Method of making a semiconductor device adapted to remove noise from a signal

Semiconductor device and process for manufacturing the same

Micro-electronic package structure and method for fabricating the same

Floating lead finger on a lead frame, lead frame strip, and lead frame assembly including same

Electronic component with multilayered rewiring plate and method for producing the same

Semiconductor device with simplified constitution

Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices

Interposers for chip-scale packages and intermediates thereof

Semiconductor integrated circuit device which restricts an increase in the area of a chip, an increase in the number of lead terminals of a package, and can reduce parasitic inductance

Rectification chip terminal structure

Semiconductor light emitting apparatus

Electronic devices at the wafer level having front side and edge protection material and systems including the devices

Dense intermetallic compound layer

Method of bonding and bonding apparatus for a semiconductor chip

Electronic device with a warped spring connector

Rectification chip terminal structure

Method of manufacturing printed wiring board

Compressible films surrounding solder connectors

Method of electrically connecting a microelectronic component

Method for transferring a semiconductor body from a growth substrate to a support material

Manufacturing method of an electronic part built-in substrate

Semiconductor device substrate, semiconductor device, and manufacturing method thereof

Current detection equipment and semiconductor device

Conductive adhesive agent with ultrafine particles

Thermal fatigue resistant tin-lead-silver solder

Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device

Electrode structure of a semiconductor device and method of manufacturing the same

Integrated inductors and compliant interconnects for semiconductor packaging

Substrate for producing semiconductor packages

Submember mounted on a chip of electrical device for electrical connection

Methods and systems for attaching die in stacked-die packages

Method and apparatus for manufacturing stacked-type semiconductor device

Electronic packages with dice landed on wire bonds

QFN package and method therefor

Multi-path bar bond connector for an integrated circuit assembly

Semiconductor device and resin structure therefor

Apparatus and methods for wafer-level testing of the chip-scale semiconductor device packages

Heat transfer sheet, heat transfer structural body and manufacturing method of the heat transfer structural body

High frequency module and manufacturing method thereof

Semiconductor element

Fluxless solder transfer and reflow process

Method and resulting structure for manufacturing semiconductor substrates

Process and lead frame for making leadless semiconductor packages

Thermal protection for electronic components during processing

Semiconductor attachment method

Anisotropic conductive adhesive for fine pitch and COG packaged LCD module

Probe for semiconductor devices

Stacked packages

Semiconductor device and manufacturing method of the same

Multilayered anisotropic conductive adhesive for fine pitch

Wafer level package, multi-package stack, and method of manufacturing the same

Power gridding scheme

Fine pitch low-cost flip chip substrate

Microwave-monolithic-integrated-circuit-mounted substrate, transmitter device for transmission only and transceiver device for transmission/reception in microwave-band communication

Systems and methods for wafer bonding by localized induction heating

Semiconductor device with sidewall wiring

Power gridding scheme

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Methods and systems for attaching die in stacked-die packages

Electronic component packaging

Process and lead frame for making leadless semiconductor packages

Metal-metal bonding of compliant interconnect

Half-bridge package

Substrate for light emitting diodes

Wire bond with improved shear strength

Apparatus and method for printing micro metal structures

System and method for low temperature plasma-enhanced bonding

Methods of forming a contact array in situ on a substrate

Circuit device manufacturing method

Programmable radio transceiver

Transmission-line spring structure

Methods of forming lead free solder bumps

Apparatus for dividing an adhesive film mounted on a wafer

Method of fabricating semiconductor device

Semiconductor device and fabricating method thereof

Semiconductor device and fabricating method thereof

Semiconductor device

Manufacturing method of semiconductor device

Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components

Method for processing a base that includes connecting a first base to a second base with an insulating film

Intermetallic spring structure

Method of creating electrostatic discharge protection in a microelectronic module

Apparatus and methods for constructing antennas using wire bonds as radiating elements

Method for processing base

Process for protecting solder joints and structure for alleviating electromigration and joule heating in solder joints

Design of BEOL patterns to reduce the stresses on structures below chip bondpads

Method of sizing via arrays and interconnects to reduce routing congestion in flip chip integrated circuits

Component arrangement having an evaluation circuit for detecting wear on connections

Mechanism and process for compressing chips

Pressure-contact type semiconductor device

Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices

Method and apparatus for stacked die packaging

Stacked chip package with exposed lead-frame bottom surface

Structure with spherical contact pins

Snap lid camera module

Method and apparatus for forming metal contacts on a substrate

Method for forming metal contacts on a substrate

Bonding structure, wire bonding method, actuator device and liquid jet head

Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame

Manufacture of RFID tags and intermediate products therefor

No-flow underfill composition and method

Interconnect assemblies and methods

Method of manufacturing semiconductor device with two-step etching of layer

Metal pad of semiconductor device and method for bonding the metal pad

Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present

Methods of forming wire bonds for semiconductor constructions

Chip package structure

Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera

Semiconductor device

Semiconductor device with signal line having decreased characteristic impedance

Front-end processing of nickel plated bond pads

Semiconductor device and method for manufacturing the same, package for LCD driver

Electrical conducting structure and liquid crystal display device comprising the same

Semiconductor component having a CSP housing

Microelectronic packages including solder bumps and AC-coupled interconnect elements

Semiconductor chip-embedded substrate and method of manufacturing same

Interposer with flexible solder pad elements and methods of manufacturing the same

Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device

Semiconductor device and manufacturing method thereof

Semiconductor package with flip chip on leadless leadframe

LOC semiconductor assembled with room temperature adhesive

Chip structure with redistribution traces

Semiconductor device and a manufacturing method of the same

Image sensor packaging structure

System and method for assembly of semiconductor dies to flexible circuits

Metal bond pad for integrated circuits allowing improved probing ability of small pads

Apparatus and method for printing micro metal structures

Semiconductor package having a grid array of pin-attached balls

Electronic component embedded substrate and method for manufacturing the same

Die bonding apparatus

Electronic device and angular velocity detector

Wafer-leveled chip packaging structure and method thereof

GOLD BUMP STRUCTURE AND FABRICATING METHOD THEREOF

Method for fabricating pad redistribution layer

Methods of fabricating integrated circuit chips for multi-chip packaging and wafers and chips formed thereby

Semiconductor device with improved heat dissipation, and a method of making semiconductor device

Method for evaluating and modifying solder attach design for integrated circuit packaging assembly

Method for forming microelectronic spring structures on a substrate

Active plate-connector device with built-in semiconductor dies

Substrates including alignment fences

Microelectronic component assemblies with recessed wire bonds and methods of making same

Collars, support structures, and forms for protruding conductive structures

Semiconductor device

Die and die-package interface metallization and bump design and arrangement

Device having contact pad with a conductive layer and a conductive passivation layer

Semiconductor package having protective layer for re-routing lines and method of manufacturing the same

Semiconductor device and method of manufacturing a semiconductor device

Method for mounting a chip on a base and arrangement produced by this method

Interconnections of semiconductor device and method of forming the same

BGA package board and method for manufacturing the same

Substrate-based BGA package, in particular FBGA package

Semiconductor device and its manufacturing method

Bonding configurations for lead-frame-based and substrate-based semiconductor packages

Power semiconductor package

Electronic part-containing elements, electronic devices and production methods

Electronic module with layer of adhesive and process for producing it

Damascene patterning of barrier layer metal for C4 solder bumps

Wirebonding method and apparatus

Strap bonding machine and method of manufacturing a semiconductor device

Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components

Mounting method and mounting device

Vibratable die attachment tool

Manufacturing method of a semiconductor device, and paste applicator

Circuit-connecting material and circuit terminal connected structure and connecting method

Methods and apparatuses relating to block configurations and fluidic self-assembly processes

Method of manufacturing semiconductor device

Castellation wafer level packaging of integrated circuit chips

Method of fabricating an electronic component having at least one semiconductor chip on a circuit carrier with elastic external contacts

Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal

Substrate for mounting IC chip

Method for manufacturing surface acoustic wave device

Semiconductor chip resin encapsulation method

Semiconductor package including rivet for bonding of lead posts

Top layers of metal for high performance IC's

Design of beol patterns to reduce the stresses on structures below chip bondpads

Connection between a semiconductor chip and a circuit component with a large contact area

Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow

Semiconductor device, semiconductor device module and method of manufacturing the semiconductor device

Circuit device with at least partial packaging and method for forming

Semiconductor chip assembly with metal containment wall and solder terminal

Semiconductor device and method of manufacturing the same

Method for producing a component comprising a conductor structure that is suitable for use at high frequencies

IMPROVED DECAL SOLDER TRANSFER METHOD

Method of fabricating a semiconductor device and mounting equipment

Formation of a wire bond with enhanced pull

Bonding method and bonding apparatus

Solder alloy material layer composition, electroconductive and adhesive composition, flux material layer composition, solder ball transferring sheet, bump and bump forming process, and semiconductore device

Multi-layered circuit board assembly with improved thermal dissipation

Method of manufacturing a wiring board

RFID tag and method of manufacturing RFID tag

High thermal cycle conductor system

Methods of forming electronic structures including conductive shunt layers and related structures

Method for forming robust solder interconnect structures by reducing effects of seed layer underetching

Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus

Stacked semiconductor chips

Electronic package having a folded flexible substrate and method of manufacturing the same

Castellation wafer level packaging of integrated circuit chips

Substrate having built-in semiconductor apparatus and manufacturing method thereof

Mounting semiconductor chips

Apparatus for manufacturing electronic device, method of manufacturing electronic device, and program for manufacturing electronic device

Method for manufacturing surface acoustic wave device

Electronic device package

Bond pad structure for copper metallization having increased reliability and method for fabricating same

Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration

Substrate based unmolded package

Semiconductor device and a method of manufacturing the semiconductor device

Method of forming a micro solder ball for use in C4 bonding process

BGA package with concave shaped bonding pads

Flip-chip without bumps and polymer for board assembly

Bonding pad and chip structure

Thermal interposer for cooled electrical packages

Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages

Semiconductor component and assembly having female conductive members

Castellation wafer level packaging of integrated circuit chips

Semiconductor component having stacked, encapsulated dice and method of fabrication

Stacked semiconductor device and semiconductor memory module

Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers

Semiconductor device and method of manufacturing same

Lead frame for improving molding reliability and semiconductor package with the lead frame

Image sensor package and method of manufacturing the same

Semiconductor integrated circuit device

Highly compliant plate for wafer bonding

Semiconductor device packages including hermetic packaging elements for at least partially encapsulating conductive elements and other package elements for protecting the portions of semiconductor devices not covered by the hermetic package elements, and packaging methods

Modified chip attach process and apparatus

Method for fabricating an electronic component embedded substrate

Stacked package electronic device

Substrate based unmolded package

Technique for protecting photonic devices in optoelectronic packages with clear overmolding

In-line wire bonding on a package, and method of assembling same

Electrode contact structure

Electronic assembly having multi-material interconnects

Methods and apparatus for integrated circuit ball bonding using stacked ball bumps

Chip-to-chip trench circuit structure

Wafer level mounting frame with passive components integration for ball grid array packaging

Castellation wafer level packaging of integrated circuit chips

Castellation wafer level packaging of integrated circuit chips

Multi-component integrated circuit contacts

Integrated circuit package including embedded thin-film battery

Electronic package and semiconductor device using the same

Package Structure

Taped lead frames and methods of making and using the same in semiconductor packaging

Semiconductor device, optoelectronic board, and production methods therefor

Method of manufacturing active matrix substrate with height control member

Circular wire-bond pad, package made therewith, and method of assembling same

Bonding apparatus and method of bonding for a semiconductor chip

Co-curable compositions

Modular board device, high frequency module, and method of manufacturing same

Method of stacking wafers with anisotropic conductive adhesive

Method for fabricating semiconductor packages

Leadless semiconductor package and method for manufacturing the same

Process for manufacturing leadless semiconductor packages including an electrical test in a matrix of a leadless leadframe

Semiconductor chip package manufacturing method including screen printing process

Electronic device package

Methods for designing carrier substrates with raised terminals

Electrical package employing segmented connector and solder joint

Method and apparatus for mapping a position of a capillary tool tip using a prism

Pad-limited integrated circuit

Electrostatic discharge (ESD) protection for integrated circuit packages

Method and structure for manufacturing improved yield semiconductor packaged devices

Circuit film with bump, film package using the same, and related fabrication methods

Lead solder indicator and method

Semiconductor device with wire bond inductor and method

Semiconductor device with magnetically permeable heat sink

Encapsulated device with heat isolating structure

Multi-chip semiconductor connector assemblies

Method of embedding semiconductor element in carrier and embedded structure thereof

Method for manufacturing a semiconductor device

Semiconductor package including a semiconductor device, and method of manufacturing the same

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Method for producing a semiconductor circuit, and corresponding semiconductor circuit

Methods of forming vias in multilayer substrates

Circuit apparatus provided with asperities on substrate surface

Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates

Electronic assembly with carbon nanotube contact formations or interconnections

Method of soldering electronic component having solder bumps to substrate

In-situ alloyed solders, articles made thereby, and processes of making same

Die attach area cut-on-fly method and apparatus

Ball bonding method and ball bonding apparatus

Apparatus and method for indexing of substrates and lead frames

Capillary for wire bonding

Flange-mounted transducer

Sensor equipment having sensing portion and method for manufacturing the same

Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device

Stud bump socket

Semiconductor layer structure and method of making the same

High density bonding of electrical devices

High-reliability solder joint for printed circuit board and semiconductor package module using the same

Methods for modifying semiconductor devices to stabilize the same and semiconductor device assembly

Semiconductor device and manufacturing method thereof

FLIP-CHIP SUBSTRATE AND FLIP-CHIP BONDING PROCESS THEREOF

Method for manufacturing semiconductor substrate and semiconductor substrate

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Thermal interposer for thermal management of semiconductor devices

Method for manufacturing wafer level chip stack package

Semiconductor device with base support structure

Semiconductor bonding and layer transfer method

Semiconductor memory device

Semiconductor device

Interposer containing bypass capacitors for reducing voltage noise in an IC device

Semiconductor die package with internal bypass capacitors