Semiconductor device and method of forming flipchip interconnect structure

Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure

Semiconductor device with overlapped lead terminals

Package process and package structure

True CSP power MOSFET based on bottom-source LDMOS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor device and method for manufacturing same

Plating apparatus

Manufacturing method of semiconductor device

3D smart power module

Component and method for producing a component

Device and manufacturing method

SEMICONDUCTOR PACKAGE WITH PRE-FORMED BALL BONDS

Wafer backside interconnect structure connected to TSVs

Strong interconnection post geometry

Semiconductor device and method of forming interposer with opening to contain semiconductor die

Semiconductor chip attach configuration having improved thermal characteristics

Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP

Method for low temperature bonding and bonded structure

Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process

Dicing tape and die attach adhesive with patterned backing

SEMICONDUCTOR CHIP STACKED STRUCTURE AND METHOD OF MANUFACTURING SAME

Protection layer for preventing UBM layer from chemical attack and oxidation

Group III nitride based flip-chip integrated circuit and method for fabricating

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Substrate and package with micro BGA configuration

Interconnection of land section to wiring layers at center of external connection terminals in semiconductor device and manufacturing thereof

Device package substrate and method of manufacturing the same

Fabrication for electroplating thick metal pads

Method for manufacturing semiconductor device and bonding apparatus

Circuit module and method of manufacturing the same

Method of manufacturing a printed wiring board

Semiconductor wafer coat layers and methods therefor

High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same

Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavity

BONDING WIRE

Power semiconductor module

Method of manufacturing semiconductor device and semiconductor device

Acceleration sensor, semiconductor device and method of manufacturing semiconductor device

LED package structure for increasing heat-dissipating and light-emitting efficiency and method for manufacturing the same

Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out

DICING/DIE BONDING FILM

Semiconductor circuit

Semiconductor device, and power conversion device using semiconductor device

Electronic devices with extended metallization layer on a passivation layer

Integrated circuits having TSVs including metal gettering dielectric liners

Interconnect layouts for electronic assemblies

Front side copper post joint structure for temporary bond in TSV application

SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME

Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant

Semiconductor package and method for packaging the same

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Semiconductor chip assembly with post/base heat spreader, signal post and cavity

Chip structure with bumps and testing pads

Wire-bonding machine with cover-gas supply device

Method of processing cavity of core substrate

Resin sheet for circuit boards, sheet for circuit boards and circuit board displays

Method for producing flexible integrated circuits which may be provided contiguously

Bonding method and bonding apparatus

Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles

Method and system for bonding electrical devices using an electrically conductive adhesive

Semiconductor device and method of forming dual-active sided semiconductor die in fan-out wafer level chip scale package

High frequency circuit having multi-chip module structure

Electronic component and manufacturing method thereof

Semiconductor device

Extendable connector and network

Layered chip for use in soldering

Electronic part and method of manufacturing the same

SOLDER JOINT STRUCTURE, AND JOINING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND ON-VEHICLE AC GENERATOR

Semiconductor device with pad with less diffusible contacting surface and method for production of the semiconductor device

Chip package with heavily doped region and fabrication method thereof

Electronic part and method of manufacturing the same

Chip package with heavily doped regions and fabrication method thereof

Method For Fabricating A Through Interconnect On A Semiconductor Substrate

Die package and method of manufacturing the same

LEAD FRAME ASSEMBLY FOR A SEMICONDUCTOR PACKAGE

Light emitting diode package

Electronic component and manufacturing method thereof

Room temperature metal direct bonding

Manufacturing method of semiconductor device

THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF

Semiconductor device

Semiconductor device

Integrated circuit

Electronic structures including barrier layers and/or oxidation barriers defining lips and related methods

Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structures

Semiconductor device

Device including a ring-shaped metal structure and method

Electrostatic chucking of an insulator handle substrate

Electrically interconnected stacked die assemblies

Semiconductor device and method of forming dam material around periphery of die to reduce warpage

Support device for resonator

Method for bonding two electronic components

Structure and process for the formation of TSVs

Method of manufacturing a semiconductor device

Self-assembly of chips on a substrate

Method for manufacturing semiconductor device including semiconductor elements with electrode formed thereon

SELF-ALIGNED METAL MASK ASSEMBLY FOR SELECTIVELY DEPOSITING THIN FILMS ON MICROELECTRONIC SUBSTRATES AND DEVICES, AND METHOD OF USE

Terminal structure and manufacturing method thereof, and electronic device and manufacturing method thereof

Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die

Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element

MEMS and a protection structure thereof

Bond pad design for reducing the effect of package stress

Semiconductor devices having stress relief layers and methods for fabricating the same

Method of manufacturing a printed wiring board

Method for manufacturing electronic device

Method and apparatus for manufacturing semiconductor device

Process of forming an electronic device including a conductive stud over a bonding pad region

Semiconductor package

System-in packages

WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE

Semiconductor device and method for manufacturing the same

STRUCTURE AND MANUFACTURING METHOD OF A CHIP SCALE PACKAGE WITH LOW FABRICATION COST, FINE PITCH AND HIGH RELIABILITY SOLDER BUMP

STRUCTURE AND MANUFACTURING METHOD OF A CHIP SCALE PACKAGE WITH LOW FABRICATION COST, FINE PITCH AND HIGH RELIABILITY SOLDER BUMP

Manufacturing method of semiconductor device and semiconductor device

Method of forming a semiconductor device including a stress buffer material formed above a low-k metallization system

Stacked semiconductor package and method for manufacturing the same

Stackable Package By Using Internal Stacking Modules

Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP

Integrated circuit packaging system with through silicon via base and method of manufacture thereof

Semiconductor device having under-filled die in a die stack

CMOS image sensor big via bonding pad application for AlCu Process

CMOS image sensor big via bonding pad application for AICu process

High frequency field-effect transistor

Semiconductor Substrates, Devices and Associated Methods

System with semiconductor components having encapsulated through wire interconnects (TWI)

Component mounting apparatus and method

Semiconductor package and method of manufacturing the same

Process for making contact with and housing integrated circuits

Bonding pad for preventing pad peeling

Semiconductor device

Package structure and method for reducing dielectric layer delamination

Multilayer UV-Curable Adhesive Film

Semiconductor device

Sealed joint structure of device and process using the same

Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation

Electronic device, method of producing the same, and semiconductor device

Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages

Semiconductor device and method of manufacturing the same

METHOD OF DESIGNING SEMICONDUCTOR INTEGRATED CIRCUIT, DESIGNING APPARATUS, SEMICONDUCTOR INTEGRATED CIRCUIT SYSTEM, SEMICONDUCTOR INTEGRATED CIRCUIT MOUNTING SUBSTRATE, PACKAGE AND SEMICONDUCTOR INTEGRATED CIRCUIT

Air cavity package with copper heat sink and ceramic window frame

Semiconductor package having discrete components and system containing the package

Semiconductor device and method of fabrication

SEMICONDUCTOR DEVICE

Semiconductor device and method of manufacturing the same

Method of plasma preparation of metallic contacts to enhance mechanical and electrical integrity of subsequent interconnect bonds

Method for exposing and cleaning insulating coats from metal contact surfaces

Method for aligning and bonding elements and a device comprising aligned and bonded elements

Solder interconnect pads with current spreading layers

Semiconductor device

Structure and method for forming pillar bump structure having sidewall protection

Board having connection terminal

Three-dimensional integrated circuit structure

METHOD OF DIE REARRANGEMENT PACKAGE STRUCTURE HAVING PATTERNED UNDER BUMP METALLURGIC LAYER CONNECTING METAL LEAD

Method of forming monolithic CMOS-MEMS hybrid integrated, packaged structures

Method of forming monolithic CMOS-MEMS hybrid integrated, packaged structures

Method and structure for adhesion of intermetallic compound (IMC) on Cu pillar bump

Assembly of a wire element with a microelectronic chip with a groove comprising at least one bump securing the wire element

Semiconductor device and a method of manufacturing the same

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURE

Power converter integrated circuit floor plan and package

SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING THE SAME

Formation of TSV backside interconnects by modifying carrier wafers

Manufacturing method of semiconductor device including Au bump on seed film

Process for producing a semiconductor device

Methods for producing an ultrathin semiconductor circuit

Three-dimensional integrated circuits with protection layers

Printed circuit board

Stacked structures and methods of fabricating stacked structures

Semiconductor device bonding wire and wire bonding method

3-D semiconductor die structure with containing feature and method

Semiconductor chip, method of fabricating the same, and stack module and memory card including the same

IC PACKAGE DESIGN WITH STRESS RELIEF FEATURE

Electrical property altering, planar member with solder element in IC chip package

Semiconductor device and manufacturing method thereof

Process for manufacturing a composite substrate

Multilayer printed wiring board

SEMICONDUCTOR DEVICE, CAMERA MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device

Surface depressions for die-to-die interconnects and associated systems

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die

Laminated body of semiconductor chips including pads mutually connected to conductive member

Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING AN EVEN COATING THICKNESS USING ELECTRO-LESS PLATING AND RELATED DEVICE

Hermeticity testing

Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers

Semiconductor substrate with interlayer connection and method for production of a semiconductor substrate with interlayer connection

Interconnect structures having lead-free solder bumps

Apparatus for restricting moisture ingress

Stacked chip package structure with leadframe having inner leads with transfer pad

Faraday cage for circuitry using substrates

Heat releasing semiconductor package, method for manufacturing the same, and display apparatus including the same

SEMICONDUCTOR DEVICE

HERMETICALLY-SEALED ELECTRICAL CIRCUIT APPARATUS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method for producing display device

Method and apparatus for no lead semiconductor package

Metallic electrode forming method and semiconductor device having metallic electrode

Semiconductor integrated circuit device

Method for manufacturing hetero-bonded wafer

Power semiconductor device package and fabrication method

Electronic module with feed through conductor between wiring patterns

Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support

Semiconductor device, semiconductor wafer and manufacturing method of the same

Method for connecting a precious metal surface to a polymer

Processed wafer via

Method of forming a bond pad

METHOD OF MANUFACTURING DICING DIE-BONDING FILM

Packaged electronic devices having die attach regions with selective thin dielectric layer

Joint structure and electronic component

WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME

CONDUCTIVE BUMP STRUCTURE FOR SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Method for providing a redistribution metal layer in an integrated circuit

Method of fabricating stacked semiconductor chips

Electronic system modules and method of fabrication

Semiconductor device having a semiconductor chip, and method for the production thereof

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, CIRCUIT SUBSTRATE, ELECTRO-OPTICAL APPARATUS, AND ELECTRONIC EQUIPMENT

Power electronic device

Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrate

Semiconductor substrate and method of connecting semiconductor die to substrate

Semiconductor device having surface protective films on bond pad

STACKABLE SEMICONDUCTOR CHIP LAYER COMPRISING PREFABRICATED TRENCH INTERCONNECT VIAS

Semiconductor device and display apparatus

System-in packages

Semiconductor component and assumbly with projecting electrode

Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation

ELEMENT MOUNTING SUBSTRATE AND METHOD OF FABRICATING THE SAME, CIRCUIT DEVICE AND METHOD OF FABRICATING THE SAME, AND MOBILE APPLIANCE ( as amended

Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package

ELECTRONIC PACKAGE AND METHOD OF MANUFACTURE

Die down ball grid array packages and method for making same

Structure and method of forming a pad structure having enhanced reliability

Semiconductor structure

SEMICONDUCTOR CHIP PACKAGE

Semiconductor device driving bridge-connected power transistor

Semiconductor device and method of manufacturing the same

DIE ATTACH FILM-PROVIDED DICING TAPE AND PRODUCTION PROCESS OF SEMICONDUCTOR DEVICE

Manufacturing method of semiconductor integrated circuit device

Semiconductor component with terminal contact surface

Electronic component for surface mounting

Semiconductor device and method of manufacturing the semiconductor device

Semiconductor device

HIGH PIN DENSITY SEMICONDUCTOR SYSTEM-IN-A-PACKAGE

Wafer backside structures having copper pillars

Method of making electronic device

Thermally enhanced wafer level package

SOLDER BALL PRINTING APPARATUS AND SOLDER BALL PRINTING METHOD

Die bonding utilizing a patterned adhesion layer

Adaptive interconnect structure

High quality electrical contacts between integrated circuit chips

Method for connecting two joining surfaces

Integrated circuit packaging system and method of manufacture thereof

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device having electrical devices mounted to IPD structure and method of shielding electromagnetic interference

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same

Method for Mounting Flip Chip and Substrate Used Therein

Semiconductor device and method for manufacturing the same

Carbon nanotubes for the selective transfer of heat from electronics

PACKAGE STRUCTURE FOR INTEGRATED CIRCUIT DEVICE AND METHOD OF THE SAME

Semiconductor die packages using thin dies and metal substrates

METHOD FOR APPLYING ELECTRICAL CONTACTS ON SEMICONDUCTING SUBSTRATES, SEMICONDUCTING SUBSTRATE AND USE OF THE METHOD

Receive circuit for connectors with variable complex impedance

Packaged electronic device having metal comprising self-healing die attach material

Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor module

Chip package structure and manufacturing method thereof for effectively lowering manufacturing costs and improving yield and reliability of the chip package structure

Stacked chip package structure with leadframe having bus bar

Stacked chip package structure with leadframe having bus bar

Semiconductor component having through wire interconnect (TWI) with compressed wire

Method of forming an inductor on a semiconductor wafer

High breakdown voltage semiconductor device and high voltage integrated circuit

Anti-reflection structures for CMOS image sensors

Semiconductor integrated circuit device and method of manufacturing same

Metal wiring structures for uniform current density in C4 balls

Solder layer, heat sink using such a solder layer and method for manufacturing such a heat sink

Manufacture method for semiconductor device with bristled conductive nanotubes

THERMOSETTING DIE BONDING FILM

Remote chip attachment

Widebody coil isolators

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

PACKAGE WITH SEMICONDUCTOR DEVICE AND INTEGRATED CIRCUIT MOUNTED THEREIN AND METHOD FOR MANUFACTURING SUCH PACKAGE

Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

Ball-limiting-metallurgy layers in solder ball structures

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Semiconductor package and manufacturing method thereof

Semiconductor die package and method for making the same

ADVANCED QUAD FLAT-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Manufacturing method of advanced quad flat non-leaded package

Conductive through connection and forming method thereof

Light-emitting diode package and wafer-level packaging process of light-emitting diode

Structures for improving current carrying capability of interconnects and methods of fabricating the same

SYSTEMS AND METHODS FOR AFFIXING A SILICON DEVICE TO A SUPPORT STRUCTURE

Electronic board, method of manufacturing the same, and electronic device

Three-dimensional semiconductor architecture

Semiconductor device

Semiconductor device with pads overlapping wiring layers including dummy wiring

SEMICONDUCTOR DEVICE AND IMAGING DEVICE USING THE SEMICONDUCTOR DEVICE

Semiconductor device with I/O cell and external connection terminal and method of manufacturing the same