Gold bonding wires for semiconductor devices and method of producing the wires

Method for stacking chips within a multichip module package

Method for producing a multichip module and multichip module

Forming of the last metallization level of an integrated circuit

Die pillar structures and a method of their formation

Semiconductor radiation emitter package

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Semiconductor device having heat radiation plate and bonding member

Integrated circuit package

Package type semiconductor device

Structure and method for forming a capacitively coupled chip-to-chip signaling interface

Anisotropic conductive film

Bonding tool with polymer coating

Printed circuit board unit with detachment mechanism for electronic component

Inter-chip and intra-chip wireless communications systems

Local multilayered metallization

Method of fabricating a wire bond pad with Ni/Au metallization

Method of manufacturing a semiconductor device including a bump forming process

Process for producing resin-sealed type electronic device

Method of producing semiconductor package, apparatus for producing semiconductor package, and adhesive film

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Pad structure for stress relief

Method for manufacturing solid-state imaging devices

Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof

Method of using pre-applied underfill encapsulant

Integrated circuit with dual electrical attachment PAD configuration

Integrated circuit package bond pad having plurality of conductive members

Semiconductor device with electrode pad having probe mark

Semiconductor device and method of fabricating the same

Sealing and protecting integrated circuit bonding pads

Wireless coupling of staked dies within system in package

Semiconductor device having heat conducting plate

Semiconductor device and method of fabricating the same

Lead frame, semiconductor device, and method for manufacturing semiconductor device

Multichip wafer level packages and computing systems incorporating same

Transistor having multiple gate pads

Method of forming low wire loops and wire loops formed using the method

Electrical circuit assembly with micro-socket

Reliable metal bumps on top of I/O pads after removal of test probe marks

Substrate for pre-soldering material and fabrication method thereof

Wafer-level moat structures

Method of mounting wafer on printed wiring substrate

Method for fabricating wafer-level chip scale packages

Devices and methods employing high thermal conductivity heat dissipation substrates

Method of manufacturing a semiconductor device

Method of manufacturing electronic device and method of manufacturing electro-optical device

Modified chip attach process and apparatus

Method and structure for cooling a dual chip module with one high power chip

Substrate having built-in semiconductor apparatus and manufacturing method thereof

Electronic parts built-in substrate and method of manufacturing the same

Reinforced bond pad

Semiconductor device having a composite layer in addition to a barrier layer between copper wiring and aluminum bond pad

Semiconductor device with multilayered metal pattern

Semiconductor device and method of manufacturing the same

Spacerless die stacking

Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said caps

Semiconductor device containing stacked semiconductor chips and manufacturing method thereof

Castellated chip-scale packages and methods for fabricating the same

Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit

Method of forming a semiconductor package and structure thereof

Pressure-contactable power semiconductor module

Method of manufacturing electronic component, method of manufacturing electro-optical device, electronic component, and electro-optical device

Wire bonder with a downholder for pressing the fingers of a system carrier onto a heating plate

Fine pitch electronic flame-off wand electrode

Hybrid integrated circuit device and method of manufacturing the same

Method of manufacturing a module

Circuit carrier and production thereof

Manufacturing method of electronic components embedded substrate

ULTRA-FINE CONTACT ALIGNMENT

Methods relating to forming interconnects and resulting assemblies

System having semiconductor component with encapsulated, bonded, interconnect contacts

Multi-chip semiconductor package and fabrication method thereof

Electrical or electronic component and method of producing same

Method for manufacturing an electronic circuit device and electronic circuit device

Method for mounting passive components on wafer

Method of manufacturing wafer level chip size package

Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device

Resin composition for encapsulating semiconductor device

Integrated circuit die/package interconnect

Microelectronic devices and methods for packaging microelectronic devices

Microelectronic substrates with integrated devices

Semiconductor package

Bridge connection type of chip package and fabricating method thereof

I/C chip suitable for wire bonding

Designs and methods for conductive bumps

Bonded structure using conductive adhesives, and a manufacturing method thereof

Package assembly for electronic device

Single chip and stack-type chip semiconductor package and method of manufacturing the same

Pad structure of semiconductor device for reducing or inhibiting wire bonding cracks

Manufacturing a bump electrode with roughened face

Substrate with terminal pads having respective single solder bumps formed thereon

Integrating chip scale packaging metallization into integrated circuit die structures

Window ball grid array semiconductor package and method for fabricating the same

Window ball grid array semiconductor package with substrate having opening and mehtod for fabricating the same

Semiconductor integrated circuit and electronic apparatus having the same

Semiconductor package

Semiconductor device having heat dissipation layer

Semiconductor device

Electronic package having a folded flexible substrate and method of manufacturing the same

Semiconductor device and method for fabricating the same

Receptacle for a programmable, electronic processing device

Method of fabrication of semiconductor integrated circuit device

Wire bonding method and apparatus

Via placement for layer transitions in flexible circuits with high density ball grid arrays

Method of fixing a sealing object to a base object

Method for the lateral contacting of a semiconductor chip

Semiconductor apparatus and method for fabricating the same

Image sensor packages

Method of making an electronic module

Moisture-resistant electronic device package and methods of assembly

Head assembly, disk unit, and bonding method and apparatus

Semiconductor device capable of detecting an open bonding wire using weak current

Semiconductor device connecting structure, liquid crystal display unit based on the same connecting structure, and electronic apparatus using the same display unit

Apparatus and method for mounting or wiring semiconductor chips

Electrical circuit assembly with improved shock resistance

INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME

Method of fabricating integrated electronic chip with an interconnect device

Bumped wafer with adhesive layer encompassing bumps and manufacturing method thereof

High frequency circuit block unit, method for producing same, high frequency module device and method for producing same

Semiconductor device having a pair of heat sinks and method for manufacturing the same

High-frequency module and method for manufacturing the same

Semiconductor apparatus with decoupling capacitor

Semiconductor package with through-hole

Stress sensitive microchip with premolded-type package

Process for precise arrangement of micro-bodies

Method and device to elongate a solder joint

Method of locating conductive spheres utilizing screen and hopper of solder balls

Apparatus for locating conductive spheres utilizing screen and hopper of solder balls

Thermal interface adhesive

Method for manufacturing a piezoelectric oscillator

Semiconductor device and method of manufacturing the same

Semiconductor device which employs an interlayer insulating film of a low mechanical strength and a highly reliable metal pad, and a method of manufacturing the same

Wire bonding method, semiconductor chip, and semiconductor package

Solder bump structure and method for forming the same

Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby

Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof

Method for producing display device

Integrated circuit, interface circuit used in the integrated circuit, and apparatus using the integrated circuit

Integrated circuit package

I/O architecture for integrated circuit package

Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow

Bonding pad design for impedance matching improvement

BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same

Thick metal layer integrated process flow to improve power delivery and mechanical buffering

Semiconductor device and method of manufacturing the same

Semiconductor package structure

Method and structure for prevention leakage of substrate strip

Tape substrates with mold gate support structures that are coplanar with conductive traces thereof and associated methods

Flip chip substrate design

Semiconductor device having transferred integrated circuit

Semiconductor package

Process of manufacturing a solder-fill for applying to semiconductor package

Method and system for stud bumping

Coupler resource module

Electrical contact and connector and method of manufacture

Method for chemical etch control of noble metals in the presence of less noble metals

Bond pad techniques for integrated circuits

Method for fabricating thermally enhanced semiconductor device

Diffusion solder position, and process for producing it

Ball film for integrated circuit fabrication and testing

Method of forming a bond pad

Method of making a circuitized substrate

Semiconductor device and manufacturing method thereof

Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus

Self-assembled nanometer conductive bumps and method for fabricating

Microbeam assembly and associated method for integrated circuit interconnection to substrates

Super high density module with integrated wafer level packages

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Printing one or more electrically conductive bonding lines to provide electrical conductivity in a circuit

Electronic part mounting substrate and method for producing same

Direct write™ system

Inorganic thin layer, organic electroluminescence device including the same, and fabrication method thereof

Semiconductor device with staggered electrodes and increased wiring width

Dicing/die-bonding film, method of fixing chipped work and semiconductor device

Flip chip stacked package

Multi-dice chip scale semiconductor components

Buried solder bumps for AC-coupled microelectronic interconnects

Zero capacitance bondpad utilizing active negative capacitance

Pad structures including insulating layers having a tapered surface

Flip-chip interconnect with increased current-carrying capability

Adhesive sheet for producing a semiconductor device

Electronic devices with small functional elements supported on a carrier

Array-molded package heat spreader and fabrication method therefor

Leadframe-based mold array package heat spreader and fabrication method therefor

Leadless semiconductor package

Chip stack package and manufacturing method thereof

High-frequency chip packages

Integrated circuit package having inductance loop formed from a bridge interconnect

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Integrated circuit package having an inductance loop formed from a multi-loop configuration

Semiconductor device using bumps, method for fabricating same, and method for forming bumps

Semiconductor light-emitting device having a semiconductor light-emitting element mounted on a substrate with anisotropically conductive adhesive interposed therebetween

Thermal conductive material utilizing electrically conductive nanoparticles

Solder-fill application for mounting semiconductor chip on PCB

Wafer-level chip scale package

Wirebonding insulated wire and capillary therefor

Circuit board and method of manufacturing the same

Process for forming lead-free bump on electronic component

Method of enhancing the adhesion between photoresist layer and substrate and bumping process

Active area bonding compatible high current structures

Fluxless assembly of chip size semiconductor packages

Electronic parts packaging structure and method of manufacturing the same

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Process for making contact with and housing integrated circuits

Device transfer method and panel

Optoelectronics processing module and method for manufacturing thereof

High frequency semiconductor integrated circuit device, wireless electric unit and wireless communication system

Electric circuit substrate

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device

Microelectronic assemblies with springs

Flip chip die bond pads, die bond pad placement and routing optimization

Semiconductor integrated circuit device

Semiconductor integrated circuit device

Ball grid array package, stacked semiconductor package and method for manufacturing the same

Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device

[CHIP STRUCTURE]

Package module for an IC device and method of forming the same

Coolant cooled type semiconductor device

Semiconductor package with improved chip attachment and manufacturing method thereof

Circuit device

Semiconductor device

Semiconductor component having dummy segments with trapped corner air

Substantially hermetic packages for semiconductor devices and substantially hermetically packaged, semiconductor devices

Semiconductor device including a semiconductor chip mounted on a metal base

Interconnections

Wirebonded assemblage method and apparatus

Method of fabricating a light emitting device

Aqueous based metal etchant

Method of metal sputtering for integrated circuit metal routing

Singulation method used in leadless packaging process

Semiconductor device and production method therefor

Semiconductor device using bumps, method for fabricating same, and method for forming bumps

Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same

Flip chip on lead frame

Process for producing a semiconductor device

Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion

Method for manufacturing semiconductor devices

Electronic component and method for manufacturing the same

CSP semiconductor device having signal and radiation bump groups

Semiconductor electronic device and method of manufacturing thereof

Semiconductor package using flexible film and method of manufacturing the same

Semiconductor device and method of manufacturing the same, circuit board and electronic instrument

Multiple stacked-chip packaging structure

Semiconductor chip with bumps and method for manufacturing the same

Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors

Power semiconductor module with deflection-resistant base plate

Method for fabricating semiconductor components using mold cavities having runners configured to minimize venting

Semiconductor package having light sensitive chips

Probe card assembly

Photo detector for weak light

Encapsulated component which is small in terms of height and method for producing the same

Process to allow electrical and mechanical connection of an electrical device with a face equipped with contact pads

Composition for removing photoresist and method of forming a bump electrode in a semiconductor device using the composition

Asymmetric plating

Method for reducing defects in post passivation interconnect process

Low fabrication cost, fine pitch and high reliability solder bump

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Fabrication method of semiconductor device

Structure and method for fine pitch flip chip substrate

Method for creating flip-chip conductive-polymer bumps using photolithography and polishing

Lead frame, semiconductor device using the same and method of producing the semiconductor device

Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials

Method for creating adhesion during fabrication of electronic devices

Cooler for cooling electric part

Under bump metallurgic layer

Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks

Tin/indium lead-free solders for low stress chip attachment

Multi-chip module

Apparatus and method for packaging circuits

Multi-functional solder and articles made therewith, such as microelectronic components

Semiconductor apparatus and method of manufacturing the same

Method for fabricating semiconductor components with thinned substrate, back side contacts and circuit side contacts

Integrated circuit package with overlapping bond fingers

Multi-chip package and manufacturing method thereof

Module with embedded semiconductor IC and method of fabricating the module

Leadframe and semiconductor package made using the leadframe

Film substrate, semiconductor device, method of manufacturing film substrate, method of manufacturing semiconductor device and method of manufacturing circuit board with semiconductor device

Topless semiconductor package

Semiconductor device and method of manufacturing the same

Light-emitting diode array

Method for manufacturing photodetector for weak light

Multi-functional solder and articles made therewith, such as microelectronic components

Wire bonders and methods of wire-bonding

Method for checking the quality of a wedge bond

Circuit board

Surface mounted electronic circuit module

Process for the production of improved metallized films

Multi-functional solder and articles made therewith, such as microelectronic components

Contact structures and methods for making same

Method for producing a semiconductor device in chip format

Integrated underfill process for bumped chip assembly

Inhibition of tin oxide formation in lead free interconnect formation

ENCAPSULATED PIN STRUCTURE FOR IMPROVED RELIABILITY OF WAFER

Fabrication of stacked microelectronic devices

Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads

Bonding structure with pillar and cap

Semiconductor integrated circuit device

Fabrication of stacked microelectronic devices