Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits

Bumping process

Bumping process and structure thereof

Fabrication method of a wafer structure

Method for reducing semiconductor die warpage

In-place bonding of microstructures

Method for fabricating semiconductor components

Thermal enhance package and manufacturing method thereof

Methods of manufacturing interposers with flexible solder pad elements

Structure of mounting electronic component

Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding

Cavity-down Package and Method for Fabricating the same

Bond pad structure for integrated circuit chip

LED with self aligned bond pad

Electronic component comprising external surface contacts and a method for producing the same

Method of mounting an electronic part to a substrate

Wiring board and method for producing same

Flip chip package including a heat spreader having an edge with a recessed edge portion and method of making the same

Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion

Semiconductor device, circuit board, electro-optic device, electronic device

Semiconductor device and method of fabricating the same

Bond pad structure with stress-buffering layer capping interconnection metal layer

Fine pitch bonding pad layout and method of manufacturing same

Semiconductor device and a method for manufacturing of the same

Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module

Fan out type wafer level package structure and method of the same

Semiconductor device and manufacturing process thereof

Flip chip package including a non-planar heat spreader and method of making the same

Low cost power MOSFET with current monitoring

Film circuit substrate having Sn-In alloy layer

Manufacturing method of solid-state image sensing device

Solid image-pickup device and method for manufacturing the solid image pickup device

Method of mounting electronic component

Method of ultrasonic-mounting electronic component and ultrasonic mounting machine

Bumping process and structure thereof

Method for manufacturing a semiconductor device

Method for fabricating semiconductor package with short-prevented lead frame

Chip package, chip packaging, chip carrier and process thereof

Method for flip chip bonding by utilizing an interposer with embedded bumps

Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel

Using an interposer to facilate capacitive communication between face-to-face chips

Oblique parts or surfaces

Substrate having a built-in chip and external connection terminals on both sides and a method for manufacturing the same

Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel for producing an electronic component

Semiconductor device having semiconductor chip on base through solder layer and method for manufacturing the same

Semiconductor device and manufacturing method of the same

Semiconductor device and method of manufacturing the same

UBM STRUCTURE FOR IMPROVING RELIABILITY AND PERFORMANCE

Packaged device and method of forming same

Chip-size package structure and method of the same

Bumping process and structure thereof

Compliant interconnects for semiconductors and micromachines

Semiconductor device capsule

Audio amplifier assembly

Functional coating of the SCFM preform

Multi-layer integrated semiconductor structure having an electrical shielding portion

IC substrate and manufacturing method thereof and semiconductor element package thereby

Solderable top metal for SiC device

Rfid tag

Method and apparatus for placing conductive balls

Thermal management of systems having localized regions of elevated heat flux

Iridium oxide nanowires and method for forming same

Device for bonding a metal on a surface of a substrate

Circuit carrier and production thereof

Semiconductor device and method of manufacturing the same

Method for making electronic packages

Plating method, semiconductor device fabrication method and circuit board fabrication method

Methods of making microelectronic packages with conductive elastomeric posts

Method for fabricating packaged die

Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits

Connection structure for connecting semiconductor element and wiring board, and semiconductor device

Semiconductor device having aluminum electrode and metallic electrode

Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device

Structure of polymer-matrix conductive film and method for fabricating the same

Chip scale package with micro antenna and method for manufacturing the same

Method of forming a bond pad on an I/C chip and resulting structure

Heat dissipating package structure and method for fabricating the same

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Package structure module of bump posited type lead frame

Multichip leadframe package

Chip-scale packages

Method and process of contact to a heat softened solder ball array

Plating apparatus and plating method

Manufacturing method of a semiconductor device

Semiconductor device and its manufacturing method

Method of manufacturing electric device

Method for manufacturing wafer level chip scale package using redistribution substrate

Inspection method of bonded status of ball in wire bonding

Bonding structure of device packaging

Transparent member, optical device using transparent member and method of manufacturing optical device

Multi-layer electronic component aggregate board and multi-layer electronic component fabricating method

Folded substrate with interposer package for integrated circuit devices

Bonding structure, actuator device and liquid-jet head

Semiconductor package using flip-chip mounting technique

Stacked die module

Method for manufacturing an electronic module, and an electronic module

Non-Circular via holes for bumping pads and related structures

Thick metal layer integrated process flow to improve power delivery and mechanical buffering

Resist sidewall spacer for C4 BLM undercut control

Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module

3D interconnect with protruding contacts

Power transistor including a leadframe and a semiconductor chip arranged on the leadframe

Die attach paddle for mounting integrated circuit die

Semiconductor device, mounting structure, electro-optical device, method of manufacturing electro-optical device, and electronic apparatus

Flip chip bonding tool

Method and apparatus for mounting and removing an electronic component

Joining method and apparatus

Electronic flame-off electrode with ball-shaped tip

Contour structures to highlight inspection regions

Method of forming bump that may reduce possibility of losing contact pad material

Redistribution layer of wafer and the fabricating method thereof

Method for forming an electrode

Semiconductor device and method of manufacturing thereof

Electronic parts packaging structure and method of manufacturing the same

Semiconductor electrical connection structure and method of fabricating the same

Fabrication of stacked die and structures formed thereby

MECHANISM AND PROCESS FOR COMPRESSING CHIPS

Die handling system

Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same

Underfill of resin and sulfonic acid-releasing thermally cleavable compound

Method for producing microsystems

Inverter and vehicle drive unit using the same

Structure and method for fabricating a bond pad structure

Semiconductor device and fabrication method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing semiconductor device

Carbon nanotube structure, a semiconductor device, a semiconductor package and a manufacturing method of a semiconductor device

Semiconductor device carrier unit and semiconductor socket provided therewith

Semiconductor device

Methods for manufacturing semiconductor device, semiconductor device and metal mold

Multi-chip package and method for manufacturing the same

Semiconductor device

Film substrate of a semiconductor package and a manufacturing method

Semiconductor device having power semiconductor elements

Integrated circuit with at least one bump

Wire bonder and method of operating the same

Chip interconnect and packaging deposition methods and structures

Underfill compositions and methods for use thereof

Semiconductor substrate thinning method for manufacturing thinned die

Method of forming electrode for semiconductor device

Semiconductor device manufacturing method

Semiconductor device with improved heat dissipation, and a method of making semiconductor device

Method of fabricating microelectronic package using no-flow underfill technology and microelectronic package formed according to the method

Method for fabricating carrier structure integrated with semiconductor element

Nano-sized metals and alloys, and methods of assembling packages containing same

Low melting-point solders, articles made thereby, and processes of making same

Thermally conductive composite and uses for microelectronic packaging

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Method and structures for testing a semiconductor wafer prior to performing a flip chip bumping process

Production method of anisotropic conductive sheet

Semiconductor package with wire bond arrangement to reduce cross talk for high speed circuits

Semiconductor device

Semiconductor element including a wet prevention film

Reliable printed wiring board assembly employing packages with solder joints

Method for manufacturing wafer level chip scale package structure

Die down ball grid array package

Reinforced bond pad for a semiconductor device

Apparatus for singulating and bonding semiconductor chips, and method for the same

Semiconductor package with crossing conductor assembly and method of manufacture

Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor

Chip package

COF flexible printed wiring board and method of producing the wiring board

Bonding tool for ultrasonic bonding and method of ultrasonic bonding

Wire feed system for a wire bonding apparatus

Self-reflowing printed circuit board and application methods

Circuit device and manufacturing method thereof

Bonding apparatus

Top layers of metal for integrated circuits

Circuit-connecting material and circuit terminal connected structure and connecting method

Aluminum cap for reducing scratch and wire-bond bridging of bond pads

Wafer scale integration packaging and method of making and using the same

Method for attaching a semiconductor die to a substrate and heat spreader

Semiconductor package having a heat slug and manufacturing method thereof

PROCESS OF FABRICATING FLIP-CHIP PACKAGES

Solder foil, semiconductor device and electronic device

High performance amine based no-flow underfill materials for flip chip applications

Semiconductor device packaged into chip size and manufacturing method thereof

Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus

Radiant energy heating for die attach

Interconnection structure of integrated circuit chip

Electronic circuit including circuit-connecting material

Projected contact structures for engaging bumped semiconductor devices and methods of making the same

Pad structure to prompt excellent bondability for low-k intermetal dielectric layers

Chip structure

Semiconductor device

Assembly for stacked BGA packages

Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components

Semiconductor device and semiconductor device unit

Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device

Redistributed solder pads using etched lead frame

Bond pad redistribution layer for thru semiconductor vias and probe touchdown

Motion control device for wire bonder bondhead

Microelectronic packaging and components

Semiconductor device and fabrication process thereof

Wafer level packages and methods of fabrication

Wire bond pads

Thin glass chip for an electronic component and manufacturing method

Manufacturing apparatus of semiconductor devices, and method of manufacturing semiconductor devices

Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device

Wafer stacking package method

Method of forming a wafer backside interconnecting wire

Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages

Method for producing a stack of chips, a stack of chips and method for producing a chip for a multi-chip stack

Method for forming a redistribution layer in a wafer structure

Thermally controlled fluidic self-assembly

Flexible device, flexible pressure sensor, and fabrication method thereof

Semiconductor module

Semiconductor package having flash-free contacts and techniques for manufacturing the same

Sensor device having stopper for limitting displacement

Semiconductor device and a method of assembling a semiconductor device

Semiconductor equipment having a pair of heat radiation plates

Method of making a solder ball

Semiconductor packages

Bonding wire and bonded connection

Tape ball grid array package with electromagnetic interference protection and method for fabricating the package

Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip

Method of manufacturing semiconductor device, semiconductor device, and mounting structure of semiconductor device

Bump structure

Projected contact structures for engaging bumped semiconductor devices and methods of making the same

Methods of forming semiconductor packages

Packaging with metal studs formed on solder pads

Robust power semiconductor package

Semiconductor packages

Integrated circuit package with open substrate

Bonded SOI substrate, and method for manufacturing the same

Light emitting device and method of producing same

Light-emitting unit and method for producing same as well as lead frame used for producing light-emitting unit

Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment

Conductive particle and adhesive agent

Non-contact ID card and the like and method for manufacturing same

Method for supplying solder

Methods for forming conductive bumps and wire loops

Method of measuring thickness of bonded ball in wire bonding

Joining apparatus

Surface mount saw device manufacturing method

Top layers of metal for high performance IC's

Bump structure of semiconductor package and method for fabricating the same

Module assembly and method for stacked BGA packages

Semiconductor device manufacturing method and electronic equipment using same

Microprobe tips and methods for making

Method for producing semiconductor chips using thin film technology, and semiconductor chip using thin film technology

Method of manufacturing a semiconductor device

Electronic assemblies having a low processing temperature

Technique for attaching die to leads

Method for manufacturing electronic component-mounted board

Method for bonding flip chip on leadframe

Thermally controlled fluidic self-assembly method and support

Electronic device provided with a magnetic screening

Chip module

Method of embedding semiconductor chip in support plate and embedded structure thereof

Flip chip metal bonding to plastic leadframe

Electronic device and method of manufacturing the same

Grooved substrates for uniform underfilling solder ball assembled electronic devices

Semiconductor device having tin-based solder layer and method for manufacturing the same

Semiconductor device mounting structure for reducing thermal stress and warpage

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

Flat chip semiconductor device and manufacturing method thereof

Semiconductor device with reduced contact resistance

Integrated semiconductor circuit and method for producing an integrated semiconductor circuit

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device, lead frame, and methods for manufacturing the same

Semiconductor device and wire bonding chip size package therefor

High density interconnect power and ground strap and method therefor

Module assembly for stacked BGA packages

Method of manufacturing a semiconductor device

Methods of making microelectronic assemblies including compliant interfaces

Semiconductor device

Lead frame and semiconductor device having the lead frame

Semiconductor device and method for fabricating the same

Operator-serviceable wire feed sensor guide for use in semiconductor package fabrication

Method for connecting a chip and a substrate

Method for assembling micro-components to binding sites

Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies

Manufacturing method of stack-type semiconductor device

Method for reducing lead precipitation during wafer processing

Substrate grooves to reduce underfill fillet bridging

Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby

Semiconductor chip packages and methods for fabricating the same

Method of manufacturing semiconductor device

Dial module, manufacturing method thereof, led display element, display module, movement module, connector module and meter using them

Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device

Semiconductor chip, electrically connections therefor

Surface-mounting semiconductor device and method of making the same

Wire sweep resistant semiconductor package and manufacturing method thereof

Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same

Integrated circuit with substantially perpendicular wire bonds

Low stress conductive polymer bump

Adhesive film for semiconductor, metal sheet with such adhesive film, wiring substrate with adhesive film, semiconductor device, and method for manufacturing semiconductor device

Semiconductor device having laminated structure

Semiconductor device

High-reliable semiconductor device using hermetic sealing of electrodes

Low temperature PB-free processing for semiconductor devices

Top layers of metal for high performance IC's

Substrate, electro-optical device, electronic apparatus, method of forming substrate, method of forming electro-optical device, and method of forming electronic apparatus

Apparatus for applying semiconductor chip to substrates comprising a moveable curing device and method of use thereof

Semiconductor device having a heat-dissipation member

Structures and methods for heat dissipation of semiconductor integrated circuits

Semiconductor and method for producing a semiconductor

Apparatus for improved power distribution in wirebond semiconductor packages