Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer

NANO IC packaging

Semiconductor packages, and methods of forming semiconductor packages

Power semiconductor arrangement

Display device

Semiconductor module mounting structure, a cardlike semiconductor module, and heat receiving members bonded to the cardlike semiconductor module

In-process semiconductor packages with leadframe grid arrays

Power semiconductor module

Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements

Semiconductor device with stacked semiconductor chips of the same type

Semiconductor integrated circuit

Semiconductor device

High performance system-on-chip discrete components using post passivation process

Semiconductor device having a refractory metal containing film and method for manufacturing the same

Electronic component, mounted structure, electro-optical device, and electronic device

Power semiconductor switching devices and power semiconductor devices

Bonding structure and method for bonding members

Thermally conductive compositions and methods of making thereof

Programmable radio transceiver

Method of migrating and fixing particles in a solution to bumps on a chip

Method of connecting base materials

Electronic component mounting method and apparatus and ultrasonic bonding head

Packaging assembly utilizing flip chip and conductive plastic traces

Electronic device and method of manufacture the same

Method for fabricating encapsulated semiconductor components

Packaging method for integrated circuits

Method for depositing a solder material on a substrate

Methods for fabricating electronic components to include supports for conductive structures

Manufacture of microelectronic fold packages

Method for manufacturing semiconductor device

Dicing die bonding film

Conductive material for integrated circuit fabrication

Method and apparatus to eliminate galvanic corrosion on copper doped aluminum bond pads on integrated circuits

Bump for semiconductor package, semiconductor package applying the bump, and method for fabricating the semiconductor package

Method for embedding a component in a base

Structure and method for contact pads having double overcoat-protected bondable metal plugs over copper-metallized integrated circuits

Structure and method for contact pads having a protected bondable metal plug over copper-metallized integrated circuits

Heat curable adhesive composition, article, semiconductor apparatus and method

High density nanostructured interconnection

Electronic component mounting method and apparatus

Extension of fatigue life for C4 solder ball to chip connection

Circuit device and method of manufacturing the circuit device

Circuit board, device mounting structure, device mounting method, and electronic apparatus

Wafer level mounting frame for ball grid array packaging, and method of making and using the same

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Integrated circuit package and method having wire-bonded intra-die electrical connections

Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus

Electronic package with optimized lamination process

Surface mounted package with die bottom spaced from support board

Power semiconductor device package

Method for maintaining solder thickness in flipchip attach packaging processes

Semiconductor device and method for manufacturing same

Circuit device

System for reducing or eliminating semiconductor device wire sweep

Multi-part lead frame

Chip fixed structure

Integrated circuit device having flexible leadframe

Leadless semiconductor package and manufacturing method thereof

Spacer die structure and method for attaching

Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device

Power semiconductor switching-device and semiconductor power module using the device

Integrated circuit with intergrated capacitor and methods for making same

Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same

Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device

Component mounting substrate and structure

Bonding an interconnect to a circuit device and related devices

Semiconductor device comprising through-electrode interconnect

Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor

Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig

Jig for a semiconductor substrate

Vacuum fixing jig for semiconductor device

Wafer stacking using interconnect structures of substantially uniform height

Self-coplanarity bumping shape for flip-chip

Method of making chip package with grease heat sink

Carrier substrates and conductive elements thereof

Wire bonding apparatus

Circuitry module

Semiconductor device with electrode pads for test probe

Circuit support for a semiconductor chip and component

Capillary underfill channel

Semiconductor device

Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device

Semiconductor flip-chip package and method for the fabrication thereof

Self-coplanarity bumping shape for flip chip

Die down semiconductor package

Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus

Use of palladium in IC manufacturing with conductive polymer bump

Method for manufacturing leadless semiconductor packages

Semiconductor device

Through electrode, spacer provided with the through electrode, and method of manufacturing the same

Microelectronic assembly having encapsulated wire bonding leads

Semiconductor device, a method of manufacturing the same and an electronic device

Semiconductor device with non-overlapping chip mounting sections

Semiconductor BGA package having a segmented voltage plane and method of making

Spacer die structure and method for attaching

Network electronic component, semiconductor device incorporating network electronic component, and methods of manufacturing both

Semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion

Underfill fluxing curative

Wire bonding apparatus

Wire bond capillary tip

Fabrication method and structure of PCB assembly, and tool for assembly thereof

Fixture and method for uniform electroless metal deposition on integrated circuit bond pads

Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits

Methods of forming bumps using barrier layers as etch masks

METHOD FOR FORMING PHOTORESIST LAYER ON SUBSRTATE AND BUMPING PROCESS USING THE SAME

Low fabrication cost, high performance, high reliability chip scale package

Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same

Method of wafer/substrate bonding

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Semiconductor device assembly method and semiconductor device assembly apparatus

BUMPING PROCESS, BUMP STRUCTURE, PACKAGING PROCESS AND PACKAGE STRUCTURE

Method for attaching a semiconductor chip in a plastic encapsulant, optoelectronic semiconductor component and method for the production thereof

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

Programmable radio transceiver

Motor driving system having power semiconductor module life detection function

Adhesion by plasma conditioning of semiconductor chip surfaces

Semiconductor device and manufacturing metthod thereof

Semiconductor apparatus with improved yield

Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip

Semiconductor package structure with reduced parasite capacitance and method of fabricating the same

Under bump metallization layer to enable use of high tin content solder bumps

Chip package and process thereof

Electric wave readable data carrier manufacturing method, substrate, and electronic component module

Semiconductor chip, semiconductor device, method for producing semiconductor device, and electronic equipment

Semiconductor package with build-up structure and method for fabricating the same

Semiconductor device and method of manufacturing the same

Electrical component

Semiconductor device

Semiconductor device with plate-shaped component

HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Circuit device

Vertically stacked semiconductor device

Semiconductor chip package

Semiconductor device designed to produce no resonance of loop due to ultrasonic vibration, semiconductor design apparatus and method of manufacturing semiconductor device

Method for attaching shields on substrates

Lead on chip semiconductor package

Surface-mountable semiconductor component and method for producing it

Semiconductor apparatus and method of fabricating the apparatus

Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices

Solid state imaging device having electromagnetic wave absorber attached to a mounting board

Electronic parts packaging structure and method of manufacturing the same

Method of microelectrode connection and connected structure of use threof

High frequency circuit block unit, method for producing same, high frequency module device and method for producing same

Spiral contactor, contact sheet having spiral contactor, and connecting device having contact sheet

Top layers of metal for high performance IC's

Solder bump structure and method for forming a solder bump

Methods for forming electrical connections and resulting devices

Method for forming robust solder interconnect structures by reducing effects of seed layer underetching

Method of routing an electrical connection on a semiconductor device and structure therefor

Dicing die-bonding film

Semiconductor device and manufacturing method of the same

Thin flip-chip method

Method for fabricating window ball grid array semiconductor package

Methods including fabrication of substrates and other semiconductor device components with collars on or around the contact pads thereof

Method of producing an electronic component with flexible bonding

Semiconductor chip packaging method with individually placed film adhesive pieces

Die to substrate attach using printed adhesive

Microelectronic device interconnects

Manufacturing method for semiconductor device and determination method for position of semiconductor element

Marking on underfill

Stress and force management techniques for a semiconductor die

Multi-flip chip on lead frame on over molded IC package and method of assembly

Method for manufacturing wiring board and semiconductor device

Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits

Wire bonding method and semiconductor device

Semiconductor device with recessed post electrode

Method of manufacturing substrate joint body, substrate joint body and electrooptical device

Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier

Die package with higher useable die contact pad area

Stacked electronic part

Thin semiconductor package including stacked dies

Stacked semiconductor packages

Methods and apparatus for packaging integrated circuit devices

Circuit device and manufacturing method thereof

Semiconductor package having step type die and method for manufacturing the same

Board-on-chip packages

Semiconductor chip and display device using the same

Ultrasonic tool and ultrasonic bonder

Connector

Method of fabricating a wire bond with multiple stitch bonds

Process for producing optical semiconductor device

Manufacturing method of a tray, a socket for inspection, and a semiconductor device

Thin-film semiconductor device and method of manufacturing the same

Wafer level semiconductor package with build-up layer and method for fabricating the same

Semiconductor chip capable of implementing wire bonding over active circuits

Memory component with asymmetrical contact row

Apparatus and method for attaching a heat sink to an integrated circuit module

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts

Top layers of metal for high performance IC's

Semiconductor device and manufacturing method thereof

Semiconductor device with increased number of external connection electrodes

Integrated circuit bond pad structures and methods of making

Semiconductor device and method for manufacturing the same

Bump and fabricating process thereof

Package structure with two solder arrays

Method and apparatus for bonding a wire

Semiconductor component assemblies having interconnects

Semiconductor package without bonding wires and fabrication method thereof

Semiconductor device, manufacturing method thereof, circuit board, and electronic appliance

Two solder array structure with two high melting solder joints

Semiconductor stack package and memory module with improved heat dissipation

Semiconductor device and manufacturing method thereof

Semiconductor device and electronic device

Semiconductor device with interlocking clip

Electronic component having an integrated passive electronic component and associated production method

Capacitor device and semiconductor device having the same, and capacitor device manufacturing method

Wire bonding apparatus having actuated flame-off wand

Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument

Solder ball excellent in micro-adhesion preventing properties and wetting properties and method for preventing the micro-adhesion of solder balls

Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material

Device mounting method and device transport apparatus

Method and apparatus for joining semiconductor

Element arrangement method

Apparatuses and methods for forming assemblies

Wire bonding method and liquid-jet head

Driver chip and display apparatus having the same

Power amplifier module for wireless communication devices

Integrated circuit package with keep-out zone overlapping undercut zone

Circuit component with bump formed over chip

Semiconductor device manufacturing method and manufacturing apparatus

Submount and semiconductor device

Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument

Semiconductor device and manufacturing method for the same

Method for mounting semiconductor chips and corresponding semiconductor chip system

Bonding structure and fabrication thereof

Resin-molded semiconductor device having posts with bumps and method for fabricating the same

Electrical connection materials and electrical connection methods

Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same

Multi-chip package including at least one semiconductor device enclosed therein

High frequency semiconductor device

Semiconductor device and manufacturing method of the same

Semiconductor package free of substrate and fabrication method thereof

Semiconductor package free of substrate and fabrication method thereof

Semiconductor package free of substrate and fabrication method thereof

Semiconductor device

Transferring semiconductor crystal from a substrate to a resin

Flip-chip light emitting diode device without sub-mount

Semiconductor devices and manufacturing method therefor

Titanium stripping solution

Ultrasonic bonding apparatus and method

Bump bonding apparatus and bump bonding method

Electrical contact

Multiple-ball wire bonds

Apparatus and method for forming bump

Method to prevent passivation layer peeling in a solder bump formation process

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods of fabrication of package assemblies for optically interactive electronic devices

Via structure of packages for high frequency semiconductor devices

Electronic component, method of manufacturing the electronic component, and electronic apparatus

Test head assembly having paired contact structures

Semiconductor package free of substrate and fabrication method thereof

Semiconductor device assembly process

Low fabrication cost, high performance, high reliability chip scale package

LSI package, LSI element testing method, and semiconductor device manufacturing method

Semiconductor package with crossing conductor assembly and method of manufacture

Semiconductor package

Interconnect system without through-holes

Semiconductor device and manufacturing method thereof

Method of surface mounting a semiconductor device

Semiconductor device support structures

Chip package sealing method

Spring biased socket system

Methods of fabricating interconnects for semiconductor components including plating solder-wetting material and solder filling

Methods of fabricating interconnects for semiconductor components including a through hole entirely through the component and forming a metal nitride including separate precursor cycles

Manufacturing method for semiconductor device and semiconductor device

Methods of fabricating interconnects including depositing a first material in the interconnect with a thickness of angstroms and a low temperature for semiconductor components

Transferring semiconductor crystal from a substrate to a resin

Process for producing semiconductor chips having a protective film on the back surface

Method and apparatus for fabricating self-assembling microstructures

Method of manufacturing semiconductor device

Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods

Semiconductor device manufacturing method and manufacturing apparatus

spliced film carrier tape

Apparatus and method for die attachment

Light emitting diodes for high AC voltage operation and general lighting

Actuator and bonding apparatus

Semiconductor integrated circuit device

Sheet to form a protective film for chips

Method and structure for interfacing electronic devices

Electrode package for semiconductor device

Semiconductor device

Optimized power delivery to high speed, high pin-count devices

Semiconductor device and a memory system including a plurality of IC chips in a common package

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Electronic device configured as a multichip module, leadframe and panel with leadframe positions

Semiconductor device and fabrication method for the same

Circuit carrier

Semiconductor package free of substrate and fabrication method thereof

High density lead arrangement package structure

Lead frame for semiconductor package and method of fabricating semiconductor package

High performance system-on-chip using post passivation process

Laser cleaning system for a wire bonding machine

Wire bonding method and apparatus

Wire bonding apparatus

Manufacturing method and manufacturing apparatus for semiconductor device

Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit

Alloying method using laser irradiation for a light emitting device