SEMICONDUCTOR DEVICE

Electromigration-Resistant Flip-Chip Solder Joints

Metallization system of a semiconductor device including metal pillars having a reduced diameter at the bottom

CHIP SCALE PACKAGE AND METHOD OF FABRICATING THE SAME

Stackable integrated circuit package system

WINDOW TYPE SEMICONDUCTOR PACKAGE

Complete power management system implemented in a single surface mount package

Quad flat non-leaded package

Molding die with tilted runner, method of manufacturing semiconductor device using the same, and semiconductor device made by the method

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE

Chip capacitive coupling

Light emitting device having luminescent layer with opening to exposed bond pad on light emitting die for wire bonding pad to substrate

Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board

DIE ATTACH AREA CUT-ON-FLY METHOD AND APPARATUS

Semiconductor device and method of forming through vias with reflowed conductive material

Integrated circuit micro-module

Electronics module comprising an embedded microcircuit

Module having a stacked magnetic device and semiconductor device and method of forming the same

Arrangement comprising an optoelectronic component

Chip and Transmitter for Wireless Communication System

Method of manufacturing a semiconductor device and a semiconductor device produced thereby

Semiconductor device

Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package

Wire bonding structure and method for forming same

Semiconductor device and method of forming through vias with reflowed conductive material

Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same

Semiconductor device having wiring layers with power-supply plane and ground plane

Solder bump UBM structure

Integrated circuit micro-module

Integrated circuit micro-module

Integrated circuit micro-module

Integrated circuit micro-module

Integrated circuit micro-module

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

Stacked semiconductor package having reduced height

Systems and methods of tamper proof packaging of a semiconductor device

MULTI-CHIP PACKAGE

WIRE BOND CHIP PACKAGE

Electronic device

Reduced-crosstalk wirebonding in an optical communication system

Bidirectional switch module

Light-emitting device having a thermal conductive member with wiring function and method of manufacturing the same

Method for fabricating a bond

Module having a stacked magnetic device and semiconductor device and method of forming the same

Formation of solder bumps

Semiconductor package, integrated circuit cards incorporating the semiconductor package, and method of manufacturing the same

Method of manufacturing semiconductor devices

Method for contacting electronic components by means of a substrate plate

Multilayer wiring substrate and method for manufacturing the same

Wire bonding method and semiconductor device

Semiconductor package with ribbon with metal layers

Semiconductor component having a stack of semiconductor chips and method for producing the same

Semiconductor device including conductive element

CHIP PACKAGE STRUCTURE

Semiconductor device

Chip attach adhesive to facilitate embedded chip build up and related systems and methods

Quad flat package with exposed common electrode bars

Semiconductor device packages with electromagnetic interference shielding

Manufacturing method of semiconductor device

Semiconductor apparatus with decoupling capacitor

Semiconductor device and wire bonding method

Electronic Device and Method of Manufacturing Same

Wire bonding method, wire bonding apparatus, and wire bonding control program

Wire bonding apparatus, record medium storing bonding control program, and bonding method

Bump Structure With Multiple Layers And Method Of Manufacture

Process for placing, securing and interconnecting electronic components

Method of refining solder materials

Multi-component integrated circuit contacts

Semiconductor package formed within an encapsulation

Method of manufacturing a semiconductor package with fine pitch lead fingers

Method of manufacturing semiconductor device, and wire bonder

Method for fabricating semiconductor packages with discrete components

Chip assembly

Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus

Gap capacitors for monitoring stress in solder balls in flip chip technology

Electronic module with EMI protection

Electric module having a conductive pattern layer

Bond pad support structure for semiconductor device

Lock and key through-via method for wafer level 3D integration and structures produced

Grain refinement by precipitate formation in PB-free alloys of tin

Semiconductor device and a method of manufacturing the same

Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process

Semiconductor device and manufacturing method thereof

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device

Method of manufacturing a semiconductor device

Layered chip package with wiring on the side surfaces

Semiconductor device and semiconductor memory device

SEMICONDUCTOR PACKAGE STRUCTURE USING THE SAME

Leadframe structure for electronic packages

Wirebonded semiconductor package

THRU SILICON ENABLED DIE STACKING SCHEME

Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same

Electronic-component-housing package and electronic device

Adhesive bonding method

CONFORMAL SHIELDING EMPLOYING SEGMENT BUILDUP

Coaxial through chip connection

Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method

Method of making semiconductor device packaged by sealing resin member

Dicing film having shrinkage release film and method for manufacturing semiconductor package using the same

Power semiconductor devices having integrated inductor

Electronic member, electronic part and manufacturing method therefor

Semiconductor wafer coated with a filled, spin-coatable material

Barrier structures and methods for through substrate vias

WAFER LEVEL, CHIP SCALE SEMICONDUCTOR DEVICE PACKAGING COMPOSITIONS, AND METHODS RELATING THERETO

Structure of UBM and solder bumps and methods of fabrication

Flip chip interconnection having narrow interconnection sites on the substrate

Semiconductor module having semiconductor device mounted on device mounting substrate

Reinforced structure for a stack of layers in a semiconductor component

Semiconductor flip-chip system having oblong connectors and reduced trace pitches

Thermally enhanced semiconductor package

SEMICONDUCTOR MODULE

Semiconductor device

Integrated antennas in wafer level package

Semiconductor device having a sealing body and partially exposed conductors

Semiconductor device stack with bonding layer and wire retaining member

Package-on-package using through-hole via die on saw streets

Semiconductor device

Memory card and method for manufacturing memory card

Semiconductor device and manufacturing method therefor

Semiconductor chip package

Semiconductor die package and method for making the same

SEMICONDUCTOR DEVICE, LEADFRAME AND METHOD OF ENCAPSULATING

Optical element package and method of manufacturing the same

Method for the manufacture of an optoelectronic component and an optoelectronic component

Solder material, method for manufacturing the same, joined body, method for manufacturing the same, power semiconductor module, and method for manufacturing the same

Method for producing an electrical and mechanical connection and an assembly comprising such a connection

Solder bump confinement system for an integrated circuit package

METHOD OF FORMING CONNECTION TERMINAL

Electronic packages with fine particle wetting and non-wetting zones

Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof

Semiconductor device and production method therefor

METHODS FOR CONTROLLING WAFER AND PACKAGE WARPAGE DURING ASSEMBLY OF VERY THIN DIE

Manufacturing method of semiconductor device

Manufacturing method of light-emitting diode

Method for manufacturing an electronic module

Power device and a method for controlling a power device

Method and apparatus for manufacturing an electronic module, and electronic module

Reduced bottom roughness of stress buffering element of a semiconductor component

Underbump metallization structure

Semiconductor package comprising alignment members

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Adhesive tape and semiconductor package using the same

Process for packaging components, and packaged components

Method for manufacturing a semiconductor component and structure therefor

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME

Monolithic semiconductor switches and method for manufacturing

Semiconductor device and production method therefor

Lead pin for mounting semiconductor and printed wiring board

CONDUCTIVE BUMPS, WIRE LOOPS INCLUDING THE IMPROVED CONDUCTIVE BUMPS, AND METHODS OF FORMING THE SAME

Method for packing electric components on a substrate

Method for producing a metal-ceramic substrate for electric circuits on modules

FLUIDIC SELF-ASSEMBLY FOR SYSTEM INTEGRATION

Semiconductor device including single circuit element for soldering

3D integration of vertical components in reconstituted substrates

SEMICONDUCTOR PACKAGE WITH WEDGE BONDED CHIP

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool

Semiconductor device having lead free solders between semiconductor chip and frame and fabrication method thereof

Lead frames with improved adhesion to plastic encapsulant

Semiconductor device which exposes die pad without covered by interposer and its manufacturing method

Semiconductor integrated circuit device and a method for manufacturing a semiconductor integrated circuit device

IC package with capacitors disposed on an interposal layer

SEMICONDUCTOR DEVICE

Semiconductor device and method for manufacturing

Wire bonding apparatus and wire bonding method

Method of teaching eyepoints for wire bonding and related semiconductor processing operations

Dual metal for a backside package of backside illuminated image sensor

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps

Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same

Thin quad flat package with no leads (QFN) fabrication methods

Laser bonding for stacking semiconductor substrates

ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, AND SEMICONDUCTOR DEVICE MADE WITH THE SAME

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps

Semiconductor device and method of fabricating the same

Semiconductor device package and method of assembly thereof

Wafer level vertical diode package structure and method for making the same

Semiconductor device including wires connecting electrodes to an inner lead

Semiconductor device, method for manufacturing the same, and multilayer substrate having the same

Metal schemes of trench MOSFET for copper bonding

Semiconductor device with circuit for reduced parasitic inductance

Apparatus and method for pulsed dispensing of liquid

ADHESIVE FILM AND SEMICONDUCTOR DEVICE HAVING THE SAME

SHIELDED ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME

Methods for forming packaged products

PACKAGED POWER SWITCHING DEVICE

HIGH RELIABILITY Au ALLOY BONDING WIRE AND SEMICONDUCTOR DEVICE OF SAME

Electronic device and electronic apparatus

Method of Producing Optoelectronic Components and Optoelectronic Component

Marking method for semiconductor device and semiconductor device provided with markings

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE, STACKED SEMICONDUCTOR DEVICE AND INTERPOSER SUBSTRATE

Semiconductor device including arrangement to control connection height and alignment between a plurity of stacked semiconductor chips

Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries

Semiconductor device with output circuit arrangement

Rigid-flex module and manufacturing method

DEVICE, UNIT, SYSTEM AND METHOD FOR THE MAGNETICALLY-ASSISTED ASSEMBLING OF CHIP-SCALE, AND NANO AND MICRO-SCALE COMPONENTS ONTO A SUBSTRATE

Structure and process for a contact grid array formed in a circuitized substrate

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

METHOD FOR FABRICATING A SEMICONDUCTOR CHIP DEVICE HAVING THROUGH-SILICON-VIA (TSV)

Structures and methods for improving solder bump connections in semiconductor devices

REDUCING WARPAGE FOR FAN-OUT WAFER LEVEL PACKAGING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Methods of manufacturing imaging device packages

Semiconductor package and plasma display device including the same

Backside metal of redistribution line with silicide layer on through-silicon via of semiconductor chips

Semiconductor device and method of manufacturing the same

Structures and methods for improving solder bump connections in semiconductor devices

Semiconductor device

Ball land structure having barrier pattern

Bump-on-lead flip chip interconnection

SEMICONDUCTOR DEVICE INCLUDING A COST-EFFICIENT CHIP-PACKAGE CONNECTION BASED ON METAL PILLARS

Semiconductor device and method of confining conductive bump material during reflow with solder mask patch

Structures and methods for improving solder bump connections in semiconductor devices

Silicon substrate and chip package structure with silicon base having stepped recess for accommodating chip

System-in-package packaging for minimizing bond wire contamination and yield loss

SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD THEREOF AND IC CHIP

Semiconductor device and manufacturing method thereof

PROTECTIVE THIN FILM COATING IN CHIP PACKAGING

Manufacturing method for semiconductor devices and semiconductor device

METHOD OF MANUFACTURING AN ASSEMBLY AND ASSEMBLY

PACKAGE ASSEMBLY FOR SEMICONDUCTOR DEVICES

Semiconductor device and method of manufacturing same

High power integrated circuit device having bump pads

True CSP power MOSFET based on bottom-source LDMOS

Package carrier

Attachment using magnetic particle based solder composites

Method of manufacturing multilayer printed circuit board

SEMICONDUCTOR APPARATUS AND PROCESS OF PRODUCTION THEREOF

LOW-COST FLIP-CHIP INTERCONNECT WITH AN INTEGRATED WAFER-APPLIED PHOTO-SENSITIVE ADHESIVE AND METAL-LOADED EPOXY PASTE SYSTEM

Bonding IC die to TSV wafers

Method of manufacturing a semiconductor device

Systems and methods for affixing a silicon device to a support structure

Memory card and memory card manufacturing method

Resin paste for die bonding, containing a polyurethaneimide resin and thermosetting resin method for manufacturing semiconductor device, and semiconductor device, using the resin paste

Grid array packages

Adhesive Tape, Semiconductor Package and Electronics

Semiconductor device

Bonding pad structure and manufacturing method thereof

Pad layout structure of semiconductor chip

LOW COST PROCESS FLOW FOR FABRICATION OF METAL CAPPING LAYER OVER COPPER INTERCONNECTS

Solder limiting layer for integrated circuit die copper bumps

Semiconductor device

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

Face-to-face (F2F) hybrid structure for an integrated circuit

Wafer structure with conductive bumps and fabrication method thereof

Stackable semiconductor device assemblies

Semiconductor package and manufacturing method of the same

Integrated circuit packaging system substrates and method of manufacture thereof

Microball assembly methods, and packages using maskless microball assemblies

Semiconductor device and method of forming recessed conductive vias in saw streets

Chip package structure and the method thereof with adhering the chips to a frame and forming UBM layers

Power module having stacked flip-chip and method of fabricating the power module

Thermally enhanced thin semiconductor package

Method for forming thin film resistor and terminal bond pad simultaneously

Light emitting diode and method for manufacturing the same

Semiconductor integrated circuit

Nano memory, light, energy, antenna and strand-based systems and methods

Wire bonding method

Microprobe Tips and Methods for Making

Printed wiring board

Semiconductor device and manufacturing method of a semiconductor device

Manufacturing method of transferring a wiring circuit layer on a metal support substrate to a semiconductor element

INTEGRATED CIRCUIT PACKAGES HAVING SHARED DIE-TO-DIE CONTACTS AND METHODS TO MANUFACTURE THE SAME

Semiconductor element and electrical apparatus

Intermediate structure of semiconductor device and method of manufacturing the same

Flip chip mounting process and flip chip assembly

Method for low stress flip-chip assembly of fine-pitch semiconductor devices

Wire bonding method and semiconductor device

Semiconductor device

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Grid array connection device and method

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Semiconductor device and method for fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor device with a vertical interconnect structure for 3-D FO-WLCSP

Double-sided semiconductor device and method of forming top-side and bottom-side interconnect structures

Grid array packages and assemblies including the same

Semiconductor device and method for manufacturing the same

Semiconductor Package Having Support Chip And Fabrication Method Thereof

Semiconductor die package including low stress configuration

Electronic devices including flexible electrical circuits and related methods

STACKABLE SEMICONDUCTOR PACKAGE AND PROCESS TO MANUFACTURE SAME

Semiconductor apparatus and manufacturing method thereof

Leadless package housing having a symmetrical construction with deformation compensation

Semiconductor die package with clip interconnection

Thermally enhanced electronic package

Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same

Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV

Semiconductor device having a mounting substrate with a capacitor interposed therebetween

Semiconductor device

Semiconductor device

Semiconductor element and electrical apparatus

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD FOR DESIGNING THE SAME

Light emitting device and method for manufacturing same