212040 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Arsenic [As]
Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
#13502Apparatus for providing capacitive decoupling between on-die power and ground conductors
#13503Multiple device package
#13504Printed wiring board
#13505Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages
#13506Semiconductor assembly having substrate with electroplated contact pads
#13507Vertical memory device structures
#13508Wafer bonding method
#13509Semiconductor, electrooptic apparatus and electronic apparatus
#13510Semiconductor device
#13511Semiconductor device, manufacturing method and apparatus for the same
#13512Bondhead for wire bonding apparatus
#13513Method of forming a lead-free bump and a plating apparatus therefor
#13514Compliant spring contact structures
#13515Field weldable connections
#13516Machine vision systems for use with programmable material consolidation system and associated methods and structures
#13517Flexible scrub ring contact
#13518Fabrication method of wafer level chip scale packages
#13519Stackable semiconductor chip layer comprising prefabricated trench interconnect vias
#13520Method for fabricating chip structure
#13521Compliant interconnect and method of formation
#13522Microfeature devices and methods for manufacturing microfeature devices
#13523Compound semiconductor device and manufacturing method thereof
#13524Method for forming bump on electrode pad with use of double-layered film
#13525Method for fastening microtool components to objects
#13526Underfill and encapsulation of semiconductor assemblies with materials having differing properties
#13527Chip scale package with open substrate
#13528High density flip chip interconnections
#13529Heat-decaying materials, transfer sheet using the same, and patterning method
#13530Manufacturing method of semiconductor device
#13531Integrated circuit device with compliant bumps and testing method for testing the integrated circuit device
#13532Reconstructed semiconductor wafers including alignment droplets contacting alignment vias
#13533Semiconductor device and semiconductor apparatus
#13534Capping of metal interconnects in integrated circuit electronic devices
#13535Semiconductor apparatus and method of manufacturing semiconductor apparatus
#13536Lead-free conductive jointing bump
#13537Method of forming a solder bump and the structure thereof
#13538Pre-doped reflow interconnections for copper pads
#13539Stress mitigation layer to reduce under bump stress concentration
#13540Semiconductor device mounted on and electrically connected to circuit board
#13541Package and method for packaging an integrated circuit die
#13542High density multilayer circuit module
#13543Vertical conduction power electronic device package and corresponding assembling method
#13544Method and system for improved wire bonding
#13545Semiconductor device having inductor
#13546Separately strained N-channel and P-channel transistors
#13547Compound semiconductor device and manufacturing method thereof
#13548Bonding apparatus
#13549Method and stencil for extruding material on a substrate
#13550Lead-free bonding systems
#13551Spread spectrum isolator
#13552Method and apparatus for cleaning mounting nozzle, and mounting machine
#13553Semiconductor device with reduced contact resistance
#13554Method for manufacturing circuit element, method for manufacturing electronic element, circuit substrate, electronic device, and electro-optical apparatus
#13555Method of manufacturing semiconductor device
#13556Methods of making microelectronic packages
#13557RF isolator for isolating voltage sensing and gate drivers
#13558RF isolator with differential input/output
#13559Methods for making electronic devices with small functional elements supported on a carriers
#13560Electronic devices with small functional elements supported on a carrier
#13561Method of making photolithographically-patterned out-of-plane coil structures
#13562Crack protection for silicon die
#13563Semiconductor package, mold used in manufacturing the same, and method for manufacturing the same
#13564Semiconductor device components with structures for stabilizing the semiconductor device components upon flip-chip arrangement with high-level substrates
#13565Apparatus and method for wire bonding and die attaching
#13566Semiconductor device and method of manufacture thereof with two or more bond pad connections for each input/output cell
#13567Semiconductor device and method capable of scribing chips with high yield
#13568Semiconductor device
#13569Semiconductor component and system having thinned, encapsulated dice
#13570Semiconductor device having adhesion increasing film to prevent peeling
#13571Semiconductor device that improves electrical connection reliability
#13572Semiconductor device with slanting side surface for external connection
#13573Stacked semiconductor package having adhesive/spacer structure and insulation
#13574Build-up structures with multi-angle vias for Chip to Chip interconnects and optical bussing
#13575Semiconductor package including redistribution pattern and method of manufacturing the same
#13576Component built-in module and method for producing the same
#13577System-in-package (SIP) structure and fabrication thereof
#13578Preparation of front contact for surface mounting
#13579Adhesive/spacer island structure for stacking over wire bonded die
#13580Semiconductor equipment having multiple semiconductor devices and multiple lead frames
#13581On chip transformer isolator
#13582Flip chip FET device
#13583Soldering method and solder joints formed therein
#13584Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith
#13585Method and stencil for extruding material on a substrate
#13586Novel aqueous based metal etchant
#13587Wire-bonding method for chips with copper interconnects by introducing a thin layer
#13588Manufacturing method of semiconductor device
#13589Process of bonding circuitry components
#13590Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits
#13591Semiconductor device and method of manufacturing the same
#13592Plasma processing method and method for fabricating electronic component module using the same
#13593Method of manufacturing semiconductor device and method of manufacturing electronic device
#13594Integrated circuit packages with reduced stress on die and associated methods
#13595Top layers of metal for high performance IC's
#13596Method of fabricating a built-in chip type substrate
#13597Package warpage control
#13598Refractory solid, adhesive composition, and device, and associated method
#13599Optical modulator module
#13600Integrated power amplifier module with power sensor
#13601Circuit device and manufacturing method thereof
#13602Method of manufacturing semiconductor device and support structure for semiconductor substrate
#13603Method for manufacturing circuit device
#13604Photoresist process to enable sloped passivation bondpad openings for ease of metal step coverings
#13605Chip structure and process for forming the same
#13606Semiconductor device
#13607Semiconductor device
#13608Asymmetric bump structure
#13609Semiconductor device and method of manufacturing the same
#13610Circuit device and manufacturing method thereof
#13611Cold weld hermetic MEMS package and method of manufacture
#13612Laminated radiation member, power semiconductor apparatus, and method for producing the same
#13613Interposer substrate, semiconductor package and semiconductor device, and their producing methods
#13614Semiconductor device and manufacturing process therefor
#13615Partially patterned lead frames and methods of making and using the same in semiconductor packaging
#13616Semiconductor device and a method of manufacturing the same
#13617Integrated circuit leadframe and fabrication method therefor
#13618Semiconductor device and method for manufacturing the same
#13619Semiconductor device formed having a metal layer for conducting the device current and for high contrast marking and method thereof
#13620Wire bonding method and apparatus for integrated circuit
#13621Semiconductor device with a floating gate electrode that includes a plurality of particles
#13622Substrate holding apparatus
#13623Apparatus relating to the reconstruction of semiconductor wafers for wafer-level processing
#13624Method of manufacturing circuit device
#13625Moisture-resistant electronic device package and methods of assembly
#13626Multi-band tunable resonant circuit
#13627Top layers of metal for high performance IC's
#13628Bonding method, bonding apparatus and sealing means
#13629Electronic and optoelectronic component packaging technique
#13630Circuit device, manufacturing method thereof, and sheet-like board member
#13631Method for fabricating leadless packages with mold locking characteristics
#13632Method for fabrication of wafer level package incorporating dual compliant layers
#13633Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#13634Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#13635Integrated ball and via package and formation process
#13636Method and system for applying an adhesive substance on an electronic device
#13637Dual row leadframe and fabrication method
#13638Semiconductor device and interposer
#13639Semiconductor molding method and structure
#13640Fine-pitch packaging substrate and a method of forming the same
#13641Substrate for solder joint
#13642Semiconductor device
#13643Bump structure
#13644Double density method for wirebond interconnect
#13645Semiconductor package with build-up layers formed on chip and fabrication method of the semiconductor package
#13646Chip heat sink device and method
#13647Leadless leadframe with an improved die pad for mold locking
#13648Semiconductor device including a semiconductor chip formed on an insulating element such as a tape, and including an improved insulating arrangement
#13649Power composite integrated semiconductor device and manufacturing method thereof
#13650Method of manufacturing electronic part packaging structure
#13651Semiconductor die attachment for high vacuum tubes
#13652Packaging of a microchip device
#13653Structure for mounting electronic component on wiring board
#13654Thermal interface adhesive and rework
#13655Method of manufacturing semiconductor device
#13656Method and resulting structure for manufacturing semiconductor substrates
#13657Method for assembling semiconductor die packages with standard ball grid array footprint
#13658Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material
#13659Chemical-enhanced package singulation process
#13660Methods for producing an electronic device having microscopically small contact areas
#13661Microelectronic devices and methods for packaging microelectronic devices
#13662Web fabrication of devices
#13663Method of attaching a leadframe to singulated semiconductor dice
#13664Method to build robust mechanical structures on substrate surfaces
#13665Multilayer substrate including components therein
#13666Light emitting diodes for high AC voltage operation and general lighting
#13667Method for testing using a universal wafer carrier for wafer level die burn-in
#13668Method for testing using a universal wafer carrier for wafer level die burn-in
#13669Semiconductor package and method for fabricating the same
#13670Vibration-assisted method for underfilling flip-chip electronic devices
#13671Semiconductor chip package and method for fabricating the same
#13672Universal interconnect die
#13673Flip chip package and process of forming the same
#13674Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface
#13675Method for integrating pre-fabricated chip structures into functional electronic systems
#13676Semiconductor device
#13677Semiconductor device and method of manufacturing the semiconductor device
#13678Electronic device package structures
#13679Semiconductor device having conductive bumps, method of manufacturing thereof, circuit board and electronic apparatus
#13680Integrated circuit packaging method and structure for redistributing configuration thereof
#13681Solder flow stops for semiconductor die substrates
#13682High electrical performance semiconductor package
#13683Mold gates and tape substrates including the mold gates
#13684Multilayer wiring substrate for providing a capacitor structure inside a multilayer wiring substrate
#13685Semiconductor device and manufacturing method therefor
#13686Package design and method for electrically connecting die to package
#13687Chip embedded package structure
#13688Systems for degating packaged semiconductor devices with tape substrates
#13689Semiconductor device capable of being connected to external terminals by wire bonding in stacked assembly
#13690Semiconductor package and method of fabricating the same
#13691Semiconductor device
#13692Semiconductor device and manufacturing method of same
#13693Die package
#13694Wireless coupling of semiconductor dies
#13695Semiconductor micro device
#13696Microelectronic assembly having a perimeter around a MEMS device
#13697Semiconductor (LED) chip attachment
#13698Method of bumping die pads for wafer testing
#13699Lead wire bonding method
#13700Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape
#13701Under bump metallization layer to enable use of high tin content solder bumps
#13702Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device with electroless plating
#13703Method for fabricating connection regions of an integrated circuit, and integrated circuit having connection regions
#13704Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive
#13705Semiconductor device and fabricating method thereof
#13706Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
#13707Underfilling with acid-cleavable acetal and ketal epoxy oligomers
#13708Method for internal electrical insulation of a substrate for a power semiconductor module
#13709Method and apparatus for shielding integrated circuits
#13710Semiconductor chip arrangement and method
#13711Method of magnetic field assisted self-assembly
#13712Electronic device including chip parts and a method for manufacturing the same
#13713Semiconductor device
#13714Chip scale package with heat spreader
#13715Mounting with auxiliary bumps
#13716High data rate chip mounting
#13717Chip-packaging with bonding options having a plurality of package substrates
#13718Flip chip semiconductor package for testing bump and method of fabricating the same
#13719Surface mount multichip devices
#13720Selectable decoupling capacitors for integrated circuits and associated methods
#13721Compositions for use in electronics devices
#13722Method for securing electronic components to a substrate
#13723Linear split axis wire bonder
#13724Method of manufacturing an electronic parts packaging structure
#13725Sealing and protecting integrated circuit bonding pads
#13726Barrier for interconnect and method
#13727Top layers of metal for high performance IC's
#13728Methods of forming solder bumps on exposed metal pads
#13729Single row bond pad arrangement
#13730Semiconductor device and manufacturing method thereof
#13731Method for making an interconnect pad
#13732Implementation of protection layer for bond pad protection
#13733Method of fabricating a semiconductor device
#13734Shielded laminated structure with embedded chips
#13735Microelectronic connection components having bondable wires
#13736Active matrix substrate with height control member
#13737Semiconductor device support element with fluid-tight boundary
#13738INTEGRATED CIRCUIT PACKAGE WITH DIFFERENT HARDNESS BUMP PAD AND BUMP AND MANUFACTURING METHOD THEREFOR
#13739Display device and manufacturing method of the same
#13740Electrode pad arrangement with open side for waste removal
#13741Integrated circuit die for wire bonding and flip-chip mounting
#13742FCBGA package structure
#13743Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same
#13744Semiconductor device with a protected active die region and method therefor
#13745Semiconductor component having multiple stacked dice
#13746Structure of package
#13747Semiconductor chip package and method for manufacturing the same
#13748LOW-CAPACITANCE BONDING PAD FOR SEMICONDUCTOR DEVICE
#13749Semiconductor device
#13750Semiconductor structure integrated under a pad
#13751Test circuit under pad
#13752Method for low loop wire bonding
#13753Flip chip bonding tool and ball placement capillary
#13754Method of fabricating a rat's nest RFID antenna
#13755Mounting machine and controller for the mounting machine
#13756Method for manufacturing an interconnect
#13757Method of making a semiconductor device using bump material including a liquid
#13758Compliant multi-composition interconnects
#13759Method for producing a semiconductor element
#13760Method for releasing stress of embedded chip and chip embedded structure
#13761Method for producing a BGA chip module and BGA chip module
#13762Semiconductor assembly using dual-cure die attach adhesive
#13763Semiconductor device and its manufacturing process, electro-optical equipment, and electronic equipment
#13764Method for testing using a universal wafer carrier for wafer level die burn-in
#13765Method for testing using a universal wafer carrier for wafer level die burn-in
#13766Method for testing using a universal wafer carrier for wafer level die burn-in
#13767Multiple chip semiconductor package
#13768Wire bonding system and method of use
#13769Process for fabricating chip package structure
#13770Semiconductor package for a large die
#13771Semiconductor device in which semiconductor chip is mounted on lead frame
#13772Semiconductor device having improved solder joint and internal lead lifetimes
#13773Fan out type wafer level package structure and method of the same
#13774High-frequency amplification device
#13775Semiconductor device, producing method of semiconductor substrate, and producing method of semiconductor device
#13776Semiconductor device
#13777Method for mounting semiconductor device, as well as circuit board, electrooptic device, and electronic device
#13778Compliant interconnect assembly
#13779Method for making an anisotropic conductive film pointed conductive inserts
#13780Method for manufacturing semiconductor device
#13781Flip chip package, semiconductor package with bumps and method for manufacturing semiconductor package with bumps
#13782Method and apparatus for improved power routing
#13783Bump structure for a semiconductor device and method of manufacture
#13784Method for manufacturing semiconductor device having solder layer
#13785Method of transferring devices, method of arranging devices using the same, and method of manufacturing an image display system
#13786DEVICE TRANSFER METHOD AND DISPLAY APPARATUS
#13787Semiconductor device and a method of manufacturing the same
#13788Semiconductor device and manufacturing method of the same
#13789Systems and methods for filling voids and improving properties of porous thin films
#13790Methods and apparatus for transferring conductive pieces during semiconductor device fabrication
#13791Semiconductor device
#13792Semiconductor device
#13793High power Doherty amplifier
#13794Led chip mounting structure and image reader having same
#13795Microelectronic assembly having a redistribution conductor over a microelectronic die
#13796Wafer level chip scale packaging structure and method of fabricating the same
#13797Flip-chip type semiconductor devices and conductive elements thereof
#13798Semiconductor device
#13799Semiconductor device, magnetic sensor, and magnetic sensor unit
#13800Semiconductor device and multilayer substrate therefor