METHOD FOR MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE, AND STACKED SEMICONDUCTOR PACKAGE

Electronic packages with fine particle wetting and non-wetting zones

Semiconductor device having elastic solder bump to prevent disconnection

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

PB-free solder bumps with improved mechanical properties

Semiconductor device

Die bonding a semiconductor device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Wiring board, semiconductor device and method for manufacturing the same

Lead frame substrate and method of manufacturing the same, and semiconductor device

Lead frame substrate, manufacturing method thereof, and semiconductor apparatus

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method of manufacturing the same

Leadframe Structure, Advanced Quad Flat No Lead Package Structure Using the Same, and Manufacturing Methods Thereof

Semiconductor chip package assembly with deflection-resistant leadfingers

Dice Rearrangement Package Structure Using Layout Process to Form a Compliant Configuration

Semiconductor device

Method for stacking serially-connected integrated circuits and multi-chip device made from same

Semiconductor device and method of manufacturing the same

Method for Soldering Contact Wires to Solar Cells

Flip-chip mounting method and bump formation method

INTEGRATED DEVICE

Adhesive composition for a semiconductor device, adhesive film, and dicing die-bonding film

Acrylic insulating adhesive

Method of manufacturing semiconductor device

PHOTOSENSITIVE ADHESIVE COMPOSITION, PHOTOSENSITIVE FILM ADHESIVE, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE, SEMICONDUCTOR DEVICE AND ELECTRONIC COMPONENT

DIE-ATTACH FILM AND METHOD OF MANUFACTURING THE SAME

INTEGRATED CIRCUITS HAVING LEAD CONTACTS AND LEADLESS CONTACT PADS CONNECTED TO A SURFACE OF A PRINTED WIRING BOARD, AND METHODS FOR CONNECTING THE SAME

Fan-out wafer level package with polymeric layer for high reliability

Inductive relayed coupling circuit between substrates

Use of die backside films to modulate EOL coplanarity of thin packages while providing thermal capability and laser markability of packages

Quad flat no lead (QFN) package

Dicing tape-integrated film for semiconductor back surface

Film for flip chip type semiconductor back surface

Dicing tape-integrated film for semiconductor back surface

SEMICONDUCTOR DEVICE

Semiconductor module

Semiconductor package and stack semiconductor package having the same

INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME

PAD STRUCTURE AND INTEGRATED CIRCUIT CHIP WITH SUCH PAD STRUCTURE

Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip

CARBON NANOTUBE-BASED FILLER FOR INTEGRATED CIRCUITS

Modified chip attach process

Micro-bump structure

Semiconductor package having electrical connecting structures and fabrication method thereof

Semiconductor package

Semiconductor package having chip using copper process

Fan-out chip scale package

Semiconductor memory device, semiconductor package and system having stack-structured semiconductor chips

Semiconductor device package having a semiconductor chip on wiring board connected to plurality of leads including power MOSFETs

Circular shield of a circuit-substrate laminated module and electronic apparatus

Bonding apparatus

Wiring board capable of containing functional element and method for manufacturing same

Method of applying an adhesive layer on thincut semiconductor chips of a semiconductor wafer

Structure of circuit board and method for fabricating the same

Manufacturing method of semiconductor device

Overcoming laminate warpage and misalignment in flip-chip packages

Heat-resistant adhesive sheet for substrateless semiconductor package fabrication and method for fabricating substrateless semiconductor package using the adhesive sheet

Method of manufacturing semiconductor device

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

Method for manufacturing chips

PHOTOSENSITIVE ADHESIVE COMPOSITION, AND FILM ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER AND SEMICONDUCTOR DEVICE USING THE PHOTOSENSITIVE ADHESIVE COMPOSITION

Method for assembling at least one chip with a wire element, electronic chip with a deformable link element, fabrication method of a plurality of chips, and assembly of at least one chip with a wire element

Method for producing a non-plane element

Radio frequency amplifier with effective decoupling

Microelectronic assembly with joined bond elements having lowered inductance

Dicing die-bonding film

Metal plugged substrates with no adhesive between metal and polyimide

Contact-based encapsulation

Lead frame land grid array with routing connector trace under unit

Semiconductor component of semiconductor chip size with flip-chip-like external contacts

MICROELECTRONIC ASSEMBLY WITH BOND ELEMENTS HAVING LOWERED INDUCTANCE

Semiconductor device and method for fabricating the same

Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier

Pre-soldered leadless package

Structures and methods to reduce maximum current density in a solder ball

Window ball grid array (BGA) semiconductor packages

Integrated circuit package with embedded components

METHOD FOR STACKING DIE IN THIN, SMALL-OUTLINE PACKAGE

Integrated circuit packaging system with embedded interconnect and method of manufacture thereof

Integrated circuit package system employing device stacking

METHOD OF VERTICALLY MOUNTING AN INTEGRATED CIRCUIT

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Substrate for integrated circuit devices including multi-layer glass core and methods of making the same

Printed wiring board and method for manufacturing printed wiring board

Method and apparatus for pass/fail determination of bonding and bonding apparatus

Semiconductor device and communication method

Heat-resistant adhesive sheet for semiconductor device fabrication, adhesive used for the sheet, and method for fabricating semiconductor device using the sheet

Method for low stress flip-chip assembly of fine-pitch semiconductor devices

Manufacturing method for semiconductor device

Semiconductor connection component

Semiconductor package with a support structure and fabrication method thereof

Method of room temperature covalent bonding

External storage device and method of manufacturing external storage device

Integrated circuit packaging system with bond wire pads and method of manufacture thereof

Semiconductor device having a microcomputer chip mounted over a memory chip

Semiconductor device and electronic device

Substrate for electronic device, stack for electronic device, electronice device, and method for manufacturing the same

Semiconductor devices including voltage switchable materials for over-voltage protection

Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip

Semiconductor device and method for manufacturing the same

Semiconductor device and manufacturing method thereof

Semiconductor device and method of forming PiP with inner known good die interconnected with conductive bumps

Integrated circuit packaging system with interconnect and method of manufacture thereof

Semiconductor device, substrate and semiconductor device manufacturing method

Panel based lead frame packaging method and device

DAP GROUND BOND ENHANCEMENT

Integrated circuit packaging system with dual row lead-frame having top and bottom terminals and method of manufacture thereof

Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof

Semiconductor device and manufacturing method thereof

Integrated circuit with pads connected by an under-bump metallization and method for production thereof

Bonding structure and method for manufacturing same

Method for manufacturing an electronic assembly

Method for manufacturing semiconductor device

Semiconductor Device with Improved Contacts

Method of forming at least one bonding structure

Method for manufacturing lamination type semiconductor integrated device

Leadframe for leadless package, structure and manufacturing method using the same

ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME

Semiconductor package

Conductor bump method and apparatus

AREA REDUCTION FOR SURFACE MOUNT PACKAGE CHIPS

Semiconductor Device and Method of Confining Conductive Bump Material with Solder Mask Patch

Interface structure for copper-copper peeling integrity

Semiconductor device and method of manufacturing the same

Integrated circuit packaging system with interconnect and method of manufacture thereof

Multi-chip stacked package and its mother chip to save interposer

Semiconductor device with sealed semiconductor chip

Leadframe for leadless package, structure and manufacturing method using the same

Heat radiation member for a semiconductor package with a power element and a control circuit

Auxiliary leadframe member for stabilizing the bond wire process

Integrated circuit package system for electromagnetic isolation and method for manufacturing thereof

System support for electronic components and method for production thereof

SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS

Semiconductor device, and communication apparatus and electronic apparatus having the same

Semiconductor device

METAL PARTICLES-DISPERSED COMPOSITION AND FLIP CHIP MOUNTING PROCESS AND BUMP-FORMING PROCESS USING THE SAME

Semiconductor device and inspection method therefor

Method for manufacturing semiconductor package system with die support pad

Encapsulation method for packaging semiconductor components with external leads

Process to form semiconductor packages with external leads

Semiconductor device and method of manufacturing the same

Pressure-bonded ball diameter detecting apparatus and pressure-bonded ball diameter detecting method

Universal IO unit, associated apparatus and method

CHIP PACKAGE AND FABRICATION METHOD THEREOF

Integrated circuit packaging system with embedded circuitry and post

Method of manufacturing a laminate electronic device including separating a carrier into a plurality of parts

Semiconductor package having a stacked wafer level package and method for fabricating the same

Semiconductor device

Chip package and manufacturing method thereof

Solder structure, method for forming the solder structure, and semiconductor module including the solder structure

Semiconductor Device and Method of Forming Bump Structure with Multi-Layer UBM Around Bump Formation Area

ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME

Wiring circuit structure and manufacturing method for semiconductor device using the structure

Semiconductor-device mounted board and method of manufacturing the same

Semiconductor Package and Manufacturing Methods Thereof

Package system with a shielded inverted internal stacking module and method of manufacture thereof

3D interconnection structure and method of manufacturing the same

Semiconductor device and method for making the same

Die-bonding method of LED chip and LED manufactured by the same

Bonding material with exothermically reactive heterostructures

Substrate holder and plating apparatus

Method of manufacturing printed circuit board

Manufacturing method of semiconductor device

Thermal enhanced upper and dual heat sink exposed molded leadless package and method

First-level interconnects with slender columns, and processes of forming same

EPOXY RESIN FORMULATIONS FOR UNDERFILL APPLICATIONS

Apparatus and method for predetermined component placement to a target platform

Integrated circuit package system with warp-free chip

Semiconductor device and method of forming electrical interconnect with stress relief void

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE AND METHODS OF THE SAME

Semiconductor device and method of packaging a semiconductor device with a clip

Bonding connection between a bonding wire and a power semiconductor chip

Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingers

Electronic device and electronic apparatus

Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP

ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME

Semiconductor device and method for manufacturing the same

Diode leadframe for solar module assembly

Semiconductor device and lead frame thereof

EXTENDED UNDER-BUMP METAL LAYER FOR BLOCKING ALPHA PARTICLES IN A SEMICONDUCTOR DEVICE

PHOTOSENSITIVE ADHESIVE COMPOSITION, FILMY ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE, AND PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

Semiconductor device and structure

Structure for bumped wafer test

Semiconductor device including first semiconductor chip including first pads connected to first terminals, and second semiconductor chip including second pads connected to second terminals

Method for assembling a multi-component electronic apparatus

ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING COATED PARTICLES

Bonding wire for semiconductor

Apparatus and method for predetermined component placement to a target platform

Apparatus and method for predetermined component placement to a target platform

Manufacturing method of semiconductor integrated circuit device

Multi-layer thick-film RF package

Circuit member, manufacturing method of the circuit member, and semiconductor device including the circuit member

Fabrication of electronic devices including flexible electrical circuits

Apparatus and method for processing a substrate

Stackable semiconductor device packages

MICROSTRUCTURE, AND METHOD FOR PRODUCTION THEREOF

RF package

Area efficient through-hole connections

Method for manufacturing a plurality of thin chips and correspondingly manufactured thin chip

Semiconductor device and method of manufacturing same

Semiconductor device, production method for the same, and substrate

Interconnect with flexible dielectric layer

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Lead-free solder connection structure and solder ball

Wafer and substructure for use in manufacturing electronic component packages

FLIP CHIP PACKAGE

Method for reducing voids in a copper-tin interface and structure formed thereby

WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION

Pad structure for semiconductor devices

Integrated circuit micro-module

Method of forming protective material between semiconductor die stacked on semiconductor wafer to reduce defects during singulation

ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE AND AN ELECTRICAL CONDUCTOR WITHIN A VIA AND A PROCESS OF FORMING THE SAME

Power semiconductor module and method for operating a power semiconductor module

Semiconductor device packages with electromagnetic interference shielding

Integrated circuit packaging system with interconnect and method of manufacture thereof

Semiconductor device and method of manufacturing the same

Wafer-level semiconductor device packages with electromagnetic interference shielding

Semiconductor device packages with electromagnetic interference shielding

Backside illuminated imaging sensor with reinforced pad structure

Circuit-connecting material and circuit terminal connected structure and connecting method

Metal nanoink and process for producing the metal nanoink, and die bonding method and die bonding apparatus using the metal nanoink

Method for creating highly compliant thermal bonds that withstand relative motion of two surfaces during temperature changes using spacing structures

Mounting structure, and method of manufacturing mounting structure

Bonding apparatus and bonding method

Stacked electronic device and method of making such an electronic device

Transfer apparatus for multiple adhesives

Wiring forming method

Method for forming post bump

ADHESIVE TAPE FOR RESIN-ENCAPSULATING AND METHOD OF MANUFACTURE OF RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

Integrated-circuit package for proximity communication

Circuit module and manufacturing method for the same

Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package

Joint structure, joining material, and method for producing joining material containing bismuth

Stable gold bump solder connections

POWER AND SIGNAL DISTRIBUTION OF INTEGRATED CIRCUITS

Laminate electronic device

Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof

Integrated circuit packaging system with leads and method of manufacture thereof

Semiconductor package with metal straps

SEMICONDUCTOR CHIP GRID ARRAY PACKAGE AND METHOD FOR FABRICATING SAME

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONCAVE TRENCHES AND METHOD OF MANUFACTURE THEREOF

Semiconductor device package

Semiconductor component having through wire interconnect with compressed bump

Wafer level chip scale package and process of manufacture

Packaging device and base member for packaging

Semiconductor device

Semiconductor devices having redistribution structures and packages, and methods of forming the same

Semiconductor element and method of manufacturing the same

Manufacturing method of semiconductor package

Dicing/die bonding film

Manufacturing method of semiconductor device

Method of manufacturing semiconductor element mounted wiring board

Packaged microdevices and methods for manufacturing packaged microdevices

Method and leadframe for packaging integrated circuits

Bonding structure of bonding wire

Flexible interconnect pattern on semiconductor package

Indium compositions

Power semiconductor module and method for operating a power semiconductor module

Integrated circuit packaging system with core region and bond pad and method of manufacture thereof

Semiconductor device and method for manufacturing the same

Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof

Microelectronic assembly with impedance controlled wirebond and conductive reference element

Integrated (multilayer) circuits and process of producing the same

Device fabricated using an electroplating process

Mechanisms for forming copper pillar bumps

Copper bump joint structures with improved crack resistance

Semiconductor device with trench-like feed-throughs

Semiconductor device with bump interconnection

PILLAR BUMP WITH BARRIER LAYER

Post passivation interconnect with oxidation prevention layer

Semiconductor die contact structure and method

Robust joint structure for flip-chip bonding

Semiconductor device and method of forming column interconnect structure to reduce wafer stress

Power module assembly with reduced inductance

Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate

Power semiconductor package

Crack resistant circuit under pad structure and method of manufacturing the same

Light-emitting diode package

Semiconductor package, method of evaluating same, and method of manufacturing same

Apparatus and methods of attaching hybrid vlsi chips to printed wiring boards

Automatic wire feeding method for wire bonders

Carrier tape for tab-package and manufacturing method thereof

Substrate anchor structure and method

SUBSTRATE-MOUNTED CIRCUIT MODULE HAVING COMPONENTS IN A PLURALITY OF CONTACTING PLANES

Method of manufacturing semiconductor device and method of manufacturing electronic device

Manufacturing method for semiconductor integrated device

Method for connecting a die assembly to a substrate in an integrated circuit

Microelectronic devices and methods for manufacturing microelectronic devices

Semiconductor chip, wafer stack package using the same, and methods of manufacturing the same

Ultra-low profile multi-chip module

High efficiency module

Microelectronic assemblies having compliant layers

Semiconductor package including flip chip controller at bottom of die stack

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board and electronic instrument

Small area, robust silicon via structure and process

Hybrid package

Semiconductor device mounted structure and its manufacturing method