212040 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Arsenic [As]
Conductive block mounting process for electrical connection
#15002Semiconductor integrated circuit package having electrically disconnected solder balls for mounting
#15003Manufacturing method of semiconductor device
#15004Packaged microelectronic components
#15005Method of manufacturing a semiconductor device
#15006Method of bonding semiconductor devices
#15007Power supply device
#15008Low-inductance circuit arrangement for power semiconductor modules
#15009Voltage protection device
#15010Semiconductor device and semiconductor device manufacturing method
#15011Pad over active circuit system and method with meshed support structure
#15012Semiconductor apparatus including a radiator for diffusing the heat generated therein
#15013High reliability chip scale package
#15014Semiconductor device with strain relieving bump design
#15015CHIP STRUCTURE WITH BUMPS AND A PROCESS FOR FABRICATING THE SAME
#15016Solder pads and method of making a solder pad
#15017Multi-chip module having bonding wires and method of fabricating the same
#15018Semiconductor device and a method of manufacturing the same
#15019Semiconductor device and a method of manufacturing the same
#15020Multi-chips module package and manufacturing method thereof
#15021Semiconductor device and method of fabricating the same, circuit board, and electronic instrument
#15022Semiconductor device and its manufacturing method
#15023Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package
#15024Stacked chip-packaging structure
#15025Packaged microelectronic devices and methods of forming same
#15026Method for fabricating semiconductor component with chip on board leadframe
#15027Semiconductor component having chip on board leadframe
#15028Electronic device package
#15029Standoffs for centralizing internals in packaging process
#15030Semiconductor device and manufacturing method thereof
#15031Method and apparatus for flip chip attachment by post collapse re-melt and re-solidification of bumps
#15032Method of manufacturing a semiconductor device by forming plating layers having differing thicknesses
#15033Telemetry system for use with microstimulator
#15034Stable electroless fine pitch interconnect plating
#15035Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
#15036Method for forming bump protective collars on a bumped wafer
#15037Bumping process
#15038Methods of forming conductive structures including titanium-tungsten base layers and related structures
#15039Method and apparatus for attaching microelectronic substrates and support members
#15040Method for making electronic devices including silicon and LTCC and devices produced thereby
#15041Semiconductor package having semiconductor constructing body and method of manufacturing the same
#15042Method of fabricating flip chip ball grid array package
#15043Module part
#15044Semiconductor component of semiconductor chip size with flip-chip-like external contacts, and method of producing the same
#15045Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same
#15046Multi-level redistribution layer traces for reducing current crowding in flipchip solder bumps
#15047Wirebond pad for semiconductor chip or wafer
#15048Semiconductor component having conductors with wire bondable metalization layers
#15049Semiconductor device with connections for bump electrodes
#15050Wafer level processing method and structure to manufacture two kinds of interconnects, gold and solder, on one wafer
#15051Structure of multi-tier wire bonding for high frequency integrated circuit
#15052Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device
#15053Interconnecting component
#15054Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same
#15055Method of stacking semiconductor element in a semiconductor device
#15056Semiconductor device and switching element
#15057Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package
#15058Semiconductor device with electrical connection balls between an integrated circuit chip and a support plate, and process for fabricating it
#15059Process for fabricating a semiconductor package and semiconductor package with leadframe
#15060Light-emitting semiconductor component
#15061[PROCESS FOR FABRICATING BUMPS]
#15062Method of manufacturing semiconductor device and manufacturing apparatus of semiconductor device
#15063Forming tool for forming a contoured microelectronic spring mold
#15064Method for manufacturing optical waveguide, optical waveguide device, electro-optical apparatus and electronic apparatus
#15065Method, system, and apparatus for transfer of dies using a pin plate
#15066Substrate holder and plating apparatus
#15067Method for forming a bond pad interface
#15068Under-bump metallization layers and electroplated solder bumping technology for flip-chip
#15069Underfill method
#15070Stencil mask design method and under bump metallurgy for C4 solder bump
#15071Method for producing an integrated circuit with a rewiring device and corresponding integrated circuit
#15072Electronic component-built-in module
#15073Semiconductor assembly encapsulation mold and method for forming same
#15074Chip package structure
#15075Wafer-level chip scale package and method for fabricating and using the same
#15076Semiconductor device, semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module
#15077Chip structure
#15078Semiconductor interconnect having compliant conductive contacts
#15079Semiconductor device including a diffusion layer
#15080Reconnectable chip interface and chip package
#15081Under-bump metallugical structure
#15082Semiconductor device having chip size package with improved strength
#15083Method of surface-mounting semiconductor chip on PCB
#15084Semiconductor unit with cooling system
#15085Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices
#15086Cutting method and method of manufacturing semiconductor device
#15087Reconnectable chip interface and chip package
#15088Modular power semiconductor module
#15089Semiconductor device including inclined cut surface and manufacturing method thereof
#15090Semiconductor packaging structure
#15091Dual gauge leadframe
#15092Semiconductor device including a potential drawing portion formed at a corner
#15093Semiconductor device
#15094Power MOSFET, power MOSFET packaged device, and method of manufacturing power MOSFET
#15095Semiconductor device wiring structure
#15096Low temperature bonding of multilayer substrates
#15097Method of fabricating an electronic device
#15098Semiconductor manufacturing apparatus, and method for manufacturing semiconductor device
#15099Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device
#15100Wafer level bumping process
#15101Method for forming a bonding pad of a semiconductor device including a plasma treatment
#15102Manufacturing method for semiconductor device
#15103Method and apparatus for self-assembly of functional blocks on a substrate facilitated by electrode pairs
#15104Electronic semiconductor device having a thermal spreader
#15105Aluminum cap with electroless nickel/immersion gold
#15106Underfill and encapsulation of carrier substrate-mounted flip-chip components
#15107Method of manufacturing a plurality of assemblies
#15108Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages
#15109Semiconductor device and method of manufacturing the same, cirucit board, and electronic instrument
#15110Process for producing semiconductor device and semiconductor device
#15111Manufacturing method of semiconductor device, including differently spaced bump electrode arrays
#15112Semiconductor integrated device including support substrate fastened using resin, and manufacturing method thereof
#15113Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus used in it
#15114Method, system, and apparatus for transfer of dies using a die plate having die cavities
#15115Semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module
#15116Laminated sheet
#15117Interlayer dielectric and pre-applied die attach adhesive materials
#15118Method, system, and apparatus for authenticating devices during assembly
#15119Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#15120Semiconductor device and method of manufacturing the same
#15121Semiconductor device, manufacturing method thereof, electronic device, electronic equipment
#15122[BONDING PAD STRUCTURE]
#15123Packaging assembly and method of assembling the same
#15124Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board
#15125Semiconductor device and method of fabricating the same
#15126Manufacturing method for multichip module
#15127Semiconductor device and manufacturing method thereof
#15128Semiconductor device having aluminum and metal electrodes and method for manufacturing the same
#15129Pre-back-grind and underfill layer for bumped wafers and dies
#15130Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#15131Semiconductor device
#15132Method of manufacturing a semiconductor device including a protruding electrode bonded to a lead electrode
#15133Bump electrodes having multiple under ball metallurgy (UBM) layers
#15134Method for packaging electronic modules and multiple chip packaging
#15135Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking
#15136Semiconductor device and method of manufacturing the same, circuit board, together with electronic instrument
#15137Semiconductor device
#15138Integrated semiconductor power device for multiple battery systems
#15139Semiconductor device and method for manufacturing the same
#15140Multiple chip semiconductor package
#15141Fabrication method for stacked multi-chip package
#15142In-line apparatus and method for manufacturing double-sided stacked multi-chip packages
#15143High frequency semiconductor module, high frequency semiconductor device and manufacturing method for the same
#15144Semiconductor packages for enhanced number of terminals, speed and power performance
#15145Partially patterned lead frames and methods of making and using the same in semiconductor packaging
#15146Selective consolidation processes for electrically connecting contacts of semiconductor device components
#15147Bonding pad for a packaged integrated circuit
#15148Surface mount multichip devices
#15149Arrangement comprising a capacitor
#15150Method of fabricating semiconductor memory device and semiconductor memory device driver
#15151Circuit board with built-in electronic component and method for manufacturing the same
#15152Method, system, and apparatus for high volume transfer of dies
#15153Method and apparatus for low temperature copper to copper bonding
#15154Method and apparatus for low temperature copper to copper bonding
#15155Process of forming bonding columns
#15156Three-dimensional stacked substrate arrangements
#15157Semiconductor device and manufacturing method thereof
#15158Manufacturing method of semiconductor device
#15159Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages
#15160System and method for increasing the strength of a bond made by a small diameter wire in ball bonding
#15161Micro lead frame package
#15162Imaging system
#15163Semiconductor package production method and semiconductor package
#15164Semiconductor device manufacturing method
#15165Methods relating to the reconstruction of semiconductor wafers for wafer-level processing
#15166Semiconductor device fabrication method
#15167Method and apparatus for non-conductively interconnecting integrated circuits
#15168System and method for controlling integrated circuit die height and planarity
#15169Semiconductor device having a plurality of semiconductor chips and method for manufacturing the same
#15170Corrosion-resistant copper bond pad and integrated device
#15171Corrosion-resistant bond pad and integrated device
#15172Semiconductor device
#15173Semiconductor device with under bump metallurgy and method for fabricating the same
#15174Chip package with grease heat sink
#15175Chip scale package and method of fabricating the same
#15176Semiconductor device, electronic device, electronic equipment, and method of manufacturing semiconductor device
#15177Substrate for semiconductor package and wire bonding method using thereof
#15178Ultra wideband BGA
#15179Method for forming semiconductor device including stacked dies
#15180Semiconductor device and lead frame
#15181Method of mounting electronic part and flux-fill
#15182Moly mask construction and process
#15183Anodes for electroplating operations, and methods of forming materials over semiconductor substrates
#15184Transfer assembly for manufacturing electronic devices
#15185Apparatuses and methods for monitoring health of probing u-bump cluster using current divider
#15186Semiconductor device with leadframe configured to facilitate reduced burr formation
#15187Flip chip cavity package
#15188Molded leadframe substrate semiconductor package
#15189Integrated chip package structure using silicon substrate and method of manufacturing the same
#15190Chip package with die and substrate