Integrated Circuit Package Having Under-Bump Metallization

Semiconductor device and method of wafer level package integration

Routing layer for mitigating stress in a semiconductor die

Semiconductor device and method of forming electrical interconnection between semiconductor die and substrate with continuous body of solder tape

Method of forming a micro pin hybrid interconnect array

Apparatus with a multi-layer coating and method of forming the same

Inverse chip connector

METHOD AND APPARATUS FOR FABRICATING INTEGRATED CIRCUIT DEVICE USING SELF-ORGANIZING FUNCTION

Method of manufacturing semiconductor device

Dummy pattern in wafer backside routing

Semiconductor device and method of forming high routing density BOL BONL and BONP interconnect sites on substrate

Leadframe package for high-speed data rate applications

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Methods and apparatus for measuring analytes using large scale FET arrays

Methods and apparatus for measuring analytes using large scale FET arrays

Adhesive for bonding circuit members, circuit board and process for its production

Adhesive for bonding circuit members, circuit board and process for its production

Adhesive for bonding circuit members, circuit board and process for its production

Wire bonding structure of semiconductor device and wire bonding method

Semiconductor package and multichip arrangement having a polymer layer and an encapsulant

Dummy metal design for packaging structures

Radiate under-bump metallization structure for semiconductor devices

Semiconductor device packages including connecting elements

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Methods and apparatus for measuring analytes using large scale FET arrays

Semiconductor device and manufacturing method of the same

Chipstack package and manufacturing method thereof

Electronic device package and fabrication method thereof

Semiconductor chip with coil element over passivation layer

Electronic devices formed of two or more substrates connected together, electronic systems comprising electronic devices, and methods of forming electronic devices

Semiconductor device and semiconductor device manufacturing method

Semiconductor device and method of forming a dual UBM structure for lead free bump connections

Semiconductor device and method of manufacturing the same

Integrated circuit system with stress redistribution layer and method of manufacture thereof

Semiconductor device

WAFER LEVEL PACKAGING WITH HEAT DISSIPATION

Integrated circuit packages

Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus

Semiconductor device and lead frame

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Apparatus for mounting semiconductor device

Methods and apparatus for measuring analytes using large scale FET arrays

Semiconductor device, manufacturing method of semiconductor device, and RFID tag

Method of providing an electronic device including dies, a dielectric layer, and an encapsulating layer

Coupling heat sink to integrated circuit chip with thermal interface material

MULTI-FUNCTION CARD DEVICE

Packaged electronic device having metal comprising self-healing die attach material

Enhanced WLP for superior temp cycling, drop test and high current applications

Under-Bump Metallization Structure for Semiconductor Devices

Wiring board and method of manufacturing the same, and semiconductor device and method of manufacturing the same

Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut

Vertical MOSFET with through-body via for gate

ROOM TEMPERATURE DIRECT METAL-METAL BONDING

Silicon nitride passivation layer for covering high aspect ratio features

Semiconductor device and automotive ac generator

Pin-type chip tooling

Method of sensing magnitude of current through semiconductor power device

High power semiconductor device for wireless applications and method of forming a high power semiconductor device

Method for fabricating circuit component

METHOD FOR FORMING A DOUBLE EMBOSSING STRUCTURE

Chip package and method for fabricating the same

Stacked semiconductor package having discrete components

Nanotube Materials for Thermal Management of Electronic Components

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Rigid-backed, membrane-based chip tooling

Carbon nanotubes for the selective transfer of heat from electronics

High Frequency Power Supply Module Having High Efficiency and High Current

Die bond film, dicing die bond film, and semiconductor device

Methods of forming a metal pattern and semiconductor device structure

CHIP PACKAGE

Assessing metal stack integrity in sophisticated semiconductor devices by mechanically stressing die contacts

Method for manufacturing a semiconductor structure

Electronic component

Circuit component with conductive layer structure

Device including an encapsulated semiconductor chip and manufacturing method thereof

Chip structure

Semiconductor device and method of forming IPD in fan-out level chip scale package

Two-shelf interconnect

Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier

Device having wire bond and redistribution layer

Low temperature bonding material comprising coated metal nanoparticles, and bonding method

Method for integrating an electronic component into a printed circuit board

System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates

Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates

Method of making a semiconductor device having a conductive particle on an electric pad

Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace

Manufacturing method of semiconductor device

Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces

PANELIZED PACKAGING WITH TRANSFERRED DIELECTRIC

Semiconductor chip, electrode structure therefor and method for forming same

Method of fabricating a conductive post on an electrode

Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly

Semiconductor device and method of patterning resin insulation layer on substrate of the same

Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace

Semiconductor chip with a bonding pad having contact and test areas

Nitride semiconductor element and method for production thereof

Flux-free chip to wafer joint serial thermal processor arrangement

METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD

ADHESIVE BONDING METHOD

Light emitting device, method for manufacturing the same, and backlight unit

Bonded structure with enhanced adhesion strength

Lead free solder interconnections for integrated circuits

Microelectronic devices with through-substrate interconnects and associated methods of manufacturing

3D IC architecture with interposer and interconnect structure for bonding dies

Pillar structure having a non-planar surface for semiconductor devices

Semiconductor device and semiconductor assembly with lead-free solder

Solder interconnect with non-wettable sidewall pillars and methods of manufacture

Manufacturing of a device including a semiconductor chip

Semiconductor package of a flipped MOSFET and its manufacturing method

Vertical LED chip package on TSV carrier

Integrated circuits having TSVs including metal gettering dielectric liners

Solder bump interconnect

Protruding TSV tips for enhanced heat dissipation for IC devices

GAAS INTEGRATED CIRCUIT DEVICE AND METHOD OF ATTACHING SAME

Semiconductor device and method of manufacturing the same

LED PACKAGE

Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, and light-emitting device

Semiconductor device and a method of manufacturing the same

Electronic device and manufacturing method of the same

Integrated semiconductor substrate structure using incompatible processes

Multi-chip package having frame interposer

Semiconductor device and a method of manufacturing the same

Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation

Polishing solution for CMP, and method for polishing substrate using the polishing solution for CMP

PACKAGING BOARD AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR, AND PORTABLE DEVICE

Multilayer printed circuit board

Method for Producing Semiconductor Chips and Corresponding Semiconductor Chip

Post passivation interconnection schemes on top of the IC chips

Method of teaching eyepoints for wire bonding and related semiconductor processing operations

Method and system for drug delivery to the eye

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

IC chip, antenna, and manufacturing method of the IC chip and the antenna

4D device process and structure

Through-silicon via formed with a post passivation interconnect structure

Semiconductor device

REAL TIME MONITORING OF INDIUM BUMP REFLOW AND OXIDE REMOVAL ENABLING OPTIMIZATION OF INDIUM BUMP MORPHOLOGY

Semiconductor package with single sided substrate design and manufacturing methods thereof

Method for establishing and closing a trench of a semiconductor component

Semiconductor device including a DC-DC converter having a metal plate

Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation

Nanotube modified solder thermal intermediate structure, systems, and methods

Thermoelectric application for waste heat recovery from semiconductor devices in power electronics systems

Method of manufacturing semiconductor device

Integrated circuit micro-module

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Dicing tape-integrated film for semiconductor back surface

Methods for forming through-substrate conductor filled vias, and electronic assemblies formed using such methods

PAD STRUCTURE AND INTEGRATED CIRCUIT CHIP WITH SUCH PAD STRUCTURE

Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip

CARBON NANOTUBE-BASED FILLER FOR INTEGRATED CIRCUITS

Micro-bump structure

RELIABLE LARGE DIE FAN-OUT WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURE

Semiconductor package having chip using copper process

Stack package

Semiconductor device package having a semiconductor chip on wiring board connected to plurality of leads including power MOSFETs

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Integrated circuit device and electronic instrument

Manufacturing method for composite substrate

Wiring board capable of containing functional element and method for manufacturing same

Method of applying an adhesive layer on thincut semiconductor chips of a semiconductor wafer

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

Radio frequency amplifier with effective decoupling

Dicing die-bonding film

METALLIZATION LAYER STRUCTURE FOR FLIP CHIP PACKAGE

Contact-based encapsulation

Semiconductor device and method for fabricating the same

Pre-soldered leadless package

Structures and methods to reduce maximum current density in a solder ball

Stackable circuit structures and methods of fabrication thereof

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Substrate for integrated circuit devices including multi-layer glass core and methods of making the same

Flow sensors having nanoscale coating for corrosion resistance

Packaging conductive structure and method for manufacturing the same

Manufacturing method for semiconductor device

Semiconductor connection component

Method of room temperature covalent bonding

Integrated circuit packaging system with bond wire pads and method of manufacture thereof

Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip

Electronic device package and method for fabricating the same

Semiconductor device and method of forming PiP with inner known good die interconnected with conductive bumps

Integrated circuit packaging system with interconnect and method of manufacture thereof

Semiconductor device, substrate and semiconductor device manufacturing method

Semiconductor device and manufacturing method thereof

Method of forming at least one bonding structure

Method for manufacturing lamination type semiconductor integrated device

ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME

Manufacturing method for electronic device having IC chip and antenna electrically connected by bridging plate

Semiconductor Wafer and Method of Manufacturing the Same and Method of Manufacturing Semiconductor Device

Semiconductor Device and Method of Confining Conductive Bump Material with Solder Mask Patch

Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers

Interface structure for copper-copper peeling integrity

Semiconductor device having heat radiating configuration

Heat radiation member for a semiconductor package with a power element and a control circuit

Region divided substrate and semiconductor device

Method of manufacturing stacked wafer level package

Semiconductor Device and Method of Forming Bump Structure with Multi-Layer UBM Around Bump Formation Area

ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME

Wiring circuit structure and manufacturing method for semiconductor device using the structure

Die-bonding method of LED chip and LED manufactured by the same

Substrate holder and plating apparatus

Method of Fabricating Semiconductor Die with Through-Hole Via on Saw Streets and Through-Hole Via in Active Area of Die

Semiconductor device and method of forming electrical interconnect with stress relief void

Bonding connection between a bonding wire and a power semiconductor chip

Electronic device and electronic apparatus

ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME

Semiconductor device and lead frame thereof

Semiconductor device and structure

Die mounting substrate and method of fabricating the same

Manufacturing method of semiconductor integrated circuit device

Fiducial scheme adapted for stacked integrated circuits

Stackable semiconductor device packages

MICROSTRUCTURE, AND METHOD FOR PRODUCTION THEREOF

Semiconductor device having multi-layered wiring layer and fabrication process thereof

WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION

Pad structure for semiconductor devices

Integrated circuit micro-module

Method of forming protective material between semiconductor die stacked on semiconductor wafer to reduce defects during singulation

ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE AND AN ELECTRICAL CONDUCTOR WITHIN A VIA AND A PROCESS OF FORMING THE SAME

Wafer-level semiconductor device packages with electromagnetic interference shielding

Backside illuminated imaging sensor with reinforced pad structure

Bonding apparatus and bonding method

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

Integrated-circuit package for proximity communication

Circuit module and manufacturing method for the same

Wafer level chip scale package and process of manufacture

Packaging device and base member for packaging

Semiconductor device

Semiconductor element and method of manufacturing the same

Manufacturing method of semiconductor package

Dicing/die bonding film

Manufacturing method of semiconductor device

Packaged microdevices and methods for manufacturing packaged microdevices

Flexible interconnect pattern on semiconductor package

Indium compositions

Semiconductor device including bottom surface wiring and manfacturing method of the semiconductor device

Copper bump joint structures with improved crack resistance

Semiconductor device with trench-like feed-throughs

Semiconductor die contact structure and method

Robust joint structure for flip-chip bonding

Power module assembly with reduced inductance

Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate

Crack resistant circuit under pad structure and method of manufacturing the same

Light-emitting diode package

Method of manufacturing semiconductor device and method of manufacturing electronic device

Via forming method and method of manufacturing multi-chip package using the same

Semiconductor chip, wafer stack package using the same, and methods of manufacturing the same

Microelectronic assemblies having compliant layers

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board and electronic instrument

Small area, robust silicon via structure and process

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Routing layer for mitigating stress in a semiconductor die

Method and apparatus for semiconductor device fabrication using a reconstituted wafer

Semiconductor device, method of manufacturing the same, and wireless transmission system utilizing the same

Semiconductor chip, stack module, and memory card

HEAT-CONDUCTIVE NOISE SUPPRESSION SHEET

Method of making a connection component with hollow inserts

Bumping Electronic Components Using Transfer Substrates

Semiconductor device suitable for a stacked structure

Preventing UBM oxidation in bump formation processes

Method of manufacturing a three dimensional integrated circuit by transfer of a mono-crystalline layer

Semiconductor device fabrication method including formation of columnar electrodes having protrusion sections

Method for manufacturing and testing an integrated electronic circuit

Terminal structure, electronic device, and manufacturing method thereof

MULTICHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF

THERMOSETTING DIE-BONDING FILM

THERMOSETTING DIE-BONDING FILM

SYSTEM AND METHOD FOR PREVENTING METAL CORROSION ON BOND PADS

Pad bonding employing a self-aligned plated liner for adhesion enhancement

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Semiconductor structure, pad structure and protection structure

Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers

Chip design with robust corner bumps

Designs and methods for conductive bumps

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Semiconductor device and information processing system including the same

Semiconductor device

METAL WIRING STRUCTURE COMPRISING ELECTROLESS NICKEL PLATING LAYER AND METHOD OF FABRICATING THE SAME

Surface modification for handling wafer thinning process

Semiconductor integrated circuit and multi-chip module

Vertically stackable dies having chip identifier structures

Integrated circuit with protective structure

Electronic assemblies including mechanically secured protruding bonding conductor joints

Semiconductor device having a copper plug

Method of manufacturing a semiconductor component and structure

Semiconductor device

APPARATUS FOR SEMICONDUCTOR DIE BONDING

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method of forming narrow interconnect sites on substrate with elongated mask openings

Method for manufacturing semiconductor device

Power semiconductor module and method for operating a power semiconductor module

Semiconductor Device and Method of Forming Pad Layout for Flipchip Semiconductor Die

Method for manufacturing a semiconductor component

Semiconductor device with interface peeling preventing rewiring layer

Back side metallization with superior adhesion in high-performance semiconductor devices

Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate

Flip chip interconnection with double post

Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding

Semiconductor device and method of forming bump-on-lead interconnection