Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Flip chip package and method of manufacturing the same

Semiconductor device and method of manufacturing semiconductor device

Semiconductor package and method for fabricating the same

LEADLESS SEMICONDUCTOR DEVICE TERMINAL

Routing layer for mitigating stress in a semiconductor die

Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same

Method and apparatus for semiconductor device fabrication using a reconstituted wafer

Semiconductor device

Wirebond-less semiconductor package

Method of attaching an interconnection plate to a semiconductor die within a leadframe package

Microelectronic assembly with impedance controlled wirebond and conductive reference element

Stackable semiconductor assemblies and methods of manufacturing such assemblies

Lead frame and intermediate product of semiconductor device

Semiconductor device, method of manufacturing the same, and wireless transmission system utilizing the same

HEAT-CONDUCTIVE NOISE SUPPRESSION SHEET

Method of making a connection component with hollow inserts

Semiconductor device suitable for a stacked structure

Preventing UBM oxidation in bump formation processes

Method of manufacturing a three dimensional integrated circuit by transfer of a mono-crystalline layer

Method of manufacturing a lead frame with a nickel coating

Method for manufacturing and testing an integrated electronic circuit

DOUBLE-LAYERED PATTERNABLE ADHESIVE FILM, METHOD OF FORMING THE SAME, AND METHOD OF FORMING PATTERNABLE ADHESIVE LAYER USING THE SAME

Method and structure for bonding flip chip

MULTICHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

Power semiconductor device and manufacturing method therefor

Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates

Method for manufacturing a package-on-package type semiconductor device

SEMICONDUCTOR DEVICE HAVING WAFER-LEVEL CHIP SIZE PACKAGE

Semiconductor package and method of manufacturing the same

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF

Leadframe packages having enhanced ground-bond reliability

Integrated circuit packaging system with package-on-package stacking and method of manufacture thereof

Semiconductor device and manufacturing method thereof

Apparatus and method configured to lower thermal stresses

Semiconductor Device

OPTO-ELECTRICAL ASSEMBLIES AND ASSOCIATED APPARATUS AND METHODS

METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY

Mounting apparatus

METALLIC BUMP STRUCTURE WITHOUT UNDER BUMP METALLURGY AND A MANUFACTURING METHOD THEREOF

THERMOSETTING DIE-BONDING FILM

Wiring substrate for a semiconductor chip, and semiconducotor package having the wiring substrate

THERMOSETTING DIE-BONDING FILM

Packaged semiconductor assemblies and methods for manufacturing such assemblies

Package-on-package system with via z-interconnections and method for manufacturing thereof

Electrical connection for multichip modules

Semiconductor package substrate and semiconductor device having the same

Semiconductor structure, pad structure and protection structure

Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers

Chip design with robust corner bumps

Reducing underfill keep out zone on substrate used in electronic device processing

Designs and methods for conductive bumps

Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask

Semiconductor device and information processing system including the same

Chip package and fabrication method thereof

SEMICONDUCTOR PACKAGE WITH SECTIONED BONDING WIRE SCHEME

Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereof

PACKAGE CARRIER, SEMICONDUCTOR PACKAGE, AND PROCESS FOR FABRICATING SAME

Semiconductor package and process for fabricating same

Device including a semiconductor chip and a carrier and fabrication method

Through silicon via (TSV) wire bond architecture

Solid state image capture device and method for manufacturing same

ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

METAL WIRING STRUCTURE COMPRISING ELECTROLESS NICKEL PLATING LAYER AND METHOD OF FABRICATING THE SAME

OPTICAL DEVICE AND METHOD FOR MANUFACTURING THE SAME

Manufacturing method for semiconductor devices

Surface modification for handling wafer thinning process

Flip chip interconnect method and design for GaAs MMIC applications

Electronic assemblies including mechanically secured protruding bonding conductor joints

Semiconductor device and method of manufacturing the same

Connection for off-chip electrostatic discharge protection

Die stacking system and method

Semiconductor device

Chip package and fabrication method thereof

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Integrated circuit chip and flip chip package having the integrated circuit chip

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD

Integrated circuit packaging system with protective coating and method of manufacture thereof

Lead frame and method of manufacturing the same

Integrated circuit packaging system with pad connection and method of manufacture thereof

Integrated circuit packaging system with shaped lead and method of manufacture thereof

Semiconductor device

APPARATUS FOR SEMICONDUCTOR DIE BONDING

Multi-chip module for battery power control

Semiconductor device and method of forming narrow interconnect sites on substrate with elongated mask openings

Self locking and aligning clip structure for semiconductor die package

Low cost lead-free preplated leadframe having improved adhesion and solderability

Molded leadframe substrate semiconductor package

POWER DEVICE PACKAGES AND METHODS OF FABRICATING THE SAME

Embedded chip package process

Method for manufacturing semiconductor device

Manufacturing method of semiconductor device

Wiring board, semiconductor device, and method of manufacturing the same

Electronic device

Semiconductor Device and Method of Forming Pad Layout for Flipchip Semiconductor Die

SEMICONDUCTOR DEVICE

Method for manufacturing a semiconductor component

Semiconductor device with interface peeling preventing rewiring layer

Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate

Flip chip interconnection with double post

Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding

Semiconductor device and method of forming bump-on-lead interconnection

Apparatus and methods of forming an interconnect between a workpiece and substrate

Semiconductor device and method of forming flipchip interconnect structure

Semiconductor device with copper wire having different width portions

Semiconductor device and method of manufacturing the same

Semiconductor device with overlapped lead terminals

Semiconductor device and method of forming adhesive material to secure semiconductor die to carrier in WLCSP

Thermally enhanced low parasitic power semiconductor package

RF transistor packages with internal stability network including intra-capacitor resistors and methods of forming RF transistor packages with internal stability networks including intra-capacitor resistors

Multiple die layout for facilitating the combining of an individual die into a single die

Semiconductor power module package with temperature sensor mounted thereon and method of fabricating the same

True CSP power MOSFET based on bottom-source LDMOS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor integrated circuit

Gas delivery system for reducing oxidation in wire bonding operations

Plating apparatus

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE

Manufacturing method of semiconductor device

Template and pattern forming method

Method of manufacturing semiconductor device

3D smart power module

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

Fabrication method of semiconductor integrated circuit device

Method of fabricating a high-temperature compatible power semiconductor module

Method for integrating an electronic component into a printed circuit board

Device and manufacturing method

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Semiconductor device and adhesive sheet

SEMICONDUCTOR PACKAGE WITH PRE-FORMED BALL BONDS

Wafer backside interconnect structure connected to TSVs

Strong interconnection post geometry

Integrated circuit packaging system with quad flat no-lead package and method of manufacture thereof

Embedded die package and process flow using a pre-molded carrier

Semiconductor device and method of forming interposer with opening to contain semiconductor die

Integrated circuit packaging system with a leaded package and method of manufacture thereof

Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method

Layered chip package

Method for manufacturing packaging structure

Semiconductor device and manufacturing method of the same

Semiconductor package and method of manufacturing the semiconductor package

Integrated circuit packaging system with cap layer and method of manufacture thereof

Semiconductor chip attach configuration having improved thermal characteristics

CHIP PACKAGE AND PROCESS THEREOF

Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP

Thermally improved semiconductor QFN/SON package

Resin-sealed semiconductor device and method of manufacturing the same

Stackable wafer level package and fabricating method thereof

Semiconductor device including vertical transistor and horizontal transistor

Method of attaching a solder ball and method of repairing a memory module

Printed wiring board and method for manufacturing the same

METHOD OF BONDING PARTS TO SUBSTRATE USING SOLDER PASTE

Dicing method using a die attach film on an adhesive sheet

Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process

Wafer level integration module with interconnects

3D multiple die stacking

Dicing tape and die attach adhesive with patterned backing

Robust FBEOL and UBM structure of C4 interconnects

ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC EQUIPMENT

Stacked-die package including substrate-ground coupling

Semiconductor device

Display device

Protection layer for preventing UBM layer from chemical attack and oxidation

Substrate and package with micro BGA configuration

Semiconductor device and method of forming cavity in PCB containing encapsulant or dummy die having CTE similar to CTE of large array WLCSP

Non-volatile memory with reduced mobile ion diffusion

Semiconductor device and method of forming integrated passive device

Fabrication for electroplating thick metal pads

Method for manufacturing semiconductor device and bonding apparatus

Method of manufacturing mounting structure and mounting structure

Circuit module and method of manufacturing the same

Method of manufacturing a printed wiring board

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND MASK

Method of integrating a MOSFET with a capacitor

Molded ultra thin semiconductor die packages, systems using the same, and methods of making the same

Method of making a semiconductor chip assembly with a post/base heat spreader, a signal post and a cavity

BONDING WIRE

Packaging structure having embedded semiconductor element

Enhanced copper posts for wafer level chip scale packaging

Terminal face contact structure and method of making same

Semiconductor device and manufacturing method therefor

Structure, method and system for assessing bonding of electrodes in FCB packaging

Semiconductor Chip with Stair Arrangement Bump Structures

Method for fabricating a semiconductor and semiconductor package

Impedance optimized chip system

Semiconductor package

Method of manufacturing semiconductor device and semiconductor device

Partially Patterned Lead Frames and Methods of Making and Using the Same in Semiconductor Packaging

Delamination resistant packaged die having support and shaped die having protruding lip on support

Acceleration sensor, semiconductor device and method of manufacturing semiconductor device

LED WITH PHOSPHOR TILE AND OVERMOLDED PHOSPHOR IN LENS

Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out

DICING/DIE BONDING FILM

ADHESIVE FILM WITH DICING SHEET AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD ELEMENT HAVING AT LEAST ONE COMPONENT EMBEDDED THEREIN AND METHOD FOR EMBEDDING AT LEAST ONE COMPONENT IN A PRINTED CIRCUIT BOARD ELEMENT

Solder joint reliability in microelectronic packaging

Semiconductor device, and power conversion device using semiconductor device

Method for producing a hermetically sealed, electrical feedthrough using exothermic nanofilm

Semiconductor chip with contoured solder structure opening

Integrated circuits having TSVs including metal gettering dielectric liners

Wafer Level Stacked Die Packaging

Semiconductor Chip Interconnection Structure and Semiconductor Package Formed Using the Same

Front side copper post joint structure for temporary bond in TSV application

Self-aligned protection layer for copper post structure

Flip-Chip Package Structure

Off-chip vias in stacked chips

Semiconductor device and method of forming pre-molded semiconductor die having bumps embedded in encapsulant

Semiconductor device that performs signal transmission using induction coupling, method of said manufacturing semiconductor device, and lead frame thereof

CONNECTION DEVICE BEWTEEN TRANSISTOR AND LEAD FRAME

Semiconductor package and method for packaging the same

Encapsulant interposer system with integrated passive devices and manufacturing method therefor

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device

Semiconductor chip assembly with post/base heat spreader, signal post and cavity

Semiconductor apparatus with improved efficiency of thermal radiation

Chip structure with bumps and testing pads

Method of joining a chip on a substrate

Wire-bonding machine with cover-gas supply device

Method of processing cavity of core substrate

Resin sheet for circuit boards, sheet for circuit boards and circuit board displays

Printed wiring board and method for manufacturing the same

Method for producing flexible integrated circuits which may be provided contiguously

Self-Filleting Die Attach Paste

Bonding method and bonding apparatus

Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles

Semiconductor device and method of forming dual-active sided semiconductor die in fan-out wafer level chip scale package

Electronic component

Electronic component and manufacturing method thereof

Semiconductor device

Semiconductor device having a wafer level chip size package structure

Extendable connector and network

BONDING STRUCTURES AND METHODS OF FORMING BONDING STRUCTURES

Chip package and method for forming the same

SOLDER JOINT STRUCTURE, AND JOINING METHOD OF THE SAME

Semiconductor apparatus and fabrication method thereof

SEMICONDUCTOR DEVICE AND ON-VEHICLE AC GENERATOR

Semiconductor device with pad with less diffusible contacting surface and method for production of the semiconductor device

Electronic device and method of manufacturing the same

Stacked packaging improvements

Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers

Semiconductor device having stable signal transmission at high speed and high frequency

Chip package with heavily doped region and fabrication method thereof

Chip package with heavily doped regions and fabrication method thereof

Semiconductor device, external connection terminal, method of manufacturing semiconductor device, and method of manufacturing external connection terminal

Die package and method of manufacturing the same

Chip package and fabrication method thereof

QFN SEMICONDUCTOR PACKAGE AND CIRCUIT BOARD STRUCTURE ADAPTED FOR THE SAME

LEAD FRAME ASSEMBLY FOR A SEMICONDUCTOR PACKAGE

Flexible contactless wire bonding structure and methodology for semiconductor device

Composite semiconductor structure formed using atomic bonding and adapted to alter the rate of thermal expansion of a substrate

Semiconductor device having semiconductor chip and metal plate

Light emitting diode package

Semiconductor memory device and semiconductor memory card

Composite silver nanoparticle, composite silver nanopaste, bonding method and patterning method

Electronic component and manufacturing method thereof

Room temperature metal direct bonding

Solderless carbon nanotube and nanowire electrical contacts and methods of use thereof

Manufacturing method of semiconductor device

Method for manufacturing semiconductor device

Method of manufacturing semiconductor device

Flip chip cavity package

Sub-field enhanced global alignment

Voltage source converter

Method for forming an electronic module having backside seal

THERMAL INTERCONNECT AND INTERFACE MATERIALS, METHODS OF PRODUCTION AND USES THEREOF

Semiconductor device

Semiconductor device

Integrated circuit

Device under bonding pad using single metallization

Method of manufacturing semiconductor component, and semiconductor component

Semiconductor device

Electronic structures including barrier layers and/or oxidation barriers defining lips and related methods

Electronic device and manufacturing method therefor

Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structures

Method and package for circuit chip packaging

Semiconductor device

Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die

Method of fabricating passive device applied to the three-dimensional package module

Device including a ring-shaped metal structure and method

Electrically interconnected stacked die assemblies

Ball-grid-array package, electronic system and method of manufacture

Semiconductor device and method of forming dam material around periphery of die to reduce warpage

Embedded semiconductor die package and method of making the same using metal frame carrier

High bond line thickness for semiconductor devices

Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereof

Package-level integrated circuit connection without top metal pads or bonding wire

Support device for resonator

Method for bonding two electronic components

Implantable electrode array assembly including a carrier in which control modules for regulating the operation of the electrodes are disposed and electrodes that are disposed on top of the carrier

Structure and process for the formation of TSVs

Method of manufacturing a semiconductor device having a semiconductor chip and resin sealing portion

Method of manufacturing a semiconductor device

STACK PACKAGE THAT PREVENTS WARPING AND CRACKING OF A WAFER AND SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME

Edge connect wafer level stacking

Method of forming solderable side-surface terminals of quad no-lead frame (QFN) integrated circuit packages

Method for manufacturing semiconductor device including semiconductor elements with electrode formed thereon

SELF-ALIGNED METAL MASK ASSEMBLY FOR SELECTIVELY DEPOSITING THIN FILMS ON MICROELECTRONIC SUBSTRATES AND DEVICES, AND METHOD OF USE

Integrated circuit device and electronic equipment

Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die

Die stacking with an annular via having a recessed socket