212065 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Cerium [Ce]
SEMICONDUCTOR PACKAGE
#2METHOD FOR PERMANENT CONNECTION OF TWO METAL SURFACES
#3SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
#4Al WIRING MATERIAL
#5AL BONDING WIRE
#6Semiconductor device with sealed semiconductor chip
#7MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS
#8Method for permanent connection of two metal surfaces
#9BONDING WIRE FOR SEMICONDUCTOR DEVICES
#10DESIGNS AND METHODS FOR CONDUCTIVE BUMPS
#11SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
#12ELECTRONIC MODULE
#13Nickel alloy for semiconductor packaging
#14Semiconductor device with sealed semiconductor chip
#15Electronic module
#16MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS
#17Nickel lanthanide alloys for MEMS packaging applications
#18Nickel lanthanide alloys for mems packaging applications
#19ALLOY DIFFUSION BARRIER LAYER
#20Method of room temperature covalent bonding
#21METHOD OF ROOM TEMPERATURE COVALENT BONDING
#22Bonding wire for semiconductor device
#23Semiconductor device with sealed semiconductor chip
#24Nickel alloy for semiconductor packaging
#25Designs and methods for conductive bumps
#26Advanced solder alloys for electronic interconnects
#27Multilayers of nickel alloys as diffusion barrier layers
#28Alloy diffusion barrier layer
#29Bonding wire for semiconductor devices
#30Sintering pastes with high metal loading for semiconductor die attach applications
#31Semiconductor packages
#32Light emitting device and method for manufacturing light emitting device
#33Advanced Solder Alloys For Electronic Interconnects
#34Bonding structure and method
#35Method for forming solder deposits
#36Semiconductor packages
#37Low temperature high reliability alloy for solder hierarchy
#38Composition for anisotropic conductive film, anisotropic conductive film, and connection structure using the same
#39Semiconductor device
#40Designs and methods for conductive bumps
#41Semiconductor device
#42Optoelectronic component and method of producing an optoelectronic component
#43Methods of fabricating a semiconductor package
#44Light-emitting apparatus
#45Method for permanent connection of two metal surfaces
#46Method of producing a hybridized device including microelectronic components
#47Light emitting device and method for manufacturing light emitting device
#48Light-emitting apparatus
#49Power semiconductor package
#50Semiconductor device
#51Stud bump and package structure thereof and method of manufacturing the same
#52Semiconductor device with sealed semiconductor chip
#53Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
#54Method of room temperature covalent bonding
#55Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
#56Electronic devices with yielding substrates
#57Light-emitting apparatus
#58Method for producing reconstituted wafers with support of the chips during their encapsulation
#59Bonding structure and method
#60Power semiconductor package
#61Solder joint flip chip interconnection
#62Three-dimensional structure in which wiring is provided on its surface
#63Three-dimensional structure for wiring formation
#64Polymer matrices for polymer solder hybrid materials
#65Semiconductor device and production method therefor
#66Semiconductor device and production method therefor
#67Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
#68Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
#69Semiconductor device and method of manufacturing the same
#70Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel
#71Method for fabricating two substrates connected by at least one mechanical and electrically conductive connection and structure obtained
#72Process for direct bonding two elements comprising copper portions and portions of dielectric materials
#73Indium compositions
#74Connecting elements for producing hybrid electronic circuits
#75Semiconductor packages and methods of fabricating the same
#76Multifunction sensor as PoP microwave PCB
#77Power semiconductor module with method for manufacturing a sintered power semiconductor module
#78Multilayer printed wiring board
#79Semiconductor component and corresponding production method
#80Module and production method
#81Manufacturing method and electronic module with new routing possibilities
#82Treatment, before the bonding of a mixed Cu-oxide surface, by a plasma containing nitrogen and hydrogen
#83Semiconductor device
#84Semiconductor device and method of forming a metallurgical interconnection between a chip and a substrate in a flip chip package
#85Inclusion of chip elements in a sheathed wire
#86Method for assembling a chip in a flexible substrate
#87Method for permanent connection of two metal surfaces
#88Light emitting device and method for manufacturing light emitting device
#89Method for assembling at least one chip using a fabric, and fabric including a chip device
#90TCE compensation for package substrates for reduced die warpage assembly
#91Copper column
#92PHOTOVOLTAIC DEVICE ELECTRICAL CONTACTS
#93Optoelectronic component and method for producing an optoelectronic component
#94Method of producing a radiation-emitting optoelectronic component
#95Optoelectronic headlight, method for production of an optoelectronic headlight and a luminescence diode chip
#96SYSTEMS AND METHODS TO COOL SEMICONDUCTOR
#97Doping Minor Elements into Metal Bumps
#98Solder joint flip chip interconnection having relief structure
#99POWER SUPPLY MODULE AND PACKAGING AND INTEGRATING METHOD THEREOF
#100Ag—Au—Pd ternary alloy bonding wire
#101Semiconductor laser mounting for improved frequency stability
#102Power module for an automobile
#103Semiconductor device and method for manufacturing semiconductor device
#104Solder ball for semiconductor packaging and electronic member using the same
#105Packaging Structure and Method
#106Electronic devices with yielding substrates
#107Low temperature high strength metal stack for die attachment
#108Multichip Packages
#109Light-emitting diode arrangement and method for producing the same
#110Contact Arrangement For Establishing A Spaced, Electrically Conducting Connection Between Microstructured Components
#111Method of room temperature covalent bonding
#112Multilayer printed wiring board
#113Method for the production of an electronic component and electronic component produced according to this method
#114Integrated circuit chip and fabrication method
#115Light emitting semiconductor element bonded to a base by a silver coating
#116Method of assembling two integrated circuits and corresponding structure
#117Solder joint flip chip interconnection
#118Semiconductor Device with Cross-shaped Bumps and Test Pads Alignment
#119ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#120DIE BOND FILM, DICING DIE BOND FILM, METHOD OF MANUFACTURING DIE BOND FILM, AND SEMICONDUCTOR DEVICE HAVING DIE BOND FILM
#121LED PACKAGE
#122Light emitting device with electrode having recessed concave portion
#123Semiconductor packages
#124Bonding wire for semiconductor device
#125Joining method and device produced by this method and joining unit
#126System and method for packaging electronic devices
#127Massively parallel interconnect fabric for complex semiconductor devices
#128LED package
#129SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#130Printed wiring board
#131Layered chip package and method of manufacturing same
#132Semiconductor Device and Method of Forming a Metallurgical Interconnection Between a Chip and a Substrate in a Flip Chip Package
#133Method and eletrostatic transfer stamp for transferring semiconductor dice using electrostatic transfer printing techniques
#134Semiconductor device comprising a passive component of capacitors and process for fabrication
#135Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same
#136Substrate processing method, semiconductor chip manufacturing method, and resin-adhesive-layer-backed semiconductor chip manufacturing method
#137SURFACE-MOUNTED SHIELDED MULTICOMPONENT ASSEMBLY
#138Semiconductor device
#139Doping minor elements into metal bumps
#140BONDING STRUCTURE AND METHOD
#141Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
#142Layered chip package and method of manufacturing same
#143Packaging Structure and Method
#144Multi-chip package including chip address circuit
#145Method of manufacturing printed wiring board
#146Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device
#147Electronic devices with yielding substrates
#148Method for positioning chips during the production of a reconstituted wafer
#149Wafer level processing method and structure to manufacture semiconductor chip
#150MULTILAYER PRINTED WIRING BOARD
#151Method for producing a matrix of individual electronic components and matrix produced thereby
#152Method for fabricating chip elements provided with wire insertion grooves
#153Semiconductor integrated circuit device
#154Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader
#155Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
#156Circuitry and Method for Encapsulating the Same
#157SEMICONDUCTOR CHIP ASSEMBLY WITH POST/DIELECTRIC/POST HEAT SPREADER
#158Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via
#159TCE compensation for package substrates for reduced die warpage assembly
#160THERMOSETTING DIE BOND FILM, DICING DIE BOND FILM AND SEMICONDUCTOR DEVICE
#161Semiconductor memory device
#162Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel
#163Semiconductor device having stacked components
#164Circuit connecting material, film-form circuit connecting material using the same, circuit member connecting structure and method of manufacturing the same
#165CIRCUIT CONNECTION MATERIAL, FILM-FORM CIRCUIT CONNECTING MATERIAL USING THE SAME, CIRCUIT MEMBER CONNECTING STRUCTURE, AND METHOD OF MANUFACTURING THE SAME
#166Process for the wafer-scale fabrication of electronic modules for surface mounting
#167Method for making an assembly of chips by means of radiofrequency transmission-reception means mechanically connected by a ribbon
#168ALUMINUM FOR ULTRASONIC BONDING
#169Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel
#170Semiconductor chip assembly with post/base heat spreader with thermal via
#171Bonding method, bonding apparatus, and manufacturing method of semiconductor device using the same
#172Electronic component manufacturing method
#173Method for metalizing blind vias
#174SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#175Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace
#176Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly
#177Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace
#178Polymer matrices for polymer solder hybrid materials
#179LED package, method for manufacturing LED package, and packing member for LED package
#180LED PACKAGE
#181Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, and light-emitting device
#182Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole
#183Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus
#184Semiconductor chip assembly with post/base heat spreader and plated through-hole
#185Method for stacking serially-connected integrated circuits and multi-chip device made from same
#186Circular shield of a circuit-substrate laminated module and electronic apparatus
#187SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/POST HEAT SPREADER AND ASYMMETRIC POSTS
#188Method for fabricating electrical bonding pads on a wafer
#189Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts
#190METHOD AND MAGNETIC TRANSFER STAMP FOR TRANSFERRING SEMICONDUCTOR DICE USING MAGNETIC TRANSFER PRINTING TECHNIQUES
#191Method for producing a non-plane element
#192SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#193Method of room temperature covalent bonding
#194ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME
#195Manufacturing method for electronic device having IC chip and antenna electrically connected by bridging plate
#196Semiconductor device with sealed semiconductor chip
#197Region divided substrate and semiconductor device
#198Universal IO unit, associated apparatus and method
#199Alternator with synchronous rectification equipped with an improved electronic power module
#200ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME
#201ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME
#202Semiconductor device and method for manufacturing the same
#203ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING COATED PARTICLES
#204MICROSTRUCTURE, AND METHOD FOR PRODUCTION THEREOF
#205Semiconductor device, production method for the same, and substrate
#206Stacked electronic device and method of making such an electronic device
#207Integrated-circuit package for proximity communication
#208Method of making a semiconductor chip assembly with a post/base/post heat spreader
#209Method of making a semiconductor chip assembly with a post/base heat spreader with an ESD protection layer
#210Indium compositions
#211Semiconductor chip assembly with post/base/post heat spreader
#212Method of making a connection component with hollow inserts
#213Method for manufacturing and testing an integrated electronic circuit
#214SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF
#215Semiconductor chip assembly with post/base heat spreader with ESD protection layer
#216ASSEMBLY OF SEMICONDUCTOR CHIPS/WAFERS
#217Designs and methods for conductive bumps
#218Semiconductor composite apparatus, method for manufacturing the semiconductor composite apparatus, LED head that employs the semiconductor composite apparatus, and image forming apparatus that employs the LED head
#219Semiconductor device with overlapped lead terminals
#220Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavity
#221LED WITH PHOSPHOR TILE AND OVERMOLDED PHOSPHOR IN LENS
#222Method for producing a hermetically sealed, electrical feedthrough using exothermic nanofilm
#223Semiconductor chip assembly with post/base heat spreader, signal post and cavity
#224Method For Fabricating A Through Interconnect On A Semiconductor Substrate
#225CONNECTION COMPONENT PROVIDED WITH INSERTS COMPRISING COMPENSATING BLOCKS
#226Ball-grid-array package, electronic system and method of manufacture
#227Method for bonding two electronic components
#228Self-assembly of chips on a substrate
#229Stacked semiconductor device including a serial path
#230CONNECTION PAD STRUCTURE FOR AN ELECTRONIC COMPONENT
#231Process for making contact with and housing integrated circuits
#232Method for bonding of chips on wafers
#233METHOD OF ELECTRICALLY CONNECTING A WIRE TO A PAD OF AN INTEGRATED CIRCUIT CHIP AND ELECTRONIC DEVICE
#234High-bandwidth ramp-stack chip package
#235SEMICONDUCTOR DEVICE
#236Copper alloy bonding wire for semiconductor device
#237Film for use in manufacturing semiconductor device, method for producing semiconductor device and semiconductor device
#238Flip chip MLP with folded heat sink
#239Assembly of a wire element with a microelectronic chip with a groove comprising at least one bump securing the wire element
#240Method of assembling a multi-component electronic package
#241Printed circuit board
#242Semiconductor device bonding wire and wire bonding method
#243Process for manufacturing a composite substrate
#244Multilayer printed wiring board
#245Adhesive film for semiconductor and semiconductor device using the adhesive film
#246MULTIFUNCTIONAL DIE ATTACHMENT FILM AND SEMICONDUCTOR PACKAGING USING THE SAME
#247Explosion-proof module structure for power components, particularly power semiconductor components, and production thereof
#248Method for making an electrically conducting mechanical interconnection member
#249CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THE SAME
#250Method for stacking serially-connected integrated circuits and multi-chip device made from same
#251Massively parallel interconnect fabric for complex semiconductor devices
#252Optoelectronic semiconductor chip, optoelectronic component and a method for producing an optoelectronic component
#253Method of interconnecting electronic wafers
#254STACK-TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#255Joining method and device produced by this method and joining unit
#256Electronic component with mechanically decoupled ball connections
#257PACKAGE FOR SEMICONDUCTOR DEVICE AND PACKAGING METHOD THEREOF
#258Semiconductor device having finger electrodes
#259Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication
#260Printed circuit board and method of manufacturing printed circuit board
#261Light emitting device having luminescent layer with opening to exposed bond pad on light emitting die for wire bonding pad to substrate
#262Method of manufacturing a semiconductor device and a semiconductor device produced thereby
#263Integrated multicomponent device in a semiconducting die
#264Method for the manufacture of an optoelectronic component and an optoelectronic component
#265Semiconductor device and production method therefor
#266Semiconductor device and production method therefor
#2673D integration of vertical components in reconstituted substrates
#268Method of assembling a member on a support by sintering a mass of conductive powder
#269SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#270METHOD OF MANUFACTURING AN ASSEMBLY AND ASSEMBLY
#271Holder for electrical component and electrical device including the holder and component
#272Electrical assembly
#273Light emitting device
#274Light emitting diode and method for manufacturing the same
#275Nano memory, light, energy, antenna and strand-based systems and methods
#276Method of forming bends in a wire loop
#277Die assemblies
#278METHOD OF PRODUCING EXTERNAL PADS ON A SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#279Method of thinning a block transferred to a substrate
#280Method for manufacturing semiconductor device
#281Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
#282Adhesive film for semiconductor, composite sheet, and method for producing semiconductor chip using them
#283ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING COATED PARTICLES
#284Single-layer component package
#285Method for coating two elements hybridized by means of a soldering material
#286Solder joint flip chip interconnection having relief structure
#287Process for spontaneous deposition from an organic solution
#288Semiconductor integrated circuit device
#289Chip Module for Installing in Sensor Chip Cards for Fluidic Applications and Method for Producing a Chip Module of This Type
#290Adhesive film, connecting method, and joined structure
#291Semiconductor device and method of manufacturing the same
#292Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
#293Connection by fitting together two soldered inserts
#294Solder joint flip chip interconnection
#295Process for making contact with and housing integrated circuits
#296Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device
#297PRODUCTION METHOD OF SEMICONDUCTOR DEVICE, PRODUCTION METHOD OF DISPLAY DEVICE, SEMICONDUCTOR DEVICE, PRODUCTION METHOD OF SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR ELEMENT
#298Method for producing an LTCC substrate
#299Electrically conductive structure on a semiconductor substrate formed from printing
#300Multi-component device integrated into a matrix