212081 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Tungsten [W]
Method of making semiconductor package having exposed heat spreader
#4202A SEMICONDUCTOR HAVING A COPPER-BASED METALLIZATION STACK WITH A LAST ALUMINUM METAL LINE LAYER
#4203Semiconductor device
#4204Pin-type chip tooling
#4205Low cost bonding pad and method of fabricating same
#4206THERMAL INTERFACE APPARATUS, SYSTEMS, AND METHODS
#4207Method for the interconnection of active and passive components and resulting thin heterogeneous component
#4208Method of making a semiconductor device with improved heat dissipation
#4209Apparatuses and methods for forming wireless RF labels
#4210Output amplifier structure with bias compensation
#4211SEMICONDUCTOR DEVICE
#4212Alternate pad structures/passivation inegration schemes to reduce or eliminate IMC cracking in post wire bonded dies during Cu/Low-K BEOL processing
#4213Alloys for flip chip interconnects and bumps
#4214Damascene patterning of barrier layer metal for C4 solder bumps
#4215Wafer redistribution structure with metallic pillar and method for fabricating the same
#4216Bonding method of semiconductor substrate and sheet, and manufacturing method of semiconductor chips using the same
#4217Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device
#4218Manufacturing method of wiring board and manufacturing method of semiconductor device
#4219Method of manufacturing a semiconductor device
#4220Chip structure and manufacturing method of the same
#4221Semiconductor device
#4222Thermally enhanced power semiconductor package system
#4223Stackable power semiconductor package system
#4224Method and apparatus for rapid thermal processing and bonding of materials using RF and microwaves
#4225Method for pressure bonding and method for manufacturing semiconductor device
#4226Method for forming a joint
#4227Method of Forming Bump, Method of Forming Image Sensor Using the Method, Semiconductor Chip and the Sensor so Formed
#4228Bonding a non-metal body to a metal surface using inductive heating
#4229Photosensitive composition
#4230Fine pitch interconnect and method of making
#4231Solvent Assisted Burnishing of Pre-Underfilled Solder-Bumped Wafers for Flipchip Bonding
#4232Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device
#4233Reduction of macro level stresses in copper/low-K wafers
#4234Composite carbon nanotube thermal interface device
#4235Semiconductor device and method of manufacturing the same
#4236Methods and apparatus for Flip-Chip-On-Lead semiconductor package
#4237Device for making an in-mold circuit
#4238Junction structure for a terminal pad and solder, and semiconductor device having the same
#4239Semiconductor device and manufacturing method of the same
#4240Printed wiring board
#4241Contact pad structure for flip chip semiconductor die
#4242Semiconductor chip with post-passivation scheme formed over passivation layer
#4243Multilayered circuit substrate with semiconductor device incorporated therein
#4244Multilayered printed circuit board and method for manufacturing the same
#4245Bond Surface Conditioning System for Improved Bondability
#4246Method for evaluating and modifying solder attach design for integrated circuit packaging assembly
#4247Methods and apparatuses for fluidic self assembly
#4248Plastic packaged device with die interface layer
#4249Closed loop thermally enhanced flip chip BGA
#4250Semiconductor structure and method of assembly
#4251Semiconductor structure and method of manufacture
#4252Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages
#4253Radio frequency power semiconductor device package comprising dielectric platform and shielding plate
#4254Bond pad structure
#4255Light emitting diode chip with reflective layer thereon
#4256Method for forming solder contacts on mounted substrates
#4257Semiconductor device and method for manufacturing thereof
#4258Method of producing image display unit
#4259Method for forming bumps
#4260Etchant and method for forming bumps
#4261METHOD AND STRUCTURE FOR VERTICALLY-STACKED DEVICE CONTACT
#4262Methods for magnetically directed self assembly
#4263Semiconductor device having strong adhesion between wiring and protective film, and manufacturing method therefor
#4264Semiconductor device having a semiconductor chip, and method for the production thereof
#4265Chip scale power LDMOS device
#4266Semiconductor device and fabrication method thereof
#4267Support structures for semiconductor devices
#4268Bond pads and methods for fabricating the same
#4269Semiconductor chip having a bump with conductive particles and method of manufacturing the same
#4270Electronic apparatus
#4271Semiconductor module having a coupling substrate, and methods for its production
#4272Semiconductor device and a method of manufacturing the same
#4273Ultrasonic horn
#4274Microelectronic packages and methods therefor
#4275Wiring board and capacitor
#4276Power semiconductor module
#4277Contact carriers (tiles) for populating larger substrates with spring contacts
#4278Semiconductor chip and semiconductor device
#4279Electronic device, semiconductor device using same, and method for manufacturing semiconductor device
#4280Semiconductor device and method for manufacturing the same
#4281Methods for protecting metal surfaces
#4282Contacts to microdevices
#4283Semiconductor device with improved design freedom of external terminal
#4284Modular bonding pad structure and method
#4285Semiconductor device featuring large reinforcing elements in pad area
#4286Component with chip through-contacts
#4287Semiconductor device with a plastic housing composition that includes filler particles and that at least partially embeds a semiconductor chip
#4288Power semiconductor module with MOS chip
#4289Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the same
#4290Electric contact and method for producing the same and connector using the electric contacts
#4291Semiconductor device and a method of manufacturing the same
#4292Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies
#4293Semiconductor manufacturing method
#4294Semiconductor device
#4295Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
#4296Fan out type wafer level package structure and method of the same
#4297Apparatuses and methods for high speed bonding
#4298Semiconductor device having metallic plate with groove
#4299Semiconductor device
#4300Semiconductor device
#4301Power semiconductor device and method therefor
#4302Semiconductor device and automotive AC generator
#4303Methods for electronic fluorescent perturbation for analysis and electronic perturbation catalysis for synthesis
#4304METHODS OF FABRICATING AND USING SHAPED SPRINGS
#4305Support with solder ball elements and a method for populating substrates with solder balls
#4306Chip structure and chip package structure
#4307Flip-chip packaging process using copper pillar as bump structure
#4308Semiconductor device and method for fabricating the same
#4309Protective barrier layer for semiconductor device electrodes
#4310Semiconductor device and manufacturing method thereof
#4311Semiconductor chip package and method of manufacturing the same
#4312Semiconductor device having pads and which minimizes defects due to bonding and probing processes
#4313Semiconductor device and power conversion apparatus using the same
#4314Method for fabricating semiconductor component having conductors and bonding pads with wire bondable surfaces and selected thickness
#4315Method for fabricating semiconductor components having encapsulated, bonded, interconnect contacts on redistribution contacts
#4316Chip package structure and method for manufacturing bumps
#4317Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices
#4318Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology
#4319Lithographic type microelectronic spring structures with improved contours
#4320Method for forming a double embossing structure
#4321Wafer structure with a multi-layer barrier in an UBM layer network device with power supply
#4322Alpha particle shields in chip packaging
#4323METHOD OF SOLDER BUMPING A CIRCUIT COMPONENT AND CIRCUIT COMPONENT FORMED THEREBY
#4324Semiconductor device and semiconductor chip
#4325Wiring board construction including embedded ceramic capacitors(s)
#4326Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#4327Display panel package
#4328BONDING PAD STRUCTURE AND METHOD OF FORMING THE SAME
#4329Approach to high temperature wafer processing
#4330Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip
#4331Methods and apparatus for high-density chip connectivity
#4332Hybridization of polynucleotides conjugated with chromophores and fluorophores to generate donor-to-donor energy transfer system
#4333Ternary alloy column grid array
#4334Method of packaging and interconnection of integrated circuits
#4335Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features
#4336Semiconductor device
#4337MOSFET package
#4338MOSFET package
#4339High current semiconductor device system having low resistance and inductance
#4340Semiconductor connection component
#4341Power semiconductor packaging method and structure
#4342METHODS OF FABRICATING A SEMICONDUCTOR DEVICE USING A PHOTOSENSITIVE POLYIMIDE LAYER AND SEMICONDUCTOR DEVICES FABRICATED THEREBY
#43433D IC method and device
#4344Manufacturing method of semiconductor device
#4345Semiconductor device and a manufacturing method of the same
#4346Method and device for attaching a chip in a housing
#4347Assembly of an electrical component comprising an electrical insulation film on a substrate and method for producing said assembly
#4348Bonding pad structure to minimize IMD cracking
#4349Bonded structure and bonding method
#4350Semiconductor device and method of manufacturing the same
#4351Semiconductor device electronic component, circuit board, and electronic device
#4352Insulated gate semiconductor device and manufacturing method thereof
#4353Method of making wafer level package structure by grinding the backside thereof and then forming metal layer on the ground side
#4354Apparatuses and methods facilitating functional block deposition
#4355Solder composition for electronic devices
#4356Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same
#4357Semiconductor device
#4358Semiconductor device
#4359Integrated circuit with low-stress under-bump metallurgy
#4360Semiconductor device and method of manufacturing the same
#4361Polysilicon film with increased roughness
#4362Semiconductor device
#4363Fluxless bumping process
#4364METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#4365Metal pad or metal bump over pad exposed by passivation layer
#4366Electrical interconnect structures for integrated circuits and methods of manufacturing the same
#4367Semiconductor power device and RF signal amplifier
#4368Technique for efficiently patterning an underbump metallization layer using a dry etch process
#4369Planar bond pad design and method of making the same
#4370Bonding pad on IC substrate and method for making the same
#4371Technique for forming a copper-based contact layer without a terminal metal
#4372Semiconductor device, electronic module, and method of manufacturing electronic module
#4373Semiconductor package with ferrite shielding structure
#4374Microelectronic bond pad
#4375Bonding pad fabrication method, method for fabricating a bonding pad and an electronic device, and electronic device
#4376Semiconductor device, power amplifier device and PC card
#4377Method for modifying surface of substrate and method for manufacturing semiconductor device
#4378Manufacturing method for electronic substrate, manufacturing method for electro-optical device, and manufacturing method for electronic device
#4379Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same
#4380Semiconductor device and a method of manufacturing the same
#4381Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack
#4382Dummy structures extending from seal ring into active circuit area of integrated circuit chip
#4383Wafer-level-chip-scale package and method of fabrication
#4384Wafer level package and its manufacturing method
#4385Semiconductor chip production method, semiconductor device production method, semiconductor chip, and semiconductor device
#4386Semiconductor device
#4387Semiconductor device and method of manufacturing the same
#4388Composite metal column for mounting semiconductor device
#4389Semiconductor device and method of manufacturing the same
#4390Semiconductor device and manufacturing method thereof
#4391Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus
#4392Method of realizing thermosonic wire bonding between metal wires and copper pads by depositing a thin film to surface of semiconductor chip with copper pads
#4393Process for making a semiconductor device having a roughened surface
#4394Method and structure for reduction of soft error rates in integrated circuits
#4395Probing pads in kerf area for wafer testing
#4396Electronic component unit
#4397Semiconductor device
#4398Semiconductor device
#4399Direct FET device for high frequency application
#4400Method of realizing direct bonding between metal wires and copper pads by means of thermosonic wire bonding using shielding gas spraying device
#4401Integrated circuit for driving semiconductor device and power converter
#4402Semiconductor device
#4403Seedless wirebond pad plating
#4404Semiconductor device
#4405Semiconductor device
#4406Chip-embedded interposer structure and fabrication method thereof, wafer level stack structure and resultant package structure
#4407Surface mount package
#4408Semiconductor device
#4409Electronic assembly and method for producing an electronic assembly
#4410Trenched MOSFET termination with tungsten plug structures
#4411Semiconductor device and manufacturing method thereof
#4412Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
#4413Chip and multi-chip semiconductor device using the chip, and method for manufacturing same
#4414Apparatuses and methods for forming assemblies
#4415Semiconductor device with semiconductor device components embedded in a plastics composition
#4416Semiconductor device
#4417Adhesive layer forming a capacitor dielectric between semiconductor chips
#4418Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom
#4419Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same
#4420Semiconductor die package and method for making the same
#4421Semiconductor device
#4422Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#4423Semiconductor device and method of manufacturing the same
#4424Cure catalyst, composition, electronic device and associated method
#4425Circuitry component and method for forming the same
#4426Ultrathin semiconductor circuit having contact bumps
#4427Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer
#4428Method of fabricating a stacked die in die BGA package
#4429Method of fabricating a stacked die in die BGA package
#4430Three dimensional device integration method and integrated device
#4431Stacked die in die BGA package
#4432Heat-dissipating semiconductor package and fabrication method thereof
#4433Mechanical integrity evaluation of low-k devices with bump shear
#4434Printed circuit board having embedded RF module power stage circuit
#4435Wire bonding structure to electrically connect a printhead chip to a flexible printed circuit of an ink cartridge and method thereof
#4436Semiconductor device and method for manufacturing the same
#4437Semiconductor device and a method of manufacturing the same
#4438Intrinsic thermal enhancement for FBGA package
#4439Semiconductor device
#4440Semiconductor device
#4441Method of manufacturing semiconductor device
#4442Transmission-line spring structure
#4443Contact Structures Comprising A Core Structure And An Overcoat
#4444Semiconductor wafer package and manufacturing method thereof
#4445Method of manufacturing a semiconductor device
#4446Stretchable form of single crystal silicon for high performance electronics on rubber substrates
#4447Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same
#4448Micro solder pot
#4449Electronic board, method of manufacturing the same, and electronic device
#4450Electronic board, method of manufacturing the same, and electronic device
#4451Method of soldering or brazing articles having surfaces that are difficult to bond
#4452Remote chip attachment
#4453Coaxial through chip connection
#4454Post-attachment chip-to-chip connection
#4455Tack & fuse chip bonding
#4456Routingless chip architecture
#4457Semiconductor device and method for manufacturing the same
#4458Rigid-backed, membrane-based chip tooling
#4459Through chip connection
#4460Chip-based thermo-stack
#4461Probe card assembly and kit
#4462Protected chip stack
#4463Integrated electronic chip and interconnect device and process for making the same
#4464Chip spanning connection
#4465Inverse chip connector
#4466Chip connector
#4467Post & penetration interconnection
#4468Triaxial through-chip connection
#4469Profiled contact
#4470Chip capacitive coupling
#4471Semiconductor device with a diffusion barrier film having a spacing for stress relief of solder bump
#4472Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#4473Metal bump with an insulation for the side walls and method of fabricating a chip with such a metal bump
#4474Electronic chip contact structure
#4475Patterned contact
#4476Contact-based encapsulation
#4477Membrane-based chip tooling
#4478METHOD FOR FORMING BUMPS
#4479Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors
#4480Superimposed displays
#4481Semiconductor device and method of manufacturing a semiconductor device
#4482Method of wafer-level packaging using low-aspect ratio through-wafer holes
#4483Gate contact and runners for high density trench MOSFET
#4484Trenched MOSFET device with contact trenches filled with tungsten plugs
#4485Structure for avalanche improvement of ultra high density trench MOSFET
#4486High density hybrid MOSFET device
#4487High density trench MOSFET with low gate resistance and reduced source contact space
#4488Source contact and metal scheme for high density trench MOSFET
#4489Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat
#4490Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts
#4491Nanotube materials for thermal management of electronic components
#4492Semiconductor element and manufacturing method thereof
#4493Method for mounting an electronic part on a substrate using a liquid containing metal particles
#4494Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device
#4495Structure and method for bond pads of copper-metallized integrated circuits
#4496Integrated circuit device
#4497Semiconductor device having capacitive insulation means and communication terminal using the device
#4498Semiconductor device
#4499Capacitor device, semiconductor devioce, and setting method of terminal capacitance of pad electrode thereof
#4500Circuit arrangement placed on a substrate and method for producing the same