212089 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Lead [Pb]
Semiconductor device including coupling ball with layers of aluminum and copper alloys
#2402Radiate under-bump metallization structure for semiconductor devices
#2403Semiconductor device packages including connecting elements
#2404SEMICONDUCTOR LAMINATION PACKAGE AND METHOD OF PRODUCING SEMICONDUCTOR LAMINATION PACKAGE
#2405Semiconductor package
#2406SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#2407Monolithic semiconductor switches and method for manufacturing
#2408Semiconductor device and communication method
#2409Power Semiconductor Device with Low Parasitic Metal and Package Resistance
#2410Methods and apparatus for measuring analytes using large scale FET arrays
#2411Semiconductor device, method for manufacturing semiconductor device, apparatus for manufacturing semiconductor device, and method for evaluating semiconductor device
#2412WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
#2413MULTIPLE DIE STRUCTURE AND METHOD OF FORMING A CONNECTION BETWEEN FIRST AND SECOND DIES IN SAME
#2414SOLDERING FLUX AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE USING THE SAME
#2415Method of making semiconductor package having redistribution layer
#2416Semiconductor device and manufacturing method of the same
#2417Die level integrated interconnect decal manufacturing method and apparatus
#2418ALUMINUM FOR ULTRASONIC BONDING
#2419Integrated circuit package component with ball conducting joints
#2420Conformal shielding process using process gases
#2421Voltage converter
#2422SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#2423Semiconductor device and method for manufacturing the same
#2424Sacrificial material to facilitate thin die attach
#2425Semiconductor device
#2426Semiconductor chip with coil element over passivation layer
#2427Electronic devices formed of two or more substrates connected together, electronic systems comprising electronic devices, and methods of forming electronic devices
#2428Manufacturing process and structure of through silicon via
#2429Semiconductor device provided with tin diffusion inhibiting layer, and manufacturing method of the same
#2430Semiconductor device and semiconductor device manufacturing method
#2431Semiconductor device and method of forming a dual UBM structure for lead free bump connections
#2432Semiconductor device package having a buffer structure and method of fabricating the same
#2433Integrated circuit system with stress redistribution layer and method of manufacture thereof
#2434Wafer level integrated interconnect decal and manufacturing method thereof
#2435Cu pillar bump with non-metal sidewall protection structure
#2436Semiconductor device
#2437SEMICONDUCTOR DEVICE
#2438Semiconductor device
#2439WAFER LEVEL PACKAGING WITH HEAT DISSIPATION
#2440Semiconductor housing package, semiconductor package structure including the semiconductor housing package, and processor-based system including the semiconductor package structure
#2441Integrated circuit packaging system with an intermediate pad and method of manufacture thereof
#2442Integrated circuit packaging system with interconnect and method of manufacture thereof
#2443Integrated circuit packaging system with stacking option and method of manufacture thereof
#2444Dual-leadframe multi-chip package and method of manufacture
#2445Integrated circuit protruding pad package system and method for manufacturing thereof
#2446Integrated circuit packaging system with leadframe and method of manufacture thereof
#2447Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#2448Semiconductor structure, manufacturing method of semiconductor structure and semiconductor device
#2449Semiconductor device and lead frame
#2450Micro-fluidic injection molded solder (IMS)
#2451Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide
#2452Fluid storage and dispensing system including dynamic fluid monitoring of fluid storage and dispensing vessel
#2453Methods and apparatus for measuring analytes using large scale FET arrays
#2454Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same
#2455CONTACT STRUCTURE HAVING A COMPLIANT BUMP AND A TESTING AREA AND MANUFACTURING METHOD FOR THE SAME
#2456Fabrication method for integrated circuit chip component, multi-chip module, and their integration structure
#2457Coupling heat sink to integrated circuit chip with thermal interface material
#2458MULTI-FUNCTION CARD DEVICE
#2459Packaged electronic device having metal comprising self-healing die attach material
#2460Semiconductor wafer processing
#2461FILLING COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE
#2462Semiconductor package including a stacking element
#2463Silicon substrate for package
#2464Semiconductor package with stacked chips and method for manufacturing the same
#2465Under-Bump Metallization Structure for Semiconductor Devices
#2466Integrated circuit packaging system with bump contact on package leads and method of manufacture thereof
#2467Integrated circuit package system with package stacking and method of manufacture thereof
#2468Structure for multi-row lead frame and semiconductor package capable of minimizing an under-cut
#2469Stacked dual chip package and method of fabrication
#2470Multi-layer lead frame package and method of fabrication
#2471Power MOS transistor device and switch apparatus comprising the same
#2472ROOM TEMPERATURE DIRECT METAL-METAL BONDING
#2473Bonding method, bonding apparatus, and manufacturing method of semiconductor device using the same
#2474Die stacking with an annular via having a recessed socket
#2475Electronic component package and method for producing electronic component package
#2476Conformal shielding employing segment buildup
#2477Electronic component manufacturing method
#2478Fabrication method for resin-encapsulated semiconductor device
#2479Semiconductor device and manufacturing method of the same
#2480Semiconductor device and automotive ac generator
#2481Pin-type chip tooling
#2482Distributed semiconductor device methods, apparatus, and systems
#2483CIRCUIT BOARD WITH ANCHORED UNDERFILL
#2484Method of sensing magnitude of current through semiconductor power device
#2485Semiconductor device
#2486Method of manufacturing electronic device and electronic device
#2487Layered chip package with wiring on the side surfaces
#2488ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE
#2489Chip package and method for forming the same
#2490METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE
#2491Methods of forming semiconductor chip underfill anchors
#2492Process for fabricating electronic components using liquid injection molding
#2493QUAD FLAT NON-LEADED SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#2494Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces
#2495Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation
#2496Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die
#2497Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP
#2498Electronic device, relay member, and mounting substrate, and method for manufacturing the electronic device
#2499Semiconductor device and method of forming insulating layer around semiconductor die
#2500High power semiconductor device for wireless applications and method of forming a high power semiconductor device
#2501Semiconductor packaging and fabrication method using connecting plate for internal connection
#2502Integrated circuit package for semiconductior devices with improved electric resistance and inductance
#2503Method of manufacturing electronic apparatus, electronic component-mounting board, and method of manufacturing the same
#2504Ferroelectric component and manufacturing the same
#2505Method for metalizing blind vias
#2506METHOD FOR SIMULTANEOUSLY FORMING A MECHANICAL AND ELECTRICAL CONNECTION BETWEEN TWO PARTS
#2507Semiconductor device
#2508Method for fabricating circuit component
#2509Multi-surface IC packaging structures
#2510Through Silicon via Bridge Interconnect
#2511METHOD FOR FORMING A DOUBLE EMBOSSING STRUCTURE
#2512Bump-on-lead flip chip interconnection
#2513Stacked semiconductor chips with separate encapsulations
#2514Thin package system with external terminals and method of manufacture thereof
#2515Semiconductor device capable of switching operation mode and operation mode setting method therefor
#2516Chip package and method for fabricating the same
#2517Stacked semiconductor package having discrete components
#2518LED packaging with integrated optics and methods of manufacturing the same
#2519ROTARY DIE BONDING APPARATUS AND METHODOLOGY THEREOF
#2520METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#2521Semiconductor device with copper wirebond sites and methods of making same
#2522SEMICONDUCTOR POWER DEVICE HAVING A STACKED DISCRETE INDUCTOR STRUCTURE
#2523Processing method for package substrate
#2524Rigid-backed, membrane-based chip tooling
#2525Semiconductor device support for bonding
#2526Assembled multi-component electronic apparatus using alignment and reference marks
#2527Carbon nanotubes for the selective transfer of heat from electronics
#2528High Frequency Power Supply Module Having High Efficiency and High Current
#2529Die bond film, dicing die bond film, and semiconductor device
#2530Methods of forming a metal pattern and semiconductor device structure
#2531SEMICONDUCTOR DEVICE HAVING BUCKET-SHAPED UNDER-BUMP METALLIZATION AND METHOD OF FORMING SAME
#2532Manufacturing method for semiconductor package
#2533CHIP PACKAGE
#2534Stackable electronic package and method of fabricating same
#2535Semiconductor chip and film and TAB package comprising the chip and film
#2536SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#2537Method for placing a component onto a target platform by an apparatus using a probe
#2538CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
#2539Assessing metal stack integrity in sophisticated semiconductor devices by mechanically stressing die contacts
#2540SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
#2541Formation method of metallic electrode of semiconductor device and metallic electrode formation apparatus
#2542Electronic component
#2543Wireless communication system
#2544Circuit component with conductive layer structure
#2545Single chip semiconductor coating structure and manufacturing method thereof
#2546IC die including RDL capture pads with notch having bonding connectors or its UBM pad over the notch
#2547Device including an encapsulated semiconductor chip and manufacturing method thereof
#2548Wirebondless wafer level package with plated bumps and interconnects
#2549System and Method for Improving Reliability of Integrated Circuit Packages
#2550Chip structure
#2551Semiconductor device and method of forming IPD in fan-out level chip scale package
#2552Thermal interface material design for enhanced thermal performance and improved package structural integrity
#2553Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier
#2554Method of manufacturing a semiconductor device
#2555Semiconductor Device and Method of Forming 3D Inductor from Prefabricated Pillar Frame
#2556Low temperature bonding material comprising coated metal nanoparticles, and bonding method
#2557Printed wiring board and method for manufacturing same
#2558Method for integrating an electronic component into a printed circuit board
#2559System for semiconductor device, method for manufacturing semiconductor device, semiconductor device and method for bonding substrates
#2560Flip chip mounting method and bump forming method
#2561Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates
#2562Method of making a semiconductor device having a conductive particle on an electric pad
#2563Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace
#2564Manufacturing method of semiconductor device
#2565Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces
#2566Led lead frame structure
#2567Semiconductor package
#2568Wiring board and liquid crystal display device
#2569Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
#2570Solder alloy and semiconductor device
#2571Wafer level chip scale package without an encapsulated via
#2572Lead frame ball grid array with traces under die
#2573Method of improving adhesion of bond pad over pad metallization with a neighboring passivation layer by depositing a palladium layer
#2574Semiconductor chip, electrode structure therefor and method for forming same
#2575Method of fabricating a conductive post on an electrode
#2576Wafer-level packaged device having self-assembled resilient leads
#2577Method of manufacturing a semiconductor device with a carrier having a cavity and semiconductor device
#2578Semiconductor device and electronic device
#2579Semiconductor storage device and manufacturing method thereof
#2580Method for manufacturing a microelectronic package comprising at least one microelectronic device
#2581Quad flat non-leaded package structure with electromagnetic interference shielding function and method for fabricating the same
#2582Semiconductor device and method of patterning resin insulation layer on substrate of the same
#2583Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same
#2584Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace
#2585III-nitride power device with solderable front metal
#2586Semiconductor chip with a bonding pad having contact and test areas
#2587Flux-free chip to wafer joint serial thermal processor arrangement
#2588METHOD FOR INTEGRATING AN ELECTRONIC COMPONENT INTO A PRINTED CIRCUIT BOARD
#2589ADHESIVE BONDING METHOD
#2590Stacking package structure with chip embedded inside and die having through silicon via and method of the same
#2591Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore
#2592FLIP-CHIP ASSEMBLY WITH ORGANIC CHIP CARRIER HAVING MUSHROOM-PLATED SOLDER RESIST OPENING
#2593Semiconductor device and a method of manufacturing the same
#2594Light emitting device, method for manufacturing the same, and backlight unit
#2595ADHESIVE FILM AND PROCESS FOR PREPARING THE SAME AS WELL AS ADHESIVE SHEET AND SEMICONDUCTOR DEVICE
#2596Conductive pillar structure for semiconductor substrate and method of manufacture
#2597Lead free solder interconnections for integrated circuits
#2598Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
#25993D IC architecture with interposer and interconnect structure for bonding dies
#2600Pillar structure having a non-planar surface for semiconductor devices
#2601Semiconductor device and semiconductor assembly with lead-free solder
#2602Solder interconnect with non-wettable sidewall pillars and methods of manufacture
#2603Manufacturing of a device including a semiconductor chip
#2604Stacked semiconductor package
#2605Semiconductor package
#2606Semiconductor package of a flipped MOSFET and its manufacturing method
#2607LEAD FRAME FOR SEMICONDUCTOR DIE
#2608Vertical LED chip package on TSV carrier
#2609Micro-fluidic injection molded solder (IMS)
#2610WIREBONDING PROCESS
#2611Method for manufacturing an electronic device
#2612Semiconductor device
#2613Adhesive composition, film-like adhesive, adhesive sheet and semiconductor device
#2614Interconnection tape providing a serial electrode pad connection in a semiconductor device
#2615Power semiconductor device
#2616Integrated circuits having TSVs including metal gettering dielectric liners
#2617Solder bump interconnect
#2618Semiconductor module and portable apparatus provided with semiconductor module
#2619Protruding TSV tips for enhanced heat dissipation for IC devices
#2620Method of manufacturing a semiconductor device
#2621LED package and method for manufacturing same
#2622LED package, method for manufacturing LED package, and packing member for LED package
#2623LED assembly with a protective frame
#2624LED PACKAGE
#2625RFID tags and processes for producing RFID tags
#2626Method for producing conductive material, conductive material obtained by the method, electronic device containing the conductive material, and light-emitting device
#2627Stable electroless fine pitch interconnect plating
#2628Semiconductor device and a method of manufacturing the same
#2629Electronic device and manufacturing method of the same
#2630Method of manufacturing a semiconductor device
#2631Packaging method involving rearrangement of dice
#2632Packaging method involving rearrangement of dice
#2633Array-molded package-on-package having redistribution lines
#2634Interconnection structure and its design method
#2635Semiconductor device having a chip bonding using a resin adhesive film and method of manufacturing the same
#2636Semiconductor device structures and electronic devices including same hybrid conductive vias
#2637SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD
#2638Method of manufacturing layered chip package
#2639Etched recess package on package system
#2640Co-axial restraint for connectors within flip-chip packages
#2641Multi-chip package having frame interposer
#2642Integrated circuit package-in-package system with wire-in-film encapsulant and method for manufacturing thereof
#2643Method of stacking flip-chip on wire-bonded chip
#2644Semiconductor device
#2645Packaged semiconductor product and method for manufacture thereof
#2646CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
#2647Semiconductor device and a method of manufacturing the same
#2648Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation
#2649Method of manufacturing semiconductor device and wire bonding apparatus
#2650PRESSURE BONDING APPARATUS AND METHOD
#2651Enhanced magnetic self-assembly using integrated micromagnets
#2652Stable Gold Bump Solder Connections
#2653Semiconductor device
#2654Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device
#2655Multilayer printed circuit board
#2656Method for Producing Semiconductor Chips and Corresponding Semiconductor Chip
#2657Semiconductor device, flip-chip mounting method and flip-chip mounting apparatus
#2658Semiconductor integrated circuit
#2659Semiconductor device
#2660Bonded structure and manufacturing method for bonded structure
#2661Stacked semiconductor components having conductive interconnects
#2662Semiconductor device having conductive pads and a method of manufacturing the same
#2663PACKAGE ASSEMBLY HAVING A SEMICONDUCTOR SUBSTRATE
#2664Semiconductor packages including die and L-shaped lead and method of manufacture
#2665Dual die semiconductor package
#2666Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material
#2667Method of teaching eyepoints for wire bonding and related semiconductor processing operations
#2668ELEMENT MOUNTING BOARD, SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, METHOD FOR FABRICATING THE ELEMENT MOUNTING BOARD, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
#2669Method of manufacturing an interconnect structure for a semiconductor device
#2670SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#2671Method of manufacturing semiconductor device
#2672IC chip, antenna, and manufacturing method of the IC chip and the antenna
#26734D device process and structure
#2674System and Method To Embed A Wireless Communication Device Into Semiconductor Packages
#2675Dual Interconnection in Stacked Memory and Controller Module
#2676Grid array connection device and method
#2677Wiring substrate, manufacturing method thereof, and semiconductor package
#2678Attaching passive components to a semiconductor package
#2679Semiconductor device
#2680REAL TIME MONITORING OF INDIUM BUMP REFLOW AND OXIDE REMOVAL ENABLING OPTIMIZATION OF INDIUM BUMP MORPHOLOGY
#2681Solder Pillars in Flip Chip Assembly
#2682Microelectronic devices
#2683Semiconductor package
#2684Semiconductor package with single sided substrate design and manufacturing methods thereof
#2685Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof
#2686Manufacturing method of lead frame substrate and semiconductor apparatus
#2687Die package including multiple dies and lead orientation
#2688Method for establishing and closing a trench of a semiconductor component
#2689Semiconductor device including a DC-DC converter having a metal plate
#2690Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation
#2691System and Method To Embed A Wireless Communication Device Into Semiconductor Packages, including Chip-Scale Packages and 3D Semiconductor Packages
#2692System and Method To Embed A Wireless Communication Device Into Semiconductor Packages
#2693Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products
#2694Plating method, semiconductor device fabrication method and circuit board fabrication method
#2695Thermoelectric application for waste heat recovery from semiconductor devices in power electronics systems
#2696Bond pad connection to redistribution lines having tapered profiles
#2697Method for Fabricating Array-Molded Package-on-Package
#2698Method of manufacturing semiconductor device
#2699METHOD OF PACKAGING SEMICONDUCTOR DEVICE
#2700Apparatus and method for predetermined component placement to a target platform