Light emitting apparatus and method of manufacturing the same

Semiconductor bond pad structures and methods of manufacturing thereof

Self assembly of elements for displays

Semiconductor device

Semiconductor device

System and method for die attach using a backside heat spreader

Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method

Semiconductor chip with coil element over passivation layer

Microelectronic assemblies having compliant layers

Semiconductor device packages with substrates for redistributing semiconductor device electrodes

Sealing membrane for thermal interface material

Chip package having chip extension and method

Low cost power semiconductor module without substrate

Semiconductor device

Light emitting device package and method for manufacturing the same

Method and device for producing a bondable area region on a carrier

Low range bonding tool

Thermal management of systems having localized regions of elevated heat flux

NANO IC

Method for manufacturing electronic component-embedded printed circuit board

Methods of packaging and testing microelectronic imaging devices

Method for making a flat-top pad

Method of manufacturing a device having a contacting structure

Intermediate semiconductor device structures

Bond pad structure comprising multiple bond pads with metal overlap

Methods for forming openings in a substrate and apparatuses with these openings and methods for creating assemblies with openings

Device with area array pads for test probing

Terminal pad structures and methods of fabricating same

Method of making the semiconductor device, circuit board, and electronic instrument

Method of manufacturing self-supporting contacting structures

Working method of metal material and semiconductor apparatus fabricated by the method

Conductive bump structure for semiconductor device and fabrication method thereof

Alignment key structure in a semiconductor device and method of forming the same

Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment

Semiconductor device

Package substrate with built-in capacitor and manufacturing method thereof

Wire bonded semiconductor device having low inductance and noise

Techniques for improving bond pad performance

Semiconductor package board using a metal base

Semiconductor device including a base member and a semiconductor constructing body directly fixed to thermosetting resin of the base member

Microelectronic component and assembly having leads with offset portions

Multilayer printed wiring board

Semiconductor device and method of manufacturing the same

Composite electronic component

Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides

Semiconductor device having a flexible board for connection to a semiconductor chip mounted on an insulating substrate

Microelectronic package interconnect and method of fabrication thereof

Semiconductor device assemblies with compliant spring contact structures

Multilayer printed wiring board

Fabrication of compliant spring contact structures and use thereof

Method of manufacturing multi-layered substrate

Semiconductor device and method of manufacturing the same

Microelectronic contact structure and method of making same

Semiconductor device having a leading wiring layer

Semiconductor device including an under electrode and a bump electrode

Thermal interconnect systems methods of production and uses thereof

Microelectronic assemblies having compliant layers

Device packages having a III-nitride based power semiconductor device

Semiconductor device having surface mountable external contact areas and method for producing the same

Bumping process and bump structure

Semiconductor chip having a soldering layer sequence, and process for soldering a semiconductor chip

Thin passivation layer on 3D devices

System for providing a redistribution metal layer in an integrated circuit

Electric circuit module with improved heat dissipation characteristics using a fixing tool for fixing an electric apparatus to a heat sink

Coolant cooled type semiconductor device

Fan out type wafer level package structure and method of the same

Electronic devices including offset conductive bumps

Semiconductor device

Semiconductor light-emitting device and its manufacturing method

Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same

Process for precise arrangement of micro-bodies

Ultrasonic tool and ultrasonic bonder

Semiconductor package substrate having contact pad protective layer formed thereon

Reinforced bond pad for a semiconductor device

Semiconductor device

Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the same

Power semiconductor device and method therefor

Manufacturing managing method of semiconductor devices and a semiconductor substrate

Copper interconnect post for connecting a semiconductor chip to a substrate and method of fabricating the same

Semiconductor wafer coat layers and methods therefor

Resin-encapsulated type semiconductor packages, and production method and apparatus therefor

Method for forming laminated structure and method for manufacturing semiconductor device using the method thereof

SEMICONDUCTOR PACKAGE SUBSTRATE HAVING CONTACT PAD PROTECTIVE LAYER FORMED THEREON AND METHOD FOR FABRICATING THE SAME

Fluidic heterogeneous microsystems assembly and packaging

Method of assembling displays on substrates

Semiconductor device to be applied to various types of semiconductor package

Chip package with dam bar restricting flow of underfill

Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads

Semiconductor device and method of manufacturing thereof

Semiconductor device and manufacturing method thereof

Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance

Method of forming self-passivating interconnects and resulting devices

Semiconductor device and method of manufacturing the same

Semiconductor device suitable for a ferroelectric memory and manufacturing method of the same

CURRENT SENSOR

Method of room temperature covalent bonding

Stacked die-in-die BGA package with die having a recess

Flip chip interconnection having narrow interconnection sites on the substrate

Methods for the electronic, homogeneous assembly and fabrication of devices

Semiconductor structure with RF element

Secure system for tracking elements using tags

Semiconductor chip and method manufacturing the same

Semiconductor device

Semiconductor device having a frame portion and an opening portion with mountable semiconductor chips therein

Semiconductor device and manufacturing method thereof

System for tracking elements using tags

Method of forming an interconnection element

ELECTRICAL CONTACT

Method for Manufacturing Gold Bumps

Method of making a flexible substrate containing self-assembling microstructures

Microelectronic component assemblies with recessed wire bonds and methods of making same

Top via pattern for bond pad structure

Semiconductor device and manufacturing method for the same

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Forming solder balls on substrates

Bonding pads having slotted metal pad and meshed via pattern

Method for producing a semiconductor device and resulting device

Front-end processing of nickel plated bond pads

Wafer-processing tape

Self assembly of elements for displays

Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device

Magnetron sputtered metallization of a nickel silicon alloy, especially useful as solder bump barrier

Semiconductor device with via hole for electric connection

Copper interconnection with conductive polymer layer and method of forming the same

Printed wiring board and method for manufacturing the same

METHOD OF FORMING REDISTRIBUTION BUMP AND SEMICONDUCTOR CHIP AND MOUNT STRUCTURE FABRICATED USING THE SAME

Method for separating electronic component from organic board

LOCAL MULTILAYERED METALLIZATION

Method for manufacturing flip-chip type semiconductor device featuring nickel electrode pads, and plating apparatus used in such method

Junction-isolated vias

Wafer bonding of thinned electronic materials and circuits to high performance substrate

Solder bump and related intermediate structure having primary and secondary portions and method of manufacturing same

Nano memory, light, energy, antenna and strand-based systems and methods

Laser processing method and laser beam processing machine

Composition of aromatic or cycloaliphatic amine-derived polyepoxide and polyamine

Semiconductor device including a semiconductor chip with signal contact areas and supply contact areas, and method for producing the semiconductor device

Planar microspring integrated circuit chip interconnection to next level

Arrangement of an electrical component placed on a substrate, and method for producing the same

MOSFET package

MOSFET package

Integrated circuit package with lead fingers extending into a slot of a die paddle

Semiconductor device and method for producing same

Methods of fabricating integrated circuit devices having self-aligned contact structures

Microfeature devices and methods for manufacturing microfeature devices

Application of impressed-current cathodic protection to prevent metal corrosion and oxidation

Method of manufacturing semiconductor device

Semiconductor device production method and semiconductor device

Microelectronic assemblies having compliancy

Underfill encapsulant for wafer packaging and method for its application

Circuit device and manufacturing method thereof

Inductor formed in an integrated circuit

Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus

Manufacturing method for electronic device

Si power device mounted on a substrate including arrangements to prevent damage to connection layers due to heat treatment

Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours

Semiconductor device, electrode member and electrode member fabrication method

Electrical contact

Ta-TaN selective removal process for integrated device fabrication

Microfeature devices and methods for manufacturing microfeature devices

Method of manufacturing semiconductor device and semiconductor device

Semiconductor component and method of manufacture

Method of manufacturing semiconductor device

High frequency semiconductor device

Semiconductor device and manufacturing method thereof

Method to create flexible connections for integrated circuits

Trace design to minimize electromigration damage to solder bumps

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Accurate relative alignment and epoxy-free attachment of optical elements

Semiconductor component sealed on five sides by polymer sealing layer

Methods for patterning dielectric material, and methods for aligning semiconductor fabrication molds and semiconductor substrates

Semiconductor package and method for manufacturing the same

METHOD OF FORMING CHIP-TYPE LOW-K DIELECTRIC LAYER

Tools and methods for forming conductive bumps on microelectronic elements

Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method

Method of forming a wear-resistant dielectric layer

Bond pad structure for integrated circuit chip

Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the same

Semiconductor device

Semiconductor device and manufacturing method of the same

Semiconductor chip having solder bumps and dummy bumps

Semiconductor device with signal wirings that pass through under the output electrode pads and dummy wirings near the peripheral portion

Multilayer printed wiring board and method of manufacturing the same

Implantable, tissue conforming drug delivery device

Manufacturing method of semiconductor device

Structure and method for bonding an IC chip

Semiconductor device and method of manufacturing the same

Semiconductor device

Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof

Semiconductor device and fabrication method thereof

Compliant electrical contacts

Method and system for 3D alignment in wafer scale integration

Device packages

Chip-stacked semiconductor package and method for fabricating the same

Efficient method of forming and assembling a microelectronic chip including solder bumps

Semiconductor laser, method of mounting semiconductor laser, semiconductor laser mounted structure, and optical disk system

Semiconductor device featuring probe area definition mark for defining probe area in electrode pad, and proof test system for proving proper contact of test probe with probe area

Device package

Transducer assembly, capillary and wire bonding method using the same

Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same

Method of making a semiconductor chip assembly using multiple etch steps to form a pillar after forming a routing line

Manufacturing method of semiconductor device

Integrated circuit die connection methods and apparatus

Semiconductor package and semiconductor module

Semiconductor device and method of manufacturing a semiconductor device

Semiconductor package with crossing conductor assembly and method of manufacture

Semiconductor device and manufacturing method thereof

Bilayer aluminum last metal for interconnects and wirebond pads

Apparatus for plating a semiconductor wafer and plating solution bath used therein

Method of making an electronic assembly

System-in-package wireless communication device comprising prepackaged power amplifier

Method of manufacturing semiconductor device and method of treating electrical connection section

Method for producing an anisotropic conductive film on a substrate

Under bump metallurgy in integrated circuits

Adhesive containing a filler, and a method for attaching and manufacturing a thin plate using the same

Semiconductor device including multiple rows of peripheral circuit units

Electronic component with semiconductor chip and semiconductor wafer with contact pads, and method for the production thereof

Low profile ball-grid array package for high power

Semiconductor integrated circuit and method of manufacturing the same

Printed-circuit board and circuit unit incorporating the circuit board

Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus

Method for fabricating semiconductor component with thinned substrate having pin contacts

Wafer-processing tape and method of producing the same

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

High temperature, stable SiC device interconnects and packages having low thermal resistance

Multi-function card device

Wire clamping plate

Method of metal sputtering for integrated circuit metal routing

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Method for fabricating module of semiconductor chip

Method for cutting semiconductor substrate

Assembly comprising functional devices and method of making same

Dicing/die-bonding film, method of fixing chipped work and semiconductor device

Thin film transistor substrate, method of manufacturing the same, liquid crystal display apparatus having the same and method of manufacturing the liquid crystal display apparatus

Semiconductor device fabricating apparatus and semiconductor device fabricating method

Semiconductor interconnect having dome shaped conductive spring contacts

Method for manufacturing semiconductor device having a pair of heat sinks

NANO IC packaging

Semiconductor device

Organic semiconductor device and its manufacturing method

Electrical contact

Interconnection device and system

Electrical contact and connector and method of manufacture

Method of forming contact pads

Semiconductor integrated device and method for manufacturing same

Method and system for 3D alignment in wafer scale integration

Method for measuring bonding quality of bonded substrates, metrology apparatus, and method of producing a device from a bonded substrate

Semiconductor package having semiconductor constructing body and method of manufacturing the same

Plating apparatus and plating method

Packaging for electronic modules

Intelligent high-power amplifier module

Layered microelectronic contact and method for fabricating same

Solder structures for out of plane connections

Method of forming a bonding pad structure

Copper interconnect

Semiconductor device having exposed heat dissipating metal plate

Semiconductor device

Semiconductor integrated circuit device and method of manufacturing the same

Semiconductor device and manufacturing method of the same

Semiconductor device and radio communication device

Method for making a planar suspended microstructure, using a sacrificial layer of polymer material and resulting component

Electronic device including a substrate structure and a process for forming the same

Method for constructing contact formations

Hot-Melt Underfill Composition and Methos of Application

Manufacturing method of semiconductor device

Method and system for performing die attach using a flame

Thermally controlled fluidic self-assembly

Module

Bonding pad structure

Ball limiting metallurgy split into segments

Circuit device with circuit board and semiconductor chip mounted thereon

Repairable three-dimensional semiconductor subsystem

Semiconductor device, method for manufacturing semiconductor device, circuit board, and electronic instrument

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument

B-stageable underfill encapsulant and method for its application

Semiconductor device having a bonding pad structure including an annular contact

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Flip chip device

Test system for semiconductor components having conductive spring contacts

Method for fabricating semiconductor components with conductive spring contacts

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Semiconductor device and manufacturing method thereof

Metallization structure over passivation layer for IC chip

Heat dissipating semiconductor package and fabrication method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device

Circuit boards, electronic devices, and methods of manufacturing thereof

Method of manufacturing a device-incorporated substrate

Bonding structure and fabrication thereof

Three-dimensional device fabrication method

Semiconductor memory device and defect remedying method thereof

Liquid metal thermal interface material system

Coolant cooled type semiconductor device

Semiconductor device, its manufacturing method, and radio communication device

Semiconductor device and fabrication method for the same

Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contacts

Micro-hole plating method, gold bump fabrication method and semiconductor device fabrication method using the micro-hole plating method, semiconductor device

Semiconductor package and manufacturing method thereof

Solder interconnect structure and method using injection molded solder

Epoxy-solder thermally conductive structure for an integrated circuit

Method for fabricating semiconductor components with conductive vias