212089 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Chemical elements Lead [Pb]
Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element
#3302Bond pad design for reducing the effect of package stress
#3303Structures and methods for improving solder bump connections in semiconductor devices
#3304CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
#3305PACKAGING SUBSTRATE HAVING EMBEDDED SEMICONDUCTOR CHIP
#3306Semiconductor package requiring reduced manufacturing processes
#3307Semiconductor devices having stress relief layers and methods for fabricating the same
#3308Method of manufacturing a semiconductor device
#3309Stacked semiconductor device including a serial path
#3310Semiconductor device having an interposer
#3311Semiconductor device including first and second carriers
#3312Microwave module
#3313CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAME
#3314Semiconductor device and manufacturing method thereof
#3315FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING METHOD THEREOF
#3316Method of manufacturing a printed wiring board
#3317Method for manufacturing electronic device
#3318Method and apparatus for manufacturing semiconductor device
#3319Process of forming an electronic device including a conductive stud over a bonding pad region
#3320Method for manufacturing a semiconductor device
#3321Method of forming electrical connections
#3322Semiconductor package
#3323System-in packages
#3324Semiconductor device and programming method
#3325Component arrangement and method for producing a component arrangement
#3326WIRING SUBSTRATE FOR A SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE HAVING THE WIRING SUBSTRATE
#3327Stacked semiconductor chips
#3328Multi-die package
#3329Semiconductor device and method of forming an interposer package with through silicon vias
#3330Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chip
#3331Semiconductor device and method for manufacturing the same
#3332Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
#3333STRUCTURE AND MANUFACTURING METHOD OF A CHIP SCALE PACKAGE WITH LOW FABRICATION COST, FINE PITCH AND HIGH RELIABILITY SOLDER BUMP
#3334Semiconductor package and package-on-package semiconductor device
#3335Semiconductor device and method of forming wafer level ground plane and power ring
#3336STRUCTURE AND MANUFACTURING METHOD OF A CHIP SCALE PACKAGE WITH LOW FABRICATION COST, FINE PITCH AND HIGH RELIABILITY SOLDER BUMP
#3337Manufacturing method of semiconductor device and semiconductor device
#3338Method of forming a semiconductor device including a stress buffer material formed above a low-k metallization system
#3339Method of assembling semiconductor devices with LEDS
#3340CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
#3341Method of reducing memory card edge roughness by edge coating
#3342Stackable Package By Using Internal Stacking Modules
#3343Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP
#3344Integrated circuit packaging system with through silicon via base and method of manufacture thereof
#3345Semiconductor device package having features formed by stamping
#3346Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors
#3347Semiconductor device, semiconductor module, method for manufacturing semiconductor device, and lead frame
#3348Semiconductor device having under-filled die in a die stack
#3349CMOS image sensor big via bonding pad application for AlCu Process
#3350CMOS image sensor big via bonding pad application for AICu process
#3351High frequency field-effect transistor
#3352System with semiconductor components having encapsulated through wire interconnects (TWI)
#3353Component mounting apparatus and method
#3354Mounting and connecting an antenna wire in a transponder
#3355Semiconductor package and method of manufacturing the same
#3356Process for making contact with and housing integrated circuits
#3357Method of manufacturing a semiconductor device
#3358Flip-chip mounting method, flip-chip mounting apparatus and tool protection sheet used in flip-chip mounting apparatus
#3359Method for bonding of chips on wafers
#3360TEST CIRCUIT UNDER PAD
#3361Flash memory
#3362FLEXIBLE CIRCUIT MODULE
#3363Vacuum coupled tool apparatus for dry transfer printing semiconductor elements
#3364Method of manufacturing semiconductor device, semiconductor device thus manufactured, and semiconductor manufacturing apparatus
#3365METHOD OF ELECTRICALLY CONNECTING A WIRE TO A PAD OF AN INTEGRATED CIRCUIT CHIP AND ELECTRONIC DEVICE
#3366Bonding pad for preventing pad peeling
#3367Semiconductor package and semiconductor package module
#3368Semiconductor device
#3369Package structure and method for reducing dielectric layer delamination
#3370Multilayer UV-Curable Adhesive Film
#3371Semiconductor device
#3372Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation
#3373Electronic device, method of producing the same, and semiconductor device
#3374Method of electrically connecting a microelectronic component
#3375Method and apparatus for mounting electric component
#3376Bonding machine incorporating dual-track transfer mechanism
#3377Method for application of a chip module to an antenna
#3378Method for manufacturing semiconductor device, and semiconductor manufacturing apparatus used in said method
#3379Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device
#3380Method for packaging semiconductor dies having through-silicon vias
#3381Stackable packages for three-dimensional packaging of semiconductor dice
#3382Semiconductor Device and Method of Forming Conductive TSV in Peripheral Region of Die Prior to Wafer Singulaton
#3383Electronic component module and method of manufacturing the electronic component module
#3384Method of making a thin film device
#3385Semiconductor device and manufacturing method of the same
#3386Semiconductor device and method of manufacturing the same
#3387Post bump and method of forming the same
#3388METHOD OF DESIGNING SEMICONDUCTOR INTEGRATED CIRCUIT, DESIGNING APPARATUS, SEMICONDUCTOR INTEGRATED CIRCUIT SYSTEM, SEMICONDUCTOR INTEGRATED CIRCUIT MOUNTING SUBSTRATE, PACKAGE AND SEMICONDUCTOR INTEGRATED CIRCUIT
#3389Semiconductor package having discrete components and system containing the package
#3390Semiconductor device and method of fabrication
#3391SEMICONDUCTOR DEVICE
#3392Semiconductor chip package
#3393Leadframe having delamination resistant die pad
#3394Semiconductor chip package
#3395Multi-Connect Lead
#3396Multi-die DC-DC buck power converter with efficient packaging
#3397BONDING APPARATUS AND BONDING METHOD
#3398Electrical conductor
#3399Bonding wire for semiconductor devices
#3400Copper alloy bonding wire for semiconductor device
#3401Method of plasma preparation of metallic contacts to enhance mechanical and electrical integrity of subsequent interconnect bonds
#3402Method for exposing and cleaning insulating coats from metal contact surfaces
#3403SEMICONDUCTOR DIE PACKAGE INCLUDING LEADFRAME WITH DIE ATTACH PAD WITH FOLDED EDGE
#3404Near chip scale package integration process
#3405Dual side cooling integrated power device module and methods of manufacture
#3406RESIN VARNISH USED FOR ADHESIVE FILM FOR SEMICONDUCTOR ELEMENT, ADHESIVE FILM FOR SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR DEVICE
#3407System and method to reduce the bondwire/trace inductance
#3408Reconstituted wafer stack packaging with after-applied pad extensions
#3409Method for aligning and bonding elements and a device comprising aligned and bonded elements
#3410Structures and methods to improve lead-free C4 interconnect reliability
#3411Solder interconnect pads with current spreading layers
#3412Film for use in manufacturing semiconductor device, method for producing semiconductor device and semiconductor device
#3413Semiconductor device and method of manufacturing semiconductor device
#3414Structure and method for forming pillar bump structure having sidewall protection
#3415Solder interconnect by addition of copper
#3416Simplified multichip packaging and package design
#3417Semiconductor wiring assembly, semiconductor composite wiring assembly, and resin-sealed semiconductor device
#3418NICKEL-TITANUM CONTACT LAYERS IN SEMICONDUCTOR DEVICES
#3419Connect and capacitor substrates in a multilayered substrate structure coupled by surface coulomb forces
#3420Method for manufacturing electronic component module
#3421STRUCTURE OF A PACKAGE FOR ELECTRONIC DEVICES AND METHOD FOR MANUFACTURING THE PACKAGE
#3422Ribbon connecting electrical components
#3423Board having connection terminal
#3424METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT
#3425Method of manufacturing a semiconductor device
#3426SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY ELECTROPLATING
#3427Placement method of an electronic module on a substrate
#3428Method of making an integrated circuit package with shielding via ring structure
#3429Flip chip MLP with folded heat sink
#3430METHOD OF DIE REARRANGEMENT PACKAGE STRUCTURE HAVING PATTERNED UNDER BUMP METALLURGIC LAYER CONNECTING METAL LEAD
#3431Method of forming monolithic CMOS-MEMS hybrid integrated, packaged structures
#3432Method of forming monolithic CMOS-MEMS hybrid integrated, packaged structures
#3433Method and structure for adhesion of intermetallic compound (IMC) on Cu pillar bump
#3434SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#3435Semiconductor device
#3436Semiconductor chip package and method for designing the same
#3437Assembly of a wire element with a microelectronic chip with a groove comprising at least one bump securing the wire element
#3438Semiconductor device and a method of manufacturing the same
#3439Stacked semiconductor device and fabrication method for same
#3440Semiconductor device and fabrication method thereof
#3441Flip-chip module and method for the production thereof
#3442Semiconductor device and manufacturing method of the same
#3443Semiconductor Chip Secured to Leadframe by Friction
#3444SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#3445Lead frame routed chip pads for semiconductor packages
#3446Method of assembling a multi-component electronic package
#3447Semiconductor device and semiconductor device manufacturing method
#3448Power converter integrated circuit floor plan and package
#3449Wire payout measurement and calibration techniques for a wire bonding machine
#3450Formation of TSV backside interconnects by modifying carrier wafers
#3451Manufacturing method of semiconductor device including Au bump on seed film
#3452Process for producing a semiconductor device
#3453Methods for producing an ultrathin semiconductor circuit
#3454Method of manufacturing semiconductor device
#3455Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
#3456Semiconductor device and method for producing the same
#3457Multichip module, printed circuit board unit, and electronic apparatus
#3458Printed circuit board
#3459Layered chip package
#3460Stacked structures and methods of fabricating stacked structures
#3461Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods
#3462Semiconductor device bonding wire and wire bonding method
#3463JOINING STRUCTURE AND A SUBSTRATE-JOINING METHOD USING THE SAME
#34643-D semiconductor die structure with containing feature and method
#3465Near chip scale semiconductor packages
#3466Package manufacturing method and semiconductor device
#3467Semiconductor chip, method of fabricating the same, and stack module and memory card including the same
#3468IC PACKAGE DESIGN WITH STRESS RELIEF FEATURE
#3469Semiconductor device with embedded interconnect pad
#3470Integrated circuit package system using heat slug
#3471Electrical property altering, planar member with solder element in IC chip package
#3472Semiconductor chip
#3473METHAL-BASED PACKAGE SUBSTRATE, THREE-DIMENSIONAL MULTI-LAYERED PACKAGE MODULE USING THE SAME, AND MANUFACTURING METHOD THEREOF
#3474Method for forming integrated circuit assembly
#3475Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member
#3476Semiconductor device and manufacturing method thereof
#3477Process for manufacturing a composite substrate
#3478ULTRASONIC BONDING EQUIPMENT FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
#3479Pressure-Sensitive Adhesive Tape
#3480Multilayer printed wiring board
#3481MEMORY CARD
#3482SEMICONDUCTOR DEVICE, CAMERA MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#3483SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#3484Adhesive film for semiconductor and semiconductor device using the adhesive film
#3485Semiconductor package with substrate having single metal layer and manufacturing methods thereof
#3486Surface depressions for die-to-die interconnects and associated systems
#3487Die stacking apparatus and method
#3488Method for fabricating a semiconductor package
#3489SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#3490Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die
#3491Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof
#3492Packaged integrated circuit devices with through-body conductive vias, and methods of making same
#3493Laminated body of semiconductor chips including pads mutually connected to conductive member
#3494Integrated circuit packaging system with inward and outward interconnects and method of manufacture thereof
#3495Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure
#3496Thru silicon enabled die stacking scheme
#3497Metallic Bump Structure Without Under Bump Metallurgy And a Manufacturing Method Thereof
#3498Standing chip scale package
#3499METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING AN EVEN COATING THICKNESS USING ELECTRO-LESS PLATING AND RELATED DEVICE
#3500Method for manufacturing semiconductor device
#3501Lead frame design to improve reliability
#3502PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
#3503MULTIFUNCTIONAL DIE ATTACHMENT FILM AND SEMICONDUCTOR PACKAGING USING THE SAME
#3504Semiconductor device and method of forming conductive vias with trench in saw street
#3505Hermeticity testing
#3506Semiconductor device and method of forming vertical interconnect structure between non-linear portions of conductive layers
#3507Explosion-proof module structure for power components, particularly power semiconductor components, and production thereof
#3508Semiconductor substrate with interlayer connection and method for production of a semiconductor substrate with interlayer connection
#3509Semiconductor chip passivation structures and methods of making the same
#3510SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#3511Interconnect structures having lead-free solder bumps
#3512Method of forming wire bonds in semiconductor devices
#3513Methods to fabricate integrated circuits by assembling components
#3514Electronic device package and method of manufacture
#3515Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereof
#3516Processes and structures for IC fabrication
#3517Methods for interconnecting bonding pads between components
#3518Apparatus for restricting moisture ingress
#3519Integrated circuit packaging system with high lead count and method of manufacture thereof
#3520Stacked chip package structure with leadframe having inner leads with transfer pad
#3521IC PACKAGE HAVING AN INDUCTOR ETCHED INTO A LEADFRAME THEREOF
#3522Semiconductor device
#3523Faraday cage for circuitry using substrates
#3524Processes and structures for IC fabrication
#3525Processes and structures for beveled slope integrated circuits for interconnect fabrication
#3526High-voltage semiconductor device
#3527SEMICONDUCTOR DEVICE
#3528Pads with different width in a scribe line region and method for manufacturing these pads
#3529Method for manufacturing tight pitch, flip chip integrated circuit packages
#3530AU ALLOY WIRE FOR BALL BONDING
#3531HERMETICALLY-SEALED ELECTRICAL CIRCUIT APPARATUS
#3532Electrical connection and method of manufacturing the same
#3533Processes for IC fabrication
#3534Processes and structures for IC fabrication
#3535METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#3536Method for producing semiconductor chip with adhesive film, adhesive film for semiconductor used in the method, and method for producing semiconductor device
#3537Method for producing display device
#3538Method and apparatus for no lead semiconductor package
#3539Semiconductor device and method of forming through hole vias in die extension region around periphery of die
#3540Semiconductor device
#3541Metallic electrode forming method and semiconductor device having metallic electrode
#3542INTERPOSER SUBSTRATE, LSI CHIP AND INFORMATION TERMINAL DEVICE USING THE INTERPOSER SUBSTRATE, MANUFACTURING METHOD OF INTERPOSER SUBSTRATE, AND MANUFACTURING METHOD OF LSI CHIP
#3543Semiconductor device and method for manufacturing the same
#3544Method for making an electrically conducting mechanical interconnection member
#3545Semiconductor device and method of forming through hole vias in die extension region around periphery of die
#3546Semiconductor device and method of forming through hole vias in die extension region around periphery of die
#3547Semiconductor integrated circuit device
#3548Semiconductor apparatus and manufacturing method of the same
#3549Method for manufacturing hetero-bonded wafer
#3550Electronic module with feed through conductor between wiring patterns
#3551Semiconductor Device and Method of Manufacturing the Same
#3552Semiconductor device
#3553Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support
#3554Semiconductor device, semiconductor wafer and manufacturing method of the same
#3555Method for connecting a precious metal surface to a polymer
#3556Processed wafer via
#3557Method of forming a bond pad
#3558Method for connecting a die attach pad to a lead frame and product thereof
#3559Method of manufacturing semiconductor device including exposing a dicing line on a wafer
#3560Semiconductor die attachment method using non-conductive screen print and dispense adhesive
#3561Method of manufacturing layered chip package
#3562METHOD OF MANUFACTURING DICING DIE-BONDING FILM
#3563Thermal interface material and method of using the same and electronic assembly having the same
#3564Source driver, method for manufacturing same, and liquid crystal module
#3565Structure and method for power field effect transistor
#3566Packaged electronic devices having die attach regions with selective thin dielectric layer
#3567Semiconductor device
#3568Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method
#3569Joint structure and electronic component
#3570Forming semiconductor chip connections
#3571Semiconductor device package structure and method for the same
#3572WIREBOND STRUCTURES
#3573Semiconductor device
#3574Lead frame, lead frame fabrication, and semiconductor device
#3575ASTERISK PAD
#3576METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE
#3577THIN FILM DEVICE, FLEXIBLE CIRCUIT BOARD INCLUDING THIN FILM DEVICE, AND METHOD FOR MANUFACTURING THIN FILM DEVICE
#3578SEMICONDUCTOR DEVICE AND METHOD OF INSPECTING AN ELECTRICAL CHARACTERISTIC OF A SEMICONDUCTOR DEVICE
#3579Bonding apparatus and bonding stage height adjustment method for the bonding apparatus
#3580Aluminum bond pads with enhanced wire bond stability
#3581Wiring board and method for manufacturing the same
#3582Wiring board and method for manufacturing the same
#3583Composite multi-layer substrate and module using the substrate
#3584Components packaging method
#3585CONDUCTIVE BUMP STRUCTURE FOR SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
#3586Method of fabricating stacked semiconductor chips
#3587Electronic system modules and method of fabrication
#3588Semiconductor package with position member
#3589Method for stacking serially-connected integrated circuits and multi-chip device made from same
#3590Power semiconductor device and method for its production
#3591Method for producing electric contacts on a semiconductor component
#3592Semiconductor device having a semiconductor chip, and method for the production thereof
#3593Semiconductor device and method for fabricating the same
#3594WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
#3595Semiconductor chip package with post electrodes
#3596Electronic component mounting structure, electronic component mounting method, and electronic component mounting board
#3597Wafer level chip scale package
#3598Power electronic device
#3599Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrate
#3600Semiconductor substrate and method of connecting semiconductor die to substrate