212081 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Tungsten [W]
Top layers of metal for high performance IC's
#3902Top layers of metal for high performance IC's
#3903Top layers of metal for high performance IC's
#3904Top layers of metal for high performance IC's
#3905Top layers of metal for high performance IC's
#3906Top layers of metal for high performance IC's
#3907Top layers of metal for high performance IC's
#3908Top layers of metal for high performance IC's
#3909Top layers of metal for high performance IC's
#3910Top layers of metal for high performance IC's
#3911Method of wire bonding over active area of a semiconductor circuit
#3912Integrated circuit package having exposed thermally conducting body
#3913SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME
#3914Conductive adhesive composition
#3915Electronic components with plurality of contoured microelectronic spring contacts
#3916WAFER LEVEL PACKAGE AND METHOD OF FABRICATING THE SAME
#3917Methodology to control underfill fillet size, flow-out and bleed in flip chips (FC), chip scale packages (CSP) and ball grid arrays (BGA)
#3918METHOD FOR PROCESSING AN INTEGRATED CIRCUIT
#3919Metallization layer for a power semiconductor device
#3920Semiconductor device including electrically conductive bump and method of manufacturing the same
#3921No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement
#3922Top layers of metal for high performance IC's
#3923Methods and apparatus having an integrated circuit attached to fused silica
#3924Method and apparatus for locating and/or forming bumps
#3925Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
#3926Super high density module with integrated wafer level packages
#3927Method for fabricating semiconductor package with multi-layer die contact and external contact
#3928SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#3929Semiconductor device and method of producing the same
#3930Top layers of metal for high performance IC's
#3931Top layers of metal for high performance IC's
#3932Top layers of metal for high performance IC's
#3933Top layers of metal for high performance IC's
#3934Top layers of metal for high performance IC's
#3935Top layers of metal for high performance IC's
#3936Circuit board, method for manufacturing the same, and semiconductor device
#3937THREE-DIMENSIONAL PACKAGING SCHEME FOR PACKAGE TYPES UTILIZING A SACRIFICIAL METAL BASE
#3938Printed circuit board
#3939CHIP STRUCTURE AND FABRICATING PROCESS THEREOF
#3940Low resistance integrated MOS structure
#39413D interconnect with protruding contacts
#3942INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME
#3943Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device
#3944Wirebond pad for semiconductor chip or wafer
#3945CHIP PACKAGING STRUCTURE
#3946Method for forming C4 connections on integrated circuit chips and the resulting devices
#3947Semiconductor device having a smaller electrostatic capacitance electrode
#3948Stackable integrated circuit structures and systems devices and methods related thereto
#3949Semiconductor device, method for manufacturing semiconductor device, and electronic appliance having the semiconductor device
#3950Semiconductor device with via hole of uneven width
#3951Method of dividing an adhesive film bonded to a wafer
#3952Surface mounting electronic component and manufacturing method thereof
#3953Semiconductor device and method of manufacturing the same
#3954Wafer level semiconductor module and method for manufacturing the same
#3955Utra-thin substrate package technology
#3956Semiconductor components having encapsulated through wire interconnects (TWI)
#3957Tail wire cutting method and bonding apparatus
#3958Method for Electroplating and Contact Projection Arrangement
#3959Fabrication method for electronic system modules
#3960FINE PITCH MICROFABRICATED SPRING CONTACT STRUCTURE & METHOD
#3961Semiconductor memory device and defect remedying method thereof
#3962Conductive structures including titanium-tungsten base layers
#3963Semiconductor device, substrate for producing semiconductor device and method of producing them
#3964Method for bonding a semiconductor substrate to a metal substrate
#3965Apparatus and method for signal bus line layout in semiconductor device
#3966Bonding Wire and Integrated Circuit Device Using the Same
#3967Semiconductor die packages using thin dies and metal substrates
#3968Space transformer having multi-layer pad structures
#3969Methods and apparatus for a reduced inductance wirebond array
#3970Power semiconductor module and fabrication method
#3971Semiconductor device and method of manufacturing the same
#3972SEMICONDUCTOR DEVICE HAVING CARBON NANOTUBE INTERCONNECTS AND METHOD OF FABRICATION
#3973Wire bonding capillary tool having multiple outer steps
#3974Devices with microjetted polymer standoffs
#3975Semiconductor device having adhesion increasing film to prevent peeling
#3976Semiconductor device and method for manufacturing the same
#3977Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
#3978Method and structure for eliminating aluminum terminal pad material in semiconductor devices
#3979Room temperature metal direct bonding
#3980Semiconductor device fabricating method
#3981Semiconductor device manufacturing method
#3982Method of manufacturing semiconductor device
#3983Gold/silicon eutectic die bonding method
#3984Flexible interconnect pattern on semiconductor package
#3985Barrier for use in 3-D integration of circuits
#3986Functional blocks for assembly
#3987Fabrication method of semiconductor integrated circuit device
#3988Article and assembly for magnetically directed self assembly
#3989Adjustable thickness thermal interposer and electronic package utilizing same
#3990Carbon nanotube via interconnect
#3991Piezoelectric device and method for manufacturing the same
#3992Isolating chip-to-chip contact
#3993Semiconductor device with guard rings that are formed in each of the plural wiring layers
#3994Semiconductor chip comprising a metal coating structure and associated production method
#3995Semiconductor device that improves electrical connection reliability
#3996Semiconductor device including a DC-DC converter
#3997Integrated-circuit chip with offset external pads and method for fabricating such a chip
#3998CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING BUMPS
#3999Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same
#4000Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
#4001Electronic package formed using low-temperature active solder including indium, bismuth, and/or cadmium
#4002Solder layer and electronic device bonding substrate and submount using the same
#4003Multilayer printed circuit board
#4004PRODUCTION METHOD FOR SEMICONDUCTOR DEVICE
#4005Single passivation layer scheme for forming a fuse
#4006Separation method for cutting semiconductor package assemblage for separation into semiconductor packages
#4007Structure and method to improve current-carrying capabilities of C4 joints
#4008Method for precision assembly of integrated circuit chip packages
#4009Semiconductor integrated circuit device
#4010Semiconductor component having test pads and method and apparatus for testing same
#4011Electronic component and its manufacturing method
#4012Method for manufacturing bump of wafer level package
#4013Semiconductor wafer coat layers and methods therefor
#4014Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device
#4015Semiconductor component having test pads and method and apparatus for testing same
#4016Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus
#4017Fiducial scheme adapted for stacked integrated circuits
#4018Low thermal resistance assembly for flip chip applications
#4019Semiconductor device
#4020Device having a contacting structure
#4021Heat-radiating tape carrier package and method for manufacturing the same
#4022METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES
#4023Semiconductor package containing multi-layered semiconductor chips
#4024Semiconductor device
#4025GaAs integrated circuit device and method of attaching same
#4026Production system
#4027Method of self-assembly on a surface
#4028Wire bonding method for preventing polymer cracking
#4029Method for manufacturing semiconductor device
#4030SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#4031Composite bump
#4032Bump structure and method of manufacturing the same, and mounting structure for IC chip and circuit board
#4033Method of forming a bump and a connector structure having the bump
#4034Semiconductor device
#4035Semiconductor device and manufacturing method thereof
#4036Semiconductor device and method of manufacturing the same
#4037Combined board level EMI shielding and thermal management
#4038Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
#4039Electronic substrate, semiconductor device, and electronic device
#4040Chip package and method for fabricating the same
#4041Stacked semiconductor device and device stacking method
#4042Layer between interfaces of different components in semiconductor devices
#4043Bond pad structure for wire bonding
#4044RF power transistor device with metal electromigration design and method thereof
#4045Method for diffusion soldering
#4046STACKED CONTACT BUMP
#4047Semiconductor device and method of manufacturing semiconductor device
#4048Semiconductor device
#4049Post passivation interconnection schemes on top of the IC chips
#4050Semiconductor apparatus
#4051Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages
#4052Apparatus And Method For Temperature-Interrupting Protection Of An Electric Device
#4053Entire encapsulation of Cu interconnects using self-aligned CuSiN film
#4054Processed wafer via
#4055Semiconductor device and manufacturing the same
#4056Stacked chip-based system and method
#4057Film bonding method, film bonding apparatus, and semiconductor device manufacturing method
#4058Semiconductor package including transformer or antenna
#4059Single-chip and multi-chip module for proximity communication
#4060Apparatus and methods for high-density chip connectivity
#4061Bonding method and apparatus
#4062RF module including control IC without the aid of a relay pad
#4063Methods of Processing Thick ILD Layers Using Spray Coating or Lamination for C4 Wafer Level Thick Metal Integrated Flow
#4064Electronic device and method of manufacturing the same
#4065Positively radiation-sensitive resin composition
#4066LED mounting module, LED module, manufacturing method of LED mounting module, and manufacturing method of LED module
#4067DRIVE IC AND DISPLAY DEVICE HAVING THE SAME
#4068Semiconductor device having improved wire-bonding reliability and method of manufacturing the same
#4069Power composite integrated semiconductor device and manufacturing method thereof
#4070ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES
#4071Method of fabricating semiconductor memory device and semiconductor memory device driver
#4072Semiconductor apparatus including a radiator for diffusing the heat generated therein
#4073Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
#4074Semiconductor device
#4075Semiconductor device
#4076Wire bond and redistribution layer process
#4077Method of producing a semiconductor device by forming an oxide film on a resin layer
#4078Semiconductor device
#4079Active area bonding compatible high current structures
#4080Methods of forming metal layers using multi-layer lift-off patterns
#4081Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board
#4082Method for fabricating semiconductor package
#4083Method of fabrication on high coplanarity of copper pillar for flip chip packaging application
#4084Solder bump confinement system for an integrated circuit package
#4085Nanoscale metal paste for interconnect and method of use
#4086Semiconductor device
#4087Semiconductor device
#4088CHIP CONNECTOR
#4089Electronic devices including solder bumps on compliant dielectric layers
#4090Semiconductor device having through contact blocks with external contact areas
#4091Semiconductor device
#4092Highly reliable, cost effective and thermally enhanced AuSn die-attach technology
#4093Capacitor and manufacturing method thereof
#4094Electronic module with stacked semiconductors
#4095Semiconductor device having an antenna with anisotropic conductive adhesive
#4096Magnetic alignment of integrated circuits to each other
#4097Direct write# system
#4098Method of packaging semiconductor die without lead frame or substrate
#4099Thermal enhanced package
#4100Probe For Semiconductor Devices
#4101Structure and method for bond pads of copper-metallized integrated circuits
#4102Method of manufacturing semiconductor device including bonding pad and fuse elements
#4103Semiconductor device including fuse elements and bonding pad
#4104Warpage-reducing packaging design
#4105Electrical component on a substrate and method for production thereof
#4106Method for mounting electronic components on a support
#4107Tooling for coupling multiple electronic chips
#4108Semiconductor device and method for fabricating the same
#4109Composite integrated device and methods for forming thereof
#4110Semiconductor interconnect having adjacent reservoir for bonding and method for formation
#4111Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#4112Semiconductor devices with oxide coatings selectively positioned over exposed features including semiconductor material and solutions for forming the coatings
#4113Triaxial through-chip connection
#4114Methods and systems for fabricating semiconductor components with through wire interconnects (TWI)
#4115Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present
#4116Method for fabricating circuit component
#4117Method for fabricating last level copper-to-C4 connection with interfacial cap structure
#4118Microelectronic interconnect device comprising localised conductive pins
#4119Multi-chip stack package and fabricating method thereof
#4120Method of wire bonding over active area of a semiconductor circuit
#4121Method of wire bonding over active area of a semiconductor circuit
#4122Method of wire bonding over active area of a semiconductor circuit
#4123Carbon nanotube circuit component structure
#4124METHOD OF WIRE BONDING OVER ACTIVE AREA OF A SEMICONDUCTOR CIRCUIT
#4125Semiconductor chip with bond area
#4126Methods of fabricating nanostructures and nanowires and devices fabricated therefrom
#4127Stacked module and manufacturing method thereof
#4128Back-to-front via process
#4129Semiconductor device package and method for manufacturing same
#4130Manufacturing method for electronic device
#4131Adhesion method using gray-scale photolithography
#4132Arrangement and method impedance matching
#4133Thermally balanced via
#4134Circuit board, method for manufacturing the same, semiconductor device, and method for manufacturing the same
#4135Electrical connections made with dissimilar metals
#4136Connecting module having passive components
#4137Semiconductor device and a method of manufacturing the same
#4138Electronic circuit package
#4139Multi-chip package system
#4140Semiconductor device, manufacturing method of semiconductor device, and RFID tag
#4141Method for joining electronic parts finished with nickel and electronic parts finished with electroless nickel
#4142Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps
#4143Microchannel heat sink manufactured from graphite materials
#4144Electronic component mounting method
#4145Manufacturing method for semiconductor device and semiconductor device
#4146Package structure and manufacturing method thereof
#4147Super high-density module with integrated wafer level packages
#4148Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device
#4149Horizontal Carbon Nanotubes by Vertical Growth and Rolling
#4150Electronic micromodule and method for manufacturing the same
#4151Object and bonding method thereof
#4152Semiconductor package having improved thermal performance
#4153CHIP STRUCTURE AND CHIP MANUFACTURING PROCESS
#4154Conductive particles for anisotropic conductive interconnection
#4155Sequential fabrication of vertical conductive interconnects in capped chips
#4156Super high-density module with integrated wafer level packages
#4157Semiconductor structure with a plastic housing and separable carrier plate
#4158Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate
#4159Microelectronic elements with compliant terminal mountings and methods for making the same
#4160Semiconductor light emitting device, semiconductor element, and method for fabricating the semiconductor light emitting device
#4161Carbon nanotubes solder composite for high performance interconnect
#4162Miniaturized Contact Spring
#4163Methods of fabricating interconnects for semiconductor components
#4164Thin-film capacitor and method for fabricating the same, electronic device and circuit board
#4165Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film
#4166Method of manufacturing semiconductor device
#4167Three dimensional microstructures and methods for making three dimensional microstructures
#4168Method of producing a semiconductor device, and wafer-processing tape
#4169PAD STRUCTURE OF SEMICONDUCTOR DEVICE AND FORMATION METHOD
#4170PAD STRUCTURE IN A SEMICONDUCTOR DEVICE AND A METHOD OF FORMING A PAD STRUCTURE
#4171Semiconductor device and manufacturing method of the same
#4172Apparatus and method for increasing the quantity of discrete electronic components in an integrated circuit package
#4173Semiconductor device with thermoplastic resin to reduce warpage
#4174ADHESIVE SHEET, SEMICONDUCTOR DEVICE HAVING THE SAME, MULTI-STACKED PACKAGE HAVING THE SAME, AND METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A MULTI-STACKED PACKAGE
#4175Electronics package with an integrated circuit device having post wafer fabrication integrated passive components
#4176Coaxial through chip connection
#4177Methods and apparatus for packaging integrated circuit devices
#4178Modified and doped solder alloys for electrical interconnects, methods of production and uses thereof
#4179Adhesive for bonding circuit members, circuit board and process for its production
#4180Dicing die-bonding film, method of fixing chipped work and semiconductor device
#4181Method for fabricating semiconductor component with adjustment circuit for adjusting physical or electrical characteristics of substrate conductors
#4182Space-efficient package for laterally conducting device
#4183In-situ functionalization of carbon nanotubes
#4184Semiconductor component having plate, stacked dice and conductive vias
#4185Projected contact structures for engaging bumped semiconductor devices
#4186Integrated circuit chip with external pads and process for fabricating such a chip
#4187Substrate panel with plating bar structured to allow minimum kerf width
#4188Radio frequency device
#4189Adhesion by plasma conditioning of semiconductor chip surfaces
#4190Method and system for increasing yield of vertically integrated devices
#4191Metal-base circuit board and its manufacturing method
#4192Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device
#4193Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
#4194Semiconductor components having through wire interconnects (TWI)
#4195Light emitting device
#4196Interconnect assemblies and methods
#4197Conductive ball arraying apparatus
#4198Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing
#4199System and method for separating and packaging integrated circuits
#4200Individualized low parasitic power distribution lines deposited over active integrated circuits