Semiconductor package

Semiconductor device

QUAD FLAT PACKAGE STRUCTURE HAVING EXPOSED HEAT SINK, ELECTRONIC ASSEMBLY AND MANUFACTURING METHODS THEREOF

Semiconductor device

Electronic component mounted structure

Bonding wire for semiconductor devices

Bonding apparatus and wire bonding method

SEMICONDUCTOR PACKAGE

Patterned die attach and packaging method using the same

STACKABLE SEMICONDUCTOR CHIP LAYER COMPRISING PREFABRICATED TRENCH INTERCONNECT VIAS

Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the same

Manufacturing method for electronic devices

METHOD FOR MANUFACTURING NITRIDE BASED SINGLE CRYSTAL SUBSTRATE AND METHOD FOR MANUFACTURING NITRIDE BASED SEMICONDUCTOR DEVICE

ADHESIVE FILM

Semiconductor package, lead frame, and wiring board with the same

System-in packages

Lens support and wirebond protector

Semiconductor die collet

Adhesive film, dicing die bonding film and semiconductor device using the same

Semiconductor component and assumbly with projecting electrode

Semiconductor power module

3D integration structure and method using bonded metal planes

Semiconductor package and manufacturing method of the semiconductor package

SUBSTRATE HAVING EMBEDDED SINGLE PATTERNED METAL LAYER, AND PACKAGE APPLIED WITH THE SAME, AND METHODS OF MANUFACTURING OF THE SUBSTRATE AND PACKAGE

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

COPPER PLATE BONDING FOR HIGH PERFORMANCE SEMICONDUCTOR PACKAGING

Semiconductor device

Semiconductor device and method of forming a 3D inductor from prefabricated pillar frame

Semiconductor device

Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation

Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package

ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD COMPRISING COOLING MEMBER AND METHOD OF MANUFACTURING THE SAME

Method and apparatus for mounting electric component

Wireless communication system

Method for fabricating QFN semiconductor package

Die down ball grid array packages and method for making same

Connecting film, and joined structure and method for producing the same

Semiconductor chip and semiconductor device including the same

Semiconductor device

Semiconductor device

Die Exposed Chip Package

SEMICONDUCTOR CHIP PACKAGE

Package on package having a conductive post with height lower than an upper surface of an encapsulation layer to prevent circuit pattern lift defect and method of fabricating the same

QFN semiconductor package

QFN semiconductor package

LEAD FRAME FOR SEMICONDUCTOR DEVICE

Method for packing semiconductor components and product produced according to the method

Semiconductor device driving bridge-connected power transistor

Photo detector

Massively parallel interconnect fabric for complex semiconductor devices

Optoelectronic system

Bonding wire for semiconductor device

Semiconductor device and method of manufacturing the same

DIE ATTACH FILM-PROVIDED DICING TAPE AND PRODUCTION PROCESS OF SEMICONDUCTOR DEVICE

Package with multiple dies

Fabrication method of semiconductor integrated circuit device

Manufacturing method of semiconductor integrated circuit device

Semiconductor device

Methods for packaging microelectronic devices and microelectronic devices formed using such methods

Injection molded soldering process and arrangement for three-dimensional structures

Electronic component for surface mounting

Plastic package and method of fabricating the same

Semiconductor device and method of manufacturing the semiconductor device

Semiconductor module

Semiconductor device

Semiconductor device

HIGH PIN DENSITY SEMICONDUCTOR SYSTEM-IN-A-PACKAGE

Wafer backside structures having copper pillars

DEVICE AND DEVICE MANUFACTURE METHOD

Optoelectronic semiconductor chip, optoelectronic component and a method for producing an optoelectronic component

Method for making a semiconductor device on a flexible substrate

Method of forming an interconnect joint

Method of producing wire-connection structure, and wire-connection structure

Semiconductor package including power ball matrix and power ring having improved power integrity

Barrier layer for fine-pitch mask-based substrate bumping

Method of making electronic device

CHIP PACKAGING METHOD

Thermally enhanced wafer level package

Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates

SEMICONDUCTOR DEVICE

Multi-chip stacked package

Die bonding utilizing a patterned adhesion layer

Microelectronic packages fabricated at the wafer level and methods therefor

Semiconductor device

Dual Interconnection in Stacked Memory and Controller Module

Semiconductor device and method of manufacturing semiconductor device

Power lead-on-chip ball grid array package

Semiconductor device, method of manufacturing the same, and silane coupling agent

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same

Controlled Application of Solder Blocks to Establish Solder Connections

Method for Mounting Flip Chip and Substrate Used Therein

Component mounting apparatus, component mounting head, and component mounting method

Semiconductor device and method for manufacturing the same

Integrated circuit module and method of packaging same

Carbon nanotubes for the selective transfer of heat from electronics

Method and system for providing a low-profile semiconductor assembly

Semiconductor die packages using thin dies and metal substrates

Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device

METHOD FOR APPLYING ELECTRICAL CONTACTS ON SEMICONDUCTING SUBSTRATES, SEMICONDUCTING SUBSTRATE AND USE OF THE METHOD

Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor

Multi-chip packages providing reduced signal skew and related methods of operation

Packaged electronic device having metal comprising self-healing die attach material

Semiconductor device and manufacturing method thereof

Methods of fluxless micro-piercing of solder balls, and resulting devices

Semiconductor device and method of manufacturing the same

Semiconductor chip package

Stacked chip package structure with leadframe having bus bar

Quad flat pack in quad flat pack integrated circuit package system and method for manufacturing thereof

Stacked chip package structure with leadframe having bus bar

Integrated circuit package system with leaded package and method for manufacturing thereof

Panel, semiconductor device and method for the production thereof

Semiconductor component having through wire interconnect (TWI) with compressed wire

Method of forming an inductor on a semiconductor wafer

Semiconductor chip pad structure and method for manufacturing the same

Semiconductor integrated circuit device and method of manufacturing same

Metal wiring structures for uniform current density in C4 balls

Solder layer, heat sink using such a solder layer and method for manufacturing such a heat sink

Electronic component mounting apparatus

Manufacturing method of semiconductor device with surface mounting terminals

Wafer level packaging method

THERMOSETTING DIE BONDING FILM

Manufacturing method of semiconductor integrated circuit device

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Remote chip attachment

Widebody coil isolators

Exposed die pad package with power ring

Semiconductor device capable of switching operation modes

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Assembling substrates that can form 3-D structures

PACKAGE WITH SEMICONDUCTOR DEVICE AND INTEGRATED CIRCUIT MOUNTED THEREIN AND METHOD FOR MANUFACTURING SUCH PACKAGE

Semiconductor device and method for manufacturing the same

SEMICONDUCTOR DEVICE

Ball-limiting-metallurgy layers in solder ball structures

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Power semiconductor module comprising a connection device with internal contact spring connection elements

Semiconductor package and manufacturing method thereof

Staircase shaped stacked semiconductor package

Relay board and semiconductor device having the relay board

Semiconductor die package and method for making the same

Pre-molded clip structure

Pre-molded clip structure

Semiconductor device and manufacturing method thereof

ADVANCED QUAD FLAT-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Manufacturing method of advanced quad flat non-leaded package

Light-emitting diode package and wafer-level packaging process of light-emitting diode

Electronic component mounting method

Semiconductor device having elastic solder bump to prevent disconnection

Semiconductor Manufacturing Method

Method of fabricating a two-sided die in a four-sided leadframe based package

Method of manufacturing a semiconductor device including plural semiconductor chips

STACK-TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Fabrication method of multi-chip stack structure

SYSTEMS AND METHODS FOR AFFIXING A SILICON DEVICE TO A SUPPORT STRUCTURE

RF POWER AMPLIFIER CIRCUIT UTILIZING BONDWIRES IN IMPEDANCE MATCHING

DC/DC converter package having separate logic and power ground terminals

Semiconductor device comprising a through electrode and a pad connected to the through electrode and having an exposed portion and method for fabricating the same

Three-dimensional semiconductor architecture

Semiconductor element, method for manufacturing the same, and mounting structure having the semiconductor element mounted thereon

Semiconductor device

Semiconductor device with pads overlapping wiring layers including dummy wiring

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Power semiconductor module, power semiconductor module assembly and method for fabricating a power semiconductor module assembly

Electronic device and method of packaging an electronic device

MULTI-DIE PACKAGE WITH IMPROVED HEAT DISSIPATION

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR THE SAME

Semiconductor device with I/O cell and external connection terminal and method of manufacturing the same

Joining method and device produced by this method and joining unit

Assembly and production of an assembly

Method of fabricating a semiconductor device

Method of manufacturing semiconductor device

Adhesive, adhesive sheet, multi-layered adhesive sheet, and production method for electronic part

Method of manufacturing a semiconductor device by lamination

Method of making chip-on-lead package

Self-Aligned Chip Stacking

Integrated circuit chip using top post-passivation technology and bottom structure technology

Interconnect structure and a method of fabricating the same

Electronic apparatus produced using lead-free bonding material for soldering

Method and apparatus for distributing a thermal interface material

Semiconductor device and method of manufacturing the same

Method for ultra thin wafer handling and processing

THREE-DIMENSIONAL ELECTRONICS PACKAGE

Integrated circuit package system with multiple device units and method for manufacturing thereof

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Interconnect structure for a semiconductor device

Chip packages

Semiconductor package and method of forming

Electronic component with mechanically decoupled ball connections

Filp chip interconnection structure with bump on partial pad and method thereof

Semiconductor device and method of forming a thin wafer without a carrier

Stackable electronic package and method of making same

Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability

Semiconductor device

Integrated circuit package and method of making same

Semiconductor device with hollow and throughhole and method of manufacturing same

Semiconductor device

Semiconductor device and method of manufacturing the same

Stackable electronics package and method of fabricating same

Stackable electronic package

Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure

Semiconductor device and method of manufacturing same

Semiconductor device and manufacturing method therefor

Multichip discrete package

Lead frame and method for manufacturing circuit device using the same

Circuit device having funnel shaped lead and method for manufacturing the same

Wafer level packaging using flip chip mounting

Component mounting apparatus and method

Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Film-like adhesive, adhesive sheet, and semiconductor device using same

Multi-chip packages including extra memory chips to define additional logical packages and related devices

Power module

Structure and Method for Thin Single or Multichip Semiconductor QFN Packages

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

IO cell with multiple IO ports and related techniques for layout area saving

Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads

Metal-metal bonding of compliant interconnect

PACKAGE FOR SEMICONDUCTOR DEVICE AND PACKAGING METHOD THEREOF

Semiconductor device and method of manufacturing the same

Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Methods and systems for packaging integrated circuits

SEMICONDUCTOR DEVICE

Semiconductor device and wire bonding method

Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

Semiconductor device and method of mounting pre-fabricated shielding frame over semiconductor die

Making a semiconductor device having conductive through organic vias

Semiconductor device and method for manufacturing the same

ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING THE SHEET

Method for forming functional element using metal-to-insulator transition material, functional element formed by method, method for producing functional device, and functional device produced by method

Method for manufacturing semiconductor apparatus

Method for fabricating chip scale package structure with metal pads exposed from an encapsulant

Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Method for bonding wafers to produce stacked integrated circuits

Reconfigured wafer alignment

DICING DIE-BONDING FILM

Method Of Forming A Paste Pattern

Substrate for mounting IC chip, manufacturing method of substrate for mounting IC chip, device for optical communication, and manufacturing method of device for optical communication

Electronic devices formed of two or more substrates bonded together, electronic systems comprising electronic devices and methods of making electronic devices

FLMP buck converter with a molded capacitor and a method of the same

Microelectronic assembly with impedance controlled wirebond and reference wirebond

SEMICONDUCTOR DEVICE, TRANSMISSION SYSTEM, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING TRANSMISSION SYSTEM

Semiconductor device

Microelectronic assembly with impedance controlled wirebond and conductive reference element

Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the die

Semiconductor constructions

Microelectronic assemblies having compliancy and methods therefor

Flip chip semiconductor package and fabrication method thereof

Wire loop and method of forming the wire loop

Reducing stress between a substrate and a projecting electrode on the substrate

Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide

Semiconductor device

Semiconductor device including spacer element

Warp-suppressed semiconductor device

Method for fabricating semiconductor components using maskless back side alignment to conductive vias

Semiconductor apparatus packaging structure having embossed tape over tab tape, the embossed tape and method of forming the semiconductor apparatus packaging structure

Semiconductor Carrier for Multi-Chip Packaging

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Electrical interconnect forming method

Electrical interconnect forming method

Joint Structure Between a Wound Coil and An IC-Chip for a Noncontact RFID Device and Methods of Manufacturing The Same

Electrical interconnect structure

Method and apparatus for electronic component mounting

Light emitting diode package and manufacturing method thereof

Printed circuit board and method of manufacturing printed circuit board

Stacked device assembly with integrated coil and method of forming same

Integrated circuit for driving semiconductor device and power converter

Wire bond interconnection

Integrated circuit packaging system with stacked die and method of manufacture thereof

Chips having rear contacts connected by through vias to front contacts

Three-dimensional system-in-package architecture

Semiconductor device

System and method for stacked die embedded chip build-up

Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts

Stress buffering package for a semiconductor component

Mounted body and method for manufacturing the same

SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR DEVICE IN WHICH CIRCUIT BOARD AND SEMICONDUCTOR CHIP ARE CONNECTED BY LEADS

Lead and lead frame for power package

Routable array metal integrated circuit package

Integrated circuit packaging system with flex tape and method of manufacture thereof

Leadless integrated circuit package having standoff contacts and die attach pad

Leadless integrated circuit package having electrically routed contacts

Leadless integrated circuit package having standoff contacts and die attach pad

Stress barrier structures for semiconductor chips

WIRE SUPPLY DEVICE FOR A WIRE BONDER

FIXTURE APPARATUS FOR LOW-TEMPERATURE AND LOW-PRESSURE SINTERING

Micro-fluidic injection molded solder (IMS)

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Method to build robust mechanical structures on substrate surfaces

METHOD OF PRODUCING SEMICONDUCTOR DEVICE

Method of manufacturing ball grid array type semiconductor device

Reversible leadless package and methods of making and using same

Multi-surface IC packaging structures and methods for their manufacture

Semiconductor device

Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition

Semiconductor device having shifted stacked chips

METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT