Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor

Semiconductor package that includes stacked semiconductor die

Chip stack package and manufacturing method thereof

Wafer level package having redistribution interconnection layer and method of forming the same

Structure for reducing stress for vias and fabricating method thereof

Semiconductor device and method of manufacturing the same

Integrated circuit package system with multi-planar paddle

Etched leadframe flipchip package system

Semiconductor device

Semiconductor chip having bond pads

Integrated circuit package system with integrated circuit support

SEMICONDUCTOR STRUCTURE

Semiconductor device and fabrication method for the same

Wire bonding method

Method and apparatus for rapid thermal processing and bonding of materials using RF and microwaves

Method for pressure bonding and method for manufacturing semiconductor device

Joining method and joining device

Method for forming a joint

Method of Forming Bump, Method of Forming Image Sensor Using the Method, Semiconductor Chip and the Sensor so Formed

Small chips with fan-out leads

Bonding a non-metal body to a metal surface using inductive heating

Semiconductor device, fabrication method therefor, and film fabrication method

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

BRACE FOR WIRE LOOP

Solder joint flip chip interconnection

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

Photosensitive composition

Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same

Liquid epoxy resin composition

Liquid epoxy resin composition

Method for plating printed circuit board and printed circuit board manufactured therefrom

Semiconductor device integrated with optoelectronic components

Mm-wave antenna using conventional IC packaging

Constant voltage diode

Universal wafer carrier for wafer level die burn-in

CHIP STRUCTURE WITH SOLDER BUMP AND METHOD FOR PRODUCING THE SAME

Fine pitch interconnect and method of making

Solvent Assisted Burnishing of Pre-Underfilled Solder-Bumped Wafers for Flipchip Bonding

Bumping process with self-aligned A1-cap and the elimination of 2nd passivation layer

Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device

Reduction of macro level stresses in copper/low-K wafers

Composite carbon nanotube thermal interface device

Single chip and stack-type chip semiconductor package and method of manufacturing the same

Multi-stack chip package with wired bonded chips

Electrode package for semiconductor device

Power semiconductor module

Lead arrangement and chip package using the same

Low profile semiconductor package

Ultrasonic welding head

WIRE EMBEDDED BRIDGE

Printed circuit board, electronic device, and manufacturing method for printed circuit board

Method for forming multi-layer bumps on a substrate

Soldering method for mounting semiconductor device on wiring board to ensure invariable gap therebetween, and soldering apparatus therefor

Reflow apparatus, a reflow method, and a manufacturing method of semiconductor device

Semiconductor device and method of manufacturing the same

Methods and apparatus for Flip-Chip-On-Lead semiconductor package

Method for producing through-contacts and a semiconductor component with through-contacts

Semiconductor package with redistributed pads

Method of making stacked die package

Method of manufacturing flash memory cards

Fabrication method for a chip packaging structure

Adhesive film and process for preparing the same as well as adhesive sheet and semiconductor device

Device for making an in-mold circuit

Semiconductor device including a particular dummy terminal

METHOD FOR REDUCING OR ELIMINATING SEMICONDUCTOR DEVICE WIRE SWEEP IN A MULTI-TIER BONDING DEVICE AND A DEVICE PRODUCED BY THE METHOD

Board on chip package and method of manufacturing the same

Electronic assembly having graded wire bonding

Junction structure for a terminal pad and solder, and semiconductor device having the same

Semiconductor package having non-solder mask defined bonding pads and solder mask defined bonding pads, printed circuit board and semiconductor module having the same

Void-free circuit board and semiconductor package having the same

Semiconductor package and substrate structure thereof

Electronic component, module, module assembling method, module identification method and module environment setting method

Semiconductor device with inclined through holes

Semiconductor device and manufacturing method of the same

Printed wiring board

Semiconductor device

Semiconductor device with solder balls having high reliability

Semiconductor device featuring electrode terminals forming superior heat-radiation system

Contact pad structure for flip chip semiconductor die

Semiconductor device and manufacturing method thereof

Structure and self-locating method of making capped chips

Structure and method of making capped chips having vertical interconnects

Semiconductor device

Semiconductor device having an electronic circuit disposed therein

Semiconductor component with a thin semiconductor chip and a stiff wiring substrate, and methods for producing and further processing of thin semiconductor chips

Back-face and edge interconnects for lidded package

Package device with electromagnetic interference shield

Multilayered circuit substrate with semiconductor device incorporated therein

Semiconductor die package including construction for preventing delamination and/or cracking of the semiconductor die

Integrated circuit package system including high-density small footprint system-in-package

Implantable microelectronic device and method of manufacture

Structure for protecting electronic packaging contacts from stress

Packaging for high speed integrated circuits

Integrated circuit packaging

High frequency chip packages with connecting elements

Multilayered printed circuit board and method for manufacturing the same

Method and apparatus for attaching a workpiece to a workpiece support

Heat treatment for a panel and apparatus for carrying out the heat treatment method

Method for mounting electronic component

Bond Surface Conditioning System for Improved Bondability

Production method for device

Method for evaluating and modifying solder attach design for integrated circuit packaging assembly

METHOD OF MAKING SEMICONDUCTOR PACKAGE WITH REDUCED MOISTURE SENSITIVITY

Semiconductor device packaging for avoiding metal contamination

Method for manufacturing a semiconductor device

Methods and apparatuses for fluidic self assembly

Plastic packaged device with die interface layer

BONDING PAD AND DISPLAY PANEL

Semiconductor package with controlled solder bump wetting

Semiconductor component of semiconductor chip size with flip-chip-like external contacts

Chip-packaging composition of resin and cycloaliphatic amine hardener

Technique for moderating stresses cause by a difference in thermal expansion coeffiecients between a substrate and an electronic component

Integrated chip device in a package

Semiconductor device that attains a high integration

Structure and method of molded QFN device suitable for miniaturization, multiple rows and stacking

Semiconductor component and methods to produce a semiconductor component

Integrated circuit mounting for thermal stress relief useable in a multi-chip module

Semiconductor structure and method of assembly

Semiconductor structure and method of manufacture

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

Housed DRAM chip for high-speed applications

Production process for manufacturing such semiconductor package

Leadframes for improved moisture reliability of semiconductor devices

Electronic module and method of assembling the same

Thin package system with external terminals

Wafer-to-wafer stack with supporting pedestal

Semiconductor device with a dummy electrode

Semiconductor devices with multiple heat sinks

Radio frequency power semiconductor device package comprising dielectric platform and shielding plate

Bond pad structure

Light emitting diode chip with reflective layer thereon

Adhesive composition and sheet having an adhesive layer of the composition

Method for forming solder contacts on mounted substrates

Semiconductor device and method for manufacturing thereof

Electronic part mounting substrate and method for producing same

Method of producing image display unit

Method for forming bumps

Wafer structure with electroless plating metal connecting layer and method for fabricating the same

Etchant and method for forming bumps

Method for forming improved bump structure

Method for applying a structure of joining material to the back surfaces of semiconductor chips

METHOD AND STRUCTURE FOR VERTICALLY-STACKED DEVICE CONTACT

Underfill aiding process for a tape

CHIP PACKAGE METHOD

Method of improving power distribution in wirebond semiconductor packages

Methods for magnetically directed self assembly

Semiconductor device, mounting substrate and method of manufacturing mounting substrate, circuit board, and electronic instrument

Circuit board structure of integrated optoelectronic component

Method for manufacturing semiconductor module using interconnection structure

Encapsulation of a chip module

Semiconductor device having strong adhesion between wiring and protective film, and manufacturing method therefor

MECHANISM AND PROCESS FOR COMPRESSING CHIPS

Semiconductor device with multiple designation marks

Method for manufacture of wafer level package with air pads

FLIP CHIP PACKAGE

Semiconductor device having a semiconductor chip, and method for the production thereof

Chip packaging process

Semiconductor device with electroless plating metal connecting layer and method for fabricating the same

Chip scale power LDMOS device

Power semiconductor device in lead frame employing connecting element with conductive film

Semiconductor insulation structure

Method for producing micromechanical components in integrated circuits and arrangement of a semiconductor on a substrate

Semiconductor chip and method of manufacturing semiconductor chip

Stack structure of carrier board embedded with semiconductor components and method for fabricating the same

Semiconductor device and fabrication method thereof

Power semiconductor module with overcurrent protective device

Semiconductor package with position member

SELECTIVE SOLDER DEPOSITION BY SELF-ASSEMBLY OF NANO-SIZED SOLDER PARTICLES, AND METHODS OF ASSEMBLING SOLDERED PACKAGES

Apparatus and method for providing bypass capacitance and power routing in QFP package

Method and apparatus for providing double-sided cooling of leadframe-based wire-bonded electronic packages

Semiconductor assembly for improved device warpage and solder ball coplanarity

Method and apparatus for manufacturing IC chip packaged device

Methods for aligning a device and for stacking two devices in an aligned manner and device for improved stacking

Bonding apparatus comprising improved oscillation amplification device

Low stress conductive polymer bump

Method for manufacturing nitride based single crystal substrate and method for manufacturing nitride based semiconductor device

Method for forming bonding pad and semiconductor device having the bonding pad formed thereby

Apparatus for block assembly process

Semiconductor device with semiconductor chip and adhesive film and method for producing the same

Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure

Support structures for semiconductor devices

Bond pads and methods for fabricating the same

Hybrid module and method of manufacturing the same

SEMICONDUCTORS AND METHODS OF MAKING

Semiconductor chip having a bump with conductive particles and method of manufacturing the same

Bump structure and its forming method

Intermetallic solder with low melting point

Electronic apparatus

Electronic circuit chip, and electronic circuit device and method for manufacturing the same

Semiconductor module having a coupling substrate, and methods for its production

Integrated circuit package system

Semiconductor packaging process and carrier for semiconductor package

Semiconductor package having an interfacial adhesive layer

Flexible substrate for package of die

Semiconductor device and a method of manufacturing the same

Semiconductor device with front side metallization and method for the production thereof

Ultrasonic horn

Wiring board, semiconductor device, and method of manufacturing the same

Methods and apparatuses relating to block receptor configurations and block assembly processes

Method of manufacturing a semiconductor device including a bump forming process

Semiconductor device and a manufacturing method of the same

Method and device for extracting an electronic chip from a silicon wafer and transporting the chip to its installation location on an electronic device

Microelectronic packages and methods therefor

Wiring board and capacitor

Chip embedded packaging structure

Power semiconductor module

Electronic device with conductive connection structure

Hard disk drive and wireless data terminal using the same

Magnetic device having a conductive clip

Power module with a magnetic device having a conductive clip

Contact carriers (tiles) for populating larger substrates with spring contacts

Optical imaging device for optical proximity communication

Resonator system for optical proximity communication

Method and apparatus for facilitating proximity communication and power delivery

Relay board and semiconductor device having the relay board

Electronic device and manufacturing method of the same

Semiconductor device

Solder joint intermetallic compounds with improved ductility and toughness

Wiring board

Semiconductor chip and semiconductor device

Semiconductor element with conductive bumps and fabrication method thereof

Electronic device, semiconductor device using same, and method for manufacturing semiconductor device

Ultra-thin wafer system and method of manufacture thereof

Semiconductor device having metallic lead and electronic device having lead frame

Semiconductor device and semiconductor device production method

Semiconductor device and a manufacturing method of the same

Semiconductor package

Semiconductor device for radio frequency applications and method for making the same

Method of forming a molded array package device having an exposed tab and structure

Semiconductor device and radiation detector employing it

Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devices

Wafer-level method for metallizing source, gate and drain contact areas of semiconductor die

Attachment system incorporating a recess in a structure

Printed circuit board and manufacturing method thereof

Method of forming a power module with a magnetic device having a conductive clip

Electronic module design to maximize volume efficiency

Semiconductor device and method for manufacturing the same

Method of assembly for multi-flip chip on lead frame on overmolded IC package

Semiconductor device and method for manufacturing the same

Semiconductor constructions comprising multi-level patterns of radiation-imageable material

PROCESS FOR FABRICATING CHIP PACKAGE STRUCTURE

Method for separating package of WLP

Methods for protecting metal surfaces

Contacts to microdevices

Semiconductor device with improved design freedom of external terminal

Solder bump structure for flip chip semiconductor devices and method of manufacture therefore

Modular bonding pad structure and method

Stackable device, device stack and method for fabricating the same

Semiconductor device featuring large reinforcing elements in pad area

Component with chip through-contacts

Semiconductor device having shield structure

Flash memory card

Semiconductor IC-embedded substrate and method for manufacturing same

Gel package structural enhancement of compression system board connections

Bumpless chip package and fabricating process thereof

Integrated circuit solder bumping system

Power semiconductor module with MOS chip

Molded semiconductor package

Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the same

Optoelectronics processing module and method for manufacturing thereof

Insulated gate semiconductor device having a clamping element to clamp gate-emitter voltage and method of manufacturing thereof

LSI design support apparatus and LSI design support method

Electric contact and method for producing the same and connector using the electric contacts

Method for establishing anisotropic conductive connection and anisotropic conductive adhesive film

Semiconductor device and a method of manufacturing the same

Method for patterning and etching a passivation layer

Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies

Method of electrically connecting a microelectronic component

Semiconductor manufacturing method

Bonding apparatus and method of bonding for a semiconductor chip

THERMAL ENHANCED PACKAGE FOR BLOCK MOLD ASSEMBLY

Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices

Wire sweep resistant semiconductor package and manufacturing method therefor

Routing under bond pad for the replacement of an interconnect layer

Packages, anisotropic conductive films, and conductive particles utilized therein

Display device and manufacturing method of the same

Semiconductor device

Chip package structure and bumping process

Complete power management system implemented in a single surface mount package

Complete power management system implemented in a single surface mount package

QFN/SON compatible package with SMT land pads

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Chip package structure and bumping process

Integrated circuit protruding pad package system

Method for producing bonding connection of semiconductor device

Electronic assembly that includes pads having a bowl shaped upper section

Semiconductor apparatus integrating an electrical device under an electrode pad

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications

Monitoring deformation and time to logically constrain a bonding process

Selective consolidation methods for fabricating semiconductor device components and conductive features thereof

INDUCTIVE STRUCTURE

Flexible assembly of stacked chips

Fan out type wafer level package structure and method of the same

Semiconductor package with a support structure and fabrication method thereof

Multiple chip semiconductor package

Apparatuses and methods for high speed bonding