon wafer with solderable coating on its wafer rear side, and process for producing it
#11884Semiconductor device and method of manufacturing a semiconductor device
#11885Semiconductor device having reduced number of external pad portions
#11886Locking mechanism for die assembly
#11887Semiconductor package and fabrication method thereof
#11888Semiconductor IC and its manufacturing method, and module with embedded semiconductor IC and its manufacturing method
#11889Electronic package structures and methods
#11890Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant
#11891Assembly structure and method for chip scale package
#11892Semiconductor device
#11893Method of wafer-level packaging using low-aspect ratio through-wafer holes
#11894Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof
#11895Gate contact and runners for high density trench MOSFET
#11896Trenched MOSFET device with contact trenches filled with tungsten plugs
#11897Structure for avalanche improvement of ultra high density trench MOSFET
#11898High density hybrid MOSFET device
#11899High density trench MOSFET with low gate resistance and reduced source contact space
#11900Heating apparatus
#11901Wiring board and method for manufacturing the same
#11902Wiring board and manufacturing method of wiring board
#11903Method of fabricating wiring board and method of fabricating semiconductor device
#11904Semiconductor package and method for forming the same
#11905Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
#11906Surface mount type semiconductor device and method of manufacturing the same
#11907Method of forming overhang support for a stacked semiconductor device
#11908Method for connecting a semiconductor chip onto an interconnection support
#11909Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts
#11910Method of making semiconductor BGA package having a segmented voltage plane
#11911Method of assembling semiconductor devices with LEDs
#11912Method for attaching dice to a package and arrangement of dice in a package
#11913Semiconductor device and manufacturing method thereof
#11914Method and circuit structure employing a photo-imaged solder mask
#11915Method and apparatus for moving blocks
#11916Nanotube materials for thermal management of electronic components
#11917Optical element
#11918Rectifier diode of electric generator
#11919Method for producing a protective assembly for protecting an electronic component from electrostatic discharge, and correspondingly configured electronic component
#11920RFID tags and processes for producing RFID tags
#11921Epoxy bump for overhang die
#11922Semiconductor element and manufacturing method thereof
#11923Integrated-circuit die having redundant signal pads and related integrated circuit, system, and method
#11924Method for mounting an electronic part on a substrate using a liquid containing metal particles
#11925Stackable tier structure comprising prefabricated high density feedthrough
#11926Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device
#11927Structure and method for bond pads of copper-metallized integrated circuits
#11928Method of making an electronic device using an electrically conductive polymer, and associated products
#11929Integrated circuit device
#11930Power module package structure
#11931Semiconductor device
#11932Encapsulated power semiconductor assembly
#11933Redistribution layer with microstrips
#11934Semiconductor BGA package having a segmented voltage plane
#11935System for assembling electronic components of an electronic system
#11936Semiconductor device modules, semiconductor devices, and microelectronic devices
#11937Semiconductor device
#11938Method for efficiently producing removable peripheral cards
#11939Solder joints for copper metallization having reduced interfacial voids
#11940Capacitor device, semiconductor devioce, and setting method of terminal capacitance of pad electrode thereof
#11941Circuit arrangement placed on a substrate and method for producing the same
#11942Semiconductor bond pad structures and methods of manufacturing thereof
#11943Soldering method, electronic part, and part-exchanging method
#11944Chip package and wire bonding process thereof
#11945Multi-chip die bonder and method
#11946Method of manufacturing shielded electronic circuit units
#11947Panel and semiconductor device having a composite plate with semiconductor chips
#11948Self assembly of elements for displays
#11949Semiconductor device
#11950Integrated circuit with substantially perpendicular wire bonds
#11951Die-wafer package and method of fabricating same
#11952Semiconductor device
#11953Offset solder bump method and apparatus
#11954Semiconductor device
#11955System and method for die attach using a backside heat spreader
#11956Method of bonding a microelectronic die to a substrate and arrangement to carry out method
#11957Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method
#11958Semiconductor chip with coil element over passivation layer
#11959CHIP PACKAGE STRUCTURE
#11960Chip structure with bevel pad row
#11961Chip structure with arrangement of side pads
#11962Semiconductor device and method of manufacturing the same
#11963Semiconductor device and manufacturing method thereof
#11964Semiconductor device and method for manufacturing the same
#11965Microelectronic assemblies having compliant layers
#11966Semiconductor device packages with substrates for redistributing semiconductor device electrodes
#11967Sealing membrane for thermal interface material
#11968Semiconductor apparatus having a cooling apparatus that compressively engages a semiconductor device
#11969Chip package having chip extension and method
#11970LED package structure and method making of the same
#11971Leadframeless package structure and method
#11972Backside method for fabricating semiconductor components with conductive interconnects
#11973Light emitting device package and method for manufacturing the same
#11974Adherence of a solid-state image-sensing device to a substrate
#11975Low range bonding tool
#11976Mask and method for electrokinetic deposition and patterning process on substrates
#11977Thermal management of systems having localized regions of elevated heat flux
#11978NANO IC
#11979Method of reducing process steps in metal line protective structure formation
#11980Ball film for integrated circuit fabrication and testing
#11981Integrated circuit with additional mini-pads connected by an under-bump metallization and method for production thereof
#11982Semiconductor device and fabrication method thereof
#11983Electrical/optical integration scheme using direct copper bonding
#11984Method for producing a chip panel by means of a heating and pressing process using a thermoplastic material
#11985Method for manufacturing electronic component-embedded printed circuit board
#11986Method and system for solder die attach
#11987Method of bonding solder pads of flip-chip package
#11988Semiconductor device and method of fabricating the same
#11989Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor device
#11990Fabrication method of IC inlet, ID tag, ID tag reader and method of reading date thereof
#11991Semiconductor device including wire bonding pads and pad layout method
#11992Packaging structure and method
#11993Flip chip interconnect solder mask
#11994Semiconductor device chip and semiconductor device chip package
#11995Handling and positioning of metallic plated balls for socket application in ball grid array packages
#11996Composite multi-layer substrate and module using the substrate
#11997Semiconductor device with sealed semiconductor chip
#11998Methods of packaging and testing microelectronic imaging devices
#11999Semiconductor device and manufacturing method of the same
#12000Semiconductor component in a housing with mechanically inforcing flat conductor webs