212081 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Tungsten [W]
Method and system for forming conductive bumping with copper interconnection
#1202Dicing/die-bonding film, method of fixing chipped work and semiconductor device
#1203Method of fabricating stacked chips in a semiconductor package
#1204Manufacturing of a device including a semiconductor chip
#1205Semiconductor assembly and semiconductor package including a solder channel
#1206Semiconductor device and semiconductor package having the same
#1207Semiconductor device including shielding layer and fabrication method thereof
#1208Dimensionally decoupled ball limiting metalurgy
#1209Metal wiring structures for uniform current density in C4 balls
#1210Semiconductor device having a pad and plurality of interconnects
#1211Method for producing display device
#1212ELECTRONIC DEVICE, CIRCUIT BOARD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
#1213Multilayered printed circuit board and method for manufacturing the same
#1214Manufacturing method of semiconductor device
#1215PRESSURE SUPPORT FOR AN ELECTRONIC CIRCUIT
#1216Semiconductor device and method of bonding different size semiconductor die at the wafer level
#1217Semiconductor element, semiconductor element mounted board, and method of manufacturing semiconductor element
#1218Semiconductor structure and method for making same
#1219Semiconductor structure having metal oxide or nirtride passivation layer on fill layer and method for making same
#1220Semiconductor structure and method for making same
#1221Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers
#1222BACKMETAL REPLACEMENT FOR USE IN THE PACKAGING OF INTEGRATED CIRCUITS
#1223Semiconductor power module and method of manufacturing the same
#1224Semiconductor package including cap
#1225Circuit device having an improved heat dissipitation, and the method of manufacturing the same
#1226Semiconductor device and a method of manufacturing the same
#1227Semiconductor package with integrated metal pillars and manufacturing methods thereof
#1228Methods and apparatus for measuring analytes using large scale FET arrays
#1229Method of making a light emitting device having a molded encapsulant
#1230COOLED ELECTRIC UNIT
#1231Device and method for manufacturing a device
#1232LAYER STACKS AND INTEGRATED CIRCUIT ARRANGEMENTS
#1233Microsprings partially embedded in a laminate structure and methods for producing same
#1234Multi-function and shielded 3D interconnects
#1235Interposer with microspring contacts
#1236Printed wiring board
#1237Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#1238Method for reducing UBM undercut in metal bump structures
#1239Apparatus for restricting moisture ingress
#1240Semiconductor device and method of manufacturing the same
#1241Semiconductor package and method for manufacturing the same
#1242STACK PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#1243Collar structure around solder balls that connect semiconductor die to semiconductor chip package substrate
#1244Semiconductor device
#1245Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in FO-WLCSP
#1246Semiconductor device having pad structure with stress buffer layer
#1247Semiconductor device and method of forming base substrate with cavities formed through etch-resistant conductive layer for bump locking
#1248Semiconductor chip with redundant thru-silicon-vias
#1249Semiconductor module and method for production thereof
#1250Semiconductor device having a pin mounted heat sink
#1251POWER SEMICONDUCTOR MODULE HAVING SINTERED METAL CONNECTIONS, PREFERABLY SINTERED SILVER CONNECTIONS, AND PRODUCTION METHOD
#1252DICING DIE BOND FILM
#1253Control device of semiconductor device
#1254Layered chip package and method of manufacturing same
#1255Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
#1256Die edge contacts for semiconductor devices
#1257Semiconductor device and manufacturing method of semiconductor device
#1258Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die
#1259Alignment marks in substrate having through-substrate via (TSV)
#1260Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die
#1261Contacting means and method for contacting electrical components
#1262Method for Forming Lead-Free Solder Balls with a Stable Oxide Layer Based on a Plasma Process
#1263Method for manufacturing semiconductor device
#1264Method for manufacturing semiconductor devices
#1265Method of manufacturing light-emitting device
#1266Method for detecting the under-fill void in flip chip BGA
#1267Semiconductor apparatus, inspection method thereof and electric device
#1268SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#1269SEMICONDUCTOR PACKAGE
#1270Method and system for routing electrical connections of semiconductor chips
#1271SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#1272Bump structure with underbump metallization structure and integrated redistribution layer
#1273Low-cost 3D face-to-face out assembly
#1274Semiconductor device and method of forming FO-WLCSP with discrete semiconductor components mounted under and over semiconductor die
#1275Conductive connection structure with stress reduction arrangement for a semiconductor device, and related fabrication method
#1276Semiconductor device
#1277Cylindrical embedded capacitors
#1278Semiconductor device
#1279ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER
#1280Method of manufacturing semiconductor package
#1281Flip chip bonder head for forming a uniform fillet
#1282Semiconductor module system having stacked components with encapsulated through wire interconnects (TWI)
#1283WAFER-LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER
#1284Method for producing a semiconductor element
#1285DEVICE MOUNTING STRUCTURE AND DEVICE MOUNTING METHOD
#1286Stitch bump stacking design for overall package size reduction for multiple stack
#1287VERTICALLY CONTACTED ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME
#1288Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers
#1289Stacked Semiconductor Device And Method Of Fabricating The Same
#1290MANUFACTURING FAN-OUT WAFER LEVEL PACKAGING
#1291Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die
#1292Semiconductor device and method of producing same
#1293SEMICONDUCTOR DEVICE
#1294Process for chip capacitive coupling
#1295WIREBONDING METHOD AND DEVICE ENABLING HIGH-SPEED REVERSE WEDGE BONDING OF WIRE BONDS
#1296Three-dimensional integrated circuits with protection layers
#1297Package substrate for bump on trace interconnection
#1298Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV
#1299SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#1300Semiconductor integrated circuit device
#1301Semiconductor device
#1302Semiconductor device having a conductive layer reliably formed under an electrode pad
#1303SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#1304Flip chip package utilizing trace bump trace interconnection
#1305Self-aligning structures and method for integrated chips
#1306Package and fabrication method of the same
#1307Wire bonding apparatus with a textured capillary surface enabling high-speed wedge bonding of wire bonds
#1308ELECTRONIC DEVICE MOUNTING STRUCTURE AND ELECTRONIC DEVICE MOUNTING METHOD
#1309In-plane silicon heat spreader and method therefor
#1310Manufacturing method of semiconductor apparatus and semiconductor apparatus
#1311Alpha particle blocking wire structure and method fabricating same
#1312Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device
#1313Embedded wafer-level bonding approaches
#1314Semiconductor device having a semiconductor chip, and method for the production thereof
#1315Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device
#1316Electronic device and method for production
#1317Integrated circuit structure incorporating a conductor layer with both top surface and sidewall passivation and a method of forming the integrated circuit structure
#1318Method of forming a memory device
#1319Solder interconnect on IC chip
#1320SEMICONDUCTOR PACKAGE
#1321Semiconductor device packages having electromagnetic interference shielding and related methods
#1322Power semiconductor device
#1323Semiconductor light-emitting device, method for manufacturing the same, and light-emitting apparatus including the same
#1324Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device production
#1325Method and apparatus for manufacturing three-dimensional integrated circuit
#1326Micro-machined structure production using encapsulation
#1327SURFACE-MOUNTED SHIELDED MULTICOMPONENT ASSEMBLY
#1328Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device
#1329Semiconductor device
#1330CONDUCTIVE STRUCTURE FOR A SEMICONDUCTOR INTEGRATED CIRCUIT
#1331Semiconductor device and method of forming stress relief layer between die and interconnect structure
#1332Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure
#1333Doping minor elements into metal bumps
#1334Multi-die stacking using bumps with different sizes
#1335Mold design and semiconductor package
#1336TAPE CARRIER SUBSTRATE
#1337Semiconductor device and method of manufacturing the same
#1338Metal-contamination-free through-substrate via structure
#1339Semiconductor device for driving electric motor
#1340Ultrasonic horn
#1341Ultrasonic horn
#1342Ultrasonic horn
#1343Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
#1344Layered chip package and method of manufacturing same
#1345Methods of forming bonded semiconductor structures using a temporary carrier having a weakened ion implant region for subsequent separation along the weakened region
#1346Conductive lines and pads and method of manufacturing thereof
#1347BONDING PAD FOR ANTI-PEELING PROPERTY AND METHOD FOR FABRICATING THE SAME
#1348Semiconductor device having an interconnect structure with TSV using encapsulant for structural support
#1349Recessed pillar structure
#1350Semiconductor device and heat sink with 3-dimensional thermal conductivity
#1351Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die
#1352Substrate stand-offs for semiconductor devices
#1353INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS
#1354THERMAL FLEX CONTACT CARRIERS #2
#1355Solder bump with inner core pillar in semiconductor package
#1356Wire bonding on reactive metal surfaces of a metallization of a semiconductor device by providing a protection layer
#1357UBM Etching Methods
#1358Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
#1359Power semiconductor module and fabrication method
#1360Electronic component module and method of manufacturing the same
#1361Backside processing of semiconductor devices
#1362Methods, devices, and materials for metallization
#1363Microelectronic packages with dual or multiple-etched flip-chip connectors
#1364Method for reducing chip warpage
#1365Semiconductor device having a capacitor
#1366Submount for Electronic Die Attach with Controlled Voids and Methods of Attaching an Electronic Die to a Submount Including Engineered Voids
#1367CLAD MATERIAL FOR WIRING CONNECTION AND WIRING CONNECTION MEMBER PROCESSED FROM THE CLAD MATERIAL
#1368Multilayered printed circuit board and method for manufacturing the same
#1369Method of manufacturing printed wiring board
#1370Stress detection within an integrated circuit having through silicon vias
#1371Method for manufacture of integrated circuit package system with protected conductive layers for pads
#1372Thermally enhanced semiconductor package
#1373ACTIVE ENERGY RAY-CURABLE PRESSURE-SENSITIVE ADHESIVE FOR RE-RELEASE AND DICING DIE-BONDING FILM
#1374SINTERING MATERIAL, SINTERED BOND AND METHOD FOR PRODUCING A SINTERED BOND
#1375Internal packaging of a semiconductor device mounted on die pads
#1376CORROSION-RESISTANT COPPER-TO-ALUMINUM BONDS
#1377Structure and process for the formation of TSVs
#1378Semiconductor package and method of forming similar structure for top and bottom bonding pads
#1379Semiconductor module and method of manufacturing the same
#1380Semiconductor device and manufacturing method thereof
#1381Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device
#1382Method for manufacturing a semiconductor device using an Al-Zn connecting material
#1383Printed circuit board manufacturing method
#1384Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
#1385Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrate
#1386Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnect
#1387Protection film having a plurality of openings above an electrode pad
#1388Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure
#1389Semiconductor device with the leads projected from sealing body
#1390Semiconductor device with heat spreader
#1391Semiconductor device
#1392Electronic devices with yielding substrates
#1393Method for manufacturing a multilayered circuit board
#1394Method for positioning chips during the production of a reconstituted wafer
#1395MICROSTRUCTURE AND MICROSTRUCTURE PRODUCTION METHOD
#1396Semiconductor device, method of manufacturing the same, in-millimeter-wave dielectric transmission device, method of manufacturing the same, and in-millimeter-wave dielectric transmission system
#1397Insulating member, metal base substrate, and semiconductor module, and manufacturing methods thereof
#1398Semiconductor device
#1399Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#1400Multi-chip stack package structure
#1401Multi-chip stack package structure
#1402Multi-chip stack package structure
#1403Plasma treatment for semiconductor devices
#1404Semiconductor device and method of forming dam material around periphery of die to reduce warpage
#1405Power semiconductor device
#1406Method of cutting semiconductor substrate via modified region formation and subsequent sheet expansion
#1407Thermally enhanced electronic package
#1408Semiconductor integrated circuit device and method of manufacturing the same
#1409Semiconductor device with copper wire ball-bonded to electrode pad including buffer layer
#1410Thermally enhanced electronic package utilizing carbon nanocapsules and method of manufacturing the same
#1411Semiconductor device and manufacturing method thereof
#1412SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, WIRING BOARD AND MANUFACTURING METHOD THEREOF, SEMICONDUCTOR PACKAGE, AND ELECTRONIC APPARATUS
#1413Wafer level processing method and structure to manufacture semiconductor chip
#1414MULTILAYER PRINTED WIRING BOARD
#1415Method of repairing a display assembled on a substrate
#1416Method for producing a matrix of individual electronic components and matrix produced thereby
#1417Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapes
#1418Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure
#1419Integrated circuit packaging system with magnetic film and method of manufacture thereof
#1420Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die
#1421SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#1422Semiconductor chip
#1423Semiconductor device with stress relaxation during wire-bonding
#1424Semiconductor device
#1425PACKAGING METHOD OF SEMICONDUCTOR DEVICE
#1426Reception circuit and signal reception method
#1427Inductive circuit arrangement
#1428Semiconductor device, substrate for producing semiconductor device and method of producing them
#1429Microelectronic packages having cavities for receiving microelectronic elements
#1430Package stacking through rotation
#1431Chip package having a chip combined with a substrate via a copper pillar
#1432Chip structure
#1433Semiconductor device with grounding conductor film formed on upper surface of dielectric film formed above integrated circuit
#1434Manufacturing method of semiconductor device, and mounting structure thereof
#1435Reliable metal bumps on top of I/O pads after removal of test probe marks
#1436Method and system for forming a thin semiconductor device
#1437Semiconductor chip and semiconductor package with stack chip structure
#1438Dry flux bonding device and method
#1439Sintering silver paste material and method for bonding semiconductor chip
#1440Activation treatments in plating processes
#1441Semiconductor integrated circuit device
#1442Semiconductor module device and driving apparatus having the same
#1443Substrate interconnections having different sizes
#1444Bump structure and fabrication method thereof
#1445Controlling Solder Bump Profiles by Increasing Heights of Solder Resists
#1446Substrate contact opening
#1447Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
#1448Package systems having interposers with interconnection structures
#1449Integrated circuit packaging system with isolated pads and method of manufacture thereof
#1450Semiconductor apparatus and power supply circuit
#1451Semiconductor device, semiconductor unit, and power semiconductor device
#1452Semiconductor assembly and multilayer wiring board
#1453Circuitry and Method for Encapsulating the Same
#1454Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant
#1455Scalable transfer-join bonding lock-and-key structures
#1456Semiconductor device and method of forming a vertical interconnect structure for 3-D FO-WLCSP
#1457Extendable network structure
#1458Chip structure and process for forming the same
#1459Semiconductor device
#1460SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#1461Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate
#1462Semiconductor device
#1463Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die
#1464Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die
#1465Semiconductor Device with Circuit for Reduced Parasitic Inductance
#1466Semiconductor unit having a power semiconductor and semiconductor apparatus using the same
#1467Method for interconnecting electrical device to a module
#1468Method and apparatus for rapid thermal processing and bonding of materials using RF and microwaves
#1469PATTERNED CONTACT
#1470Semiconductor package having ink-jet type dam and method of manufacturing the same
#1471Semiconductor device and method of forming channels in back surface of FO-WLCSP for heat dissipation
#1472Semiconductor Components Having Conductive Vias With Aligned Back Side Conductors
#1473Stacked semiconductor package and method for manufacturing the same
#1474Semiconductor device for preventing crack in pad region and fabricating method thereof
#1475Semiconductor device and method for fabricating semiconductor device
#1476Semiconductor package and method of manufacturing same
#1477Biocompatible Bonding Method
#1478SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#1479Mixed alloy solder paste
#1480CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT MEMBER AND CONNECTION METHOD OF CIRCUIT MEMBER USING THE CIRCUIT CONNECTION MATERIAL
#1481Semiconductor device and manufacturing method thereof
#1482Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#1483Selective die electrical insulation by additive process
#1484Stackable power MOSFET, power MOSFET stack, and process of manufacture
#1485Carbon nanotube circuit component structure
#1486Semiconductor device having trench-isolated element formation region
#1487Laser etch via formation
#1488WAFER LEVEL CHIP SCALE PACKAGE WITH ANNULAR REINFORCEMENT STRUCTURE
#1489Semiconductor chip with post-passivation scheme formed over passivation layer
#1490MICROELECTRONIC ASSEMBLIES HAVING COMPLIANCY
#1491Cu pillar bump with non-metal sidewall protection structure
#1492Bonding device, ultrasonic transducer, and bonding method
#1493Preventing breakage of long metal signal conductors on semiconductor substrates
#1494Photosensitive composition
#1495Semiconductor method of forming bump on substrate to prevent ELK ILD delamination during reflow process
#1496THROUGH-SUBSTRATE VIA AND FABRICATION METHOD THEREOF
#1497TRANSDUCER OF AN ULTRASONIC BONDER
#1498Method of manufacturing a power transistor module and package with integrated bus bar
#1499Method of manufacturing semiconductor apparatus
#1500Integrated method for high-density interconnection of electronic components through stretchable interconnects