212081 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Tungsten [W]
Chip and wafer integration process using vertical connections
#3302Methods and apparatus for flip-chip-on-lead semiconductor package
#3303SEMICONDUCTOR PACKAGE HAVING WIRE REDISTRIBUTION LAYER AND METHOD OF FABRICATING THE SAME
#3304Electrode pattern and wire bonding method
#3305Method of making an interconnect structure
#3306Method of joining chips utilizing copper pillar
#3307Microelectronic substrate including bumping sites with nanostructures
#3308Chip structure with bumps and testing pads
#3309Method for manufacturing semiconductor device
#3310Power module having stacked flip-chip and method of fabricating the power module
#3311Method of opening reservoir of containment device
#3312Method of manufacturing device having a UV-curable adhesive
#3313MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#3314Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns
#3315Substrate with feedthrough and method for producing the same
#3316METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS
#3317Metallic electrode forming method and semiconductor device having metallic electrode
#3318Chip carrier structure having semiconductor chip embedded therein and metal layer formed thereon
#3319Space-efficient package for laterally conducting device
#3320Electropolishing metal features on a semiconductor wafer
#3321Designs and methods for conductive bumps
#3322Thermosetting die bonding film
#3323Semiconductor device and a method of manufacturing the same
#3324Method of assembling chips
#3325High temperature, stable SiC device interconnects and packages having low thermal resistance
#3326Power semiconductor module and method for producing the same
#3327Semiconductor device and a method of manufacturing for high output MOSFET
#3328Semiconductor wafer, semiconductor device, and semiconductor device manufacturing method
#3329Method for manufacturing circuit modules and circuit module
#3330Tape carrier for semiconductor device and method for making same
#3331Interconnections for flip-chip using lead-free solders and having reaction barrier layers
#3332Electronic component structure and method of making
#3333Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
#3334CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL, AND SEMICONDUCTOR DEVICE
#3335Plastic Conductive Particles and Manufacturing Method Thereof
#3336Semiconductor memory device and defect remedying method thereof
#3337Solder layer and device bonding substrate using the same and method for manufacturing such a substrate
#3338SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME, AND POWER CONVERSION APPARATUS INCORPORATING THIS SEMICONDUCTOR DEVICE
#3339Interconnections for flip-chip using lead-free solders and having reaction barrier layers
#3340Semiconductor package and fabrication method thereof
#3341Circuit device, a method for manufacturing a circuit device, and a semiconductor module
#3342Semiconductor integrated circuit device and fabrication method for the same
#3343BACKSIDE METALLIZATION FOR INTEGRATED CIRCUIT DEVICES
#3344Sensor-type semiconductor package and method for fabricating the same
#3345Wiring structure, forming method of the same and printed wiring board
#3346INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS
#3347Mask and substrate alignment for solder bump process
#3348Multilayer printed circuit board and multilayer printed circuit board manufacturing method
#3349BARRIER FOR USE IN 3-D INTEGRATION OF CIRCUITS
#3350Conductive structure for a semiconductor integrated circuit and method for forming the same
#3351Packaging conductive structure and method for manufacturing the same
#3352Packaging conductive structure for a semiconductor substrate having a metallic layer
#3353Conductive structure for a semiconductor integrated circuit and method for forming the same
#3354SEMICONDUCTOR DEVICE FOR WHICH ELECTRICAL TEST IS PERFORMED WHILE PROBE IS IN CONTACT WITH CONDUCTIVE PAD
#3355Method for manufacturing a circuit board
#3356Method for mounting electronic components
#3357SD Flash Memory Card Manufacturing Using Rigid-Flex PCB
#3358Undercut-free BLM process for Pb-free and Pb-reduced C4
#3359Electronic component module and method for manufacturing the same
#3360Bumping process and bump structure
#3361Bump structure and manufacturing method thereof
#3362Integrated circuit including gas phase deposited packaging material
#3363Surface mount electronic component and process for manufacturing same
#3364Semiconductor circuit
#3365Semiconductor device
#3366Low fabrication cost, fine pitch and high reliability solder bump
#3367Method, system, program product for bonding two circuitry-including substrates and related stage
#3368Semiconductor display devices
#3369Method of room temperature covalent bonding
#3370Versatile Si-based packaging with integrated passive components for mmWave applications
#3371SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#3372Stacked structure of semiconductor chips, memory card, and method of manufacturing stacked structure of semiconductor chips
#3373Aluminum-based interconnection in bond pad layer
#3374Microelectronic packages and methods therefor
#3375Imaging device equipped with a last copper and aluminum based interconnection level
#3376System and method for separating and packaging integrated circuits
#3377Method for precision assembly of integrated circuit chip packages
#3378Probe card assembly and kit
#3379Wiring board and semiconductor device
#3380Working Method of Metal Material and Semiconductor Apparatus Fabricated by the Method
#3381Multi-chip semiconductor package and method for fabricating the same
#3382Bumping electronic components using transfer substrates
#3383Fabrication method of multichip stacking structure
#3384Thermal interconnect systems methods of production and uses thereof
#3385Multichip stacking structure
#3386SEMICONDUCTOR DEVICE AND METHOD OF FORMING METAL PAD OF SEMICONDUCTOR DEVICE
#3387Chip having side pad, method of fabricating the same and package using the same
#3388Semiconductor structure and method for forming the same
#3389Zigzag-stacked package structure
#3390Semiconductor device including ground and power-supply planes and a dielectric layer between the ground and power-supply planes
#3391Semiconductor integrated circuit device including wiring lines and interconnections
#3392Semiconductor device
#3393Low temperature bonding material comprising metal particles and bonding method
#3394Electrically conductive interconnect system and method
#3395Bonding pad of semiconductor integrated circuit, method for manufacturing the bonding pad, semiconductor integrated circuit, and electronic device
#3396Semiconductor package and method of manufacturing the same
#3397Semiconductor package having a semiconductor chip in a substrate and method of fabricating the same
#3398Under bump metallurgy structure of a package and method of making same
#3399MOSFET package
#3400Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
#3401Printed circuit board
#3402Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof
#3403HIGHLY CONDUCTIVE COMPOSITION FOR WAFER COATING
#3404Highly conductive composition for wafer coating
#3405INJECTION MOLDED SOLDER BALL METHOD
#3406Semiconductor module with a dielectric layer including a fluorocarbon compound on a chip
#3407Microelectronic component assemblies with recessed wire bonds and methods of making same
#3408Method for reduction of soft error rates in integrated circuits
#3409Method for manufacturing a three-dimensional semiconductor device and a wafer used therein
#3410INTEGRATED CIRCUITS WITH CONDUCTIVE FEATURES IN THROUGH HOLES PASSING THROUGH OTHER CONDUCTIVE FEATURES AND THROUGH A SEMICONDUCTOR SUBSTRATE
#3411METHOD FOR CHIP TO PACKAGE INTERCONNECT
#3412SEMICONDUCTOR DEVICE HAVING FUSE CIRCUIT ON CELL REGION AND METHOD OF FABRICATING THE SAME
#3413B-stageable die attach adhesives
#3414Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same
#3415CONDUCTIVE SINTERED LAYER FORMING COMPOSITION AND CONDUCTIVE COATING FILM FORMING METHOD AND BONDING METHOD USING THE SAME
#3416Printed circuit board
#3417Printed circuit board
#3418Semiconductor device package having pseudo chips
#3419Wafer level package with die receiving through-hole and method of the same
#3420Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers
#3421Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages
#3422Semiconductor device
#3423DIRECT TERMINATION OF A WIRING METAL IN A SEMICONDUCTOR DEVICE
#3424Semiconductor components having through interconnects
#3425Conductive systems and devices including wires coupled to anisotropic conductive film, and methods of forming the same
#3426RF module package for releasing stress
#3427Packing board for electronic device, packing board manufacturing method, semiconductor module, semiconductor module manufacturing method, and mobile device
#3428Wafer level package with die receiving through-hole and method of the same
#3429Power device package
#3430Integrated circuits and interconnect structure for integrated circuits
#3431Anisotropic electrically conductive structure
#3432Bonding method and bonding material using metal particle
#3433Method for integrating pre-fabricated chip structures into functional electronic systems
#3434Fabrication for electroplating thick metal pads
#3435Semiconductor device and method of forming passive devices
#3436ELECTRONIC ASSEMBLY HAVING AN INDIUM WETTING LAYER ON A THERMALLY CONDUCTIVE BODY
#3437Thinned die integrated circuit package
#3438SEMICONDUCTOR DICE HAVING BACK SIDE REDISTRIBUTION LAYER ACCESSED USING THROUGH-SILICON VIAS, METHODS
#3439Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
#3440Multilayer printed circuit board
#3441Multilayer printed circuit board
#3442Multilayer printed circuit board
#3443Voltage regulator integrated with semiconductor chip
#3444Semiconductor device and method of protecting passivation layer in a solder bump process
#3445Semiconductor device and manufacturing method of the same
#3446Single mask via method and device
#3447High surface area aluminum bond pad for through-wafer connections to an electronic package
#3448Semiconductor device
#3449Heat dissipating chip structure and fabrication method thereof and package having the same
#3450Microelectronic assemblies having compliancy and methods therefor
#3451Semiconductor device with lead frame including conductor plates arranged three-dimensionally
#3452Process for making contact with and housing integrated circuits
#3453Nitride semiconductor device
#3454Wiring structure of printed wiring board and method for manufacturing the same
#3455Printed wiring board
#3456Method of manufacturing multi-layer printed circuit board
#3457Micro-machined structure production using encapsulation
#3458Top layers of metal for high performance IC's
#3459Chip structure and process for forming the same
#3460Method for fabricating a circuit component
#3461Printed circuit board
#3462Contact Pad And Bump Pad Arrangement for High-Lead Or Lead-Free Bumps
#3463Thin passivation layer on 3D devices
#3464Three-dimensional integrated circuits with protection layers
#3465Semiconductor processing methods, methods of forming contact pads, and methods of forming electrical connections between metal-containing layers
#3466Top layers of metal for high performance IC's
#3467Top layers of metal for high performance IC's
#3468Chip structure and process for forming the same
#3469Chip structure and process for forming the same
#3470Semiconductor device
#3471Tubular-shaped bumps for integrated circuit devices and methods of fabrication
#3472WAFER LEVEL PACKAGE WITH GOOD CTE PERFORMANCE
#34733D ELECTRONIC PACKAGING STRUCTURE WITH ENHANCED GROUNDING PERFORMANCE AND EMBEDDED ANTENNA
#3474Leadframe on heat sink (LOHS) semiconductor packages and fabrication methods thereof
#3475Semiconductor device encapsulated by an electrically conductive plastic housing composition with conductive particles
#3476Semiconductor device having active element formation region provided under a bump pad
#3477Semiconductor device
#3478Semiconductor device and method for manufacturing the same
#3479Printed circuit board
#3480Post passivation interconnection schemes on top of the IC chips
#3481Semiconductor chip and production process therefor
#3482Method of sputtering a nickel silicon alloy, especially useful for forming a solder bump barrier
#3483Manufacturing method of semiconductor device
#3484Stacked die in die BGA package
#3485Semiconductor package and method of manufacturing the same
#3486INTEGRATED CIRCUITS WITH CONDUCTIVE FEATURES IN THROUGH HOLES PASSING THROUGH OTHER CONDUCTIVE FEATURES AND THROUGH A SEMICONDUCTOR SUBSTRATE
#3487Chip structure and process for forming the same
#3488Structure and process for WL-CSP with metal cover
#3489Semiconductor device
#3490Method for manufacturing semiconductor device and semiconductor device
#3491Solder Bump/Under Bump Metallurgy Structure for High Temperature Applications
#3492Function element and function element mounting structure
#3493Semiconductor device, method for manufacturing the same, and semiconductor device mounting structure
#3494MULTI-CHIP PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
#3495Articles and assembly for magnetically directed self assembly and methods of manufacture
#3496Semiconductor wafer
#3497Method for Preparing an Intergrated Circuits Device Having a Reinforcement Structure
#3498Semiconductor device and manufacturing method of the same
#3499Method of processing wafer
#3500Single Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices
#3501Double Layer Carbon Nanotube-Based Structures and Methods for Removing Heat from Solid-State Devices
#3502Semiconductor device and manufacturing method therefor
#3503Semiconductor device and method of manufacturing the same
#3504Microcircuit package having ductile layer
#3505Intergrated Circuits Device Having a Reinforcement Structure
#3506Semiconductor integrated circuit providing for wire bonding directly above an active circuit region, and manufacturing method thereof
#3507Light emitting device having a mirror portion
#3508Chip structure and process for forming the same
#3509Stacked structures and methods of fabricating stacked structures
#3510Resin for sealing semiconductor device, resin-sealed semiconductor device and the method of manufacturing the semiconductor device
#3511Reduction of damage to thermal interface material due to asymmetrical load
#3512Method of mounting semiconductor chip to circuit substrate using solder bumps and dummy bumps
#3513Silica nanoparticles thermoset resin compositions
#3514Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud-bumps
#3515Three-dimensional wafer stacking with vertical interconnects
#3516Bond pad design to minimize dielectric cracking
#3517Chip structure and process for forming the same
#3518Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart
#3519Semiconductor device and a method of manufacturing the same
#3520SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE CONTAINING THE SAME
#3521Systems and methods to passivate on-die redistribution interconnects
#3522Chip and manufacturing method and application thereof
#3523HEAT SPREADER FOR AN ELECTRICAL DEVICE
#3524SEMICONDUCTOR CHIP EMBEDDED IN AN INSULATOR AND HAVING TWO-WAY HEAT EXTRACTION
#3525SEMICONDUCTOR DEVICE INCLUDING CORROSION RESISTANT WIRING STRUCTURE
#3526Semiconductor Device And Production Method For Semiconductor Device
#3527INTERGRATED CIRCUIT DEVICE, CHIP, AND METHOD OF FABRICATING THE SAME
#3528Top layers of metal for integrated circuits
#3529Interconnect For Microelectronic Structures With Enhanced Spring Characteristics
#3530SEMICONDUCTOR CHIP HAVING BUMPS OF DIFFERENT HEIGHTS AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#3531METHOD FOR IMPROVED COPPER LAYER ETCHING OF WAFERS WITH C4 CONNECTION STRUCTURES
#3532Method for manufacturing semiconductor device with reduced damage to metal wiring layer
#3533Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same
#3534Use of palladium in IC manufacturing with conductive polymer bump
#3535Method for manufacturing semiconductor device
#3536Lithographic apparatus and method
#3537CONTACT TIP STRUCTURE FOR MICROELECTRONIC INTERCONNECTION ELEMENTS AND METHODS OF MAKING SAME
#3538Semiconductor device and method for manufacturing same
#3539Self-aligned through vias for chip stacking
#3540Post passivation interconnection schemes on top of the IC chips
#3541Integrated circuit chip assembly having array of thermally conductive features arranged in aperture of circuit substrate
#3542WIRE BOND AND METHOD OF FORMING SAME
#3543System and method for solder bump plating
#3544Method of making lithographic contact elements
#3545LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE
#3546Low fabrication cost, high performance, high reliability chip scale package
#3547Semiconductor integrated circuit and multi-chip module
#3548COPPER-METALLIZED INTEGRATED CIRCUITS HAVING AN OVERCOAT FOR PROTECTING BONDABLE METAL CONTACTS AND IMPROVING MOLD COMPOUND ADHESION
#3549High performance system-on-chip using post passivation process
#3550Integrated circuit chips with fine-line metal and over-passivation metal
#3551Low fabrication cost, high performance, high reliability chip scale package
#3552Semiconductor package with embedded die
#3553Semiconductor package
#3554Radiation hardened lateral MOSFET structure
#3555Metal filled through via structure for providing vertical wafer-to-wafer interconnection
#3556Semiconductor device and manufacturing method of the same
#3557Fan out type wafer level package structure and method of the same
#3558Thin, thermally enhanced flip chip in a leaded molded package
#3559Semiconductor device, wiring of semiconductor device, and method of forming wiring
#3560Plating Device, Plating Method, Semiconductor Device, And Method For Manufacturing Semiconductor Device
#3561Electronic component and wire bonding method
#3562Solder ball mounting method and solder ball mounting substrate manufacturing method
#3563Method of manufacturing complementary metal oxide semiconductor image sensor
#3564Bonding structure and fabrication thereof
#3565Low fabrication cost, high performance, high reliability chip scale package
#3566Semiconductor device
#3567Semiconductor device and a method of manufacturing the same
#3568Semiconductor device, mounting structure, electro-optical apparatus, electronic system, and method for manufacturing electronic component
#3569METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER
#3570Packaging with base layers comprising alloy 42
#3571Stacked chip package structure with leadframe having inner leads with transfer pad
#3572Semiconductor device and a method of manufacturing the same
#3573Stacked chip packaging with heat sink structure
#3574Semiconductor device, method of manufacturing the same
#3575Micropad for bonding and a method therefor
#3576Mounting structure, electro-optical device, electronic apparatus, and method of producing the mounting structure
#3577METHOD FOR PRODUCING AN INTEGRATED CIRCUIT INCLUDING A CONNECTION CONTACT ON A SEMICONDUCTOR BODY
#3578Flip chip metallization method and devices
#3579Method for forming conductive layer and substrate having the same, and method for manufacturing semiconductor device
#3580Stacked die with a recess in a die BGA package
#3581Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates
#3582Low profile ball grid array (BGA) package with exposed die and method of making same
#3583Apparatus and method for connecting components
#3584METHODS FOR FORMING PATTERNS OF A FILLED DIELECTRIC MATERIAL ON SUBSTRATES
#3585Three dimensional device integration method and integrated device
#3586High performance system-on-chip using post passivation process
#3587Integrated circuit with a reduced pad bump area and the manufacturing method thereof
#3588Semiconductor module arrangement
#3589SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
#3590Semiconductor Device and Method of Fabricating the Same
#3591Probe arrays and method for making
#3592Wire bonding and wire bonding method
#3593Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
#3594Terminal pad structures and methods of fabricating same
#3595Method for fabricating heat dissipating package structure
#3596SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#3597Dicing die-bonding film
#3598Semiconductor device and method for manufacturing the same
#3599ATTACHING AND INTERCONNECTING DIES TO A SUBSTRATE
#3600Structure and manufacturing method of a chip scale package