212040 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Arsenic [As]
BONDING PROCESS FOR SENSITIVE MICRO- AND NANO-SYSTEMS
#1202Conductor structure element and method for producing a conductor structure element
#1203Module substrate, module-substrate manufacturing method, and terminal connection substrate
#1204Antenna device and wireless apparatus
#1205Semiconductor device and manufacturing method
#1206Method for fabricating a semiconductor and semiconductor package
#1207Electrical connection for multichip modules
#1208Semiconductor device and bonding material for semiconductor device
#1209Flip chip interconnect solder mask
#1210Flip chip interconnect solder mask
#1211CONDUCTIVE CONNECTION SHEET, METHOD FOR CONNECTING TERMINALS, METHOD FOR FORMING CONNECTION TERMINAL, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE
#1212Integrated circuit packaging system with encapsulation and underfill and method of manufacture thereof
#1213Semiconductor storage device and manufacturing method thereof
#1214Wiring board with built-in semiconductor element
#1215Method of Manufacturing a semiconductor module and device for the same
#1216Electronic device and method for producing electronic device
#1217Electronic device and manufacturing thereof
#1218Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
#1219METHOD FOR PRODUCING RECONSTITUTED WAFERS AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICES
#1220Semiconductor device having through silicon vias and manufacturing method thereof
#1221Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer material
#1222Semiconductor package, electrical and electronic apparatus including the semiconductor package, and method of manufacturing the semiconductor package
#1223Bonded semiconductor structures and methods of forming same
#1224Method and apparatus for dicing die attach film on a semiconductor wafer
#1225Impedence controlled packages with metal sheet or 2-layer RDL
#1226Wiring substrate, semiconductor device and manufacturing method thereof
#1227Chip package structure and method of making the same
#1228LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
#1229Module including a sintered joint bonding a semiconductor chip to a copper surface
#1230Multilayer pillar for reduced stress interconnect and method of making same
#1231Apparatus for restricting moisture ingress
#1232Implantable electrode array assembly including a carrier, superstrates mounted to the carrier and electrodes disposed on the superstrates
#1233Implantable microelectronic device and method of manufacture
#1234Semiconductor device and method of manufacturing same
#1235Power converter, semiconductor device, and method for manufacturing power converter
#1236Component-embedded substrate
#1237Device and system detecting breakage in dummy bumps and method thereof
#1238Semiconductor device and method of manufacturing the same
#1239Curing low-k dielectrics for improving mechanical strength
#1240Semiconductor device and method of forming WLCSP structure using protruded MLP
#1241Conductive pads defined by embedded traces
#1242Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and electrically conductive second connector
#1243Semiconductor device
#1244Wafer-level package device
#1245CHIP PACKAGE
#1246HIGH-FREQUENCY MODULE MANUFACTURING METHOD
#1247Semiconductor device, semiconductor package, and electronic device
#1248Semiconductor device including Schottky barrier diode
#1249Light emitting device package and lighting system
#1250Power semiconductor device
#1251Electronic component module
#1252MODULE MANUFACTURING METHOD
#1253METHOD OF FABRICATION OF A THREE-DIMENSIONAL INTEGRATED CIRCUIT DEVICE USING A WAFER SCALE MEMBRANE
#1254Method for fabricating packaging substrate with embedded semiconductor component
#1255Semiconductor device including semiconductor chips with different thickness
#1256Distributed semiconductor device methods, apparatus, and systems
#1257Optoelectronic headlight, method for production of an optoelectronic headlight and a luminescence diode chip
#1258Connecting and bonding adjacent layers with nanostructures
#1259STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE
#1260Integrated circuit apparatus, systems, and methods
#1261Copper bonding wire for semiconductor device and bonding structure thereof
#1262Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area
#1263SYSTEMS AND METHODS TO COOL SEMICONDUCTOR
#1264Stacked wafer level package having a reduced size
#1265APPARATUS FOR THREE-DIMENSIONAL INTEGRATED CIRCUIT DEVICE FABRICATION INCLUDING WAFER SCALE MEMBRANE
#1266METHOD OF BONDING SEMICONDUCTOR SUBSTRATE AND MEMS DEVICE
#1267Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool
#1268Bonding material and bonding method using the same
#1269METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
#1270Fabrication method of embedded chip substrate
#1271Semiconductor device, method of manufacturing the semiconductor device, flip chip package having the semiconductor device and method of manufacturing the flip chip package
#1272METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIVE FILM FOR SEMICONDUCTOR USED IN THE METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
#1273Integrated void fill for through silicon via
#1274Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP
#1275Protection layer for adhesive material at wafer edge
#1276Pad layout structure of semiconductor chip
#1277Mounting method and mounting device
#1278SEMICONDUCTOR DEVICE
#1279Method for producing a metal layer on a substrate and device
#1280Shielded electronic components and method of manufacturing the same
#1281Multi-transistor exposed conductive clip for high power semiconductor packages
#1282Thermally enhanced semiconductor package with exposed parallel conductive clip
#1283Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die
#1284Methods and structures for forming integrated semiconductor structures
#1285Vertical MOSFET device
#1286METHOD OF JOINING A CHIP ON A SUBSTRATE
#1287Method for soldering surface-mount component and surface-mount component
#1288MOUNTING METHOD AND MOUNTING DEVICE
#1289Flexible interconnect pattern on semiconductor package
#1290Method for making solder-top enhanced semiconductor device of low parasitic packaging impedance
#1291Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device
#1292Method for manufacturing semiconductor modules
#1293Wafer level IC assembly method
#1294Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (TWI)
#1295BUMP STRUCTURE AND FABRICATION METHOD THEREOF
#1296EMBEDDED CHIP PACKAGE
#1297Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the same
#1298Robust FBEOL and UBM structure of C4 interconnects
#1299Semiconductor device and a manufacturing method thereof
#1300Die stacking with an annular via having a recessed socket
#1301Doping Minor Elements into Metal Bumps
#1302Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
#1303SEMICONDUCTOR CHIP PACKAGE ASSEMBLY AND METHOD FOR MAKING SAME
#1304Method of producing semiconductor module and semiconductor module
#1305Semiconductor device and method for manufacturing the same
#1306SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR MODULE USING THE SAME
#1307Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure
#1308Semiconductor device
#13093D interconnection structure and method of manufacturing the same
#1310Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device
#1311LEADFRAME AND METHOD FOR PACKAGING SEMICONDUCTOR DIE
#1312Manufacturing electronic device having contact elements with a specified cross section
#1313Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers
#1314Electronic Component-Embedded Board and Method of Manufacturing the Same
#1315Method for fluid guided self-assembly of microcomponents
#1316System and method for producing devices including a semiconductor part and a non-semiconductor part
#1317METHOD FOR PRODUCING A TWO-SIDED FAN-OUT WAFER LEVEL PACKAGE WITH ELECTRICALLY CONDUCTIVE INTERCONNECTS, AND A CORRESPONDING SEMICONDUCTOR PACKAGE
#1318Manufacturing method of semiconductor device
#1319Backside illuminated imaging sensor with reinforced pad structure
#1320Method of producing semiconductor device with patterned photosensitive adhesive
#1321Circuit module and manufacturing method for the same
#1322Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip
#1323Integrated circuit packaging system with formed interconnects and method of manufacture thereof
#1324Chip package and fabrication method thereof
#1325Copper pillar bump with non-metal sidewall protection structure and method of making the same
#1326Three-dimensional stacked substrate arrangements
#1327Semiconductor device and method of producing same
#1328Window interposed die packaging
#1329Semiconductor device and method of manufacturing same
#1330INTEGRATED PASSIVE COMPONENT
#1331Techniques for improving bond pad performance
#1332Heating apparatus and implemented body manufacturing method
#1333EPOXY COATING ON SUBSTRATE FOR DIE ATTACH
#1334Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers
#1335Module comprising a semiconductor chip
#1336Method for Assemblying a Semiconductor Chip Package with Deflection-Resistant Leadfingers
#1337Semiconductor device and method of forming wafer level die integration
#1338Apparatus and method for embedding components in small-form-factor, system-on-packages
#1339Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
#1340Semiconductor device, semiconductor device design method, semiconductor design apparatus, and program
#1341SEMICONDUCTOR DEVICE
#1342SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#1343Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer
#1344Chip-packaging module for a chip and a method for forming a chip-packaging module
#1345Method for protecting copper wire bonds on aluminum pads of a semiconductor device from corrosion
#1346Contact Metal for Hybridization and Related Methods
#1347Chip package with a chip embedded in a wiring body
#1348Integrated circuit device including a copper pillar capped by barrier layer
#1349Solder joint flip chip interconnection having relief structure
#1350Flip-chip Mounting Structure and Flip-chip Mounting Method
#1351Three-dimensional system-in-a-package
#1352POWER SUPPLY MODULE AND PACKAGING AND INTEGRATING METHOD THEREOF
#1353Semiconductor device and manufacturing method of the same
#1354Package with multiple dies
#1355SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR THE SAME
#1356Etchant and method for manufacturing semiconductor device using same
#1357Routing layer for mitigating stress in a semiconductor die
#1358DIE ATTACH FILM
#1359Semiconductor device and manufacturing method thereof
#1360Methods for Lead Free Solder Interconnections for Integrated Circuits
#1361Manufacturing method for semiconductor integrated device
#1362REINFORCED FAN-OUT WAFER-LEVEL PACKAGE
#1363Adhesive for semiconductor bonding, adhesive film for semiconductor bonding, method for mounting semiconductor chip, and semiconductor device
#1364Semiconductor device and method of forming IPD in fan-out wafer level chip scale package
#1365Flip-chip, face-up and face-down centerbond memory wirebond assemblies
#1366Semiconductor device with a layer including niobium, and/or tantalum overlying a contact pad or a metal layer
#1367Mechanisms for forming copper pillar bumps using patterned anodes
#1368SEMICONDUCTOR PACKAGE
#1369Method of manufacturing a semiconductor device
#1370Method of making a semiconductor device having a functional capping
#1371Device and method including a soldering process
#1372Formation of alpha particle shields in chip packaging
#1373Wafer-leveled chip packaging structure and method thereof
#1374Semiconductor package with embedded spiral inductor
#1375Sensor mounted in flip-chip technology on a substrate
#1376Semiconductor device
#1377Package substrate and fabricating method thereof
#1378Method for fabricating multi-chip module with multi-level interposer
#1379Semiconductor device and manufacturing method thereof
#1380SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER PROVIDED WITH ADHESIVE LAYER
#1381Ag—Au—Pd ternary alloy bonding wire
#1382Optical printed circuit board and method of fabricating the same
#1383Article and panel comprising semiconductor chips, casting mold and methods of producing the same
#1384SEMICONDUCTOR DEVICE
#1385Multi-chip package and method of providing die-to-die interconnects in same
#1386Semiconductor device
#1387Active area bonding compatible high current structures
#1388Semiconductor device
#1389Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation
#1390Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution
#1391DEVICE PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
#1392REINFORCED VIA FARM INTERCONNECT STRUCTURE, A METHOD OF FORMING A REINFORCED VIA FARM INTERCONNECT STRUCTURE AND A METHOD OF REDESIGNING AN INTEGRATED CIRCUIT CHIP TO INCLUDE SUCH A REINFORCED VIA FARM INTERCONNECT STRUCTURE
#1393Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof
#1394Epoxy resin composition for semiconductor encapsulation, cured product thereof, and semiconductor device
#1395Wiring board, semiconductor device, and method for manufacturing wiring board
#1396Semiconductor device and radio communication device
#1397Etchant and method for manufacturing semiconductor device using same
#1398Method for fabricating a semiconductor and semiconductor package
#1399ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE MAKING USE THEREOF, AND PRODUCTION METHOD THEREOF
#1400WIRING BOARD MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WIRING BOARD
#1401Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
#1402Short and low loop wire bonding
#1403Semiconductor device and method for fabricating the same
#1404Integrated Circuit Package Security Fence
#1405Semiconductor device with through silicon via and alignment mark
#1406Die-bonded LED
#1407Semiconductor device
#1408Production method of connection structure
#1409Semiconductor device and a method of manufacturing the same
#1410Controlled electroplated solder bumps
#1411Packaged electronic devices having die attach regions with selective thin dielectric layer
#1412REDISTRIBUTED CHIP PACKAGING WITH THERMAL CONTACT TO DEVICE BACKSIDE
#1413Semiconductor device manufacturing apparatus and method for manufacturing semiconductor device
#1414PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE AND APPARATUS THEREFOR
#1415Electronic component manufacturing method
#1416METHOD FOR MANUFACTURING FILM-LIKE ADHESIVE, ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#1417Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device
#1418Methods for packaging microelectronic devices and microelectronic devices formed using such methods
#1419Semiconductor device having pad region for wire-bonding and method of manufacturing the semiconductor device
#1420Methods for forming a semiconductor structure
#1421Semiconductor device and a method of manufacturing the same
#1422Method for the production of an electronic component and electronic component produced according to this method
#1423Semiconductor die having fine pitch electrical interconnects
#1424Selective electromigration improvement for high current C4s
#1425Semiconductor device and a method of manufacturing the same
#1426Method of making a semiconductor device comprising a land grid array flip chip bump system with short bumps
#1427Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure
#1428Package structure for DC-DC converter
#1429Lead component and method for manufacturing the same, and semiconductor package
#1430Flip chip semiconductor device
#1431Vertical MOSFET transistor having source/drain contacts disposed on the same side and method for manufacturing the same
#1432Light-reflective anisotropic conductive paste and light-emitting device
#1433Bonding apparatus and bonding method
#1434METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE
#1435Printed substrate manufacturing equipment and manufacturing method
#1436Method of manufacturing semiconductor device
#1437Reducing warpage for fan-out wafer level packaging
#1438Method of fabricating semiconductor die with through-hole via on saw streets and through-hole via in active area of die
#1439METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, ADHESIVE FILM FOR SEMICONDUCTOR, AND COMPOSITE SHEET USING THE FILM
#1440Metallic laminate and method for preparing the same
#1441Semiconductor device and method of forming pad layout for flipchip semiconductor die
#1442Packaged semiconductor assemblies and methods for manufacturing such assemblies
#1443Semiconductor packaging process using through silicon vias
#1444Semiconductor device
#1445Semiconductor device having a pad-disposition restriction area
#1446Integrated circuit packaging system with interconnects and method of manufacture thereof
#1447Solder in cavity interconnection structures
#1448Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus
#1449Magnetic integration double-ended converter
#1450Techniques for packaging multiple device components
#1451Chip scale package assembly in reconstitution panel process format
#1452Apparatuses and methods to enhance passivation and ILD reliability
#1453WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION
#1454Semiconductor Device and Method of Forming High Routing Density Interconnect Sites on Substrate
#1455Semiconductor device and method of forming flipchip interconnect structure
#1456Semiconductor device and method of manufacturing the same
#1457Apparatus for thermally enhanced semiconductor package
#1458SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
#1459Integrated circuit packaging system with interconnects and method of manufacture thereof
#1460Leadframe-based mold array package heat spreader and fabrication method therefor
#1461Integrated circuit packaging system for electromagnetic interference shielding and method of manufacture thereof
#1462Reduction of fluorine contamination of bond pads of semiconductor devices
#1463Wireless communication system
#1464Semiconductor device and method of manufacturing the same
#1465Manufacturing method of semiconductor device
#1466Semiconductor laser mounting for improved frequency stability
#1467Stacked integrated component devices with energization
#1468Manufacturing method of semiconductor device, and semiconductor device
#1469Virtually substrate-less composite power semiconductor device
#1470ELECTRONIC DEVICE AND METHOD FOR PRODUCING A DEVICE
#1471IC devices having TSVS including protruding tips having IMC blocking tip ends
#1472Power module for an automobile
#1473Power device with bottom source electrode
#1474Protection of reactive metal surfaces of semiconductor devices during shipping by providing an additional protection layer
#1475Multiple energization elements in stacked integrated component devices
#1476SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#1477Low cost high frequency device package and methods
#1478Method for contacting a chip
#1479DEBONDER TO MANUFACTURE SEMICONDUCTOR AND DEBONDING METHOD THEREOF
#1480Method of manufacturing optical module
#1481Wafer bonding apparatus
#1482Template and pattern forming method
#1483DEVICE INCLUDING A SEMICONDUCTOR CHIP
#1484ADHESIVE SHEET AND ELECTRONIC COMPONENT
#1485Stacked semiconductor component having through wire interconnect (TWI) with compressed wire
#1486Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substrates
#1487Semiconductor device adapted to improve heat dissipation
#1488Diode array and method for producing a diode array
#1489Solder bump interconnect
#1490Systems including an I/O stack and methods for fabricating such systems
#1491SEMICONDUCTOR PACKAGE HAVING INTERCONNECTION OF DUAL PARALLEL WIRES
#1492SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#1493Semiconductor device and method for manufacturing semiconductor device
#1494Optoelectronic Component Having a Semiconductor Body, an Insulating Layer, and a Planar Conductor Structure, and Method for the Production thereof
#1495Light emitting diode emitter substrate with highly reflective metal bonding
#1496Anisotropic conductive film, connection structure and method of producing the same
#1497Circuit board and method for manufacturing circuit board
#1498Semiconductor Load Board
#1499Process for wet passivation of bond pads for protection against subsequent TMAH-based processing
#1500Electronic device with aerogel thermal isolation