Power module with heat exchange

Conductor composition, a mounting substrate and a mounting structure utilizing the composition

Method of manufacturing a semiconductor device and a semiconductor device

Semiconductor component and method for fabricating

Inverted J-lead for power devices

Structure and method for fabricating a bond pad structure

Structure and method for reinforcing a bond pad on a chip

Electronic component with flexible contacting pads and method for producing the electronic component

Semiconductor device

Semiconductor device and the method of producing the same

Semiconductor device and method for fabricating the same

Solder bump structure for flip chip package and method for manufacturing the same

Semiconductor device having insulating material dispersed with conductive particles which establish electrical connection by penetrating to both copper conductive layer and land of wiring board

Power semiconductor module and method for producing it

Copper-based chip attach for chip-scale semiconductor packages

Arrangement with a semiconductor chip and support therefore and method for a bonded wire connection

Bonding pads with dummy patterns in semiconductor devices and methods of forming the same

Semiconductor packages for enhanced number of terminals, speed and power performance

Microelectronic device signal transmission by way of a lid

Semiconductor package with improved solder joint reliability

Chip-scale package and carrier for use therewith

Thin, thermally enhanced molded package with leadframe having protruding region

Method for manufacturing thin GaAs die with copper-back metal structures

Carrier layer for a semiconductor layer sequence and method for producing semiconductor chips

[METHOD OF FORMING BOND MICROSTRUCTURE]

Mounting method of bump-equipped electronic component and mounting structure of the same

Roller wire brake for wire bonding machine

Bonding apparatus and bonding external appearance inspection device

Nano-metal composite made by deposition from colloidal suspensions

Combination back grind tape and underfill for flip chips

Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment

Connector for making electrical contact at semiconductor scales

Fine particle film forming apparatus and method and semiconductor device and manufacturing method for the same

Method for embedding a component in a base and forming a contact

Method of forming land grid array packaged device

Fan out type wafer level package structure and method of the same

Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices

Semiconductor device and method of manufacturing thereof

Module board having embedded chips and components and method of forming the same

Power amplifier module for wireless communication devices

Chip structure with pads having bumps or wirebonded wires formed thereover or used to be tested thereto

Internally reinforced bond pads

Offset-bonded, multi-chip semiconductor device

Component

Semiconductor device manufacturing method and semiconductor device manufactured thereby

Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method

Configuration for testing the bonding positions of conductive drops and test method for using the same

Method for the hermetic encapsulation of a component

Semiconductor device package utilizing proud interconnect material

Semiconductor device manufacturing method and manufacturing apparatus

Thinned die integrated circuit package

Semiconductor device

Semiconductor device with stacked chips

Method for fabricating chip package

Multi-chips bumpless assembly package and manufacturing method thereof

Stackable integrated circuit packaging

Temperature sustaining flip chip assembly process

Semiconductor device and method for fabricating the same

Semiconductor package with a chip on a support plate

Thin package for stacking integrated circuits

Integrated circuit package overlay

Method for making dual gauge leadframe

Low-power semiconductor chip with separated power ring, method for manufacturing the same, and method for controlling the same

Chip package and electrical connection structure between chip and substrate

Chip and wafer integration process using vertical connections

Semiconductor device

Capillary with contained inner chamfer

Multi-part capillary

Method of manufacturing circuits

Electroplating method for a semiconductor device

Method and substrate to control flow of underfill

Method for electrical interconnection of angularly disposed conductive patterns

System and method used in attaching die for ball grid arrays

Method for forming MEMS grid array connector

Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices

Method of manufacturing semiconductor device and system of manufacturing semiconductor device

Methods of reducing bleed-out of underfill and adhesive materials

Techniques for joining an opto-electronic module to a semiconductor package

Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus

Electronic device and method of manufacturing same

Resonator device, electronic equipment provided with resonator device and method of manufacturing resonator device

Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification

Circuit layout structure

Substrate for mounting semiconductor chip, mounting structure of semiconductor chip, and mounting method of semiconductor chip

Stacked semiconductor device

Semiconductor interconnect having conductive spring contacts

Selective deposition of solder ball contacts

Semiconductor device and method of manufacturing the same

Semiconductor testing device

Method of making multichip wafer level packages and computing systems incorporating same

Method of manufacturing a semiconductor device including using a sealing resin to form a sealing body

Formation of circuitry with modification of feature height

Semiconductor device and manufacturing method thereof

Semiconductor device and method for assembling the same

Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)

Light emitting diode lamp

Method of manufacturing a solid state image sensing device

Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers

Roughened bonding pad and bonding wire surfaces for low pressure wire bonding

Apparatus for manufacturing semiconductor devices, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method

Method for anodic bonding of wafers and device

Semiconductor device and its manufacturing method, and semiconductor device manufacturing system

Semiconductor device and method of fabricating the same

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Electronics circuit manufacture

Wiring base with wiring extending inside and outside of a mounting region

Bond pad

Wire bond integrity test system

Bonding structure with buffer layer and method of forming the same

Light source apparatus with light-emitting chip which generates light and heat

Semiconductor device and method of making the same

Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device

Semiconductor chip, semiconductor device, circuit board, and electronic instrument

Bump-on-lead flip chip interconnection

Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same

Method for mounting semiconductor chip and semiconductor chip-mounted board

Wafer level packages for chips with sawn edge protection

Customized microelectronic device and method for making customized electrical interconnections

Module assembly and method for stacked BGA packages

Highly reliable stack type semiconductor package

Chip adhesive

Encapsulated chip and procedure for its manufacture

Low loop height ball bonding method and apparatus

Bonding apparatus

Bonding tool with resistance

Methods and apparatus for integrated circuit device power distribution via internal wire bonds

Device having a complaint element pressed between substrates

Film adhesives containing maleimide compounds and methods for use thereof

Method of manufacturing a semiconductor device

Method of manufacturing semiconductor device, semiconductor device, circuit board, and electronic instrument

Techniques for packaging multiple device components

Method of applying a pattern of particles to a substrate

Structure and method for lead free solder electronic package interconnections

Power amplifier device

Wafer level chip scale packaging structure and method of fabricating the same

Conductive bumps with insulating sidewalls and method for fabricating

Bond pad for flip chip package

Conductive bumps with non-conductive juxtaposed sidewalls

Flip chip device having supportable bar and mounting structure thereof

Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate

Seedless wirebond pad plating

Barrier layers for tin-bearing solder joints

Use of palladium in IC manufacturing with conductive polymer bump

STABILIZING COPPER OVERLAYER FOR ENHANCED C4 INTERCONNECT RELIABILITY

Corrosion-resistant bond pad and integrated device

Wafer-level package and its manufacturing method

Method of fabricating semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surface

Circuit device and manufacturing method thereof

Semiconductor package

Semiconductor device with magnetically permeable heat sink

Optimum padset for wire bonding RF technologies with high-Q inductors

Semiconductor chip package and method

Wafer level stack structure for system-in-package and method thereof

Methods and apparatus for packaging integrated circuit devices

Semiconductor device

Integrated circuit carrier apparatus method and system

Molded leadless package having a partially exposed lead frame pad

Semiconductor device and manufacturing method thereof

Semiconductor element, semiconductor device, and method for manufacturing semiconductor element

Method for selective electroplating of semiconductor device I/O pads using a titanium-tungsten seed layer

Compliant interconnect assembly

Method for forming bond pad openings

Integrated circuit device and the manufacturing method thereof

Method of manufacturing a semiconductor device

Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same

Test system with interconnect having conductive members and contacts on opposing sides

Techniques for joining an opto-electronic module to a semiconductor package

Hyperbga buildup laminate

Mounting method for a semiconductor component

Inductor formed in an integrated circuit

Semiconductor device having a bond pad and method therefor

Bonding structure with compliant bumps

Semiconductor device and method of manufacturing the same

Method for producing an adhesive bond and adhesive bond between a chip and a planar surface

Using backgrind wafer tape to enable wafer mounting of bumped wafers

Semiconductor package

Semiconductor package board using a metal base

Semiconductor device with semiconductor chip and rewiring layer and method for producing the same

FBGA arrangement

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Lead frame and semiconductor package with the same

Semiconductor device having a semiconductor chip mounted on external terminals and fabrication method thereof

Semiconductor device

Method of forming wirings for tile-shaped elements, structures of wirings for tile-shaped elements, and electronic equipment

Design of an insulated cavity

Apparatus and method for mounting electronic components

Ball mounting method

Apparatus and method for low pressure wirebond

Electronic part, and electronic part mounting element and an process for manufacturing such the articles

Method and system for integrated circuit bonding

Fabrication method of semiconductor package with heat sink

Semiconductor device and manufacturing method thereof

Bond pad scheme for Cu process

Structure and method of making capped chips having vertical interconnects

Process for strengthening semiconductor substrates following thinning

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

System to couple integrated circuit die to substrate

Fabrication method of semiconductor integrated circuit device

Wire loop height measurement apparatus and method

Chip scale packaged semiconductor device

Semiconductor device

Bonding pad structure

Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components

Electronic circuit device, and method and apparatus for manufacturing the same

Integrated interconnect package

Semiconductor chip and semiconductor device including lamination of semiconductor chips

Semiconductor device and method for fabricating the same

Multi-surface contact IC packaging structures and assemblies

Semiconductor circuit with multiple contact sizes

Method of manufacturing a semiconductor device having an enhanced electrode pad structure

Semiconductor device and method of manufacturing the same

Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof

Semiconductor device having metal plates and semiconductor chip

Multi-surface IC packaging structures and methods for their manufacture

Flip-chip sub-assembly, methods of making same and device including same

Power semiconductor device and power semiconductor module

Modular power semiconductor module

Semiconductor device

Plastic package and method of fabricating the same

Chip package with die and substrate

Semiconductor package capable of absorbing electromagnetic wave

Semiconductor device and method of fabricating the same

Technique for attaching die to leads

Semiconductor device and wire bonding method

Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece

Bath and method for high rate copper deposition

Circuit device

Use of a down-bond as a controlled inductor in integrated circuit applications

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Chip package with die and substrate

Method of forming multi-piled bump

Method of fabricating ultra thin flip-chip package

Method for forming solder bump structure

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding

Method of manufacturing a semiconductor device

Method of manufacturing a semiconductor device

Circuit device

Use of an internal on-chip inductor for electrostatic discharge protection of circuits which use bond wire inductance as their load

No-flow underfill composition and method

Method for reduced input output area

RF circuit electrostatic discharge protection

Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof

Electronic device

Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

Back-face and edge interconnects for lidded package

Semiconductor chip package and method for making the same

Circuit device

Electromagnetic noise shielding in semiconductor packages using caged interconnect structures

Microelectronic component and assembly having leads with offset portions

Chip package structure and process for fabricating the same

Electronic module having plug contacts and method for producing it

Electronic substrate, power module and motor driver

Chip scale package and method of fabricating the same

Method for fabricating a semiconductor package with multi layered leadframe

Chip structure and process for forming the same

Integrated circuit bond pad structures and methods of making

Semiconductor device and fabrication method for the same

Vertical removal of excess solder from a circuit substrate

Automated filament attachment system for vacuum fluorescent display

Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing

Device for processing a wire

Radio frequency unit analog level detector and feedback control system

Method for forming metal contacts on a substrate

Processes and tools for forming lead-free alloy solder precursors

Method of forming bumps

System and method for reducing or eliminating semiconductor device wire sweep

Structure and method of making capped chips using sacrificial layer

Method of electrically connecting a microelectronic component

Method of manufacturing a semiconductor device

Thinned, strengthened semiconductor substrates and packages including same

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Semiconductor device manufacturing method

Output circuit for a semiconductor amplifier element

RF amplifier

Rectifier diode device

Method for producing semiconductor device and semiconductor device

Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion

Semiconductor component and production method suitable therefor

Integrated circuit with copper interconnect and top level bonding/interconnect layer

Electronic circuit device and porduction method therefor

Radio card

Semiconductor device

Simplified stacked chip assemblies

Structure and self-locating method of making capped chips

Structure and method of making sealed capped chips

Methods of coating and singulating wafers

Integrated circuit packaging system

Package for semiconductor device having a device-supporting polymeric material covering a solder ball array area

Chip package and electrical connection structure between chip and substrate

Semiconductor element, semiconductor device, method for manufacturing semiconductor element, method for manufacturing semiconductor device, and electronic apparatus

STRUCTURE OF WAFER LEVEL PACKAGE WITH AREA BUMP

Semiconductor device using insulating film of low dielectric constant as interlayer insulating film

Large bumps for optical flip chips

Large bumps for optical flip chips

Methods for forming patterns on a filled dielectric material on substrates

Self-locking wire bond structure and method of making the same

Die bonding apparatus and method for bonding semiconductor chip using the same

Method for low temperature bonding and bonded structure

Deposition of diffusion barrier