212081 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Tungsten [W]
Interconnections for fine pitch semiconductor devices and manufacturing method thereof
#3602Semiconductor device having recessed connector portions
#3603Materials, structures and methods for microelectronic packaging
#3604Bumping electronic components using transfer substrates
#3605Method of providing solder bumps on a substrate using localized heating
#3606Top layers of metal for high performance IC's
#3607Top layers of metal for high performance IC's
#3608Wafer-level interconnect for high mechanical reliability applications
#3609Low fabrication cost, fine pitch and high reliability solder bump
#3610BUMP ELECTRODE INCLUDING PLATING LAYERS AND METHOD OF FABRICATING THE SAME
#3611Stacked structures and methods of fabricating stacked structures
#3612Light emitting device
#3613SEMICONDUCTOR DEVICE
#3614Integrated circuit chips with fine-line metal and over-passivation metal
#3615INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL
#3616Integrated circuit chips with fine-line metal and over-passivation metal
#3617Integrated circuit chips with fine-line metal and over-passivation metal
#3618Integrated circuit chips with fine-line metal and over-passivation metal
#3619INTEGRATED CIRCUIT CHIPS WITH FINE-LINE METAL AND OVER-PASSIVATION METAL
#3620Method of making a light emitting device having a molded encapsulant
#3621METHOD AND STRUCTURE TO ENHANCE TEMPERATURE/HUMIDITY/BIAS PERFORMANCE OF SEMICONDUCTOR DEVICES BY SURFACE MODIFICATION
#3622Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
#3623Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor device
#3624Semiconductor-embedded substrate and manufacturing method thereof
#3625ELECTRONIC SYSTEM MODULES AND METHOD OF FABRICATON
#3626CHIP PACKAGE, CHIP STRUCTURE AND MANUFACTURING PROCESS THEREOF
#3627Plastic surface mount large area power device
#3628Process of forming an electronic device including an inductor
#3629Arrangement for cooling a power semiconductor module
#3630METHOD FOR PRODUCING FLEXIBLE INTEGRATED CIRCUITS WHICH MAY BE PROVIDED CONTIGUOUSLY
#3631Nanoscopic Assurance Coating for Lead-Free Solders
#3632Wire Bump Material
#3633Electronic device and method for production
#3634METHOD OF FABRICATING A WIRE BOND PAD WITH Ni/Au METALLIZATION
#3635Semiconductor device
#3636Multi-part capillary
#3637Method of forming an inlay substrate having an antenna wire
#3638Method of actuating implanted medical device
#3639Pad over active circuit system and method with meshed support structure
#3640Ta-TaN SELECTIVE REMOVAL PROCESS FOR INTEGRATED DEVICE FABRICATION
#3641Bonding pad for contacting a device
#3642Structure and manufacturing method of a chip scale package with low fabrication cost, fine pitch and high reliability solder bump
#3643Semiconductor device and method for manufacturing the same
#3644Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
#3645Chip Comprising at Least One Test Contact Configuration
#3646Ta-TaN SELECTIVE REMOVAL PROCESS FOR INTEGRATED DEVICE FABRICATION
#3647Adhesive film for circuit connection, and circuit connection structure
#3648METHOD OF FORMING A MULTI-LAYER SEMICONDUCTOR STRUCTURE INCORPORATING A PROCESSING HANDLE MEMBER
#3649Extendable connector and network
#3650Method for low temperature bonding and bonded structure
#3651Pad over active circuit system and method with frame support structure
#3652WIRE-BONDED PACKAGE WITH ELECTRICALLY INSULATING WIRE ENCAPSULANT AND THERMALLY CONDUCTIVE OVERMOLD
#3653Wafer level chip scale package and method for manufacturing the same
#3654Methods and substrates to connect an electrical member to a substrate to form a bonded structure
#3655Stacked chip package structure with leadframe having bus bar
#3656Three dimensional device integration method and integrated device
#3657Three dimensional device integration method and integrated device
#3658Chip-stacked package structure having leadframe with multi-piece bus bar
#3659Chip-stacked package structure for lead frame having bus bars with transfer pads
#3660Semiconductor device
#3661Semiconductor and method for manufacturing the same
#3662Method for manufacturing SIP semiconductor device
#3663Lead pin for mounting semiconductor and printed wiring board
#3664Printed circuit board
#3665Semiconductor device, relay chip, and method for producing relay chip
#3666SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
#3667Semiconductor apparatus and manufacturing method of semiconductor apparatus
#3668Low fabrication cost, fine pitch and high reliability solder bump
#3669Semiconductor chip and method for fabricating the same
#3670Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
#3671Chip package and method for fabricating the same
#3672Wire bonding method, wire bonding apparatus and semiconductor device
#3673SEMICONDUCTOR DEVICES AND MANUFACTURING METHOD THEREFOR
#3674Apparatus and method for packaging circuits
#3675Semiconductor device
#3676Device structures including backside contacts, and methods for forming same
#3677COMPOSITIONS FOR USE IN ELECTRONICS DEVICES
#3678Method for low temperature bonding and bonded structure
#3679Top layers of metal for high performance IC's
#3680Chip structure and process for forming the same
#3681Top layers of metal for high performance IC's
#3682Low fabrication cost, fine pitch and high reliability solder bump
#3683METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#3684Adhesion by plasma conditioning of semiconductor chip
#3685Method for producing semiconductor device
#3686Semiconductor device including through electrode and method of manufacturing the same
#3687SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
#3688Top layers of metal for high performance IC's
#3689Chip structure and process for forming the same
#3690FLIP CHIP SEMICONDUCTOR ASSEMBLY WITH VARIABLE VOLUME SOLDER BUMPS
#3691Low fabrication cost, fine pitch and high reliability solder bump
#3692Packaged microdevices and methods for manufacturing packaged microdevices
#3693Semiconductor device, substrate for producing semiconductor device and method of producing them
#3694Process of forming an electronic device including a barrier layer
#3695Etching solution for etching metal layer, etching method using the etching solution, and method of fabricating semiconductor product using the etching solution
#3696Top layers of metal for integrated circuits
#3697Method of wire bonding over active area of a semiconductor circuit
#3698Semiconductor device and method for manufacturing same
#3699High performance system-on-chip using post passivation process
#3700High performance system-on-chip using post passivation process
#3701Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#3702Plastic overmolded packages with molded lid attachments
#3703SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
#3704Post passivation interconnection schemes on top of the IC chips
#3705Bond pad for wafer and package for CMOS imager
#3706High performance system-on-chip using post passivation process
#3707Semiconductor chip structure
#3708High performance system-on-chip using post passivation process
#3709Trace design to minimize electromigration damage to solder bumps
#3710Microelectronic package
#3711Stacked semiconductor components with through wire interconnects (TWI)
#3712High performance system-on-chip using post passivation process
#3713High performance system-on-chip using post passivation process
#3714Laminating system, IC sheet, scroll of IC sheet, and method for manufacturing IC chip
#3715Power semiconductor component
#3716Diamond heat sink
#3717Assembling Two Substrates by Molecular Adhesion, One of the Two Supporting an Electrically Conductive Film
#3718Semiconductor element and manufacturing method thereof
#3719METHODS OF FORMING ALUMINUM-FREE WIRE BOND PAD AND PAD SO FORMED
#3720Semiconductor bonding and layer transfer method
#3721Chip package and method for fabricating the same
#3722High performance system-on-chip using post passivation process
#3723Process for packaging components, and packaged components
#3724Semiconductor integrated circuit device
#3725Semiconductor apparatus having improved thermal fatigue life
#3726Web process interconnect in electronic assemblies
#3727Semiconductor device and method for manufacturing the same
#3728Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same
#3729Interconnection structure of integrated circuit chip
#3730Conductive connection structure formed on the surface of circuit board and manufacturing method thereof
#3731Package structure with leadframe on offset chip-stacked structure
#3732High performance system-on-chip using post passivation process
#3733High performance system-on-chip using post passivation process
#3734Acceleration sensor
#3735Ball transferring method and apparatus
#3736Interconnect structures with bond-pads and methods of forming bump sites on bond-pads
#3737SEMICONDUCTOR MEMORY DEVICE
#3738Method for fabricating chip-stacked semiconductor package
#3739Method of fabricating a stacked die having a recess in a die BGA package
#3740COMBINATION HEAT DISSIPATION DEVICE WITH TERMINATION AND A METHOD OF MAKING THE SAME
#3741Method of assembling displays on substrates
#3742METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS
#3743Electronic device including a conductive stud over a bonding pad region
#3744Versatile Si-based packaging with integrated passive components for mmWave applications
#3745SEMICONDUCTOR DEVICE WITH INTERNAL HEAT SINK
#3746Electrical through contact
#3747On-chip magnetic components
#3748Methods of forming electronic structures including conductive shunt layers and related structures
#3749Solder Ball Pad Structure
#3750Electronic system modules and method of fabrication
#3751Composite photoresist for modifying die-side bumps
#3752Microelectronic device connection structure
#3753Method of forming hole in semiconductor device using mask
#3754Semiconductor device with interface peeling preventing rewiring layer
#3755Solder connector structure and method
#3756Semiconductor device
#3757Fabrication method and structure of PCB assembly, and tool for assembly thereof
#3758Bonding apparatus
#3759Bonding apparatus and method for cleaning tip of a bonding tool
#3760Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuit
#3761Pad structure design with reduced density
#3762Method Of Transferring At Least One Object Of Micrometric Or Millimetric Size By Means Of A Polymer Handle
#3763Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device
#3764Structure of image sensor module and a method for manufacturing of wafer level package
#3765Method to build robust mechanical structures on substrate surfaces
#3766Electronic component module and radio comunications equipment
#3767SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE
#3768Semiconductor integrated circuit device
#3769Semiconductor device with reduced contact resistance
#3770BLM structure for application to copper pad
#3771Semiconductor chip and method for manufacturing same, electrode structure of semiconductor chip and method for forming same, and semiconductor device
#3772Compliant Bumps for Integrated Circuits Using Carbon Nanotubes
#3773Chip having two groups of chip contacts
#3774Surface mount multichip devices
#3775Interconnect structure for semiconductor package
#3776Structure of image sensor module and a method for manufacturing of wafer level package
#3777Power semiconductor apparatus
#3778Methods and apparatus for packaging integrated circuit devices
#3779Conductive adhesive rework method
#3780Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same
#3781Application of PVD W/WN bilayer barrier to aluminum bondpad in wire bonding
#3782Method for manufacturing a semiconductor wiring base that includes a wiring base with wiring extending inside and outside of a mounting region
#3783Method of fabricating a semiconductor device including forming an insulating layer with a hard sheet buried therein
#3784Component and method for producing a component
#3785Semiconductor chip structure
#3786Chip structure with redistribution traces
#3787Semiconductor device, mounting construction of a semiconductor device, and method of manufacturing the semiconductor device with the mounting construction
#3788Semiconductor device and method of producing the same
#3789Semiconductor device, electro-optical device, and method for manufacturing semiconductor device
#3790Semiconductor device having pillar-shaped terminal
#3791Methods and apparatus for packaging integrated circuit devices
#3792Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#3793Sheet Peeling Apparatus and Peeling Method
#3794Multilayer printed circuit board
#3795Thermally conductive composite and uses for microelectronic packaging
#3796Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
#3797Semiconductor package and method of manufacturing the same
#3798Method for bonding wafers to produce stacked integrated circuits
#3799Solderability Improvement Method for Leaded Semiconductor Package
#3800Flip chip package including a non-planar heat spreader and method of making the same
#3801Thermal release adhesive-backed carrier tapes
#3802Flip chip package and method of fabricating the same
#3803Semiconductor device
#3804Semiconductor device and method for manufacturing semiconductor device
#3805Semiconductor device with back surface electrode including a stress relaxation film
#3806Bonding pad structure and method for making the same
#3807Vibration-Assisted Method for Underfilling Flip-Chip Electronic Devices
#3808Semiconductor device and method of manufacturing the semiconductor device
#3809Integrated circuit (IC) chip and method for fabricating the same
#3810STACKED-TYPE WAFER LEVEL PACKAGE, METHOD OF MANUFACTURING THE SAME, WAFER-LEVEL STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME
#3811Semiconductor Device and Manufacturing Method Thereof, Semiconductor Package, and Electronic Apparatus
#3812IC chip, antenna, and manufacturing method of the IC chip and the antenna
#3813Flexible joint methodology to attach a die on an organic substrate
#3814System Comprising an Electrical Component and an Electrical Connecting Lead for Said Component, and Method for the Production of Said System
#3815Solid state image pickup device, method for manufacturing the same, semiconductor device and method for manufacturing the same
#3816COMPLIANT ELECTRICAL CONTACTS
#3817Capping of metal interconnects in integrated circuit electronic devices
#3818BONDING MATERIALS HAVING PARTICLE WITH ANISOTROPIC SHAPE
#3819Use of a die-attach composition for high power semiconductors, method for attaching same to a printed circuit board and semiconductor device manufactured thereby
#3820Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#3821SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#3822Semiconductor Module Having Low Thermal Load
#3823RF power transistor having an encapsulated chip package
#3824Three dimensional integrated circuit and method of making the same
#38253D electronic packaging structure having a conductive support substrate
#3826Micro universal serial bus (USB) memory package
#3827Semiconductor device, manufacturing method and apparatus for the same
#3828Molding methods to manufacture single-chip chip-on-board USB device
#3829Top layers of metal for high performance IC's
#3830Top layers of metal for high performance IC's
#3831SEMICONDUCTOR DEVICE HAVING WIRE LOOP AND METHOD AND APPARATUS FOR MANUFACTURING THE SEMICONDUCTOR DEVICE
#3832Top layers of metal for high performance IC's
#3833Via layout with via groups placed in interlocked arrangement
#3834Top layers of metal for high performance IC's
#3835Top layers of metal for high performance IC's
#3836Top layers of metal for high performance IC's
#3837Top layers of metal for high performance IC's
#3838Top layers of metal for high performance IC's
#3839Top layers of metal for high performance IC's
#3840Top layers of metal for high performance IC's
#3841Top layers of metal for high performance IC's
#3842Top layers of metal for high performance IC's
#3843Top layers of metal for high performance IC's
#3844Top layers of metal for high performance IC's
#3845Electronic component, semiconductor device employing same, and method for manufacturing electronic component
#3846Semiconductor device having semiconductor element with back electrode on insulating substrate
#3847CHIP STRUCTURE
#3848Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same
#3849Thermal improvement for hotspots on dies in integrated circuit packages
#3850Method of wafer plating
#3851Top layers of metal for high performance IC's
#3852Semiconductor device capable of suppressing current concentration in pad and its manufacture method
#3853Composition for removing a photoresist and method of forming a bump electrode
#3854METHODS OF FORMING SOLDER CONNECTIONS AND STRUCTURE THEREOF
#3855Methods of forming solder connections and structure thereof
#3856MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#3857Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component
#3858Top layers of metal for high performance IC's
#3859Top layers of metal for high performance IC's
#3860Top layers of metal for high performance IC's
#3861Top layers of metal for high performance IC's
#3862Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
#3863Top layers of metal for high performance IC's
#3864Semiconductor Device
#3865Method of making thermally enhanced substrate-base package
#3866Semiconductor device package utilizing proud interconnect material
#3867Semiconductor device
#3868Interconnections resistant to wicking
#3869Methods and apparatus for a semiconductor device package with improved thermal performance
#3870HIGHLY COMPLIANT PLATE FOR WAFER BONDING
#3871Top layers of metal for high performance IC's
#3872Top layers of metal for high performance IC's
#3873Semiconductor device and method for fabricating the same
#3874Top layers of metal for high performance IC's
#3875Top layers of metal for high performance IC's
#3876Chip stack package and manufacturing method thereof
#3877Backages with buried electrical feedthroughs
#3878Stacked contact bump
#3879METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS
#3880Top layers of metal for high performance IC's
#3881Top layers of metal for high performance IC's
#3882Top layers of metal for high performance IC's
#3883Top layers of metal for high performance IC's
#3884Top layers of metal for high performance IC's
#3885Top layers of metal for high performance IC's
#3886Top layers of metal for high performance IC's
#3887Top layers of metal for high performance IC's
#3888Interlayer dielectric and pre-applied die attach adhesive materials
#3889Top layers of metal for high performance IC's
#3890Semiconductor package structure having enhanced thermal dissipation characteristics
#3891Modular bonding pad structure and method
#3892Semiconductor integrated circuit device
#3893Leadframe IC packages having top and bottom integrated heat spreaders
#3894Semiconductor device and method for manufacturing the same
#3895Semiconductor device with reduced parasitic inductance
#3896Light-emitting device manufacturing method and light-emitting device
#3897Spring connector for making electrical contact at semiconductor scales
#3898Contact surrounded by passivation and polymide and method therefor
#3899Separation method of semiconductor device
#3900Non-cyanide gold electroplating for fine-line gold traces and gold pads