Joining method and device produced by this method and joining unit

Methods and apparatuses for assembling components onto substrates

Method of manufacturing a semiconductor device by lamination

Method of handling a thin wafer

Self-Aligned Chip Stacking

Integrated circuit chip using top post-passivation technology and bottom structure technology

Interconnect structure and a method of fabricating the same

Method and apparatus for distributing a thermal interface material

Semiconductor device having integral structure of contact pad and conductive line

Chip packages

Semiconductor device and method of forming a thin wafer without a carrier

Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability

Semiconductor device

Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure

Semiconductor device and method of manufacturing same

Semiconductor device and method of forming a shielding layer between stacked semiconductor die

Semiconductor device with first and second semiconductor substrates

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Wafer level packaging using flip chip mounting

Component mounting apparatus and method

PROCESS FOR STRIPPING PHOTORESIST AND REMOVING DIELECTRIC LINER

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Film-like adhesive, adhesive sheet, and semiconductor device using same

Multi-chip packages including extra memory chips to define additional logical packages and related devices

Power module

Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads

SEMICONDUCTOR DEVICE, AND STACKED STRUCTURE, PACKAGE, MODULE, AND ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME

Semiconductor device and method of manufacturing the same

Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DUAL SIDED CONNECTION AND METHOD OF MANUFACTURE THEREOF

Semiconductor device and method of mounting pre-fabricated shielding frame over semiconductor die

Semiconductor device and method for manufacturing the same

Method for forming functional element using metal-to-insulator transition material, functional element formed by method, method for producing functional device, and functional device produced by method

Semiconductor device and method of stacking same size semiconductor die electrically connected through conductive via formed around periphery of the die

Method for bonding wafers to produce stacked integrated circuits

DICING DIE-BONDING FILM

Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication

Electronic devices formed of two or more substrates bonded together, electronic systems comprising electronic devices and methods of making electronic devices

Semiconductor constructions

Microelectronic assemblies having compliancy and methods therefor

Reducing stress between a substrate and a projecting electrode on the substrate

Method for fabricating semiconductor components using maskless back side alignment to conductive vias

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Silicon Wafer Having Interconnection Metal

Joint Structure Between a Wound Coil and An IC-Chip for a Noncontact RFID Device and Methods of Manufacturing The Same

Method and apparatus for electronic component mounting

Printed circuit board and method of manufacturing printed circuit board

Semiconductor device

Integrated circuit for driving semiconductor device and power converter

Chips having rear contacts connected by through vias to front contacts

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE

Semiconductor device

Electronic device including dies, a dielectric layer, and a encapsulating layer

Stress barrier structures for semiconductor chips

EMBEDDED CAPACITOR DEVICE AND METHODS OF FABRICATION

Method to build robust mechanical structures on substrate surfaces

Method of manufacturing ball grid array type semiconductor device

Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition

Electronic substrate, semiconductor device, and electronic device

Electromigration-Resistant Flip-Chip Solder Joints

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

Chip capacitive coupling

MIM decoupling capacitors under a contact pad

Manufacturing method of mounting part of semiconductor light emitting element, manufacturing method of light emitting device, and semiconductor light emitting element

Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board

Module having a stacked magnetic device and semiconductor device and method of forming the same

Arrangement comprising an optoelectronic component

Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same

Through-silicon via formed with a post passivation interconnect structure

Integrated circuit micro-module

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

Systems and methods of tamper proof packaging of a semiconductor device

SENSOR CHIP AND METHOD OF MANUFACTURING THE SAME

Light-emitting device having a thermal conductive member with wiring function and method of manufacturing the same

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Method for fabricating a bond

Module having a stacked magnetic device and semiconductor device and method of forming the same

Method of mounting LED chip

Semiconductor component having a stack of semiconductor chips and method for producing the same

SEMICONDUCTOR DEVICE

Semiconductor device and semiconductor device mounted structure

Electronic Device and Method of Manufacturing Same

Connection structure, power module and method of manufacturing the same

Semiconductor device and method of manufacturing semiconductor device

Method for fabricating semiconductor packages with discrete components

Gap capacitors for monitoring stress in solder balls in flip chip technology

Electronic module with EMI protection

Semiconductor device and method for manufacturing semiconductor device

Lock and key through-via method for wafer level 3D integration and structures produced

Grain refinement by precipitate formation in PB-free alloys of tin

Semiconductor device and a method of manufacturing the same

Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Power transistor package with integrated bus bar

SEMICONDUCTOR PACKAGE STRUCTURE USING THE SAME

Wirebonded semiconductor package

Electronic-component-housing package and electronic device

SUPER GTO-BASED POWER BLOCKS

Adhesive bonding method

Coaxial through chip connection

Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method

Dicing film having shrinkage release film and method for manufacturing semiconductor package using the same

Barrier structures and methods for through substrate vias

WAFER LEVEL, CHIP SCALE SEMICONDUCTOR DEVICE PACKAGING COMPOSITIONS, AND METHODS RELATING THERETO

Structure of UBM and solder bumps and methods of fabrication

Flip chip interconnection having narrow interconnection sites on the substrate

Reinforced structure for a stack of layers in a semiconductor component

Thermally enhanced semiconductor package

Integrated antennas in wafer level package

Package-on-package using through-hole via die on saw streets

Memory card and method for manufacturing memory card

SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD OF ENCAPSULATING

Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same

Solder bump confinement system for an integrated circuit package

THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

METHOD OF FORMING CONNECTION TERMINAL

Semiconductor device and production method therefor

Method of manufacturing semiconductor device

Underbump metallization structure

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Process for packaging components, and packaged components

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and production method therefor

Lead pin for mounting semiconductor and printed wiring board

Method of attaching die using self-assembling monolayer and package substrate including die attached thereto using self-assembling monolayer

FLUIDIC SELF-ASSEMBLY FOR SYSTEM INTEGRATION

Micro-machined structure production using encapsulation

Metallized substrate and method for producing the same

Achieving mechanical and thermal stability in a multi-chip package

Lead frames with improved adhesion to plastic encapsulant

Semiconductor integrated circuit device and a method for manufacturing a semiconductor integrated circuit device

Semiconductor device and method for manufacturing

Method of teaching eyepoints for wire bonding and related semiconductor processing operations

Dual metal for a backside package of backside illuminated image sensor

Semiconductor device and fabrication method for the same

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps

ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE MADE WITH THE SAME

Contact pad supporting structure and integrated circuit for crack suppresion

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps

Semiconductor device, method for manufacturing the same, and multilayer substrate having the same

Metal schemes of trench MOSFET for copper bonding

Semiconductor device with circuit for reduced parasitic inductance

SHIELDED ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME

Methods for forming packaged products

PACKAGED POWER SWITCHING DEVICE

HIGH RELIABILITY Au ALLOY BONDING WIRE AND SEMICONDUCTOR DEVICE OF SAME

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Electronic device and electronic apparatus

Marking method for semiconductor device and semiconductor device provided with markings

Semiconductor device including arrangement to control connection height and alignment between a plurity of stacked semiconductor chips

Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries

Isolation Structure for Stacked Dies

Semiconductor device with output circuit arrangement

REDUCING WARPAGE FOR FAN-OUT WAFER LEVEL PACKAGING

CHIP PACKAGES WITH POWER MANAGEMENT INTEGRATED CIRCUITS AND RELATED TECHNIQUES

Semiconductor device

Structures and methods for improving solder bump connections in semiconductor devices

Semiconductor device and method of confining conductive bump material during reflow with solder mask patch

Structures and methods for improving solder bump connections in semiconductor devices

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing same

True CSP power MOSFET based on bottom-source LDMOS

Package carrier

Method for low temperature bonding and bonded structure

Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns

Method of manufacturing multilayer printed circuit board

Systems and methods for affixing a silicon device to a support structure

Memory card and memory card manufacturing method

Resin paste for die bonding, containing a polyurethaneimide resin and thermosetting resin method for manufacturing semiconductor device, and semiconductor device, using the resin paste

Semiconductor device

Bonding pad structure and manufacturing method thereof

LOW COST PROCESS FLOW FOR FABRICATION OF METAL CAPPING LAYER OVER COPPER INTERCONNECTS

Solder limiting layer for integrated circuit die copper bumps

Semiconductor device

Semiconductor device

SEMICONDUCTOR DEVICE

Semiconductor device and method of manufacturing the same

Power module having stacked flip-chip and method of fabricating the power module

Nano memory, light, energy, antenna and strand-based systems and methods

Microprobe Tips and Methods for Making

Printed wiring board

Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages

Manufacturing method of transferring a wiring circuit layer on a metal support substrate to a semiconductor element

Semiconductor device including chip

Step cavity for enhanced drop test performance in ball grid array package

Semiconductor device with a vertical interconnect structure for 3-D FO-WLCSP

Double-sided semiconductor device and method of forming top-side and bottom-side interconnect structures

Stacked semiconductor device and method of manufacturing the same

Thermally enhanced electronic package

Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV

Semiconductor device

Semiconductor device

Oblique parts or surfaces

Method for producing chip with adhesive applied

Die assemblies

SEMICONDUCTOR DIE INTERCONNECT FORMED BY AEROSOL APPLICATION OF ELECTRICALLY CONDUCTIVE MATERIAL

Insulating film material, multilayer wiring board and production method thereof, and semiconductor device and production method thereof

Method of forming bump structure having tapered sidewalls for stacked dies

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Semiconductor device, and method of manufacturing multilayer wiring board and semiconductor device

Extended redistribution layers bumped wafer

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Apparatus and method for packaging circuits

Manufacturing fan-out wafer level packaging

Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devices

Triaxial through-chip connection

Alpha shielding techniques and configurations

Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure

Semiconductor devices

Semiconductor device

Oblique parts or surfaces

Bonding tool, electronic component mounting apparatus and electronic component mounting method

CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Sealed surface acoustic wave element package

ELECTRONIC CIRCUIT WITH EMBEDDED MEMORY

Semiconductor integrated circuit device

Semiconductor device with solder bump formed on high topography plated Cu pads

Semiconductor chip stacked body and method of manufacturing the same

Semiconductor package, method of manufacturing semiconductor package, electronic component, and method of manufacturing electronic component

Apparatus and method for reducing pitch in an integrated circuit

Semiconductor device and method for manufacturing the same

DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

DICING DIE-BONDING FILM AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

Dicing die-bonding film and process for producing semiconductor device

Semiconductor device including a DC-DC converter having a metal plate

Semiconductor device

Wiring structure between steps and wiring method thereof

Through substrate vias for back-side interconnections on very thin semiconductor wafers

Device including a semiconductor chip

Integrated circuit devices having printed circuit boards therein with staggered bond fingers that support improved electrical isolation

WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGES

Power semiconductor module with segmented base plate

Leadframe-based chip scale semiconductor packages

Semiconductor device and method of forming WLCSP using wafer sections containing multiple die

3-D circuits with integrated passive devices

Trench MOSFET with trench source contact having copper wire bonding

Method of manufacturing a semiconductor device

High temperature, stable SiC device interconnects and packages having low thermal resistance

Carbon nanotubes solder composite for high performance interconnect

Heat radiation material, electronic device and method of manufacturing electronic device

Semiconductor device having through electrodes, a manufacturing method thereof, and an electronic apparatus

Layout design method and semiconductor integrated circuit

Double solid metal pad with reduced area

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Substrate with chips mounted thereon, method of manufacturing substrate with chips mounted thereon, display, and method of manufacturing display

Interconnect and method for mounting an electronic device to a substrate

THERMALLY CONTROLLED FLUIDIC SELF-ASSEMBLY

SEMICONDUCTOR DEVICE

Method for reducing chip warpage

Method for manufacturing semiconductor device

Printed circuit board

TECHNIQUE FOR PACKAGING MULTIPLE INTEGRATED CIRCUITS

Semiconductor device having stacked multiple substrates and method for producing same

Top layers of metal for high performance IC's

Metal line in semiconductor device and method for forming the same

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Structure and method for stacked wafer fabrication

Semiconductor device and a manufacturing method of the same

Stacked wafer level package and method of manufacturing the same

Chip package structure

Coil and semiconductor apparatus having the same

Semiconductor body and method for the design of a semiconductor body with a connecting line

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE FOR DRIVING DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF

Component with Mechanically Loadable Connecting Surface

Circuit manufacturing apparatus

Method for producing semiconductor chips using thin film technology

Integrated circuit package formation

Semiconductor device having semiconductor chips stacked and mounted thereon and manufacturing method thereof

Semiconductor memory device

Semiconductor body and method for voltage regulation

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device including a reduced stress configuration for metal pillars

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Method of manufacturing a multilayer printed wiring board

Connecting wire and method for manufacturing same

DEVICE CAPABLE OF THERMALLY COOLING WHILE ELECTRICALLY INSULATING

Semiconductor package with passivation island for reducing stress on solder bumps

SEMICONDUCTOR DEVICE

MICROELECRONIC ASSEMBLY AND METHOD FOR FORMING THE SAME

FUNCTIONAL-DEVICE-EMBEDDED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT

LOW-TEMPERATURE-COFIRED-CERAMIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

Hybrid Semiconductor Chip Package

Semiconductor electronic component and semiconductor device using the same

Wafer level package using stud bump coated with solder

POWER MODULE AND INVERTER FOR VEHICLES

Methods of Forming Integrated Circuit Contact Pads Using Electroless Plating of Diffusion Barrier Layers

DICING/DIE-BONDING TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP

Process for spontaneous deposition from an organic solution

Through-substrate vias (TSVs) electrically connected to a bond pad design with reduced dishing effect

Semiconductor substrates with unitary vias and via terminals, and associated systems and methods

Semiconductor package, semiconductor module, and method for fabricating the semiconductor package

Through-silicon via structures providing reduced solder spreading and methods of fabricating the same