212081 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Tungsten [W]
Semiconductor component having plate and stacked dice
#4802Semiconductor device and manufacturing method of semiconductor device
#4803Substrate package structure and packaging method thereof
#4804Semiconductor device
#4805Methods for aligning semiconductor fabrication molds and semiconductor substrates
#4806Plating apparatus
#4807Forming an intermediate layer in interconnect joints and structures formed thereby
#4808Semiconductor device having low-k dielectric film in pad region and method for manufacture thereof
#4809Method for removing resin mask layer and method for manufacturing solder bumped substrate
#4810High surface area aluminum bond pad for through-wafer connections to an electronic package
#4811Semiconductor device, and method for manufacturing the same
#4812Electronic device and manufacturing method of the same
#4813Ultra-thin semiconductor package device and method for manufacturing the same
#4814Semiconductor device with a via hole having a diameter at the surface larger than a width of a pad electrode
#4815Probe arrays and method for making
#4816Semiconductor device and method of fabricating the same
#4817Integrated circuit component and mounting method thereof
#4818Method of fabricating a high Q factor integrated circuit inductor
#4819Micro-machined structure production using encapsulation
#4820REDISTRIBUTION LAYER AND CIRCUIT STRUCTURE THEREOF
#4821Heat dissipating packages structure and method for fabricating the same
#4822Electronic device package and electronic equipment
#4823Active area bonding compatible high current structures
#4824Fabricating surface mountable semiconductor components with leadframe strips
#4825Flip-chip semiconductor device utilizing an elongated tip bump
#4826Integration type semiconductor device and method for manufacturing the same
#4827Semiconductor device with crack-resistant multilayer copper wiring
#4828Electronic device package and electronic equipment
#4829Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument
#4830Electrical contact and connector and method of manufacture
#4831Structure and method for contact pads having an overcoat-protected bondable metal plug over copper-metallized integrated circuits
#4832Bumping process
#4833Fabrication method of a wafer structure
#4834Method for plasma enhanced bonding and bonded structures formed by plasma enhanced bonding
#4835Bond pad structure for integrated circuit chip
#4836Flip chip package including a heat spreader having an edge with a recessed edge portion and method of making the same
#4837Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion
#4838Semiconductor chip with passivation layer comprising metal interconnect and contact pads
#4839Semiconductor device, circuit board, electro-optic device, electronic device
#4840Bond pad structure with stress-buffering layer capping interconnection metal layer
#4841Semiconductor module, process for producing the same, and film interposer
#4842Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module
#4843Fan out type wafer level package structure and method of the same
#4844Flip chip package including a non-planar heat spreader and method of making the same
#4845Bumping process and structure thereof
#4846Oblique parts or surfaces
#4847Semiconductor device and manufacturing method of the same
#4848Bumping process and structure thereof
#4849Semiconductor device capsule
#4850Audio amplifier assembly
#4851Multi-layer integrated semiconductor structure having an electrical shielding portion
#4852Method and apparatus for placing conductive balls
#4853Thermal management of systems having localized regions of elevated heat flux
#4854Device for bonding a metal on a surface of a substrate
#4855Method for fabricating packaged die
#4856Structure and method for contact pads having a recessed bondable metal plug over of copper-metallized integrated circuits
#4857Heat dissipating package structure and method for fabricating the same
#4858Plating apparatus and plating method
#4859Semiconductor device and manufacturing method for the same
#4860Method for manufacturing wafer level chip scale package using redistribution substrate
#4861Inspection method of bonded status of ball in wire bonding
#4862Bonding structure, actuator device and liquid-jet head
#4863Non-Circular via holes for bumping pads and related structures
#4864Thick metal layer integrated process flow to improve power delivery and mechanical buffering
#4865Resist sidewall spacer for C4 BLM undercut control
#48663D interconnect with protruding contacts
#4867Flip chip bonding tool
#4868Joining method and apparatus
#4869Electronic flame-off electrode with ball-shaped tip
#4870Semiconductor electrical connection structure and method of fabricating the same
#4871Inverter and vehicle drive unit using the same
#4872Structure and method for fabricating a bond pad structure
#4873Copper interconnect
#4874Carbon nanotube structure, a semiconductor device, a semiconductor package and a manufacturing method of a semiconductor device
#4875Semiconductor device carrier unit and semiconductor socket provided therewith
#4876Integrated circuit with at least one bump
#4877Chip interconnect and packaging deposition methods and structures
#4878Semiconductor device with improved heat dissipation, and a method of making semiconductor device
#4879Method for fabricating carrier structure integrated with semiconductor element
#4880Low melting-point solders, articles made thereby, and processes of making same
#4881Thermally conductive composite and uses for microelectronic packaging
#4882Semiconductor element including a wet prevention film
#4883Die down ball grid array package
#4884Reinforced bond pad for a semiconductor device
#4885Semiconductor package with crossing conductor assembly and method of manufacture
#4886Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor
#4887Wire feed system for a wire bonding apparatus
#4888Top layers of metal for integrated circuits
#4889Wafer scale integration packaging and method of making and using the same
#4890Solder foil, semiconductor device and electronic device
#4891Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus
#4892Interconnection structure of integrated circuit chip
#4893Projected contact structures for engaging bumped semiconductor devices and methods of making the same
#4894Pad structure to prompt excellent bondability for low-k intermetal dielectric layers
#4895Chip structure
#4896Materials, structures and methods for microelectronic packaging
#4897Semiconductor device, flexible substrate, tape carrier, and electronic device including the semiconductor device
#4898Motion control device for wire bonder bondhead
#4899Method of stacking thin substrates by transfer bonding
#4900Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages
#4901Method of forming a surface mountable IC and its assembly
#4902Thermally controlled fluidic self-assembly
#4903Semiconductor device and a method of assembling a semiconductor device
#4904Copper interconnect
#4905Copper interconnect
#4906Copper interconnect
#4907Copper interconnect for semiconductor device
#4908Microelectronic device chip including hybrid Au bump, package of the same, LCD apparatus including microelectronic device chip and method of fabricating microelectronic device chip
#4909Projected contact structures for engaging bumped semiconductor devices and methods of making the same
#4910Sealed surface acoustic wave element package
#4911Robust power semiconductor package
#4912Light emitting device and method of producing same
#4913Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment
#4914Method of measuring thickness of bonded ball in wire bonding
#4915Top layers of metal for high performance IC's
#4916Microprobe tips and methods for making
#4917Method for producing semiconductor chips using thin film technology, and semiconductor chip using thin film technology
#4918Method of manufacturing a semiconductor device
#4919Method for manufacturing electronic component-mounted board
#4920Thermally controlled fluidic self-assembly method and support
#4921Electronic device and method of manufacturing the same
#4922Semiconductor device with reduced contact resistance
#4923Semiconductor device, lead frame, and methods for manufacturing the same
#4924Semiconductor device
#4925Operator-serviceable wire feed sensor guide for use in semiconductor package fabrication
#4926Method for assembling micro-components to binding sites
#4927Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies
#4928Substrate grooves to reduce underfill fillet bridging
#4929Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby
#4930Semiconductor chip packages and methods for fabricating the same
#4931Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same
#4932Top layers of metal for high performance IC's
#4933Substrate, electro-optical device, electronic apparatus, method of forming substrate, method of forming electro-optical device, and method of forming electronic apparatus
#4934Semiconductor device having a heat-dissipation member
#4935SMT three phase inverter package and lead frame
#4936Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices
#4937Electronic device with a warped spring connector
#4938Method of manufacturing printed wiring board
#4939Methods for forming molds
#4940Conductive adhesive agent with ultrafine particles
#4941Semiconductor chip manufacturing method, semiconductor chip, semiconductor device manufacturing method, and semiconductor device
#4942Electrode structure of a semiconductor device and method of manufacturing the same
#4943Heat transfer sheet, heat transfer structural body and manufacturing method of the heat transfer structural body
#4944Semiconductor element
#4945Thermal protection for electronic components during processing
#4946Probe for semiconductor devices
#4947Serial thermal processor arrangement
#4948Programmable radio transceiver
#4949Transmission-line spring structure
#4950Methods of forming lead free solder bumps
#4951Method of fabricating semiconductor device
#4952Method for fabricating semiconductor package with circuit side polymer layer
#4953Method for processing a base that includes connecting a first base to a second base with an insulating film
#4954Apparatus and methods for constructing antennas using wire bonds as radiating elements
#4955Method for processing base
#4956Bonding structure, wire bonding method, actuator device and liquid jet head
#4957No-flow underfill composition and method
#4958Interconnect assemblies and methods
#4959Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present
#4960Semiconductor device
#4961Front-end processing of nickel plated bond pads
#4962Hermetic chip in wafer form
#4963Semiconductor device and method of manufacturing same
#4964Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device
#4965Semiconductor device and manufacturing method thereof
#4966LOC semiconductor assembled with room temperature adhesive
#4967Chip structure with redistribution traces
#4968Semiconductor device and a manufacturing method of the same
#4969Die bonding apparatus
#4970Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures
#4971Semiconductor device with improved heat dissipation, and a method of making semiconductor device
#4972Method for evaluating and modifying solder attach design for integrated circuit packaging assembly
#4973Method for forming microelectronic spring structures on a substrate
#4974Microelectronic component assemblies with recessed wire bonds and methods of making same
#4975Formation method and structure of conductive bumps
#4976Interconnections of semiconductor device and method of forming the same
#4977Power semiconductor package
#4978Electronic part-containing elements, electronic devices and production methods
#4979Damascene patterning of barrier layer metal for C4 solder bumps
#4980Method of fabricating an electronic component having at least one semiconductor chip on a circuit carrier with elastic external contacts
#4981Method of making a semiconductor chip assembly with a metal containment wall and a solder terminal
#4982Substrate for mounting IC chip
#4983Semiconductor package including rivet for bonding of lead posts
#4984Top layers of metal for high performance IC's
#4985Connection between a semiconductor chip and a circuit component with a large contact area
#4986Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow
#4987Semiconductor chip assembly with metal containment wall and solder terminal
#4988Radiofrequency power semiconductor module with cavity housing, and method for producing it
#4989High thermal cycle conductor system
#4990Methods of forming electronic structures including conductive shunt layers and related structures
#4991Method for forming robust solder interconnect structures by reducing effects of seed layer underetching
#4992Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus
#4993Stacked semiconductor chips
#4994Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration
#4995Semiconductor device and a method of manufacturing the semiconductor device
#4996Flip-chip without bumps and polymer for board assembly
#4997Bonding pad and chip structure
#4998Semiconductor component and assembly having female conductive members
#4999Semiconductor integrated circuit device
#5000Under bump metallurgy process on passivation opening
#5001Highly compliant plate for wafer bonding
#5002Semiconductor device packages including hermetic packaging elements for at least partially encapsulating conductive elements and other package elements for protecting the portions of semiconductor devices not covered by the hermetic package elements, and packaging methods
#5003Electronic assembly having multi-material interconnects
#5004Low inductance semiconductor device having half-bridge configuration
#5005Method of manufacturing active matrix substrate with height control member
#5006Heat sink formed of multiple metal layers on backside of integrated circuit die
#5007Method of stacking wafers with anisotropic conductive adhesive
#5008Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#5009Circuit apparatus provided with asperities on substrate surface
#5010Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates
#5011Electronic assembly with carbon nanotube contact formations or interconnections
#5012In-situ alloyed solders, articles made thereby, and processes of making same
#5013Semiconductor layer structure and method of making the same
#5014Method for manufacturing semiconductor substrate and semiconductor substrate
#5015Thermal interposer for thermal management of semiconductor devices
#5016Prefabricated semiconductor chip carrier
#5017Semiconductor device with base support structure
#5018Semiconductor bonding and layer transfer method
#5019Semiconductor memory device
#5020Electronic assembly having an indium wetting layer on a thermally conductive body
#5021Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
#5022Printed wiring board
#5023Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages
#5024Vertical memory device structures
#5025Wafer bonding method
#5026Semiconductor device, manufacturing method and apparatus for the same
#5027Wire bonding wedge
#5028Method of forming a lead-free bump and a plating apparatus therefor
#5029Compliant spring contact structures
#5030Field weldable connections
#5031Stackable semiconductor chip layer comprising prefabricated trench interconnect vias
#5032Method for fabricating chip structure
#5033Compliant interconnect and method of formation
#5034Microfeature devices and methods for manufacturing microfeature devices
#5035Heat-decaying materials, transfer sheet using the same, and patterning method
#5036Manufacturing method of semiconductor device
#5037Integrated circuit device with compliant bumps and testing method for testing the integrated circuit device
#5038Semiconductor device and semiconductor apparatus
#5039Capping of metal interconnects in integrated circuit electronic devices
#5040Semiconductor device having inductor
#5041Separately strained N-channel and P-channel transistors
#5042Lead-free bonding systems
#5043Semiconductor device with reduced contact resistance
#5044Method for manufacturing circuit element, method for manufacturing electronic element, circuit substrate, electronic device, and electro-optical apparatus
#5045Method of manufacturing semiconductor device
#5046Method for forming interconnects on thin wafers
#5047Method of making photolithographically-patterned out-of-plane coil structures
#5048Semiconductor device and method capable of scribing chips with high yield
#5049Semiconductor component and system having thinned, encapsulated dice
#5050Semiconductor device having adhesion increasing film to prevent peeling
#5051Semiconductor device that improves electrical connection reliability
#5052Semiconductor module with high process accuracy, manufacturing method thereof, and semiconductor device therewith
#5053Novel aqueous based metal etchant
#5054Process of bonding circuitry components
#5055Top layers of metal for high performance IC's
#5056Refractory solid, adhesive composition, and device, and associated method
#5057Integrated power amplifier module with power sensor
#5058Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device
#5059Photoresist process to enable sloped passivation bondpad openings for ease of metal step coverings
#5060Chip structure and process for forming the same
#5061Semiconductor device
#5062Circuit device and manufacturing method thereof
#5063Laminated radiation member, power semiconductor apparatus, and method for producing the same
#5064Semiconductor device with a floating gate electrode that includes a plurality of particles
#5065Multi-band tunable resonant circuit
#5066Top layers of metal for high performance IC's
#5067Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#5068Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
#5069Fine-pitch packaging substrate and a method of forming the same
#5070Semiconductor device
#5071Power composite integrated semiconductor device and manufacturing method thereof
#5072Wedge-bonding of wires in electronic device manufacture with reversible wedge bonding tool
#5073Semiconductor die attachment for high vacuum tubes
#5074Thermal interface adhesive and rework
#5075Method of manufacturing semiconductor device
#5076Web fabrication of devices
#5077Method to build robust mechanical structures on substrate surfaces
#5078Vibration-assisted method for underfilling flip-chip electronic devices
#5079Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface
#5080Method for integrating pre-fabricated chip structures into functional electronic systems
#5081Semiconductor device having conductive bumps, method of manufacturing thereof, circuit board and electronic apparatus
#5082Semiconductor device
#5083Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device
#5084Underfilling with acid-cleavable acetal and ketal epoxy oligomers
#5085Electronic device including chip parts and a method for manufacturing the same
#5086Circuit method integrating the power distribution functions of the circuits and leadframes into the chip surface
#5087High data rate chip mounting
#5088Electronic circuit package
#5089Surface mount multichip devices
#5090Compositions for use in electronics devices
#5091Sealing and protecting integrated circuit bonding pads
#5092Barrier for interconnect and method
#5093Top layers of metal for high performance IC's
#5094Methods of forming solder bumps on exposed metal pads
#5095Method for making an interconnect pad
#5096Implementation of protection layer for bond pad protection
#5097Method of fabricating a semiconductor device
#5098Shielded laminated structure with embedded chips
#5099Active matrix substrate with height control member
#5100INTEGRATED CIRCUIT PACKAGE WITH DIFFERENT HARDNESS BUMP PAD AND BUMP AND MANUFACTURING METHOD THEREFOR