Semiconductor device with leadframe configured to facilitate reduced burr formation

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

Not Applicable

STATEMENT RE: FEDERALLY SPONSORED RESEARCH/DEVELOPMENT

Not Applicable

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to integrated circuit package technology and, more particularly, to an increased capacity semiconductor device or package which includes a leadframe defining a plurality of leads which are arranged and partially etched in a manner facilitating a substantial reduction in burr formation resulting from a saw singulation process used to complete the fabrication of the semiconductor device.

2. Description of the Related Art

Semiconductor dies are conventionally enclosed in plastic packages that provide protection from hostile environments and enable electrical interconnection between the semiconductor die and an underlying substrate such as a printed circuit board (PCB) or motherboard. The elements of such a package include a metal leadframe, an integrated circuit or semiconductor die, bonding material to attach the semiconductor die to the leadframe, bond wires which electrically connect pads on the semiconductor die to individual leads of the leadframe, and a hard plastic encapsulant material which covers the other components and forms the exterior of the semiconductor package commonly referred to as the package body.

The leadframe is the central supporting structure of such a package, and is typically fabricated by chemically etching or mechanically stamping a metal strip. A portion of the leadframe is internal to the package, i.e., completely surrounded by the plastic encapsulant or package body. Portions of the leads of the leadframe may extend externally from the package body or may be partially exposed therein for use in electrically connecting the package to another component. In certain semiconductor packages, a portion of the die pad of the leadframe also remains exposed within the package body.

Leadframes for semiconductor devices or packages can be largely classified into copper-based leadframes (copper/iron/phosphorous; 99.8/0.01/0.025), copper alloy-based leadframes (copper/chromium/tin/zinc; 99.0/0.25/0.22), and alloy 42-based leadframes (iron/nickel; 58.0/42.0) according to the composition of the elements or materials included in the leadframe. Exemplary semiconductor devices employing leadframes include a through-hole mounting dual type inline package (DIP), a surface mounting type quad flat package (QFP), and a small outline package (SOP). The aforementioned semiconductor devices are particularly advantageous for their smaller size and superior electrical performance.

Leadframe based semiconductor devices such as those described above are typically fabricated using techniques wherein material removal processes such as sawing or punching are used to effectively electrically isolate various leads of the individual leadframe within the semiconductor device from each other and further to separate multiple leadframes within a matrix-type array from each other. However, such sawing or punching process often results in undesirable burr formation on the individual leads of each semiconductor device. In those semiconductor devices wherein the pitch between the adjacent leads is small, such burrs could have the effect of electrically shorting certain leads to each other. To prevent this occurrence, post-treatment is necessarily performed to remove the burrs after completing the manufacturing process. However, the need to complete such post-treatment process increases the manufacturing cost, and may further degrade the reliability of the device. The present invention addresses this issue by providing a semiconductor device which includes a leadframe defining a plurality of leads which are arranged and partially etched in a manner facilitating a substantial reduction in burr formation resulting from a saw singulation process used to complete the fabrication of the semiconductor device. These, as well as other features and attributes of the present invention will be discussed in more detail below.

BRIEF DESCRIPTION OF THE DRAWINGS

These, as well as other features of the present invention, will become more apparent upon reference to the drawings wherein:

FIG. 1A is a top plan view of an unsingulated leadframe which is integrated into a semiconductor device or package constructed in accordance with the present invention;

FIG. 1B is a bottom plan view of an unsingulated leadframe shown in FIG. 1A;

FIG. 2A is a cross-sectional view of the leadframe taken along line 2A-2A of FIG. 1A;

FIG. 2B is a cross-sectional view of the leadframe taken along line 2B-2B of FIG. 1A;

FIG. 2C is a cross-sectional view of the leadframe taken along line 2C-2C of FIG. 1A;

FIG. 2D is a cross-sectional view of the leadframe taken along line 2D-2D of FIG. 1A;

FIG. 3A is an enlargement of the region 3A shown in FIG. 1A;

FIG. 3B is an enlargement of the region 3B shown in FIG. 1B;

FIGS. 4A and 4B are cross-sectional views of a semiconductor device of the present invention as fabricated to include the leadframe shown in FIGS. 1A and 1B subsequent to the singulation thereof;

FIGS. 5A and 5B are partial side-elevational views of the semiconductor device shown in FIGS. 4A and 4B;

FIG. 6 is a flow chart illustrating an exemplary fabrication method for the semiconductor device shown in FIGS. 4A and 4B; and

FIGS. 7A-7D are views illustrating an exemplary fabrication method for the semiconductor device shown in FIGS. 4A and 4B.

Common reference numerals are used throughout the drawings and detailed description to indicate like elements.

DETAILED DESCRIPTION OF THE INVENTION

Referring now to the drawings wherein the showings are for purposes of illustrating preferred embodiments of the present invention only, and not for purposes of limiting the same, FIGS. 4A and 4B depict a semiconductor package or device 200 constructed in accordance with the present invention. The leadframe 100 integrated into the semiconductor package 200 is shown in its unsingulated state in FIGS. 1A and 1B.

Referring now to FIGS. 1A-1B, 2A-2D, and 3A-3B, the leadframe 100 comprises a generally quadrangular (e.g., square) die paddle or die pad 110 which defines four peripheral edge segments. Additionally, the die pad 110 defines opposed, generally planar top and bottom surfaces 111, 112. As seen in FIGS. 2A and 2B, the die pad 110 of the leadframe 100 is not of uniform thickness. Rather, a peripheral portion of the bottom surface 112 of the die pad 110 is partially etched (e.g., half-etched) to define an etched surface 113. More particularly, the etched surface 113, which is recessed relative to the remainder of the bottom surface 112 of the die pad 110, is segregated into four segments, with each of these segments extending along a respective one of peripheral edge segments of the die pad 110 and between a respective pair of tie bars 114 of the leadframe 100 which are described in more detail below. In FIG. 1B, which is a bottom plan view of the leadframe 100, the etched surface 113 in the bottom surface 112 of the die pad 110 is indicated by the condensed hatching which slopes downwardly from right to left.

As will be discussed in more detail below, in the fabrication process for the semiconductor device 200 including the leadfame 100, a semiconductor die is attached to the top surface 111 of the die pad 110 through the use of an adhesive layer, with an encapsulant material thereafter being applied to the semiconductor die and the leadframe 100 to form the package body of the semiconductor device 200. Advantageously, the etched surface 113 formed in the peripheral portion of the bottom surface 112 of the die pad 110 as indicated above effectively increases the distance along which moisture must travel to reach the semiconductor die mounted to the top surface 111 of the die pad 110. As a result, such semiconductor die is safely protected against moisture in the completed semiconductor device 200. Additionally, the flow of encapsulant material over the etched surface 113 during the formation of the package body of the semiconductor device 200 facilitates the creation of a mechanical interlock between the package body and the die pad 110.

As indicated above, integrally connected to the die pad 110 are a plurality of tie bars 114. More particularly, the leadframe 100 includes four tie bars 114 which extend diagonally from respective ones of the four corner regions defined by the die pad 110. As seen in FIGS. 1A and 1B, the tie bars 120 are integrally connected to a generally quadrangular frame or dambar 150 which circumvents the die pad 110 and is disposed in spaced relation thereto. The tie bars 114 are identically configured to each other, and extend diagonally outwardly at predetermined lengths from respective ones of the corner regions of the die pad 110, with the integral connection of the tie bars 120 to the dambar 150 effectively supporting the die pad 110 within the interior of the dambar 150. However, as is apparent from FIGS. 1A and 1B, each of the tie bars 114 does not have an uninterrupted, linear configuration. Rather, each of the tie bars 114 defines a generally straight or linear inner portion which is integrally connected to and extends from a respective corner region of the die pad 110. The inner portion transitions into an angled pair of outer portions which are each integrally connected to the dambar 150.

As further shown in FIG. 1A, each of the tie bars 114 defines a generally planar top surface which extends in generally co-planar relation to the top surface 111 of the die pad 110. However, as shown in FIG. 1B, each tie bar 114 further defines an etched bottom surface which extends along the entire length of the inner and outer portions thereof. The etched bottom surface of each tie bar 114 extends in generally co-planar relation to the etched surface 113 of the die pad 110. In FIG. 1B, the etched bottom surface of each tie bar 114 is indicated by the condensed hatching which slopes downwardly from right to left. During the fabrication process for the semiconductor device 200 including the leadframe 100, the encapsulant material used to form the package body of the semiconductor device 200 is also able to flow over the etched bottom surfaces of the tie bars 114, thus resulting in the tie bars 114 being encapsulated by the package body of the semiconductor device 200 which enhances the bonding or mechanical interlock therebetween.

As indicated above, the tie bars 114 are integrally connected to the dambar 150 which circumvents the die pad 110. In the leadframe 100, the dambar 150 is provided in the form of a substantially quadrangular (e.g., square) ring which interconnects the distal outer portions of the tie bars 114. As best seen in FIGS. 1A and 1B, the dambar 150 defines four peripheral segments which extend in spaced, generally parallel relation to respective ones of the peripheral edge segments of the die pad 110. In a fabrication process for the semiconductor package 200 which will be described in more detail below, the dambar 150 is singulated or removed from the leadframe 100 to electrically isolate other structural features of the leadframe 100 from each other.

The leadframe 100 further comprises a plurality of first leads 120. The first leads 120 are preferably segregated into four (4) sets, with each set of the first leads 120 extending generally perpendicularly from a corresponding one of the peripheral segments of the dambar 150 toward a respective one of the peripheral edge segments of the die pad 110. Each of the first leads 120 is sized such that the inner, distal end thereof is spaced a predetermined distance from the corresponding peripheral edge segment of the die pad 110. From the perspectives shown in FIGS. 1A and 1B, each of the first leads 120 includes a generally planar first or top surface 121 and an opposed, generally planar second or bottom surface 122.

As is best seen in FIGS. 2A, 3A and 3B, each of the first leads 120 is not of uniform thickness. Rather, each of the first leads 120 is partially etched to include a bottom etched surface 123 which is disposed in opposed relation to the top surface 121, but is recessed relative to the bottom surface 122. As is seen in FIG. 3B, the bottom etched surface 123 extends to the distal end of the corresponding first lead 120 which is disposed closest to the corresponding peripheral edge segment of the die pad 110. In FIG. 3B, the bottom etched surface 123 of each first lead 120 is indicated by the condensed hatching which slopes downwardly from right to left. As will be recognized, the thickness of each first lead 120 between the top and bottom surfaces 121, 122 exceeds the thickness between the top surface 121 and the bottom etched surface 123.

In addition to the bottom etched surface 123, each first lead 120 is partially etched to include a top etched surface 125 which is disposed in opposed relation to the bottom surface 122, and is recessed relative to the top surface 121. In addition to being recessed relative to the top surface 121, the top etched surface 125 of each first lead 120 extends from the top surface 121 to a corresponding peripheral segment of the dambar 150. The thickness of each first lead 120 between the top and bottom surfaces 121, 122 also exceeds the thickness between the bottom surface 122 and the top etched surface 125. In FIG. 3A, the top etched surface 125 of each first lead 120 is indicated by cross hatching. As is most apparent from FIG. 2A, the top and bottom surfaces 121, 122 of each first lead 120 extend in substantially coplanar relation to respective ones of the top and bottom surfaces 111, 112 of the die pad 110. Further, the bottom and top etched surfaces 123, 125 of each first lead 120 extend in substantially coplanar relation to each other and to the etched surface 113 of the die pad 110. Those of ordinary skill in the art will recognize that the number of first leads 120 included in each set thereof may vary from that shown. In FIGS. 1A and 1B without departing from the spirit and scope of the present invention.

In FIGS. 1A and 1B, the leadframe 100 is shown in its unsingulated state as positioned within a matrix of interconnected leadframes 100. In this regard, each first lead 120 of that leadframe 100 shown in its entirety in FIGS. 1A and 1B extends in opposed relation to a corresponding, identically configured first lead 120 of an adjacent leadframe 100. As such, each peripheral segment of the dambar 150 shown in FIGS. 1A and 1B includes two sets of first leads 120 extending generally perpendicularly from each of the opposite sides thereof. Stated another way, for each peripheral segment of the dambar 150 shown in FIGS. 1A and 1B, a corresponding set of the first leads 120 of that leadframe 100 shown in its entirety extends generally perpendicularly from one side thereof, with one set of the first leads 120 of an adjacent leadframe 100 extending generally perpendicularly from the opposite side thereof in opposed relation to respective ones of the first leads 120 of the remaining set.

As best seen in FIG. 3A, each peripheral segment of the dambar 150 is provided with multiple top etched regions 151 which extend between or “bridge” the etched top surfaces 125 of respective ones of each of the opposed pairs of first leads 120 in the interconnected leadframes 100. As best seen in FIG. 2A, the etched top surfaces 125 of each opposed pair of the first leads 120 protruding from a common peripheral segment of the depicted dambar 150, and the corresponding intervening top etched region 151 of the dambar 150, extend in generally coplanar relation to each other.

The leadframe 100 further comprises a plurality of second leads 130. Like the first leads 120, the second leads 130 are preferably segregated into four (4) sets, with each set of the second leads 130 extending generally perpendicularly from a corresponding one of the peripheral segments of the dambar 150 toward a respective one of the peripheral edge segments of the die pad 110. Each of the second leads 130 is sized such that the inner, distal end thereof is spaced a predetermined distance from the corresponding peripheral edge segment of the die pad 110. From the perspectives shown in FIGS. 1A and 1B, each of the second leads 130 includes a generally planar first or top surface 131 and an opposed, generally planar second or bottom surface 132.

As is best seen in FIGS. 2A, 3A and 3B, each of the second leads 130 is not of uniform thickness. Rather, each of the second leads 130 is partially etched to include a bottom etched surface 133 which is disposed in opposed relation to the top surface 131, but is recessed relative to the bottom surface 132. As best seen in FIG. 3B, the bottom etched surface 133 is segregated by the bottom surface 132 into a first segment 133a which extends to the distal end of the corresponding second lead 130 which is disposed closest to the corresponding peripheral edge segment of the die pad 110, and a second segment 133b which extends between the bottom surface 132 and a corresponding peripheral segment of the dambar 150. In FIG. 3B, the first and second segments 133a, 133b of the bottom etched surface 133 of each second inner lead 130 are each indicated by the condensed hatching which slopes downwardly from right to left. As will be recognized, the thickness of each second inner lead 130 between the top and bottom surfaces 131, 132 exceeds the thickness between the top surface 131 each of the first and second segments 133a, 133b of the bottom etched surface 133.

As is most apparent from FIG. 2B, the top and bottom surfaces 131, 132 of each second inner lead 130 extend in substantially coplanar relation to respective ones of the top and bottom surfaces 111, 112 of the die pad 110. Further, the first and second segments 133a, 133b of the bottom etched surface 133 of each second inner lead 130 each extend in substantially coplanar relation to the etched surface 113 of the die pad 110, and to the bottom and top etched surfaces 123, 125 of the first leads 120. Those of ordinary skill in the art will recognize that the number of second inner leads 130 included in each set thereof may vary from that shown. In FIGS. 1A and 1B without departing from the spirit and scope of the present invention.

As indicated above, in FIGS. 1A and 1B, the leadframe 100 is shown in its unsingulated state as positioned within a matrix of interconnected leadframes 100. In this regard, each second lead 130 of that leadframe 100 shown in its entirety in FIGS. 1A and 1B extends in opposed relation to a corresponding, identically configured second lead 130 of an adjacent leadframe 100. As such, each peripheral segment of the dambar 150 shown in FIGS. 1A and 1B includes two sets of second leads 130 extending generally perpendicularly from each of the opposite sides thereof. Stated another way, for each peripheral segment of the dambar 150 shown in FIGS. 1A and 1B, a corresponding set of the second leads 130 of that leadframe 100 shown in its entirety extends generally perpendicularly from one side thereof, with one set of the second leads 130 of an adjacent leadframe 100 extending generally perpendicularly from the opposite side thereof in opposed relation to respective ones of the second leads 130 of the remaining set.

As best seen in FIG. 3B, each peripheral segment of the dambar 150 is provided with multiple bottom etched regions 152 which extend between or “bridge” the second segments 133b of the etched bottom surfaces 133 of respective ones of each of the opposed pairs of second leads 130 in the interconnected leadframes 100. As best seen in FIG. 2B, the second segments 133b of the etched bottom surfaces 133 of each opposed pair of the second leads 130 protruding from a common peripheral segment of the depicted dambar 150, and the corresponding intervening bottom etched region 152 of the dambar 150, extend in generally coplanar relation to each other. Further, as seen in FIG. 2C, the etched top and bottom etched regions 151, 152 of the dambar 150 extend in generally coplanar relation to each other, and thus in generally coplanar relation to the bottom and top and bottom etched surfaces 123, 125 of the first leads 120, as well as the first and second segments 133a, 133b of the bottom etched surfaces 133 of the second leads 130.

In a fabrication process for the semiconductor device 200 which will be described in more detail below, the dambar 150 is singulated or removed from the leadframe 100 to electrically isolate other structural features of the leadframe 100 from each other. Additionally, during such fabrication process for the semiconductor device 200 including the leadframe 100, the encapsulant material used to form the package body of the semiconductor device 200 is able to flow over the bottom and top and bottom etched surfaces 123, 125 of the first leads 120, as well as the first and second segments 133a, 133b of the bottom etched surfaces 133 of the second leads 130, thus resulting in substantial portions of the first and second leads 120, 130 being encapsulated by the package body of the semiconductor device 200 which enhances the bonding or mechanical interlock therebetween.

The leadframe 100 may be fabricated from a conventional metal material, such as copper, copper alloy, steel plated with copper, or a functional equivalent. However, those of ordinary skill in the art will recognize that the present invention is not limited to any particular material for the leadframe 100. Additionally, as indicated above, the number of first and second leads 120, 130 shown in FIGS. 1A and 1B is for illustrative purposes only, and may be modified according to application field. Additionally, though the first and second leads 120, 130 are each shown as being segregated into four sets, it will be recognized that fewer sets thereof may be provided, and may be arranged along any combination of two or three of the peripheral sides of the die pad 110. Moreover, less than four tie bars 114 may be included in the leadframe 100, extending to respective corners of the die pad 110 in any combination.

In the leadframe 100, it is contemplated that the bottom and top and bottom etched surfaces 123, 125 of the first leads 120, the first and second segments 133a, 133b of the bottom etched surfaces 133 of the second leads 130, and the etched top and bottom etched regions 151, 152 of the dambar 150, may be formed to a depth in the range of from about ten percent (10%) to about ninety percent (90%) of the total thickness of the leadframe 100. Importantly, the formation of the top etched surfaces 125 of the first leads 120, and the second segments 133b of the bottom etched surfaces 133 of the second leads 130 to a depth of less than approximately ten percent (10%) of the total thickness of the leadframe 100 could result in the formation of burrs during a sawing process described below. Such burr formation could in turn result in certain adjacent pairs of first and second leads 120, 130 electrically shorting to each other. Conversely, the formation of the bottom etched surfaces 125 of the first leads 120 and the second segments 133b of the bottom etched surfaces 133 of the second leads 130 to a depth greater than approximately 90% of the total thickness of the leadframe 100 could result in premature separation of the first or second leads 120, 130 from the dambar 150 during the manufacturing process for the semiconductor device 200.

Referring now to FIGS. 4A and 4B, the semiconductor device or package 200 as fabricated to include the leadframe 100 is shown in detail. As will be recognized by those of ordinary skill in the art, in the completed semiconductor device 200 shown in FIGS. 4A and 4B, the dambar 150 is singulated or removed from the leadframe 100 to facilitate the electrical isolation of the various structural features of the leadframe 100 from each other. More particularly, the dambar 150 is singulated in a manner wherein the first and leads 120, 130 are electrically isolated from each other, and from the die pad 110 and tie bars 114 as well.

In the semiconductor device 200, a semiconductor die 210 is attached to the top surface 111 of the die pad 110 through the use of an adhesive layer. The semiconductor die 210 includes a plurality of terminals or bond pads 211 which are disposed on the top surface thereof opposite the bottom surface adhered to the adhesive layer. The bond pads 211 are used to deliver and receive electrical signals.

The semiconductor device 200 further comprises a plurality of conductive wires 221 which are used to electrically connect the bond pads 211 of the semiconductor die 210 to respective ones of the first and second leads 120, 130. More particularly, as seen in FIGS. 4A and 4B, the wires 221 are extended to the top surfaces 121, 131 of respective ones of the first and second leads 120, 130. The conductive wires 221 may be fabricated from aluminum, copper, gold, silver, or a functional equivalent. However, those of ordinary skill in the art will recognize that the present invention is not limited to any particular material for the wires 221. One or more conductive wires 221 may also be used to electrically connect one or more bond pads of the semiconductor die 210 directly to the die pad 110.

In the semiconductor device 200, the die pad 110, the tie bars 114, the first and second leads 120, 130, the semiconductor die 210, and the conductive wires 221 are at least partially encapsulated or covered by an encapsulant material which, upon hardening, forms a package body 230 of the semiconductor device 200. More particularly, the package body 230 covers the entirety of the die pad 110 except for the bottom surface thereof which is circumvented by the etched surface 113. The package body 230 also covers the top surfaces 121, 131 of the first and second leads 120, 130, the bottom and top etched surfaces 123, 125 of the first leads 120, and the first and second segments 133a, 133b of the bottom etched surfaces 133 of the second leads 130. The package body 230 further covers the top and etched bottom surfaces of the tie bars 114. However, the package body 230 does not cover the bottom surfaces 122, 132 of the first and second leads 120, 130. The flow of the encapsulant material over the etched surface 113, the bottom etched surfaces 123, and the first and second segments 133a, 133b of the bottom etched surfaces 133 facilitates a firm mechanical interlock between the package body 230, the die pad 110, and the first and second leads 120, 130.

As indicated above, though the package body 230 covers the etched surface 113 of the die pad 110, it does not cover the bottom surface 112 thereof. Thus, as is apparent from FIG. 7D, the bottom surface 112 of the die pad 110 and the bottom surfaces 122, 132 of the first and second leads 120, 130 are exposed in a common exterior surface of the package body 230 which, as viewed from the perspective shown in FIGS. 4A and 4B, is the bottom surface 231 thereof. As is also shown in FIG. 7D, the varying lengths of the first and second leads 120, 130 results in the bottom surfaces 122, 132 thereof which are exposed in the bottom surface 231 of the package body 230 being staggered or offset relative to each other, rather than being linearly aligned with each other. The bottom surfaces 122, 132 of the first and second leads 120, 130 may extend in substantially flush or coplanar relation to the bottom surface 231 of the package body 230, or may protrude slightly therefrom as is apparent from FIGS. 5A and 5B. As a result of their exposure in the bottom surface 231, the first and second leads 120, 130 are capable of being mounted to the surface of an underlying substrate such as a printed circuit board through the use of, for example, a soldering technique. Electrical signals are routed between the first and second leads 120, 130 and the semiconductor die 210 by the corresponding conductive wires 221.

During the process of fabricating the semiconductor device 200 as will be described in more detail below, the package body 230 is a portion of a single, unitary mold cap 240 which covers a plurality of interconnected leadframes 100 within a matrix. In this regard, it is only when such mold cap 240 and portions of the leadframes 100 covered thereby are subjected to a saw singulation process that discrete semiconductor devices 200 are fabricated having the structural features described above. For the interconnected leadframes 100 in the matrix, each dambar 150 is partially covered by the encapsulant material used to form such mold cap 240 and ultimately the individual package bodies 230 singulated therefrom. More particularly, as is best seen in FIG. 7C, the encapsulant material used to form the mold cap 240 covers the entirety of the top surface of each dambar 150, including the top etched regions 151 formed therein. However, the bottom surface of each dambar 150 is, for the most part, not covered by the mold cap 240. Rather, as seen in FIG. 7C, only the bottom etched regions 152 within each dambar 150 are covered by the mold cap 240.

As will also be described in more detail below, the dambar 150 separating adjacent interconnected leadframes 100 in the matrix from each other is ultimately removed or singulated by the completion of a sawing process which concurrently segregates the mold cap 240 into the individual package bodies 230 of the discrete semiconductor devices 200. As seen in FIGS. 4A, 4B and 5A, 5B, each completed package body 230 formed as a result of the aforementioned saw singulation process defines a side surface 232 which extends generally perpendicularly relative to the bottom surface 231. The removal of the dambar 150 by such saw singulation process, in addition to facilitating the electrical isolation of the first and second leads 120, 130 of each individual leadframe 100 from each other, further results in each of the first leads 120 defining a generally planar outer end 124 which is exposed in the side surface 232 of a corresponding package body 230, and each of the second leads 130 also defining a generally planar outer end 134 exposed in such side surface 232 as well. As seen in FIGS. 4A and 4B, the outer ends 124, 134 of the first and second leads 120, 130 are substantially flush or coplanar with the side surface 232 of the package body 230.

As is apparent from FIGS. 5A and 5B, the outer ends 124, 134 of the first and second leads 120, 130 within the semiconductor device 200 are of differing shapes and hence areas, with the area of the outer end 124 of each first lead 120 exceeding that of the outer end 134 of each second lead 130. Additionally, the outer ends 134 of the second leads 130 are oriented above or elevated relative to the outer ends 124 of the first leads 120. Typically, when the first and second leads 120, 130 of each leadframe 100 are severed from the corresponding dambar 150, the quantity of burrs formed in the sawing process is proportional to the cross-sectional area of the first and second leads 120, 130. Since the cross-sectional area of that portion of each first lead 120 which, when severed, defines the outer end 124 is larger than the cross-sectional area of that portion of each second lead 130 which, when severed, defines the outer end 134, the probability of forming burrs on the outer ends 124 of the first leads 120 is greater than the probability of forming burrs on the outer ends 134 of the second leads 130. However, despite the increased risk of burr formation on the first leads 120, as a result of the outer ends 124 of such first leads 120 being positioned lower than the outer ends 134 of the second leads 130, the probability of any such burrs formed on the outer ends 124 being electrically shorted to the outer ends 134 is substantially reduced in the semiconductor device 200. In FIG. 5B, an exemplary burr 124a is shown as extending from the outer end 124 of one first lead 120. However, as is apparent from FIG. 5B, contact between such burr 124a and the outer end 134 of the adjacent second lead 130 as could otherwise cause a shorting therebetween being avoided by the elevation of the outer ends 134 relative to the outer ends 124.

Referring now to FIG. 6, there is provided a flow chart which sets forth an exemplary method for fabricating the semiconductor device 200 of the present invention. The method comprises the steps of preparing the leadframe (S1), semiconductor die attachment (S2), wire bonding (S3), encapsulation (S4), and sawing (S5). FIGS. 7A-7D provide illustrations corresponding to these particular steps, as will be discussed in more detail below.

Referring now to FIG. 7A, in the initial step S1 of the fabrication process for the semiconductor device 200, the leadframe 100 having the above-described structural attributes is provided. Thereafter, step S2 is completed wherein the semiconductor die 210 having the bond pads 211 is attached to the top surface of the die pad 110 of the leadframe 100 through the use of the adhesive layer. The adhesive layer can be selected from well known liquid epoxy adhesives, adhesive films and adhesive tapes, as well as equivalents thereto.

Referring now to FIG. 7B, in the next step S3 of the fabrication process, the conductive wires 221 are used to electrically interconnect the semiconductor die 210 to the leadframe 100 in the aforementioned manner. Specifically, the bond pads 211 of the semiconductor die 210 are electrically connected to the top surfaces 121, 131 of the first and second leads 120, 130. Though not shown, as indicated above, one or more conductive wires 221 may also be used to electrically connect one or more bond pads 211 of the semiconductor die 210 directly to the die pad 110, allowing for the use of the die pad 110 as a ground region.

Referring now to FIG. 7C, in the next step S4 of the fabrication process for the semiconductor device 200, portions of the leadframe 100, the semiconductor die 210 and the conductive wires 221 are encapsulated with an encapsulant material which, upon hardening, forms the package body 230 of the semiconductor device 200. As indicated above, the package body 230 covers the entirety of the die pad 110 except for the bottom surface thereof which is circumvented by the etched surface 113. The package body 230 also covers the top surfaces 121, 131 of the first and second leads 120, 130, the bottom and top etched surfaces 123, 125 of the first leads 120, and the first and second segments 133a, 133b of the bottom etched surfaces 133 of the second leads 130. The package body 230 further covers the top and etched bottom surfaces of the tie bars 114. However, the package body 230 does not cover the bottom surfaces 122, 132 of the first and second leads 120, 130. Thus, the bottom surface 112 of the die pad 110 and the bottom surfaces 122, 132 of the first and second leads 120, 130 are exposed in the bottom surface 231 of the package body 230.

As also indicated above, during the process of fabricating the semiconductor device 200, the package body 230 is a portion of the single, unitary mold cap 240 which covers a plurality of interconnected leadframes 100 within a matrix. For the interconnected leadframes 100 in the matrix, each dambar 150 is partially covered by the encapsulant material used to form such mold cap 240 and ultimately the individual package bodies 230 singulated therefrom. As is seen in FIG. 7C, the encapsulant material used to form the mold cap 240 covers the entirety of the top surface of each dambar 150, including the top etched regions 151 formed therein. However, the bottom surface of each dambar 150 is, for the most part, not covered by the mold cap 240. Rather, only the bottom etched regions 152 within each dambar 150 are covered by the mold cap 240.

Referring now to FIG. 7D, in the next step S5 of the fabrication process for the semiconductor device 200, a sawing process using a diamond blade rotating at a high speed is used to facilitate the removal of the dambars 150 from between the interconnected leadframes 100 in the matrix, and further to concurrently segregate the mold cap 240 into the separate package bodies 230. As indicated above, the removal of the dambar from each leadframe 100 is needed to facilitate the electrical isolation of the first and second leads 120, 130 thereof from each other, as well as from the die pad 110 and tie bars 114.

This disclosure provides exemplary embodiments of the present invention. The scope of the present invention is not limited by these exemplary embodiments. Numerous variations, whether explicitly provided for by the specification or implied by the specification, such as variations in structure, dimension, type of material and manufacturing process may be implemented by one of skill in the art in view of this disclosure.